CN111787710A - Preparation method of ceramic circuit board - Google Patents
Preparation method of ceramic circuit board Download PDFInfo
- Publication number
- CN111787710A CN111787710A CN202010699709.0A CN202010699709A CN111787710A CN 111787710 A CN111787710 A CN 111787710A CN 202010699709 A CN202010699709 A CN 202010699709A CN 111787710 A CN111787710 A CN 111787710A
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- conductive pattern
- ceramic substrate
- metal foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0405—Solder foil, tape or wire
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a preparation method of a ceramic circuit board, wherein the ceramic circuit board comprises a ceramic substrate and a conductive pattern welded on the ceramic substrate through active solder; the preparation method comprises the following steps: s1, providing a metal foil for forming a conductive pattern, and performing thickness reduction treatment on the non-conductive pattern area from the first main surface of the metal foil; s2, arranging an active solder on the ceramic substrate; wherein the active solder is only arranged in the area for connecting the conductive pattern on the ceramic substrate; s3, placing the conductive pattern onto the active filler metal with the ceramic substrate facing the first major surface of the metal foil, and soldering the conductive pattern onto the ceramic substrate through the active filler metal; s4, removing the reduced thickness non-conductive pattern area of step S1 from the second main surface of the metal foil. The invention is beneficial to achieving smaller pattern circuit spacing, does not need etching of active solder, avoids the damage of the active solder etching to the conductive pattern, and improves the pattern precision.
Description
Technical Field
The invention relates to a preparation method of a ceramic circuit board; and more particularly, to a method for preparing an AMB ceramic circuit board.
Background
The ceramic circuit board has the advantages of high heat conduction and low expansion, and is more and more widely applied to the fields of new energy automobiles, power locomotives, aerospace and the like in recent years. The Active Metal Brazing (AMB) connection technology realizes the metallurgical Bonding of a ceramic substrate and a metal conducting circuit by means of Active brazing filler metal, and has the advantages of high Bonding strength, good cold-hot circulation reliability and the like.
AMB ceramic circuit boards typically have relatively thick conductive patterns, which can be as thick as 0.2 mm or even more than 1 mm. The conventional preparation method of the AMB ceramic circuit board generally includes the steps of firstly welding a whole metal foil on a ceramic substrate by using an AMB connection technology, then carrying out chemical etching on the metal foil to obtain a conductive pattern, and finally removing active brazing filler metal between conductive circuits by using an etching process different from metal foil etching, wherein the etching process of the active brazing filler metal usually needs longer etching time, is high in cost and is very easy to damage the conductive circuits.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a preparation method of a ceramic circuit board, wherein the ceramic circuit board comprises a ceramic substrate and a conductive pattern welded on the ceramic substrate through active solder; the preparation method comprises the following steps:
s1, providing a metal foil for forming the conductive pattern, and performing thickness reduction treatment on a non-conductive pattern area from the first main surface of the metal foil;
s2, arranging an active solder on the ceramic substrate; wherein the active filler metal is provided only on a region of the ceramic substrate for connecting the conductive pattern;
s3, placing the conductive pattern onto the active filler metal with the ceramic substrate facing the first major surface of the metal foil, and soldering the conductive pattern onto the ceramic substrate through the active filler metal;
s4, removing the non-conductive pattern area with the reduced thickness in the step S1 from the second main surface of the metal foil.
Here, the order of steps S1 and S2 is not limited.
Preferably, the metal foil is a copper foil; the thickness of the metal foil is more than or equal to 0.1 mm and less than or equal to 2 mm.
Preferably, the ceramic substrate is an aluminum nitride or silicon nitride ceramic substrate.
Preferably, both sides of the ceramic substrate are provided with conductive patterns.
In the present invention, the step S1 may be performed by performing thickness reduction on the non-conductive pattern region of the metal foil by mechanical milling, chemical etching, or laser ablation, and the step S4 may be performed by removing the non-conductive pattern region with the reduced thickness in the step S1 by mechanical milling, chemical etching, or laser ablation. According to an embodiment of the invention, the non-conductive pattern region is subjected to a thickness reduction process by a first etching process in step S1, and the non-conductive pattern region after the thickness reduction in step S1 is removed by a second etching process in step S4.
Preferably, in step S4, the non-conductive pattern area with the reduced thickness in step S1 is removed by a spray etching process.
More preferably, in step S4, after etching through the metal foil, the etching is continued on the sidewalls of the conductive pattern to reduce the protruding residual copper on the sidewalls.
According to an embodiment of the present invention, the thickness of the non-conductive pattern is reduced by 30 to 80% in step S1.
Preferably, the thickness of the non-conductive pattern is reduced by 40 to 70% in step S1.
According to an embodiment of the present invention, an active filler metal is disposed on the ceramic substrate in a screen printing process in step S2.
According to the preparation method of the ceramic circuit board, the conductive pattern is manufactured by processing the metal foil in two steps, and the two steps of processing are respectively performed from the two surfaces of the metal foil before and after the welding of the active brazing filler metal, so that the active brazing filler metal can be only arranged in the area, used for connecting the conductive pattern, on the ceramic substrate, and the using amount of the active brazing filler metal is reduced; the chemical etching step of the active solder is not needed, the processing time is shortened, the chemical pollution is reduced, the damage to the conductive pattern when the active solder is chemically etched is avoided, and the pattern precision is improved.
To more clearly illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and detailed description.
Drawings
FIG. 1 is a schematic structural view of a ceramic circuit board of embodiment 1 of the present invention;
FIG. 2 is a schematic structural view of a ceramic circuit board of embodiment 2 of the present invention;
FIG. 3 is a flow chart of an embodiment of a method of making a ceramic circuit board according to the present invention;
FIG. 4 is a schematic view of a structure in which a resist film is attached to a first surface of a metal foil;
FIG. 5 is a schematic diagram of the structure of the etched first surface of the metal foil;
FIG. 6 is a schematic structural view of an active brazing filler metal provided on a first surface of a ceramic substrate;
FIG. 7 is a schematic view of a structure in which a metal foil after a first etching is bonded to a first surface of a ceramic substrate;
FIG. 8 is a schematic structural view of a second surface of a metal foil with a resist film;
FIG. 9 is a schematic view of the structure when the metal foil is etched through from the second surface thereof;
FIG. 10 is a schematic view of a structure in which the protruding residual copper on the sidewall of the conductive pattern is reduced.
Detailed Description
Fig. 1 is a schematic structural view of a ceramic circuit board of embodiment 1 of the present invention. As shown in fig. 1, the ceramic circuit board is a single-sided circuit ceramic circuit board, and includes a ceramic substrate 20 and a conductive pattern 10, the ceramic substrate 20 has a first surface 21, and the conductive pattern 10 is connected to the first surface 21 of the ceramic substrate 20 by soldering through an active solder 30. The conductive pattern 10 includes a set of conductive traces 11 having gaps therebetween, such as gaps 12 between the conductive trace 111 and the conductive trace 112.
Fig. 2 is a schematic structural view of a ceramic circuit board of embodiment 2 of the present invention. As shown in fig. 2, the ceramic circuit board of example 2 is a ceramic circuit board of a double-sided circuit, including a ceramic substrate 20, a conductive pattern 10, and a conductive pattern 40; wherein, the conductive pattern 10 is welded on the first surface 21 of the ceramic substrate 20 through the active solder 30; the conductive pattern 40 is soldered to the second surface 22 of the ceramic substrate 20 by the active solder 30. The conductive pattern 10 includes a set of conductive lines 11 having a gap therebetween, and the conductive pattern 40 includes a set of conductive lines 41 having a gap therebetween.
In an embodiment of the present invention, the conductive pattern may be made of a metal conductive material such as aluminum, copper, or an alloy thereof, and preferably copper (including pure copper or a copper alloy). The thickness of the conductive pattern is preferably 0.1 mm to 2 mm, more preferably 0.2 mm to 1.5 mm, but the present invention is not limited thereto. The conductive pattern 10 and the conductive pattern 40 may have the same or different pattern designs, materials and thicknesses, and usually, the pattern designs are different, and the materials and the pattern thicknesses are the same.
In the embodiment of the present invention, the ceramic substrate 20 is preferably an aluminum nitride or silicon nitride ceramic substrate, and the thickness thereof can be selected according to actual needs, and is preferably 0.2 mm to 2 mm, such as 0.25 mm, 0.635 mm, 1 mm or 1.5 mm, but the present invention is not limited thereto.
In the embodiment of the present invention, the active solder 30 may be, for example, a silver copper titanium active solder, but the present invention is not limited thereto as long as the active solder can achieve reliable connection between the conductive pattern and the ceramic substrate 20.
Hereinafter, embodiments of a method for manufacturing a ceramic circuit board according to the present invention will be described with reference to fig. 3 to 10.
As shown in fig. 3, an embodiment of the method for manufacturing a ceramic circuit board of the present invention includes a step S1 of thinning the non-conductive pattern area from the first surface of the metal foil to a predetermined thickness. In step S1, a metal foil for forming a conductive pattern is provided, and a thickness reduction process is performed on a non-conductive pattern region from a first main surface of the metal foil.
Preferably, step S1 is performed by performing a thickness reduction process on the non-conductive pattern region by using a chemical etching method, and here, the etching reduction process performed on the copper foil used for forming the conductive pattern 10 is taken as an example. First, as shown in fig. 4, a copper foil 10 ' for forming the conductive pattern 10 is provided, and a region corresponding to the conductive pattern 10 on the first surface 101 of the copper foil 10 ' is covered with a first resist film RF1, that is, a region of the first surface 101 exposed to the resist film RF1 is a non-conductive pattern region of the copper foil 10 '.
Then, as shown in fig. 5, the non-conductive pattern area is subjected to a thickness reduction process by a first etching process (e.g., a spray etching process) to reduce the thickness of the non-conductive pattern area by 30-80%, preferably 40-70%, for example, as shown in fig. 5, the thickness of the non-conductive pattern area is reduced by about 50%, and a gap groove 121 is formed on the first surface 101 of the copper foil 10' after the thickness reduction.
In the first etching process of step S1, assuming that the target pitch of the pattern lines (e.g., the gap 12 between the conductive line 111 and the conductive line 112) is L, the windowing pitch of the resist RF1 is D1, and the etching depth is H1, L is controlled to D1+ H1.
The embodiment of the method for manufacturing a ceramic circuit board of the present invention further includes a step S2 of disposing an active filler metal on the ceramic substrate in a region corresponding to the conductive pattern. Wherein, the active solder can be arranged on the ceramic substrate by adopting a screen printing process, so that the active solder is only arranged on the area for connecting the conductive pattern on the ceramic substrate.
In preparing the single-sided wiring ceramic circuit board shown in fig. 1, an active solder 30 may be screen-printed on the first surface 21 of the ceramic substrate 20 at a region corresponding to the conductive pattern 10 as shown in fig. 6. It will be readily appreciated that in the preparation of a double-sided wiring ceramic circuit board such as that shown in fig. 2, it is also necessary to screen-print an active solder 30 on the second surface 22 of the ceramic substrate 20 in the region corresponding to the conductive pattern 40; here, the screen printing of the active filler metal 30 on both surfaces of the ceramic substrate 20 is performed separately.
The embodiment of the method for manufacturing a ceramic circuit board of the present invention further includes a step S3 of soldering the conductive pattern region of the first surface of the metal foil to the surface of the ceramic substrate. That is, the conductive pattern is placed onto the active filler metal with the ceramic substrate facing the first main surface of the metal foil in step S3, and the conductive pattern is soldered onto the ceramic substrate through the active filler metal.
Taking the connection of the conductive pattern 10 and the ceramic substrate 20 as an example, as shown in fig. 7, with the first main surface 101 of the ceramic substrate 20 facing the copper foil 10 '(i.e., the second main surface 102 of the copper foil 10' is relatively distant from the ceramic substrate 20), the conductive pattern 10 is placed on the active filler 30 of the first surface 21 of the ceramic substrate 20, and the conductive pattern 10 is soldered to the ceramic substrate 20 through the active filler 30. Since the respective components of the conductive pattern are soldered to the ceramic substrate in a connected state in step S3, the relative positions between the respective components in the conductive pattern can be accurately determined.
The embodiment of the preparation method of the ceramic circuit board further comprises the step S4: removing the non-conductive pattern areas with the reduced thickness of step S1 from the second main surface of the metal foil; preferably, step S4 uses a chemical etching method to remove the thinned non-conductive pattern region in step S1.
Here, the etching removal of the non-conductive pattern region of the copper foil 10' after the thickness reduction in step S1 will be described as an example. First, as shown in fig. 8, the second resist RF2 is covered on the second surface 102 of the copper foil 10 'in the area corresponding to the conductive pattern 10, that is, the area of the second surface 101 exposed to the resist RF2 is the non-conductive pattern area of the copper foil 10' thinned in step S1. Then, the non-conductive pattern area with the reduced thickness in the copper foil 10' is removed by a second etching process, which may also be a spray etching process.
Preferably, in step S4, if the target pitch of the pattern lines is L, the window pitch of the resist film RF2 is D2, and the etching depth is H2, L > D2+ H2 is controlled. Accordingly, the spray etching of step S4 is preferably controlled to include two stages: a first stage of etching through the copper foil 10' and a second stage of etching the sidewalls of the conductive pattern 10. As shown in fig. 9, in the first stage of step S4, the copper foil 10 'is etched through from the second main surface 102 of the copper foil 10' so that the respective constituent parts of the conductive pattern 10 are separated from each other to form the gap 12, and since L > D2+ H2, the pattern-line pitch of the second main surface 102 is smaller than the target pitch L at the time of completion of the first-stage etching; moreover, the sidewall of the conductive pattern 10 has protruding residual copper 122 formed by etching from different surfaces twice, and the protruding residual copper 122 usually has an adverse effect on the electrical performance of the ceramic circuit board.
As shown in fig. 10, in the second stage of step S4, after etching through the metal foil 10', the etching rate of the sidewalls of the conductive pattern 10 is continued, in which the etching rate of the protruding residual copper 122 is greater than that of other areas of the sidewalls, and after a certain period of time of continued etching, the pattern-line pitch of the second main surface 102 reaches the target pitch, and the protruding residual copper 122 is etched away, so that the sidewalls of the conductive pattern 10 are nearly vertical, and the pattern precision is higher.
The steps for fabricating the conductive pattern 40 can be referred to the fabrication of the conductive pattern 10, and are not described in detail.
In the embodiment of the preparation method of the ceramic circuit board, the metal foil is etched twice, the single etching amount is reduced, compared with the single etching in the prior art, the film compensation can be reduced by half, the width of residual copper is reduced by half under the condition of the same etching capacity, and the minimum pattern pitch is reduced. Particularly, the metal foil is etched twice, and the two times of etching are respectively carried out from the two surfaces of the metal foil before and after the welding of the active brazing filler metal, so that the active brazing filler metal can be only arranged in a region for connecting a conductive pattern on the ceramic substrate, and the using amount of the active brazing filler metal is reduced; the chemical etching step of the active solder is not needed, the processing time is shortened, the chemical pollution is reduced, the damage to the conductive pattern when the active solder is chemically etched is avoided, and the pattern precision is improved.
In other embodiments of the manufacturing method of the present invention, the thickness reduction process in step S1 may also adopt a method such as mechanical milling or laser ablation to reduce the thickness of the non-conductive pattern area by 30-80%, preferably 40-70%; step S4 may also remove the thinned non-conductive pattern region in step S1 by a metal material removal method such as mechanical milling or laser ablation.
Although the present invention has been described with reference to specific embodiments, these embodiments are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that various changes/substitutions may be made without departing from the scope of the invention, and it is intended that all equivalent changes and modifications made in accordance with the present invention shall be embraced by the scope of the invention.
Claims (10)
1. A preparation method of a ceramic circuit board comprises a ceramic substrate and a conductive pattern welded on the ceramic substrate through active solder; the preparation method comprises the following steps:
s1, providing a metal foil for forming the conductive pattern, and performing thickness reduction treatment on a non-conductive pattern area from the first main surface of the metal foil;
s2, arranging an active solder on the ceramic substrate; wherein the active filler metal is provided only on a region of the ceramic substrate for connecting the conductive pattern;
s3, placing the conductive pattern onto the active filler metal with the ceramic substrate facing the first major surface of the metal foil, and soldering the conductive pattern onto the ceramic substrate through the active filler metal;
s4, removing the non-conductive pattern area with the reduced thickness in the step S1 from the second main surface of the metal foil.
2. The production method according to claim 1, wherein the metal foil is a copper foil, and the thickness of the metal foil is 0.1 mm or more and 2 mm or less.
3. The production method according to claim 1, wherein the ceramic substrate is an aluminum nitride or silicon nitride ceramic substrate.
4. The production method according to claim 1, wherein both sides of the ceramic substrate are provided with a conductive pattern.
5. The method of claim 1, wherein: in step S1, the non-conductive pattern region is subjected to a thickness reduction process by a first etching process, and in step S4, the non-conductive pattern region with the reduced thickness in step S1 is removed by a second etching process.
6. The method of claim 5, wherein: in step S4, the non-conductive pattern area with the reduced thickness in step S1 is removed by a spray etching process.
7. The method of claim 6, wherein: in step S4, after etching through the metal foil, the sidewalls of the conductive pattern are continuously etched to reduce the protruding residual copper on the sidewalls.
8. The method of claim 1, wherein: in step S1, the thickness of the non-conductive pattern region is reduced by 30 to 80%.
9. The method of claim 7, wherein: in step S1, the thickness of the non-conductive pattern areas is reduced by 40-70%.
10. The method of claim 1, wherein: in step S2, an active filler metal is provided on the ceramic substrate by a screen printing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010699709.0A CN111787710A (en) | 2020-07-20 | 2020-07-20 | Preparation method of ceramic circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010699709.0A CN111787710A (en) | 2020-07-20 | 2020-07-20 | Preparation method of ceramic circuit board |
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| CN111787710A true CN111787710A (en) | 2020-10-16 |
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| CN202010699709.0A Pending CN111787710A (en) | 2020-07-20 | 2020-07-20 | Preparation method of ceramic circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114361301A (en) * | 2022-01-07 | 2022-04-15 | 井敏 | Method for interconnecting upper and lower conducting layers of ceramic substrate and substrate |
| CN114364133A (en) * | 2022-01-07 | 2022-04-15 | 井敏 | Metallized ceramic substrate and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177507A (en) * | 1992-12-10 | 1994-06-24 | Tanaka Kikinzoku Kogyo Kk | Manufacture of circuit substrate |
| CN105188269A (en) * | 2015-10-28 | 2015-12-23 | 广州杰赛科技股份有限公司 | Ultra-thick copper circuit board and manufacturing method thereof |
| CN108040435A (en) * | 2017-12-12 | 2018-05-15 | 北京科技大学 | A kind of aluminum nitride ceramic substrate circuit lithographic method |
-
2020
- 2020-07-20 CN CN202010699709.0A patent/CN111787710A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177507A (en) * | 1992-12-10 | 1994-06-24 | Tanaka Kikinzoku Kogyo Kk | Manufacture of circuit substrate |
| CN105188269A (en) * | 2015-10-28 | 2015-12-23 | 广州杰赛科技股份有限公司 | Ultra-thick copper circuit board and manufacturing method thereof |
| CN108040435A (en) * | 2017-12-12 | 2018-05-15 | 北京科技大学 | A kind of aluminum nitride ceramic substrate circuit lithographic method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114361301A (en) * | 2022-01-07 | 2022-04-15 | 井敏 | Method for interconnecting upper and lower conducting layers of ceramic substrate and substrate |
| CN114364133A (en) * | 2022-01-07 | 2022-04-15 | 井敏 | Metallized ceramic substrate and manufacturing method thereof |
| CN114364133B (en) * | 2022-01-07 | 2024-03-22 | 井敏 | Metallized ceramic substrate and manufacturing method thereof |
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