CN212970238U

CN212970238U - Novel LED rigid-flexible circuit board module

Info

Publication number: CN212970238U
Application number: CN202021625791.4U
Authority: CN
Inventors: 张�林
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-08-04
Filing date: 2020-08-04
Publication date: 2021-04-13
Anticipated expiration: 2030-08-04

Abstract

The utility model relates to a novel LED soft and hard combines circuit board module, particularly, the design openly has the flexible circuit board of a plurality of pads, accomplish the back with the flexible circuit board preparation, welding LED or LED and control element, at the circuit board back of the position that needs the sclerosis with the screen print resin, roast board makes the resin solidification, the resin after the solidification is hard resin, form the hardblock at the back after the solidification, make the circuit board become hard in the part that has the hardblock, it is still soft in all the other parts that do not have the hardblock, a novel LED soft and hard combines circuit board module has been made into promptly.

Description

Novel LED rigid-flexible circuit board module

Technical Field

The utility model relates to a LED lamp area field, concretely relates to novel LED rigid-flex circuit board module.

Background

The prior art for manufacturing the rigid-flex board has the following defects:

1. the LED flexible circuit board module in the prior art is a fully flexible circuit board module, and an LED and a control element are easy to fall off or break when the LED flexible circuit board module is bent.

2. The other type is a module made of LEDs welded by using a traditional rigid-flex board, but the traditional rigid-flex board is high in cost.

The prior art is used for manufacturing the rigid-flex board by the following methods:

firstly, an insulating plate or a metal plate is adhered to the back of the flexible circuit board through an adhesive at the position where the flexible board needs to be hardened to form a soft-hard combined board.

Secondly, in the process of manufacturing the circuit, the hard board copper-clad plate is bonded and pressed on the soft board by using an adhesive sheet, and then the circuit is manufactured in the hard board and the soft board area simultaneously to manufacture the circuit board with soft and hard combination.

Obviously, the two schemes are complex in process and high in cost.

In order to solve the problem, the utility model discloses take following method preparation LED soft or hard to combine circuit board module, overcome this new technique, the cost is reduced.

A flexible circuit board module with a plurality of bonding pads on the front surface is designed, LEDs or LEDs and control elements are welded after the flexible circuit board is manufactured, resin is printed on the back surface of the circuit board at positions needing hardening through a screen printing mode, baking is conducted to enable the resin to be solidified, the solidified resin is hard resin, hard blocks are formed on the back surface after solidification, the hard blocks on the circuit board are made to be hard, and the rest parts without the hard blocks are still soft, so that the novel LED flexible-hard circuit board module is manufactured.

SUMMERY OF THE UTILITY MODEL

According to the utility model provides a novel LED soft or hard combines circuit board module, include: LED or LED and control element; a flexible circuit board; a hard block-shaped resin block; the circuit board is characterized in that a flexible circuit board with a plurality of bonding pads on the front surface is designed and manufactured, LEDs or LEDs and control elements are soldered on the bonding pads on the front surface, resin which is firmly bonded and cured is applied to the back surface of the circuit board at positions needing to be hardened on the flexible circuit board to form one or more hard block-shaped resin blocks which are bonded on the back surface of the circuit board, a hard area is formed in the area with the hard block-shaped resin blocks of the circuit board, the LEDs and/or the control elements are soldered on the front surface of the circuit board in the hard area, the rest areas without the hard block-shaped resin blocks and the areas without soldering tin are still soft areas, the formed hard area is 1 hard area or a plurality of hard areas, and the formed soft area is 1 soft area or a plurality of soft areas, so that the circuit module is a novel LED soft-hard combination circuit module.

According to the utility model discloses a preferred embodiment, a novel LED soft or hard combines circuit board module, its characterized in that, the resin piece be polymer resin or polymer resin and inorganic filler.

According to the utility model discloses a preferred embodiment, a novel LED soft or hard combines circuit board module, its characterized in that, inorganic filler contain metal powder or/and graphite powder, the resin piece have good heat conduction.

According to a preferred embodiment of the present invention, the novel LED rigid-flex circuit board module is characterized in that the inorganic filler contains alumina or/and aluminum nitride, and the resin block has a good thermal conductivity.

According to the utility model discloses a preferred embodiment, a novel LED soft or hard combines circuit board module, its characterized in that, LED be flip-chip LED or just adorn chip LED.

According to the utility model discloses a preferred embodiment, a novel LED soft or hard combines circuit board module, its characterized in that, LED be the LED lamp pearl of encapsulation on the support.

According to the utility model discloses a preferred embodiment, a novel LED soft or hard combines circuit board module, its characterized in that, hard regional area, the area > 0.001 square centimeter, the area < 3600 square centimeter.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.

Drawings

The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.

FIG. 1 is a schematic plan view of a flexible printed circuit with LED devices.

FIG. 2 is a schematic plan view of a connected module of multiple rigid-flexible modules.

Fig. 3 is a schematic plan view of a single novel LED soft and hard combined circuit board module.

Fig. 4 is a schematic cross-sectional view of a single novel LED soft and hard combined circuit board module.

Detailed Description

The present invention will be described in detail below by taking preferred embodiments as examples.

It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.

Examples

Manufacturing method of flexible circuit board with LED (light-emitting diode) element

Solder paste is printed on the positions, where the components are pasted on the front sides, of the flexible single-sided circuit board or the flexible double-sided circuit board with the multiple bonding pads on the front side, then the flexible single-sided circuit board or the flexible double-sided circuit board is placed on a chip mounter, the LED components 1.1a are pasted on the solder paste, the LED components are welded on the circuit board through reflow soldering equipment with adjusted temperature, and the flexible circuit board 1.1 with the LED components is manufactured for standby (shown in figure 1).

Second, preparation of resin

1. Adding alumina powder into epoxy resin, stirring, pouring curing agent, and stirring.

2. Or adding aluminum powder into the epoxy resin, stirring uniformly, pouring the curing agent into the epoxy resin, and stirring uniformly.

Third, the manufacture of the steel mesh

And making hollow holes in the positions of the hard block resin blocks and the positioning holes of the steel mesh, and making the hollow steel mesh for later use.

Production of four-block and hard-block resin block

1. The manufactured hollowed steel mesh is installed on printing machine equipment, after debugging is well carried out, the flexible circuit board 1.1 is placed on an operation table board of the printing machine, the flexible circuit board 1.1 with welded elements is aligned with the steel mesh by taking the positioning holes as the standard, then the manufactured resin 1.2 is poured into the steel mesh and printed on the back face of the flexible circuit board 1.1, and after self-checking, the flexible circuit board 1.1 is placed on a thousand-layer rack one by one.

2. Curing

Adjusting the temperature of the oven to 150 ℃, putting the printed semi-finished product into the oven, baking for 1 hour, taking out after the resin is solidified, and cooling to room temperature to prepare a connected module of a plurality of modules with soft and hard combination (shown in figure 2).

Fifthly, forming

And cutting into single modules by using corresponding knife dies to manufacture a single novel LED soft and hard combined circuit board module (as shown in figures 3 and 4).

The present invention has been described in detail with reference to the accompanying drawings. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.

Claims

1. The utility model provides a novel LED soft or hard combines circuit board module, includes:

LED or LED and control element;

a flexible circuit board;

a hard block-shaped resin block;

the circuit board is characterized in that a flexible circuit board with a plurality of pads on the front surface is designed and manufactured, LEDs or LEDs and control elements are soldered on the pads on the front surface, a firmly-bonded and cured resin is applied to the back surface of the circuit board at positions needing to be hardened on the flexible circuit board, one or more hard block-shaped resin blocks are formed and are bonded on the back surface of the circuit board, a hard area is formed in the area with the hard block-shaped resin blocks of the circuit board, the LEDs and/or the control elements are soldered on the front surface of the circuit board in the hard area, the rest areas without the hard block-shaped resin blocks and the areas without soldering tin are still soft areas, the formed hard area is 1 hard area or a plurality of hard areas, and the formed soft area is 1 soft area or a plurality of soft areas.

2. The novel LED rigid-flexible circuit board module as claimed in claim 1, wherein the resin block is a polymer resin or a polymer resin plus an inorganic filler.

3. The novel LED rigid-flex circuit board module as claimed in claim 1, wherein the LED is a flip-chip LED or a front-chip LED.

4. The novel LED rigid-flexible circuit board module as claimed in claim 1, wherein the LED is an LED bead packaged on a support.

5. The novel LED rigid-flexible circuit board module as claimed in claim 1, wherein the area of the rigid region is greater than 0.001 square centimeter and less than 3600 square centimeter.