JP2005051204A - Module for mounting electrical component and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To attain high precision mounting of an electronic part, to prevent short circuiting between wiring patterns, and to improve heat release performance. <P>SOLUTION: A structure is provided wherein the surface mounting electrical part 104 having a terminal electrode 104a is mounted on an electrically insulating substrate 101. A recess 101a is provided on a surface of the substrate 101. The wiring pattern 102 to be connected to the electrical part 104 is provided at the recess 101a. The electrical part 104 is mounted on the substrate 101 with the terminal electrode 104a of the electrical part 104 being faced to the recess 101a and with a part mounting surface being entirely in contact with the surface of the substrate 101. Thus, the terminal electrode 104a is electrically connected to the wiring pattern 102. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electrical component mounting module in which electrical components are mounted on a printed wiring board made of an electrically insulating base material, an electrical component mounting module in which the printed wiring is sealed using an insulating material, and an electrical insulating base material used therefor The present invention relates to a method for manufacturing and mounting an electrical component mounting module, and a method for manufacturing an electrically insulating substrate.

  Conventionally, when mounting electrical components such as chip resistors, chip capacitors, and chip ICs on a printed wiring board that has been formed with a wiring pattern using a subtractive method that is highly mass-productive and can reduce manufacturing costs, the following methods are generally used: Taken. That is, each electric component is placed on the printed wiring board after the terminal electrodes of the individual electric components are aligned with the land pattern of the printed wiring board using a chip mounter. Then, the terminal electrode of an electrical component is soldered to the land pattern on a printed wiring board by a reflow process.

  With recent high performance and miniaturization of electronic devices, higher density and higher functionality are required for semiconductor devices. In order to satisfy such requirements, a small and high-density printed wiring board for mounting a semiconductor device or an electrical component is required.

However, a printed wiring board manufactured by the subtractive method has a structure in which a wiring pattern protrudes from the substrate surface. In a mounting board having such a configuration, after forming bumps on an electrical component or a semiconductor device, and mounting these components on a printed wiring board using a solder or a conductive adhesive,
・ It is difficult to mount solder or conductive adhesive on the printed circuit board.
・ Bumps are misaligned between wiring patterns, causing short circuits.
・ Electric parts (including semiconductor devices) are likely to be misaligned or have solder flow.
There is an inconvenience. These disadvantages are caused mainly by the fact that the wiring pattern formed by the subtractive method protrudes structurally from the substrate surface.

  Therefore, recently, the additive method tends to be adopted. The additive method is a method in which a wiring pattern is formed on a substrate surface on which a resist layer is formed by plating using the resist layer as a mask. By this method, a wiring pattern having a line width of about 30 μm can be formed. However, the additive method has a problem that the adhesion strength between the substrate and the wiring pattern is weaker than the subtractive method.

  In view of this, various methods have been devised in which a fine wiring pattern is formed and pattern inspection is performed, and then only a non-defective wiring pattern is transferred to a desired substrate. The first transfer method is a method in which a fine wiring pattern is printed on the surface of a carbon plate and fired, and then the wiring pattern is transferred to a ceramic substrate or the like.

  The second transfer method is a method in which a wiring pattern made of copper foil is formed on a releasable support plate, and then the wiring pattern is transferred to a prepreg (see, for example, Patent Document 1 and Patent Document 2).

  The third transfer method is a method of transferring to a substrate using a copper foil as a wiring pattern and utilizing a difference in the degree of adhesion between a roughened surface and a glossy surface (see, for example, Patent Document 3).

  The wiring pattern transferred by using such a transfer method has a shape embedded without protruding from the substrate surface. Therefore, the surface of the wiring board obtained by this method has a flat structure, and the problem due to the protrusion of the wiring pattern as described above hardly occurs.

Further, by using an insulating material as a means for mounting at a higher density, the surface of the electrically insulating substrate on which the electrical component is mounted is further sealed, and a wiring pattern is formed on the surface of the insulating material, thereby providing a multilayer substrate. The method of trying to achieve high density by manufacturing the sapphire has been studied
Japanese Patent Laid-Open No. 10-84186 (pages 1-8) JP 10-41611 A (pages 1-13) JP-A-8-330709 (page 1-6) JP 2001-244368 A

  In the current situation where further miniaturization is progressing in the conventional configuration, sufficient strength is ensured between the electrical component and the joint portion of the electrically insulating base material, and reliability is ensured in a narrower pitch mounting. There is a problem that it is difficult.

  In addition, there is a problem that initial connection failure is likely to occur when an electrical component or a semiconductor device is connected to the electrically insulating substrate. Specifically, wiring patterns caused by initial connection failure due to misalignment of mounting components when mounting electrical components or semiconductor devices on wiring, or by flowing out of conductive adhesive during mounting or soldering during reflow Such as a short circuit.

Such inconvenience is to meet the demand for further miniaturization of electrical components.
・ The distance between electrical parts becomes narrower.
・ Narrow pitch of semiconductor chips with flip chip mounting or semiconductor packages having a ball grid array (BGA) structure is being promoted.
This is a big issue.

  In order to cope with downsizing and narrowing of the pitch, in the situation where additional setting of precise processes and accompanying increase in equipment must be carried out, the initial connection failure is more likely to occur, which is This is a factor that increases manufacturing costs.

  Also, in a method for producing a multilayer substrate with a built-in electrical component in which an electrically insulating substrate surface on which an electrical component is mounted using an insulating material is sealed and a wiring pattern is formed on the insulating material surface, the electrical component is When using solder for the method of connecting to the electrical insulating substrate, if the distance between the terminal electrodes of the electrical component is extremely short, the volume of the solder after sealing will be expanded by remelting, and the solder bridge on the lower side of the electrical component As a result, problems such as a decrease in yield occur, and there is a limit to narrow pitch mounting for higher density.

  The present invention includes an electrical component having terminal electrodes and an electrically insulating substrate on which the electrical component is mounted. A recess is provided on the surface of the electrically insulating substrate. A wiring pattern connected to the electrical component is provided in the recess. The electrical component is mounted on the electrical insulating base material in a state where the terminal electrode is opposed to the concave portion and the mounting surface is attached to the base material surface of the electrical insulating base material. A conductive material is provided in the recess, and the wiring pattern and the terminal electrode are electrically connected via the conductive material.

  By the structure of this invention, an electrical component can be stably arrange | positioned because the mounting surface of an electrical component and the base-material surface of an electrically insulating base material contact | connect, and a connection is reinforced.

  Improve productivity by eliminating misalignment of electrical components that occur when electronic components are mounted on electrically insulating substrates, and poor connection and short-circuiting of conductive materials caused by conductive materials entering under the mounting surface of electrical components. Yield can be reduced.

  Since the mounting surface of the electrical component and the electrically insulating base material excellent in thermal conductivity are surely brought into contact with each other, the heat generated in the module can be quickly dissipated, and long-term reliability can be obtained. This is because the mounting surface of the electrical component can be mounted so as to be in contact with the electrical insulating substrate material, so that the molten conductive material can be prevented from flowing out, and the conductive material can be prevented from contacting under the electrical component. It is because the improvement of sex can be expected. In this case, if the conductive material is a conductive adhesive containing a thermosetting resin and a conductive filler, or solder, this effect is enormous.

  Further, according to the present invention, the electrical component has a plurality of the terminal electrodes, and the electrically insulating substrate has a recess corresponding to each of the terminal electrodes, and the recesses are opposed to the terminal electrodes. Preferably, the wiring pattern is provided in each of the recesses. This is because, even in an electrical component having a plurality of terminal electrodes, it is possible to mount the electrical component so as to be in contact with the surface of the electrically insulating base material, thereby exhibiting the above-described effects.

  In the present invention, it is preferable that the recess has a depth in which the terminal electrode is accommodated between the wiring pattern surface and the substrate surface. Furthermore, it is preferable that the depth dimension of the recess is 3 μm to 20 μm. This is because the depth of the concave portion can prevent the conductive material from flowing to the outside, thereby suppressing a short circuit between electrical components and between wiring patterns. This exerts a tremendous effect in mounting each electrical component at a high density.

Moreover, it is preferable that this invention is that an electrically insulating base material consists of an inorganic filler and a thermosetting resin. Producing a prepreg having excellent thermal conductivity by using a mixture of an inorganic filler (any of Al ₂ O ₃ , MgO, BN, AlN, and SiO ₂ ) and a thermosetting resin as the electrically insulating substrate. This is because it is possible to obtain a special effect that can quickly dissipate heat generated from components and semiconductors. Furthermore, excellent heat resistance and electrical insulation can be obtained by using an epoxy resin, a phenol resin or a cyanate resin as the main component of the thermosetting resin composition.

  Further, the present invention provides at least one reinforcing material selected from a glass fiber woven fabric, a glass fiber non-woven fabric, a heat-resistant organic fiber woven fabric, and a heat-resistant organic fiber non-woven fabric, and heat It is preferable to impregnate the curable resin composition. At least one reinforcing material selected from glass fiber woven fabric, glass fiber non-woven fabric, heat-resistant organic fiber woven fabric and heat-resistant organic fiber non-woven fabric as the electrically insulating substrate, and a thermosetting resin composition for the reinforcing material This is because the use of a prepreg impregnated with a high reinforcing effect makes it easy to handle in production and manufacturing processes.

  In the present invention, the conductive material is preferably a mixture of a thermosetting resin and a conductive filler, or solder. This is because the electrical connection can be obtained by mounting the electrical component on the electrically insulating substrate and then melting the conductive material in a reflow process and curing the conductive material again. Furthermore, the conductive filler is at least one metal powder selected from silver, copper, and nickel, and an electrical connection can be obtained by including a thermosetting resin and a curing agent.

  Further, the present invention is a semiconductor chip in which the electrical component is flip-chip mounted, or a semiconductor package in which at least an electrical connection portion is resin-sealed, and the mounting surface of the semiconductor chip or the semiconductor package is the electrically insulating substrate. It is preferable to be in contact with a protruding portion made of a material. By forming a recess in the wiring pattern to be connected and mounting the semiconductor chip / semiconductor package, it is possible to suppress the outflow of conductive material (solder, etc.) that occurs during mounting, thereby eliminating the possibility of a short circuit. Narrower pitch mounting is possible. In addition, by using an electrically insulating substrate in contact with the mounting surface of the semiconductor chip / semiconductor package as an electrically insulating substrate having excellent thermal conductivity, it is possible to quickly dissipate heat generated in the semiconductor. Further, the positional deviation that occurs during the mounting of the manufacturing can be suppressed by the convex portions (bumps) provided on the semiconductor chip / semiconductor package by using the concave portions provided on the electrical insulating base material, thereby improving productivity. However, it is possible to improve efficiency.

  In the present invention, the wiring pattern and the electronic component are electrically connected via the conductive material in the form of providing a gap between the electrically insulating base material, the surface on which the electronic component is attached, and the conductive material. It is preferable that the entire surface of the electrically insulating base material to which the electrical component is connected is sealed with an insulating material.

  Then, the following effects can be obtained. In the process of sealing the surface of the electrically insulating substrate on which the electrical component is mounted with an insulating material, the subsequent mounting of another electrical component, or the process of mounting the electrical component mounting module on another electrically insulating substrate The heat treatment may be performed. When such heat treatment is carried out, the electrical material flows down to the mounting surface due to remelting of the conductive material in the sealed module, resulting in poor connection and short-circuiting of the conductive material. It is feared that it will cause defects. On the other hand, if the gap is provided in the initial mounting stage according to the configuration of the present invention, the remelted conductive material is accommodated in the gap and the outflow is suppressed. Thereby, there is no connection failure / short circuit of the conductive material due to the remelted conductive material, and the connection accuracy is further increased accordingly.

  In this case, it is preferable that the insulating material contains at least a thermosetting resin. This is because excellent heat resistance and electrical insulation can be obtained by using an epoxy resin, a phenol resin or a cyanate resin as the main component of the thermosetting resin composition.

  Moreover, it is preferable that the said insulating material is comprised with the same composition as the said electrically insulating base material. This is because high reliability can be secured by combining physical property values such as a linear expansion coefficient and an elastic coefficient.

A method for manufacturing an electrical component mounting module according to the present invention includes:
A step of preparing a wiring pattern-formed base layer having a wiring pattern on one side of the base layer;
A step of removing the wiring pattern forming surface of the base layer on which the wiring pattern has been formed halfway through the base layer leaving a base plate region below the wiring pattern;
A step of preparing an uncured prepreg, and laminating the wiring pattern formed base layer on the prepreg so that the wiring pattern formation surface faces the prepreg;
・ By heating and pressurizing the laminated prepreg and the wiring pattern formed base layer, the prepreg is made into an electrically insulating substrate, and the formed electrically insulating substrate and the wiring pattern formed base layer are , The step of integrating the wiring pattern in a state where it is pushed in the middle of the base material in the thickness direction of the electrically insulating base material,
-Removing the base layer from the wiring pattern-formed base layer integrated with the electrically insulating substrate to form a recess in the surface of the electrically insulating substrate and providing the wiring pattern in the recess; -Providing a conductive material in the recess;
A step of mounting the electrical component on the electrically insulating substrate so that the terminal electrode faces the recess;
Curing the conductive material and fixing the electrical component on the electrically insulating substrate via the conductive material, and electrically connecting the terminal electrode and the wiring pattern via the conductive material; ,
Is included.

Another production method of the present invention is as follows:
A step of preparing a base layer with a wiring pattern provided with a wiring pattern on one side of the base layer;
A step of preparing an uncured prepreg, and laminating the wiring pattern formed base layer on the prepreg so that the wiring pattern formation surface faces the prepreg;
-Heating and pressing the laminated prepreg and the wiring pattern formed base layer to make the prepreg an electrically insulating substrate, and forming the formed electrically insulating layer substrate and the wiring pattern formed base layer , The step of integrating the wiring pattern in a state where it is pushed in the middle of the base material in the thickness direction of the electrically insulating base material,
The wiring pattern embedded in the electrically insulating substrate with the pattern surface exposed to the outside by removing the base layer from the wiring pattern formed base layer integrated with the electrically insulating substrate. Forming, and
-Removing a part of the wiring pattern from the pattern surface to form a concave portion continuous on the surface of the electrically insulating substrate on the wiring pattern;
-Providing a conductive material in the recess;
A step of mounting the electrical component on an electrically insulating substrate so that the terminal electrode faces the recess;
The step of curing the conductive material and fixing the electrical component on the electrically insulating substrate via the conductive material, and electrically connecting the terminal electrode and the wiring pattern via the conductive material. When,
Is included.

  According to these production methods of the present invention, an electrically insulating substrate having a recess and having a wiring pattern provided in the recess can be produced using existing equipment. Further, by attaching the electrical component and the electrically insulating substrate, the electrical component can be stably mounted on the electrically insulating substrate by increasing the contact area, and the connection strength is increased. Further, it is possible to prevent a short circuit caused by a phenomenon such that the liquefied conductive material protrudes around the wiring pattern during reflow. This is because the substrate surface and the mounting surface of the electrical component are bonded together, so that the flow down to the component can be suppressed, and the conductive material is provided in the recess to prevent excessive flow of the conductive material. It depends on. Thus, in the manufacturing method of the present invention, it is possible to prevent misalignment at the time of mounting a smaller electrical component and a connection failure such as a solder bridge that short-circuits between the remelted conductive material wiring patterns.

  In the manufacturing method of the present invention, terminal electrodes (such as bumps) provided on a semiconductor chip (semiconductor package) are aligned with an electrically insulating substrate in a semiconductor chip by flip chip mounting or a semiconductor package having a BGA structure. Work can be easily and accurately performed. This is an effect that utilizes the fact that the terminal electrode naturally enters the recess due to the self-alignment effect.

  The recess is preferably formed by an etching method, preferably a chemical etching method. This is because the depth of the recess can be easily adjusted with high accuracy by controlling the etching time.

  Moreover, in the said structure, it is preferable to use the said wiring pattern formed base layer that the said metal layer and the said base layer are comprised from the same kind of metal. If it does so, it will become possible to form the recessed part of the same shape as the wiring pattern formed in the surface layer part of a base layer with processes, such as an etching. In this case, since there is no difference in thermal expansion coefficient between the base layer and the metal layer, pattern distortion hardly occurs during heating, which is suitable for transferring a fine wiring pattern.

  Further, in the above configuration, it is preferable that the base layer is selected from aluminum, silver, and nickel, and the metal layer is made of copper. Among these, it is preferable to use a copper foil. By using a copper foil, it is possible to make it excellent in electrical conductivity, and it is possible to manufacture an electrically insulating substrate on which a wiring pattern is formed at a very low cost. Particularly preferred is electrolytic copper foil. In addition, the said metal may be one type and may use 2 or more types together.

Moreover, in the said structure, it is preferable that the depth of a recessed part is the range of 3 micrometers-20 micrometers. It is because the effect which suppresses a conductive material flow can be acquired by having such a dent.
In the manufacturing method of the present invention, the base layer can be made of a metal film using copper, aluminum, silver, nickel, or the like, or a resin film using PET / polyimide, etc., and the cost can be reduced. It is extremely useful industrially.

  In this case, it is preferable to remove the surface of the wiring pattern by etching, so that the surface of the wiring pattern can be removed with high accuracy. Further, as a pretreatment when etching the wiring pattern surface, a resist layer is formed on the wiring pattern forming surface of the electrically insulating substrate excluding the wiring pattern surface, and after the wiring pattern surface is etched. As the treatment, it is preferable to remove the resist layer. By doing so, the wiring pattern can be selectively etched by the resist layer, and by forming only the portion where the conductive material is applied in the recess, the wiring pattern can be finer by not damaging other wiring patterns. A substrate with a simple wiring pattern can be realized. In addition, by mounting so that the mounting surface of the electrical component to be mounted and the wiring pattern protected by the resist layer and not recessed are brought into contact with each other, the electrical component is quickly radiated to obtain an effect of more efficiently radiating heat. be able to.

  Furthermore, the etching performed in this case is preferably chemical etching. Then, other wiring patterns formed at a narrow pitch are not removed by the etching process, and the effect of improving the connectivity and suppressing the flow of the conductive material can be obtained.

  In these production methods of the present invention, when the electrical component mounting surface of the electrically insulating substrate is sealed with an insulating material while maintaining the gap, the following configuration is preferable. That is, a conductive material is provided in the recess with a gap provided in the recess. And while fixing the said electrical component on the said electrically insulating base material via the said electrically conductive material in the state which maintained the said space | gap, the said terminal electrode and the said wiring pattern are electrically connected via the said electrically conductive material. Furthermore, the electrical component mounting surface of the electrically insulating substrate is sealed with an insulating material while maintaining the gap. Then, even if the conductive material is remelted by heat generated when the electric component mounting surface of the electric insulating substrate is sealed with an insulating material or heat generated in a later process, the remelted conductive The material is housed in the gap remaining in the recess and does not flow out. Such outflow of the remelted conductive material causes a decrease in connection accuracy. However, in the present invention, since the remelted conductive material is absorbed by the gap, the electrical connection accuracy is increased by that amount.

  As described above, according to the electrical component mounting module of the present invention, the mounting surface of the electrical component is mounted so that the mounting surface of the electrical component is in contact with the surface of the electrically insulating substrate, thereby increasing the contact area. It is possible to suppress the positional deviation and stably mount the circuit board. Thereby, the electrical connection intensity | strength of an electrical component can be raised.

  Further, it is possible to prevent a problem that the terminal electrode of the electrical component is short-circuited by the conductive material liquefied at the time of reflow by attaching the electrically insulating base material and the electrical component to each other and storing the conductive material in the recess. it can. In addition, in the initial mounting, the conductive material is formed so as to provide a gap between the surface of the electrically insulating base material and the surface of the electrical component. Heat curing of electrically insulating substrate for sealing parts, reflow for mounting other electrical components, reflow for mounting electrical component mounting modules on other electrically insulating substrates, etc. The conductive material in the electrically insulating base material sealed by the heating process expands by remelting, and the conductive material that has nowhere to flow flows into the surface where the electrically insulating base material and the electrical component are in contact with each other. The problem of short-circuiting can be prevented.

  Furthermore, by configuring the electrically insulating base material that is bonded to the mounting surface of the electrical component / semiconductor with a mixture of an inorganic filler and a thermosetting resin, the thermal conductivity of the base material itself is increased. It is possible to obtain a special effect that heat generated from the apparatus) can be quickly dissipated.

  In electrical parts consisting of a semiconductor chip by flip chip mounting or a semiconductor package having a BGA structure, it is possible to prevent misalignment during mounting and to prevent a conductive material from flowing under the semiconductor chip / semiconductor package. Narrow pitch mounting can be performed. As a result, it is possible to achieve higher performance and smaller size, which are required for recent electronic devices.

  In addition, the method for manufacturing an electrical component mounting module of the present invention is not significantly different from the conventional mounting substrate manufacturing process, and the recess is formed by controlling the etching time or the like for the metal layer for forming the wiring pattern. It becomes possible. By being able to manufacture using conventional manufacturing equipment, the burden on equipment costs can be reduced, and initial defects during mounting can be suppressed to improve reliability, thereby reducing yield and improving productivity.

  As described above, according to the present invention, the concave portion is provided in the electrically insulating base material, and the electrical component is mounted to suppress the connection failure with a high connection strength. By providing a gap between the conductive materials, poor connection due to remelting of the conductive material can be suppressed, and furthermore, by adding a function to the electrical insulating base material, an extremely reliable electrical component with excellent heat dissipation A mounting module can be easily manufactured.

  The present invention is an electrical insulating substrate having a wiring pattern on at least the front and back surfaces of the electrical insulating substrate as an aspect of the first electrical component mounting module, and all of the wiring patterns formed on the front and back surfaces Alternatively, a part of the surface is disposed at a position recessed from the surface of the electrically insulating base material, and a conductive material is formed in the recessed portion at an arbitrary location for electrical connection with an external terminal of an electrical component, And the mounting surface of the said electrical component is adhere | attached on the said electrically insulating base material surface, The electrical component mounting module characterized by the above-mentioned is provided.

  Hereinafter, an electric component mounting module according to the best embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1)
1A and 1B are cross-sectional views showing the configuration of the electrical component mounting module according to Embodiment 1 of the present invention. In FIG. 1A, reference numeral 101 denotes an electrically insulating substrate. Reference numeral 102 denotes a wiring pattern formed on the electrically insulating substrate 101. Reference numeral 104 denotes a chip component as an example of an electrical component mounted on the wiring pattern 102. An example of the chip component may be a chip resistor or a chip capacitor. 104 a is a terminal electrode of the chip component 104.

  In FIG. 1B, reference numeral 101 denotes an electrically insulating substrate. Reference numeral 102 denotes a wiring pattern formed on the electrically insulating substrate 101. Reference numeral 103 denotes a conductive material. The conductive material 103 is a conductive material that electrically connects the wiring patterns 102 formed on the electrically insulating substrate 101, and is composed of solder or a conductive adhesive. Reference numeral 105 denotes a semiconductor device as an example of an electrical component mounted on the wiring pattern 102. The semiconductor device 105 may be a semiconductor chip or a semiconductor package. Reference numeral 106 denotes a terminal electrode formed on the semiconductor mounting surface. The terminal electrode 106 is made of, for example, a metal bump.

  The present embodiment is characterized in that a recess 101a is provided on the surface of the electrically insulating substrate 101, and the wiring pattern 102 is disposed in the lower portion of the recess 101a. The recess 101a is provided corresponding to each terminal electrode 104a, 106. The spacing between the recesses 101a is set to the same spacing (same formation pitch) as the spacing between the plurality of terminal electrodes 104a and 106. The size of the opening of each recess 101a (depth dimension × width w1 in the figure) is equal to or larger than the size of the terminal electrodes 104a, 106 (depth dimension × width w2 in the figure). When the chip component 104 or the semiconductor device 105 is mounted on the electrically insulating substrate 101 in a state where the terminal electrodes 104a and 106 are aligned with the recesses 101a, the terminal electrodes 104a and 106 are accommodated in the recesses 101a, and the wiring patterns 102 are accommodated. Opposite to. The terminal electrodes 104 a and 106 are arranged so as to protrude from the mounting surface of the chip component 104 or the semiconductor device 105. Therefore, when the terminal electrodes 104a and 106 are accommodated in the recess 101a, the mounting surfaces of the chip component 104 and the semiconductor device 105 are surely attached to the electrically insulating substrate 101, and the thermal conductivity between them is good. Become.

  The depth dimension h in the recess 101a is set in the range of 3 μm to 20 μm. The conductive material 103 is disposed in the recess 101a and extends from the wiring pattern 102 to the terminal electrode 104a. The conductive material 103 electrically connects the wiring pattern 102 and the terminal electrodes 104a and 106. Since the mounting surface of the chip component 104 or the semiconductor device 105 and the substrate surface (electronic component mounting surface) of the electrically insulating substrate 101 are attached, the conductive material 103 is made of the components 104 and 105 and the electrically insulating substrate. 101. Accordingly, there is no problem such as a short circuit caused by the conductive material 103 entering between the component and the board. Further, the components 104 and 105 can be mounted on the electrically insulating substrate 101 in a stable state. As a result, it is possible to mount the components 104 and 105 without any misalignment, and the connection can be reinforced accordingly.

  In this embodiment, a cured product of a prepreg made of a mixture of an inorganic filler and a thermosetting resin is used as the electrically insulating substrate 101. Since the cured prepreg itself has excellent thermal conductivity, heat generated during component mounting can be quickly dissipated. Therefore, the electrical component mounting module of the present embodiment is extremely reliable even for that amount.

As said thermosetting resin, an epoxy resin, a phenol resin, and cyanate resin can be mentioned, for example. At this time, as a method for controlling the elastic modulus and glass transition temperature of the thermosetting resin at room temperature, the resin composition can be obtained by adding a resin having a low elastic modulus or low glass transition temperature at room temperature. Examples of the inorganic filler include Al ₂ O ₃ , MgO, BN, AlN, and SiO ₂ . Further, if necessary, a coupling agent, a dispersant, a colorant, and a release agent can be further added to the composite of the inorganic filler and the thermosetting resin. The semiconductor device is not limited to a power element that is a silicon semiconductor, but a bipolar element, a MOS element, or a silicon-germanium semiconductor, a gallium arsenide semiconductor, or the like having a low mechanical strength can also be used. Further, when the wiring pattern 102 can be made of copper foil and has a nickel or gold plated surface, stable electrical connection with the terminal electrodes (metal bumps) 106 on the semiconductor device 105 can be obtained. As the terminal electrode 106, a gold bump can be used, and a two-step bump formed by a wire bonding method or a bump by gold plating can be used.

  FIG. 2A to FIG. 2G are cross-sectional views illustrating the first manufacturing method of the electrical component mounting module according to this embodiment.

  As shown in FIG. 2A, a sheet-like metal 209 is prepared in which a metal layer 203 ′ is laminated on a main surface of a base layer 201 as a carrier with a release layer 202 interposed therebetween. The metal copper foil is preferably a rolled copper foil having good transportability and electrical resistance as a carrier.

  As shown in FIG. 2B, after a resist layer 207 that defines a region to be finally left as the wiring pattern 203 is formed on the metal layer 203 ′, unnecessary portions of the metal layer 203 ′ are formed using the resist layer 207 as a mask. By removing by etching, a wiring pattern 203 is formed. Thereafter, the resist layer 207 is removed, and a desired wiring pattern 203 is formed on the base layer 201. Thereby, the wiring pattern formed base layer 210 is formed. At this time, the metal layer 203 ′ is etched using the resist layer 207 as a mask to form the wiring pattern 203, then the release layer 202 is etched, and the surface layer portion of the base layer 201 excluding the lower position of the wiring pattern 203 is Subsequently, it is removed by etching. As a result, a convex portion 208 is formed in the base layer 201 at a position below the wiring pattern 203. In this case, by controlling the etching time, the height of the convex portion 208 can be arbitrarily set by removing the surface layer of the base layer 201 to a predetermined depth.

  As shown in FIG. 2C, an uncured prepreg 204 ′ is prepared, and the prepreg 204 ′ and the wiring pattern formed base layer 210 are aligned and overlapped. Further, the wiring pattern forming portion of the wiring pattern formed base layer 210 is buried in the prepreg 204 ′ and integrated. At this time, the wiring pattern 203 is integrated in a state in which the height dimension h1 of the convex portion 208 is pushed in the middle of the base material in the thickness direction of the electrically insulating base material prepreg 204 ′. By applying heat and pressure in this state, the prepreg 204 ′ and the wiring pattern formed base layer 210 are integrated. Further, the prepreg 204 ′ is cured by heating and pressing to form the electrically insulating substrate 204.

  As shown in FIG. 2D, the base layer 201 is peeled from the wiring pattern-formed base layer 210 integrated with the electrically insulating base material 204. The base layer 201 can be easily peeled by providing the peeling layer 202. By peeling the base layer 201, a recess 211 is formed on the surface of the electrically insulating substrate 204, and the wiring pattern 203 is arranged and fixed on the bottom of the recess 211. The depth dimension h2 of the recess 211 is uniquely defined by the height dimension h2 of the protrusion 208.

  As shown in FIG. 2E, a conductive material 205 is applied to all or arbitrarily selected recesses 211. Examples of the conductive material 205 include a conductive adhesive obtained by kneading solder, gold, silver, copper, silver-palladium alloy or the like with a thermosetting resin. Also, a combination of solder and a conductive adhesive is possible, and molten solder may be used.

  As shown in FIG. 2 (f), the terminal electrode 206a of the electric component 206 is aligned so as to face the recess 211 (wiring pattern 203) and enter the inside thereof. In this state, the electric component 206 is mounted on the electric insulating base material 204 so that the mounting surface of the electric component 206 is attached to the electric insulating base material 204. At this time, since the terminal electrode 206a enters the recess 211, the electrical component 206 is accurately (self-aligned) with high accuracy.

  In this state, the conductive material 205 is heat-treated to dissolve the conductive material 205, whereby the electrical component 206 is adhered onto the electrically insulating substrate 204 and the terminal electrode 206 a is electrically connected to the wiring pattern 203.

  FIGS. 3A to 3G are cross-sectional views illustrating the second manufacturing method of the electric component mounting module according to this embodiment. In the figure, 301 is a base layer, 302 is a release layer, 303 is a wiring pattern, 303 ′ is a metal layer, 304 is an electrically insulating substrate, 304 ′ is a prepreg, 305 Is a conductive material, 309 is a sheet metal, 310 is a base layer on which a wiring pattern is formed, and 311 is a recess.

  3A and 3B, a wiring pattern-formed base layer 310 in which a desired wiring pattern 303 is formed on the base layer 301 is formed. These steps are the same as those described above with reference to FIGS. 2 (a) and 2 (b). However, in this manufacturing method, the base layer 301 is not removed by etching, and the thickness is maintained as it is throughout the entire layer. Further, the thickness of the metal layer 303 ′ is made thicker by the depth of the recess 311 than the thickness of the finally formed wiring pattern 303.

  As shown in FIG. 3C, an uncured prepreg 304 ′ is prepared, and the prepreg 304 ′ and the wiring pattern formed base layer 310 are aligned and overlapped. Further, the recess 311 is formed in the wiring pattern formed base layer 310 by pushing the wiring pattern formed base layer 310 through the wiring pattern forming portion of the wiring pattern formed base layer 310. The wiring pattern 303 is buried in the prepreg 304 ′ in a form stored in the formed recess 311. By applying heat and pressure in this state, the prepreg 304 ′ and the wiring pattern formed base layer 310 are integrated. Further, the prepreg 304 ′ is cured by heating and pressing to form the electrically insulating substrate 304.

  As shown in FIG. 3D, the base layer 301 is peeled from the wiring pattern-formed base layer 310 integrated with the electrically insulating base material 304. By peeling the base layer 301, the wiring pattern 303 is fixed in a state where it is substantially flush with the surface of the electrically insulating substrate 304.

  As shown in FIG. 3E, the surface of the wiring pattern 303 is removed by an etching process. As a result, a recess 311 is formed on the surface of the electrically insulating substrate 304.

  As shown in FIG. 3F, a conductive material 305 is applied to all or arbitrarily selected recesses 311. An example of the conductive material 305 is a conductive adhesive obtained by kneading solder, gold, silver, copper, silver-palladium alloy or the like with a thermosetting resin. Also, a combination of solder and a conductive adhesive is possible, and molten solder may be used.

  As shown in FIG. 3G, the terminal electrode 306a of the electrical component 306 is aligned so as to face the recess 311 and enter the inside thereof. Then, the electrical component 306 is mounted on the electrical insulating base material 304 so that the mounting surface of the electrical component 306 is attached to the electrical insulating base material 304. By applying heat treatment to the conductive material 305 in this state, the electrical component 306 is bonded onto the electrically insulating substrate 304 and the terminal electrode 306a is electrically connected to the wiring pattern 303 by melting the conductive material 305.

  FIG. 4A to FIG. 4I are cross-sectional views showing the third manufacturing method of the electric component mounting module according to this embodiment. In the figure, 401 is a base layer, 402 is a release layer, 403 ′ is a metal layer, 404 is an electrically insulating substrate, 404 ′ is a prepreg, 405 is a conductive material, 409 Is a sheet metal, 410 is a base layer on which a wiring pattern is formed, and 411 is a recess.

As shown in FIGS. 4A to 4D,
Forming a wiring pattern-formed base layer 410 in which a desired wiring pattern 403 is formed on the base layer 401;
The wiring pattern formed base layer 410 and the prepreg 404 ′ are integrated, and the prepreg 404 ′ is heated and pressed to form an electrically insulating base material 404.
Removing the base layer 401 from the electrically insulating substrate 404;
Perform the process.

  These processes are the same as those shown in FIGS. 3 (a) to 3 (d).

  As shown in FIG. 4E, a resist layer 407 is formed on the wiring pattern forming surface of the electrically insulating base material 404. The resist layer 407 is formed so as to cover the wiring pattern forming surface of the electrically insulating substrate 404 with the surface of the wiring pattern 403 connected to the electronic component 406 selectively exposed. The resist layer 407 is formed by applying a photosensitive resin or laminating a photosensitive film, and then performing exposure / development processing and unnecessary portion removal processing.

  As shown in FIG. 4F, by using the resist layer 407 as a mask, the surface of the wiring pattern 403 is etched to form a recess 411 in which the wiring pattern 403 is disposed at the bottom.

  As shown in FIG. 4G, the resist layer 407 used to form the recess 411 is removed. As shown in FIG. 4H, a conductive material 405 is applied to the recess 411. The conductive material 405 is the same as the conductive materials 205 and 305 in the first and second manufacturing methods.

  As shown in FIG. 4I, after the terminal electrode 406a of the electrical component 406 is aligned so as to face the recess 411 and enter the interior thereof, the mounting surface of the electrical component 406 faces the electrically insulating substrate 404. The electrical component 406 is mounted on the electrically insulating substrate 404 so as to be worn. In this state, the conductive material 405 is subjected to heat treatment to melt the conductive material 405, thereby bonding the electrical component 406 onto the electrically insulating substrate 404 and electrically connecting the terminal electrode 406 a to the wiring pattern 403.

  The first to third manufacturing methods described above are methods for manufacturing an electrical component mounting module on which electrical components 206, 306, and 406 made of chip components are mounted. Next, a method for manufacturing the electrical component mounting module according to the present embodiment on which electrical components including semiconductor chips and semiconductor packages are mounted will be described. In the figure, 501 is a base layer, 502 is a release layer, 503 ′ is a metal layer, 503 is a wiring pattern, 504 ′ is a prepreg, 504 is an electrically insulating substrate, 506 Is an electric component made of a semiconductor chip or semiconductor package, 506a is a terminal electrode made of a metal bump, 507 is a resist layer, 508 is a convex portion, 509 is a sheet metal, and 510 is a wiring pattern A formed base layer 511 is a recess.

  This manufacturing method is basically the same method as the first manufacturing method shown in FIGS. 2 (a) to 2 (f). In particular, FIGS. 5A to 5D are exactly the same as FIGS. 2A to 2D.

  As shown in FIG. 5E, an electrical component (semiconductor chip or semiconductor package having a BGA structure) 506 to be flip-chip mounted is mounted on the mounting surface of the electrically insulating substrate 504. The terminal electrodes (metal bumps) 506a of the electrical component 506 are aligned so as to face the recesses 511 (wiring pattern 503) and enter the inside thereof to contact the wiring pattern 503. Then, the electrical component 506 is mounted on the electrical insulating base 504 so that the mounting surface of the electrical component 506 is attached to the electrical insulating base 504 in the aligned state. At this time, the electrical component 506 is aligned with high accuracy and naturally (self-alignment) by the terminal electrode 506a entering the recess 511. At this time, the mounting surface of the electrical component 506 is attached to the electrically insulating base material 504 by setting the size (particularly the depth size) in the recess 511 to a size that allows all the terminal electrodes 505 to enter. Thereby, the heat generated by the electrical component 506 made of a semiconductor device or the like can be efficiently radiated through the electrically insulating base material 504.

(Embodiment 2)
FIG. 6 is a cross-sectional view showing the configuration of the electrical component mounting module according to Embodiment 2 of the present invention. The second embodiment is an application of the first embodiment, and the present invention is an electrically insulating substrate having a wiring pattern on at least the front and back surfaces of the electrically insulating substrate,
-All or part of the surface of the wiring pattern formed on the front and back surfaces is disposed at a position recessed from the surface of the electrically insulating substrate.
-A conductive material for electrical connection with the terminal electrode of the electrical component is formed in the recess at an arbitrary location.
・ Electrical component mounting surface is attached to the surface of the electrically insulating substrate, and the conductive material is cured by providing a gap between the electrically insulating substrate, the surface of the surface of the electrical component, and the conductive material. Fixed to an electrically insulating substrate,
An electrical component mounting module having the characteristics described above is provided.

  Hereinafter, an electric component mounting module according to the best embodiment of the present invention will be described with reference to the drawings.

  In FIG. 6, reference numeral 601 denotes an electrically insulating substrate. Reference numeral 602 denotes a wiring pattern formed on the electrically insulating substrate 601. Reference numeral 604 denotes a chip component as an example of an electrical component mounted on the wiring pattern 602. An example of the chip component 604 is a chip resistor or a chip capacitor. Reference numeral 604 a denotes a terminal electrode of the chip component 604. Reference numeral 603 denotes a conductive material. The conductive material 603 is a conductive material that electrically connects the wiring patterns 602 formed on the electrically insulating base material 601 and is composed of solder or a conductive adhesive.

  Similar to the first embodiment, the present embodiment is characterized in that a recess 601a is provided on the surface of the electrically insulating substrate 601 and a wiring pattern 602 is disposed at the bottom of the recess 601a. The recess 601a is provided corresponding to each terminal electrode 604a. The spacing between the recesses 601a is set to the same spacing (same formation pitch) as the spacing between the plurality of terminal electrodes 604a. The size of the opening of each recess 601a (depth dimension × width w1 in the figure) is set to be equal to or larger than the size of the terminal electrode 604a (depth dimension × width w2 in the figure). When the chip component 604 is mounted on the electrically insulating substrate 601 with the terminal electrode 604a aligned with the recess 601a, the terminal electrode 604a is housed in each recess 601a and faces each wiring pattern 602. The terminal electrode 604a is disposed so as to protrude from the mounting surface of the chip component 604. Therefore, when the terminal electrode 604a is housed in the recess 601a, the mounting surface of the chip component 604 is surely attached to the electrically insulating substrate 601 and the thermal conductivity between the two is improved.

  The depth dimension h of the recess 601a is set in the range of 3 μm to 20 μm. The conductive material 603 is in the recess 601a, is formed on the width w3 in the recess 601a, and is arranged from the wiring pattern 602 to the terminal electrode 604a. The wiring pattern 602 and the terminal electrode 604a are electrically connected with a gap 605 formed between the terminal electrode 604a and the wiring pattern 602. This embodiment has the greatest feature in that the gap 605 is provided. The gap 605 is enclosed and sealed by the conductive material 603, the terminal electrode 604a, and the surface of the chip component 604 in the recess 601a.

  Furthermore, in this embodiment, the electronic component mounting surface 601a of the electrically insulating substrate 601 is sealed with the electrically insulating material 614. As an electrically insulating material, it is comprised from electrically insulating resins, such as a thermosetting resin, for example.

  In the present embodiment, since the mounting surface of the chip component 604 and the base material surface of the electrically insulating base material 601 are attached as in the first embodiment, the conductive material 603 is electrically insulated from the chip component 604. The base material 601 does not enter. Further, the air gap 605 absorbs the thermal expansion of the conductive material 603 after the electronic component mounting surface 601b of the electrically insulating substrate 601 is sealed with the electrically insulating substrate 606. This prevents the thermally expanded (remelted) conductive material 603 from flowing into the interface between the chip component 604 and the substrate 601. Therefore, problems such as a short circuit caused by the conductive material 603 entering the recess between the component and the substrate can be prevented with higher accuracy.

  The effect by the structure of this embodiment is demonstrated in detail. When the electronic component mounting surface 601b is sealed with the electrical insulating material 614, the electrical insulating material 614 is subjected to a heat treatment such as a thermosetting treatment. Furthermore, the heat treatment is performed on the electrically insulating material 614 also when other electronic components are mounted on the electrically insulating substrate 601. When such heat treatment is performed, the conductive material 603 may be remelted due to the heat, and then the remelted conductive material 603 enters the gap between the component and the substrate and causes a short circuit or the like. May occur.

  In order to solve such a problem, in this embodiment, a gap 605 is provided in the recess 601a. As a result, the remelted conductive material 603 is accommodated in the gap 605 and held here, and therefore does not flow out of the gap 605 (such as a gap between the component and the substrate). For this reason, the present embodiment can prevent a malfunction such as a short circuit with higher accuracy.

  FIG. 7A to FIG. 7H are cross-sectional views for each process showing the first manufacturing method of the electric component mounting module according to the second embodiment. In each of these drawings, reference numeral 701 is a base layer, 702 is a release layer, 703 ′ is a metal layer, 703 is a wiring pattern, 704 ′ is a prepreg, and 704 is an electrically insulating substrate. 705 is a conductive material, 706 is an electrical component (chip component), 706a is a terminal electrode, 707 is a resist layer, 708 is a convex portion, 709 is a sheet metal, Reference numeral 710 denotes a wiring pattern-formed base layer, reference numeral 711 denotes a recess, reference numeral 713 denotes a gap, reference numeral 714 denotes an electrically insulating material, and reference numeral 715 denotes a cavity part.

  7A to 7D are exactly the same as FIGS. 2A to 2D. In this step, the first manufacturing method according to the first embodiment is shown as an example, but the second manufacturing method according to the first embodiment and the third manufacturing method according to the first embodiment are used. Of course, it is possible.

  As shown in FIG. 7E, coating is performed so that a gap 713 is formed between the conductive material 703 and the terminal electrode 706a of the electronic component 706 in all or arbitrarily selected recesses 701a. Specifically, for example, the gap 713 is formed as follows.

  In each combination of the recesses 711 provided corresponding to each electronic component 706, the position of each recess 711 is set so that the terminal electrode 706a enters the recess inner end 711a located inside the recess facing direction. Then, when the terminal electrode 706a enters the recess 711, a gap is formed between the terminal electrode 706a and the bottom of the recess 711. The conductive material 703 is selectively provided only on the concave outer end side 711b located outside the concave facing direction while avoiding the gap. Thus, the gap formed at the bottom of the inner end side 711a of the recess 711 is a gap 713 that is covered with the electronic component 706 including the terminal electrode 706a and sealed from the outside.

  An example of the conductive material 705 is a conductive adhesive obtained by kneading solder, gold, silver, copper, a silver-palladium alloy, or the like with a thermosetting resin. Also, a combination of solder and a conductive adhesive is possible, and molten solder may be used.

  As shown in FIG. 7F, the terminal electrode 706a of the electric component 706 is aligned so as to face the recess 711 (wiring pattern 703) and enter the inside thereof. In this state, the electric component 706 is mounted on the electric insulating substrate 704 so that the mounting surface of the electric component 706 is attached to the electric insulating substrate 704. At this time, since the terminal electrode 706a enters the recess 711, the electrical component 706 is highly accurately and naturally aligned (self-aligned).

  In this state, the conductive material 705 is melted by performing a heat treatment on the conductive material 705, whereby the electric component 706 is formed in the form of a gap 713 between the terminal electrode 704 a and the wiring pattern 702. The terminal electrode 706a is electrically connected to the wiring pattern 703.

  As shown in FIG. 7G, the insulating material 714 is sealed so as to cover the electric component 706 mounted on the electric insulating base material 704. The insulating material 714 preferably has the same material configuration as that of the electrically insulating substrate 704. This is because high reliability can be secured by combining physical property values such as a linear expansion coefficient and an elastic coefficient. However, it is not necessarily limited to the same material by adjusting various physical property values.

The insulating material 714 has a cavity portion 715 for the purpose of incorporating the electronic component 706. Further, a multilayer substrate in which a wiring pattern is formed on the other side of the insulating material 714 and an inner via is formed may be used.
As shown in FIG. 7 (h), an electronic component mounting module in which the electric component 706 is sealed can be manufactured by positioning and laminating and then applying heat and pressure.

  By using the above-described manufacturing method, a heating process such as re-flow for mounting other electrical components performed in a later process and re-flow for mounting the electrical component mounting module on another electrically insulating substrate is performed. As a result, the conductive material 705 in the sealed electrical component mounting module is remelted, and the conductive material 705 flows into the surface where the electrically insulating base material 704 and the electrical component 706 are attached, thereby short-circuiting the wiring pattern. Problems can be prevented.

  Hereinafter, specific examples (production methods) of the present invention will be described. Here, each example of the present invention will be described using the manufacturing method of the second embodiment shown in FIG. 7 as an example, but it can be said that each example can be similarly implemented in each manufacturing method of the first embodiment. Not too long.

(Example 1)
In the production of the electrical component mounting module of the present invention, a method of producing a wiring pattern-formed base layer having a wiring pattern formed on the surface by chemical etching by photolithography will be described.

  The base layer 701 constituting the wiring pattern formed base layer 710 can use existing copper foil for circuit boards. An example of a specific method for producing the copper foil for circuit boards is as follows. By slowly rotating the drum-like plating electrode in the electrolytic solution, a copper plating layer is continuously formed on the drum-like plating electrode, and a copper foil for a circuit board is produced by winding the formed copper plating layer. it can. At that time, a copper foil having an arbitrary thickness can be continuously formed from the plating current value, the rotation speed, and the like. The base layer (copper foil) used in the examples of the present invention has a thickness of 70 μm.

Next, an extremely thin organic layer is formed on the surface of the base layer (copper foil) 701, or a dissimilar metal such as nickel or tin is similarly thinly plated to form the peeling layer 702. The peeling layer 702 can be transferred without being formed. However, by providing the release layer 702,
-When etching the wiring pattern 703, it works to stop further etching,
The base layer (copper foil) 701 is slightly etched, and the wiring pattern 703 is embedded at the time of transfer;
Fulfill.

  On the peeling layer 702, copper plating that becomes a wiring pattern 703 is further performed to form a metal layer 703 '. In this embodiment, the metal layer 703 ′ is formed with a plating thickness of 9 μm.

  Next, the metal layer 703 ′ is etched to the surface layer of the base layer 701, and the base layer 701 is further etched to the middle of its thickness to form a wiring pattern 703 from the metal layer 703 ′. Further, the base layer 701 is subsequently etched. In this case, it is easy to etch the surface layer of the base layer 701 to a certain depth by controlling the etching time. In this embodiment, the base layer 701 is scraped by 15 μm. As a result, a base layer 710 with a wiring pattern is formed.

An uncured prepreg 704 ′ made of a mixture of an inorganic filler and a thermosetting resin is prepared, and the prepreg 704 ′ and the wiring pattern formed base layer 710 are laminated. The wiring pattern 703 is embedded in the prepreg 704 ′ by heating and pressing the laminated prepreg 704 ′ and the wiring pattern formed base layer 710. In this embodiment, the heating and pressurizing conditions are as follows. The base layer 710 with the wiring pattern formed is set in a mold heated to 200 ° C., and a prepreg 704 ′ is further arranged and pressurized with a mold at a pressure of 100 kg / cm ^2. The condition is as follows. The heating and pressing time is 15 minutes.

The prepreg 704 ′ used in this example is manufactured by mixing an inorganic filler and a liquid thermosetting resin using a stirring mixer. A stirrer / mixer is one in which an inorganic filler and a liquid thermosetting resin are put into a container of a predetermined capacity and revolved while rotating the container itself, and a sufficiently dispersed state can be obtained even if the viscosity is relatively high. It is. The composition of the implemented prepreg 704 ′ is shown below.
Inorganic filler: Al ₂ O ₃ (AS-40 manufactured by Showa Denko KK, spherical 12 μm)
90% by weight
・ Thermosetting resin: Liquid epoxy resin (EF-450 manufactured by Nippon Rec Co., Ltd.)
9.5% by weight
・ Coupling agent: (Titanate KR-46B manufactured by Ajinomoto Fine Techno Co., Ltd.)
0.3% by weight
A pasty mixture weighed and mixed with the above composition is prepared. The mixture is prepared by putting a predetermined amount of inorganic filler and liquid epoxy resin into a container and mixing the container together with a kneader. The mixing operation using the kneader is performed by a method of rotating while revolving the container. Kneading is performed in a short time of about 10 minutes. As the release film, a polyethylene terephthalate film in which a release process with silicon is performed on a surface having a thickness of 75 μm is used.

  A predetermined amount of the above mixture is taken and dropped onto the release film. A release film is further stacked on the dropped mixture on the release film, and the mixture is pressed to a certain thickness by a pressure press. Next, the mixture sandwiched between the release films is heated together with the release film, and heat-treated under conditions where the tackiness is lost. The heat treatment conditions are temperature (120 ° C.) and treatment time (15 minutes).

  As described above, a prepreg 704 ′ having a thickness of 500 μm and having no adhesiveness can be obtained.

  Since the thermosetting epoxy resin has a curing start temperature of 130 ° C., it is in an uncured state (B stage) under the heat treatment conditions, and can be melted again by heating in the subsequent steps.

The release films provided on both sides of the prepreg 704 ′ thus obtained are peeled and sandwiched again with a heat-resistant release film (PPS: polyphenylene sulfide 75 μm thickness), and the temperature is 170 ° C. and the pressure is 50 kg / cm ^3. Cured with. Further, the PPS release film is peeled off and processed into a predetermined dimension to obtain a prepreg 704 ′.

  The thermal conductivity of the prepared prepreg 704 ′ was measured. The thermal conductivity was obtained by calculating the thermal conductivity from the manner of temperature transfer on the opposite surface by heating the surface of the sample cut to 10 mm square with a heater. The results are shown in Table 1.

表1に示すように、無機フィラとしてＡｌ_２Ｏ_３を用いた場合には、従来のガラス-エポキシ基板(０．２ｗ／ｍＫ〜０．３ｗ／ｍＫ)に比べて熱伝導度が約２０倍以上の熱伝導性が得られ、また同様にＡｌＮ,ＭｇＯを用いた場合でも、それ以上の熱伝導度が得られることがわかる。また、非晶質ＳｉＯ_２を用いた場合では、熱膨張係数がシリコン半導体に近い熱膨張係数のものが得られる。これにより、本実施例のプリプレグ７０４'から作製した電気絶縁性基材７０４は半導体装置を直接実装するフリップチップ用基板としても有望である。即ちＡｌＮの良好な熱伝導性を利用すれば、セラミック基板に近い熱伝導性が得られる。またＢＮを添加した場合、表１に示すように高熱伝導でしかも低熱膨張性が得られる。特にアルミナを用いた系では、８５重量％以上で良好な熱伝導度が得られ、コストも安いことから高熱伝導モジュールとして有望である。

As shown in Table 1, when Al ₂ O ₃ is used as the inorganic filler, the thermal conductivity is about 20 times that of the conventional glass-epoxy substrate (0.2 w / mK to 0.3 w / mK). It can be seen that the above thermal conductivity is obtained, and that even when AlN or MgO is used, thermal conductivity higher than that is obtained. When amorphous SiO ₂ is used, a material having a thermal expansion coefficient close to that of a silicon semiconductor can be obtained. As a result, the electrically insulating base material 704 manufactured from the prepreg 704 ′ of this embodiment is promising as a flip chip substrate on which a semiconductor device is directly mounted. That is, if the good thermal conductivity of AlN is utilized, thermal conductivity close to that of a ceramic substrate can be obtained. When BN is added, as shown in Table 1, high thermal conductivity and low thermal expansion can be obtained. In particular, a system using alumina is promising as a high thermal conductivity module because good thermal conductivity is obtained at 85% by weight or more and the cost is low.

  The prepreg 704 ′ and the wiring pattern-formed base layer 710 described above are stacked and heated and pressed. As a result, the prepreg 704 ′ is made into an electrically insulating base material 704. At this time, the base layer 701 is etched by about 15 μm, so that a concave portion 711 having a depth of 15 μm is formed on the electrically insulating substrate 704, and the wiring pattern 703 is disposed in a buried state at the bottom of the concave portion 711. Is done. A recess 711 is formed between the wiring pattern 703 and the substrate surface.

  The base layer (copper foil) 701 is peeled from the laminate of the electrically insulating base material 704 and the wiring pattern-formed base layer 710. Next, a conductive material 705 made of solder is applied and filled in the recess 711. In this state, alignment is performed so that the terminal electrode 706a of the electrical component 706 faces the recess 711 (wiring pattern 703). Thereby, the electrical component 706 is mounted on the electrically insulating base material 704 so that its mounting surface is in contact with the base material surface. The conductive material (solder) 705 is melted by heating the electrically insulating substrate 704 on which the electrical component 706 is mounted in a reflow furnace. Thereby, the electrical component mounting module of the present invention in which the electrical component 706 and the electrically insulating base material 704 are surface-mounted is obtained.

  In the electrical component mounting module manufactured as described above, no connection failure due to misalignment of the electrical component 706 or short circuit due to solder flow has occurred since the initial mounting. Furthermore, when the solder reflow test and the temperature cycle test were performed, the following results were obtained. The solder reflow test was conducted by passing 10 times using a belt-type reflow tester having a maximum temperature of 260 ° C. and 10 seconds. In addition, the temperature cycle test was carried out for 200 cycles with the high temperature side held at 125 ° C. and the low temperature side at −60 ° C. for 30 minutes each. As a result of the temperature cycle test, the electrical components on the electrical component mounting module had almost no change in initial connection performance.

(Example 2)
Example 2 is an example in which an electrical component mounting module is manufactured by the method described in the third manufacturing method of the first embodiment.

  An example of an electrical component mounting module manufactured by the method described in the third manufacturing method of the first embodiment using the wiring pattern-formed base layer 710 and the prepreg 704 ′ manufactured by the same method as in Example 1. Show. The wiring pattern-formed base layer (copper foil) 710 has a thickness of 70 μm, and a wiring pattern 703 is formed through a release layer 702. The wiring pattern 703 is formed with a copper plating thickness of 9 μm. The wiring pattern formed base layer 710 uses a wiring pattern 703 formed by etching only the metal layer 703 ′ and the peeling layer 702 on the base layer 701 by controlling the etching time.

The composition of the prepreg 704 ′ used in this example is shown below.
Inorganic filler: Al ₂ O ₃ (AS-40 manufactured by Showa Denko KK, spherical 12 μm)
90% by weight
・ Thermosetting resin: Liquid epoxy resin (EF-450 manufactured by Nippon Rec Co., Ltd.)
9.5% by weight
・ Coupling agent: (Titanate KR-46B manufactured by Ajinomoto Fine Techno Co., Ltd.)
0.3% by weight
By stacking and heating and pressing, the prepreg 704 ′ and the wiring pattern formed base layer 710 are integrated with the wiring pattern 703 embedded in the prepreg 704 ′. Heating and pressing are performed as follows. In a state where the wiring pattern formed base layer 710 is set in a mold heated to 200 ° C., and the prepreg 704 ′ is disposed on the wiring pattern formed base layer 710, the laminated body is 100 Kg / cm ² by the mold. Pressurize with pressure. The holding time is 15 minutes.

  The base layer 701 is peeled from the heat-pressed laminate. The wiring pattern 703 has a shape embedded in the electrically insulating base material 704 so that the surface of the base material and the wiring pattern 703 become flat.

  The electrically insulating base material 704 on which the wiring pattern 703 is formed is laminated with a photosensitive film to form a resist layer 707. The resist layer 707 has a pattern shape in which an opening is selectively provided above the wiring pattern 703 connected to the electrical component 706 so that the wiring pattern 703 is exposed to the outside. The thickness of the resist layer 707 is 6 μm.

  The surface of the electrically insulating substrate 704 is etched using an aqueous solution of ferric chloride. Thereby, only the wiring pattern 703 exposed in the resist layer 707 is etched, and a recess 711 having a depth of about 5 μm is formed between the wiring pattern 703 and the substrate surface.

  The resist layer 707 that has not been removed by the etching process is removed. Further, a conductive material (solder) 705 is applied to the recess 711 on the wiring pattern 703.

  The electrical component 706 is mounted on the electrically insulating substrate 704 so that its mounting surface is in contact with the electrically insulating substrate 704 in a state where the electrical component 706 is aligned so that the terminal electrode 706a faces the wiring pattern 703. To do. The electrically insulating base material 704 on which the electrical component 706 is mounted is heated by a reflow furnace. As a result, the conductive material (solder) 705 is melted to electrically connect the electrical component 706 and the electrically insulating substrate 704.

  Thus, an electrical component mounting module is obtained by the method described in the third embodiment of the present invention.

  As a result of measuring the characteristics of the electrical component mounting module fabricated in Example 2, there was no location where a connection failure due to a positional shift of the electrical component or a short circuit due to a solder flow occurred since the first mounting. Furthermore, in order to evaluate reliability, a solder reflow test and a temperature cycle test were performed. The solder reflow test was conducted by passing 10 times using a belt-type reflow tester having a maximum temperature of 260 ° C. and 10 seconds. Further, in the temperature cycle test, a process of holding for 30 minutes at a temperature of 125 ° C. on the high temperature side and −60 ° C. on the low temperature side was performed 200 cycles. At this time, the electrical resistance on the electrical component mounting module was almost unchanged from the initial performance.

(Example 3)
Example 3 is an example of producing an electrical component mounting module formed by mounting electrical components made of a semiconductor device.

  An example of the electrical component mounting module manufactured by the method described in the first manufacturing method of the first embodiment using the wiring pattern-formed base layer 710 and the prepreg 704 ′ manufactured by the same method as in Example 1. Show.

  A recess 711 is formed on the electrically insulating substrate 704 by the same manufacturing method as in the first embodiment, and a wiring pattern 703 is formed on the bottom of the recess 711. A recess 711 of about 15 μm is formed between the wiring pattern 703 and the surface of the electrically insulating substrate 704.

  An electrical component (semiconductor device) 706 is flip-chip bonded to the wiring pattern 703 of the manufactured electrically insulating substrate 704 using solder bumps. By inserting the terminal electrodes (bumps) 706a formed on the electric component 706 into the recesses 711 formed on the electric insulating substrate 704, the electric component 706 can be easily and accurately mounted on the electric insulating substrate 704. By electrically connecting the terminal electrodes (bumps) 706a of the electrical component 706 and the wiring pattern 703 by heat treatment, an electrical component mounting module in which the electrical component (semiconductor device) 706 is mounted on the electrically insulating substrate 704 is obtained.

  In the electrical component mounting module manufactured according to this example, there was no location where a connection failure due to a positional shift of the electrical device (semiconductor device) 706 or a short circuit due to a solder flow occurred from the first mounting.

  In order to evaluate the reliability, a solder reflow test and a temperature cycle test were performed on the products of this example. The solder reflow test was conducted by passing 10 times using a belt-type reflow tester having a maximum temperature of 260 ° C. and 10 seconds. Further, the temperature cycle test was performed for 200 cycles at a temperature of 125 ° C. on the high temperature side and −60 ° C. on the low temperature side for 30 minutes each. In any reliability test, no abnormality was found in the mounted semiconductor element even when an ultrasonic flaw detector was used. There was almost no change in initial performance and connection resistance.

(Example 4)
Example 4 is an example in which an electrical component mounting module was manufactured by the method described in the first manufacturing method of the second embodiment.

An example of the electrical component mounting module manufactured by the method described in the first manufacturing method of the second embodiment using the wiring pattern-formed base layer 710 and the prepreg 704 ′ manufactured by the same method as in Example 1. Show.
A recess 711 is formed on the electrically insulating substrate 704 by the same manufacturing method as in the first embodiment, and a wiring pattern 703 is formed on the bottom of the recess 711. A recess 711 of about 15 μm is formed between the wiring pattern 703 and the surface of the electrically insulating substrate 704.

  Further, a conductive material (solder paste) 705 is formed in the recess 711 on the wiring pattern 703 by a printing method. The conductive material 705 is formed on each of the side where the electrically insulating base 704 and the electrical component 706 are attached and the opposite side. The conductive material 705 is applied to an area of 50% of the area of the electrode pad included in the wiring pattern 703.

  The electrical component 706 is mounted so that its mounting surface is in contact with the electrically insulating substrate 704 in a state where the electrical component 706 is aligned so that the terminal electrode 706 a faces the wiring pattern 703. The electrically insulating base material 704 on which the electrical component 706 is mounted is heated by a reflow furnace. As a result, the conductive material (solder) 705 is melted to electrically connect the electrical component 706 and the electrically insulating substrate 704.

  Further, a material in which a cavity portion 715 is formed on an electrically insulating material 714 made of the same material as the prepreg 704 ′ used as the electrically insulating substrate 704 is prepared. Then, the electrically insulating material 714 and the electrically insulating base material 704 are aligned and laminated so that the electronic component 706 faces the cavity portion 715. Thereafter, the laminate is placed in a mold heated to 200 ° C. and pressurized at a pressure of 3 MPa.

  Thus, an electrical component mounting module is obtained by the method described in the second embodiment of the present invention.

  As a result of measuring the characteristics of the electrical component mounting module produced in Example 4, there was no connection failure due to misalignment of the electrical components or short circuit due to the solder flow even after the initial mounting and sealing. Furthermore, in order to evaluate reliability, a solder reflow test and a temperature cycle test were performed. The solder reflow test was conducted by passing 10 times using a belt-type reflow tester having a maximum temperature of 260 ° C. and 10 seconds. Further, in the temperature cycle test, a process of holding for 30 minutes at a temperature of 125 ° C. on the high temperature side and −60 ° C. on the low temperature side was performed 200 cycles.

  In the electronic component mounting module in which the one manufactured in Embodiment 1 is sealed with the same prepreg 704 ′, the conductive material (solder) 705 remelted in four out of ten samples in the solder reflow test is electrically connected. Solder bridges occurred on the surface contact surfaces of the insulating base 704 and the electrical component 706. However, in the solder reflow test, none of the samples manufactured in the second embodiment had solder bridges out of 10 samples. In other reliability tests, there was no increase in connection resistance, and no change from the initial performance was observed.

BRIEF DESCRIPTION OF THE DRAWINGS It is a partial cross section figure of the electrical component mounting module explaining Embodiment 1 of this invention, Comprising: (a) is an electrical component mounting module which mounted the chip component, (b) is the electrical which mounted the semiconductor device. This is a component mounting module. FIG. 5 is a cross-sectional view showing each step of the first manufacturing method of the electrical component mounting module according to Embodiment 1. It is sectional drawing which shows each process of the 2nd manufacturing method of the electrical component mounting module of Embodiment 1. FIG. It is sectional drawing which shows each process of the 3rd manufacturing method of the electrical component mounting module of Embodiment 1. FIG. It is sectional drawing which shows each manufacturing process of the electrical component mounting module of Embodiment 1, Comprising: The module which mounted the semiconductor device as an electrical component. It is a partial cross section figure of the electrical component mounting module explaining Embodiment 2 of this invention, Comprising: It is an electrical component mounting module which mounted the chip component. FIG. 12 is a cross-sectional view showing each step of the method for manufacturing the electrical component mounting module according to the second embodiment.

Explanation of symbols

101 Electrically insulating substrate 101a recess
102 wiring pattern 103 conductive material 104 chip component 104a terminal electrode 105 semiconductor device 106 terminal electrode 201 base layer 202 peeling layer 203 ′ metal layer 203 wiring pattern 204 ′ prepreg 204 electrically insulating substrate 205 conductive material 206 electrical component 206a terminal electrode 207 Resist layer 208 convex portion 209 sheet-like metal 210 wiring pattern formed base layer 211 concave portion 301 base layer 302 peeling layer 303 wiring pattern 303 ′ metal layer 304 electrically insulating substrate 304 ′ prepreg 305 conductive material 306 electrical component 306a terminal electrode 309 Sheet metal 310 Wiring pattern-formed base layer 311 recess 401 base layer 402 release layer 403 'metal layer 404 electrically insulating substrate 404' prepreg 405 conductive material 406 electrical component 406a terminal electrode 407 resist layer 409 sheets Metallic 410 Wiring pattern-formed base layer 411 recess 501 Base layer 502 Release layer 503 Wiring pattern 503 ′ Metal layer 504 Electrical insulating substrate 504 prepreg 505 Conductive material 509 Sheet metal 510 Wiring pattern-formed base layer 511 concave 601 Electrically insulating substrate 601a recess 602 wiring pattern 603 conductive material 604 chip component 604a terminal electrode 605 gap 701 base layer 702 peeling layer 703 ′ metal layer 703 wiring pattern 704 ′ prepreg 704 electrical insulating substrate 705 conductive material 706 electrical component 706a Terminal electrode 707 Resist layer 708 Convex part 709 Sheet metal 710 Wiring pattern-formed base layer 711 Concave part 713 Cavity 714 Insulating material 715 Cavity part

Claims (32)

An electrical component having a terminal electrode, and an electrically insulating substrate on which the electrical component is mounted,
A recess is provided on the surface of the electrically insulating substrate, and a wiring pattern connected to the electrical component is provided in the recess,
The electrical component is mounted on the electrically insulating base material in a state where the terminal electrode faces the recess and the mounting surface is attached to the base material surface of the electrically insulating base material,
A conductive material is provided in the recess, and the wiring pattern and the terminal electrode are electrically connected through the conductive material.
An electrical component mounting module characterized by that. The conductive material is a conductive adhesive containing a thermosetting resin and a conductive filler, or solder.
The electrical component mounting module according to claim 1. The electrical component has a plurality of the terminal electrodes, and the electrically insulating substrate has recesses corresponding to the terminal electrodes, and the recesses are provided at positions facing the terminal electrodes, respectively. Providing the wiring pattern on
The electrical component mounting module according to claim 1. The recess has a depth where the terminal electrode is accommodated between the wiring pattern surface and the electrically insulating substrate surface,
The electrical component mounting module according to claim 1. The depth dimension of the recess is 3 μm to 20 μm.
The electrical component mounting module according to claim 4. The electrically insulating substrate includes an inorganic filler and a thermosetting resin.
The electrical component mounting module according to claim 1. The electrical insulating base material is at least one reinforcing material selected from glass fiber woven fabric, glass fiber non-woven fabric, heat-resistant organic fiber woven fabric and heat-resistant organic fiber non-woven fabric, and thermosetting impregnated in the reinforcing material. A functional resin composition,
The electrical component mounting module according to claim 1. The electrical component is a flip-chip mounted semiconductor chip or a semiconductor package in which at least an electrical connection portion is resin-sealed.
The electrical component mounting module according to claim 1. Providing an electrically insulating material for sealing an electrical component mounting surface of the electrically insulating substrate;
Providing a gap in the recess;
The electronic component mounting module according to claim 1, The gap is sealed by the electronic component and the conductive material in the recess, and in this state, the electrical component mounting surface is sealed by the electrically insulating material,
The electronic component mounting module according to claim 9. The electrically insulating material includes at least a thermosetting resin.
The electrical component mounting module according to claim 9. The electrically insulating material is composed of the same composition as the electrically insulating substrate.
The electrical component mounting module according to claim 9. An electrically insulating base material on which a surface mount type electrical component having a terminal electrode is mounted,
A recess is provided on the substrate surface, and a wiring pattern connected to the electrical component is provided in the recess.
An electrically insulating substrate characterized by the above. A method for producing an electrical component mounting module comprising a surface-mounted electrical component having a terminal electrode and an electrically insulating substrate on which the electrical component is mounted,
Preparing a wiring pattern-formed base layer having a wiring pattern on one side of the base layer;
Removing the wiring pattern forming surface of the wiring pattern formed base layer to the middle of the base layer leaving a base plate region below the wiring pattern;
Preparing an uncured prepreg, and laminating the wiring pattern formed base layer on the prepreg so that the wiring pattern forming surface faces the prepreg;
By heating and pressurizing the laminated prepreg and the wiring pattern formed base layer, the prepreg is made an electrically insulating substrate, and the formed electrically insulating substrate and the wiring pattern formed base layer are Integrating the wiring pattern in a state where it is pushed in part in the thickness direction of the electrically insulating substrate;
Removing the base layer from the wiring pattern-formed base layer integrated with the electrically insulating substrate, thereby forming a recess in the surface of the electrically insulating substrate and providing the wiring pattern in the recess;
Providing a conductive material in the recess;
Mounting the electrical component on the electrically insulating substrate so that the terminal electrode faces the recess; and
Curing the conductive material and fixing the electrical component on the electrically insulating substrate via the conductive material, and electrically connecting the terminal electrode and the wiring pattern via the conductive material;
The manufacturing method of the electrical component mounting module characterized by including. A method for producing an electrical component mounting module comprising a surface-mount electronic component having a terminal electrode and an electrically insulating substrate on which the electrical component is mounted,
Preparing a wiring pattern-formed base layer having a wiring pattern on one side of the base layer;
Removing the wiring pattern forming surface of the wiring pattern formed base layer to the middle of the base layer leaving a base plate region below the wiring pattern;
Preparing an uncured prepreg, and laminating the wiring pattern formed base layer on the prepreg so that the wiring pattern formation surface faces the prepreg;
By heating and pressurizing the laminated prepreg and the wiring pattern formed base layer, the prepreg is made an electrically insulating substrate, and the formed electrically insulating substrate and the wiring pattern formed base layer are Integrating the wiring pattern in a state where it is pushed in part in the thickness direction of the electrically insulating substrate;
Removing the base layer from the wiring pattern-formed base layer integrated with the electrically insulating substrate, thereby forming a recess in the surface of the electrically insulating substrate and providing the wiring pattern in the recess;
A step of providing a conductive material in the concave portion with a gap provided in the concave portion;
Mounting the electrical component on the electrically insulating substrate so that the terminal electrode faces the recess; and
The conductive material is cured in a state where the gap is maintained, and the electric component is fixed on the electrically insulating base material via the conductive material, and the terminal electrode and the wiring pattern are bonded to the conductive material. Via the electrical connection step,
Sealing the electrical component mounting surface of the electrical insulating base material with an insulating material while maintaining the gap;
The manufacturing method of the electrical component mounting module characterized by including. In the step of mounting the electrical component on the electrically insulating base, the gap is sealed from the outside with the terminal electrode as a lid,
The method of manufacturing an electronic component mounting module according to claim 15. The wiring pattern formed base layer is
After providing a sheet metal having a metal layer on the entire surface of one side of the base layer,
Form by removing other parts of this metal layer except for the wiring pattern formation part in the metal layer,
16. The method of manufacturing an electrical component mounting module according to claim 14 or 15, wherein: The process of removing other parts of the metal layer except the wiring pattern forming part in the metal layer is performed by etching.
The method of manufacturing an electrical component mounting module according to claim 17. Performing chemical etching as the etching process;
The method of manufacturing an electrical component mounting module according to claim 18. As the sheet metal, the metal layer and the base layer are made of the same kind of metal,
The method of manufacturing an electrical component mounting module according to claim 17. Using an electrolytic copper foil as the base layer,
16. The method of manufacturing an electrical component mounting module according to claim 14 or 15, wherein: As the base layer, a layer selected from aluminum, silver, nickel is used, and as the metal layer, a copper layer is used.
16. The method of manufacturing an electrical component mounting module according to claim 14 or 15, wherein: Forming the recess to a depth in the range of 3 μm to 20 μm;
16. The method of manufacturing an electrical component mounting module according to claim 14 or 15, wherein: A method for producing an electrical component mounting module comprising a surface-mounted electrical component having a terminal electrode and an electrically insulating substrate on which the electrical component is mounted,
Preparing a wiring pattern formed base layer in which a wiring pattern is provided on one side of the base layer;
Preparing an uncured prepreg, and laminating the wiring pattern formed base layer on the prepreg so that the wiring pattern forming surface faces the prepreg;
By heating and pressurizing the laminated prepreg and the wiring pattern formed base layer, the prepreg is made an electrically insulating base material, and the formed electrically insulating layer base material and the wiring pattern formed base layer are Integrating the wiring pattern in a state where it is pushed in part in the thickness direction of the electrically insulating substrate;
By removing the base layer from the wiring pattern-formed base layer integrated with the electrically insulating substrate, the wiring pattern embedded in the electrically insulating substrate is formed with the pattern surface exposed to the outside. And a process of
Removing a part of the wiring pattern from the pattern surface to form a concave portion continuous with the surface of the electrically insulating substrate on the wiring pattern;
Providing a conductive material in the recess;
Mounting the electrical component on an electrically insulating substrate so that the terminal electrode faces the recess; and
Curing the conductive material, fixing the electrical component on the electrically insulating substrate via the conductive material, and electrically connecting the terminal electrode and the wiring pattern via the conductive material; ,
The manufacturing method of the electrical component mounting module characterized by including. A method for producing an electrical component mounting module comprising a surface-mounted electrical component having a terminal electrode and an electrically insulating substrate on which the electrical component is mounted,
Preparing a wiring pattern formed base layer in which a wiring pattern is provided on one side of the base layer;
Preparing an uncured prepreg, and laminating the wiring pattern formed base layer on the prepreg so that the wiring pattern forming surface faces the prepreg;
By heating and pressurizing the laminated prepreg and the wiring pattern formed base layer, the prepreg is made an electrically insulating base material, and the formed electrically insulating layer base material and the wiring pattern formed base layer are Integrating the wiring pattern in a state where it is pushed in part in the thickness direction of the electrically insulating substrate;
By removing the base layer from the wiring pattern-formed base layer integrated with the electrically insulating substrate, the wiring pattern embedded in the electrically insulating substrate is formed with the pattern surface exposed to the outside. And a process of
Removing a part of the wiring pattern from the pattern surface to form a concave portion continuous with the surface of the electrically insulating substrate on the wiring pattern; and
A step of providing a conductive material in the concave portion with a gap provided in the concave portion;
Mounting the electrical component on an electrically insulating substrate so that the terminal electrode faces the recess; and
The conductive material is cured in a state where the gap is maintained, and the electrical component is fixed to the electrically insulating base material via the conductive material, and the terminal electrode and the wiring pattern are interposed via the conductive material. Electrical connection process,
Sealing the electrical component mounting surface of the electrical insulating base material with an insulating material while maintaining the gap;
The manufacturing method of the electrical component mounting module characterized by including. In the step of mounting the electrical component on the electrically insulating substrate, the terminal electrode is used as a lid, and the gap is sealed from the outside.
26. The method of manufacturing an electronic component mounting module according to claim 25. As the base layer, a base layer made of a resin film material is used.
26. The method of manufacturing an electrical component mounting module according to claim 24 or 25. Removing the surface of the wiring pattern by etching;
26. The method of manufacturing an electrical component mounting module according to claim 24 or 25. As a pretreatment when etching the surface of the wiring pattern, a resist layer is formed on the wiring pattern forming surface of the electrically insulating substrate excluding the wiring pattern surface,
As a post-processing when the wiring pattern surface is etched, the resist layer is removed.
The method of manufacturing an electrical component mounting module according to claim 28. Performing chemical etching as the etching process;
30. The method of manufacturing an electrical component mounting module according to claim 28 or 29. A method for producing an electrically insulating substrate on which a surface-mount type electric component having terminal electrodes is mounted,
Preparing a wiring pattern-formed base layer having a wiring pattern on one side of the base layer;
Removing the wiring pattern forming surface of the wiring pattern formed base layer to the middle of the base layer leaving a base plate region below the wiring pattern;
Preparing an uncured prepreg, and laminating the wiring pattern formed base layer on the prepreg so that the wiring pattern forming surface faces the prepreg;
By heating and pressurizing the laminated prepreg and the wiring pattern formed base layer, the prepreg is made an electrically insulating substrate, and the formed electrically insulating substrate and the wiring pattern formed base layer are Integrating the wiring pattern in a state where it is pushed in part in the thickness direction of the electrically insulating substrate; and
The surface of the electrically insulating substrate is removed by removing the base layer from the base layer having the wiring pattern formed integrally with the electrically insulating substrate in a state where the wiring pattern remains in the middle of the substrate thickness. Forming a recess in the recess and providing the wiring pattern in the recess;
The manufacturing method of the electrically insulating base material characterized by including. A method for manufacturing an electrically insulating substrate on which a surface-mount type electric component having terminal electrodes is mounted,
Preparing a wiring pattern formed base layer in which a wiring pattern is provided on one side of the base layer;
Preparing an uncured prepreg, and laminating the wiring pattern formed base layer on the prepreg so that the wiring pattern forming surface faces the prepreg;
By heating and pressurizing the laminated prepreg and the wiring pattern formed base layer, the prepreg is made into an electrically insulating base material, and the formed electrical insulating layer base material and the wiring pattern formed base layer are Integrating the wiring pattern in a state where it is pushed in part in the thickness direction of the electrically insulating substrate;
By removing the base layer from the wiring pattern-formed base layer integrated with the electrically insulating substrate, the wiring pattern embedded in the electrically insulating substrate is formed with the pattern surface exposed to the outside. And a process of
A step of removing a part of the wiring pattern from the pattern surface to form a concave portion continuous with the surface of the electrically insulating substrate on the wiring pattern. Method.

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