JP3375555B2 - Circuit component built-in module and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit component built-in module, and more particularly to a circuit component built-in module in which circuit components are arranged inside an electrically insulating substrate.

[0002]

2. Description of the Related Art In recent years, with the demand for higher performance and smaller size of electronic equipment, higher density and higher functionality of circuit components have been sought after. Therefore, there is a demand for a circuit board that is compatible with high density and high functionality of circuit components.

As a method of densifying circuit components, a method of forming circuits in multiple layers is conceivable. However, in the conventional glass-epoxy substrate, it is necessary to use a through-hole structure with a drill, and therefore high density packaging is required. It is difficult to deal with. For this reason, as a method for achieving the highest circuit density, development of an inner via hole connection method capable of connecting wiring patterns between LSIs and between components in the shortest distance is being promoted in various fields.

The inner via-hole connection method allows connection only between required layers, and is excellent in mountability of circuit components (Japanese Patent Laid-Open Nos. 63-47991 and 6-268).
345).

[0005]

[Problems to be Solved by the Invention] However, in the past,
The substrate used in the inner via hole connection method has a problem of low thermal conductivity because it is made of a resin material. In the circuit component built-in module, the higher the packaging density of the circuit components, the more it becomes necessary to radiate the heat generated from the components. However, the conventional board cannot sufficiently radiate the heat and the circuit component built-in module However, there was a problem that the reliability of the device deteriorated.

In order to solve the above-mentioned conventional problems, it is an object of the present invention to provide a circuit component built-in module capable of mounting circuit components at high density and having high reliability, and a manufacturing method thereof.

[0007]

In order to achieve the above object, a circuit component built-in module of the present invention comprises one electrically insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin, and the electrically insulating substrate. Wiring patterns formed on at least one main surface of the flexible substrate (one wiring pattern consists of a group of electric wirings formed in the same plane)
When, viewed contains an electrically connected circuit component on the wiring pattern embedded in the electrically insulating substrate, and the circuit component
The wiring pattern is electrically connected via a conductive adhesive.
Has been continued. Further, another circuit component built-in module of the present invention
Is the mixture containing an inorganic filler and a thermosetting resin?
One electrically insulating substrate, and
Multiple wiring patterns formed on at least one main surface
And embedded in the electrically insulating substrate to form the wiring pattern.
And a circuit component electrically connected to the circuit component,
The wiring pattern is electrically connected via bumps.
ing. In addition, another circuit component built-in module of the present invention
Is an inorganic filler 70% by weight to 95% by weight and a thermosetting resin.
One electrically insulative substrate consisting of a mixture containing fat;
Formed on at least one main surface of the electrically insulating substrate
A plurality of wiring patterns and embedded in the electrically insulating substrate
And a circuit component mounted on the wiring pattern. Well
Another module with built-in circuit parts of the present invention is an inorganic fiber module.
Laminates made of a mixture containing a resin and a thermosetting resin
A plurality of electrically insulating substrates, and a plurality of the laminated electric insulation.
Formed on at least one main surface and inside of the limbic substrate
A plurality of wiring patterns and a plurality of the laminated electric insulations
Embedded in a flexible substrate and electrically connected to the wiring pattern
Circuit part, and the circuit part and the wiring pattern
And are electrically connected via a conductive adhesive. Well
Another module with built-in circuit parts of the present invention is an inorganic fiber module.
Laminates made of a mixture containing a resin and a thermosetting resin
A plurality of electrically insulating substrates, and a plurality of the laminated electric insulation.
Formed on at least one main surface and inside of the limbic substrate
A plurality of wiring patterns and a plurality of the laminated electric insulations
Embedded in a flexible substrate and electrically connected to the wiring pattern
Circuit part, and the circuit part and the wiring pattern
It is electrically connected via the Togaba amplifier. Also books
Another circuit component built-in module of the invention is an inorganic filler 7
A mixture containing 0 wt% to 95 wt% and a thermosetting resin?
A plurality of laminated electrically insulating substrates,
A main surface of at least one of the plurality of electrically insulating substrates
A plurality of wiring patterns formed inside and the laminated
Embedded in multiple electrically insulating substrates
Mounted circuit components.

In the circuit component built-in module, the inner via holes are formed by the inner vias formed in the electrically insulating substrate, so that the circuit components can be mounted at a high density. In addition, since the heat generated from the circuit components is quickly dissipated by the inorganic filler, a highly reliable circuit component built-in module can be obtained. Furthermore, by selecting the inorganic filler, the thermal conductivity, linear expansion coefficient, dielectric constant, withstand voltage, etc. of the electrically insulating substrate can be changed according to the circuit components to be incorporated. Further, in the circuit component built-in module including the semiconductor element and the chip capacitor, the noise of the electric signal can be reduced by shortening the distance between the semiconductor element and the chip capacitor.

In the circuit component built-in module, the wiring pattern is preferably formed on the main surface and inside of the electrically insulating substrate. By making the wiring pattern a multi-layer structure, it is possible to mount circuit components at a higher density.

In the circuit component built-in module, the circuit component preferably includes an active component, and the inner via is preferably made of a conductive resin composition. Since the circuit component includes the active component, the circuit component having a desired function can be formed. In addition, when the inner via is made of a conductive resin composition, the manufacturing becomes easy.

In the circuit component built-in module, it is preferable that the circuit component is shielded from the outside air by the electrically insulating substrate. By cutting off the circuit components from the outside air, it is possible to prevent the reliability of the circuit components from being deteriorated due to humidity.

In the circuit component built-in module, it is preferable that the thermosetting resin contains at least one thermosetting resin selected from epoxy resin, phenol resin and cyanate resin. This is because these resins have excellent heat resistance and electrical insulation.

In the circuit component built-in module, the inorganic filler is Al ₂ O ₃ , MgO, BN, AlN and Si.
It is preferable to include at least one inorganic filler selected from O ₂ . By using these inorganic fillers, an electrically insulating substrate having excellent heat dissipation can be obtained. Moreover, when MgO is used as the inorganic filler, the linear expansion coefficient of the electrically insulating substrate can be increased. Further, as an inorganic filler, SiO ₂ (particularly amorphous SiO ₂ )
When using, the dielectric constant of the electrically insulating substrate can be reduced. Moreover, when BN is used as the inorganic filler, the linear expansion coefficient can be lowered.

In the circuit component built-in module, it is preferable that the average particle size of the inorganic filler is 0.1 μm to 100 μm. In the circuit component built-in module, it is preferable that the wiring pattern contains copper. Since copper has a low electric resistance, a fine wiring pattern can be formed.

In the circuit component built-in module, the wiring pattern preferably contains a conductive resin composition. The wiring pattern can be easily formed by using the conductive resin composition.

In the circuit component built-in module, the active component preferably includes a semiconductor bare chip, and the semiconductor bare chip is preferably flip-chip bonded to the wiring pattern.

In the circuit component built-in module, the conductive resin composition may contain metal particles containing one metal selected from gold, silver, copper and nickel as a conductive component and an epoxy resin as a resin component. preferable. This is because the above metal has a low electric resistance and the epoxy resin has excellent heat resistance and electric insulation.

In the circuit component built-in module, it is preferable that the wiring pattern is a lead frame of a metal plate formed by an etching method or a punching method. This is because the lead frame made of a metal plate has a low electric resistance. By using the etching method, a fine wiring pattern can be formed. By using the punching method, the wiring pattern can be formed with simple equipment.

In the circuit component built-in module, it is preferable that the circuit component includes at least one component selected from a chip-shaped resistor, a chip-shaped capacitor, and a chip-shaped inductor. By using the chip-shaped component, it can be easily embedded in the electrically insulating substrate.

In the circuit component built-in module, it is preferable that the mixture further contains at least one additive selected from a dispersant, a colorant, a coupling agent and a release agent. The dispersant can disperse the inorganic filler in the thermosetting resin with good uniformity. Since the electrically insulating substrate can be colored with the colorant, the heat dissipation of the circuit component built-in module can be improved.
Since the bonding strength of the thermosetting resin and the inorganic filler can be increased by the coupling agent, the insulating property of the electrically insulating substrate can be improved. The mold release agent can improve the mold releasability between the mold and the mixture, thus improving the productivity.

In the circuit component built-in module, the linear expansion coefficient of the electrically insulating substrate is 8 × 10 ⁻⁶ / ° C. to 20 × 10 ^−6.
/ ° C and the thermal conductivity of the electrically insulating substrate is 1 w / m
It is preferably K to 10 w / mK. This is because a thermal conductivity close to that of a ceramic substrate can be obtained and a substrate with excellent heat dissipation can be obtained.

In the first method for manufacturing a circuit component built-in module of the present invention, a mixture containing 70% by weight to 95% by weight of an inorganic filler (based on the mixture) and an uncured thermosetting resin is used as a through hole. A step of processing into a first plate-shaped body having: and a second plate-shaped body in which the through-hole is filled with the thermosetting conductive substance by filling the through-hole with the thermosetting conductive substance. The step of forming, the step of mounting the circuit component on the one main surface of the first copper foil, the second plate-shaped body aligned and superposed on the one main surface of the first copper foil, and further A step of forming a third plate-shaped body in which circuit components are embedded by stacking and pressing a second copper foil on the top, and heating the third plate-shaped body to form a thermosetting resin and A step of curing a conductive material, and processing the first and second copper foils to form a wiring pattern And a degree. According to the first manufacturing method, the circuit component built-in module of the present invention can be easily manufactured.

In the second method for manufacturing a circuit component built-in module of the present invention, a mixture containing 70% by weight to 95% by weight of an inorganic filler (based on the mixture) and an uncured thermosetting resin is used as a through hole. A step of processing into a first plate-shaped body having: and a second plate-shaped body in which the through-hole is filled with the thermosetting conductive substance by filling the through-hole with the thermosetting conductive substance. Forming step, forming a wiring pattern on one main surface of the first release film, mounting a circuit component on the wiring pattern, and forming a wiring pattern on one main surface of the second release film Step, aligning and pressing the first release film, the second plate-shaped body, and the second release film in this order so that the wiring pattern faces the second plate-shaped body A step of forming a third plate-shaped body in which the circuit component is embedded by A step of curing the thermosetting resin and the conductive substance by heating the third plate-shaped body, and a step of peeling the first and second release films from the cured third plate-shaped body. Including.

According to the second manufacturing method, the circuit component built-in module of the present invention can be easily manufactured.
A third method for manufacturing a circuit component built-in module of the present invention is
A method of manufacturing a circuit component built-in module having a multi-layer structure, comprising a mixture containing 70% by weight to 95% by weight of an inorganic filler (relative to the mixture) and an uncured thermosetting resin, and having a through hole. 1. A step of processing into a plate-like body, and a step of forming a second plate-like body having a through-hole filled with a thermosetting conductive substance by filling the through-hole with a thermosetting conductive substance And a step of forming a wiring pattern on one main surface of the first release film and mounting a circuit component on the wiring pattern, and a second plate-shaped body on the one main surface side of the first release film. A step of forming a third plate-shaped body in which circuit components are embedded by aligning and stacking and pressurizing;
Forming the fourth plate-shaped body by peeling the release film of the third plate-shaped body from the third plate-shaped body, aligning and stacking the plurality of fourth plate-shaped bodies, and further wiring pattern on one main surface. The second release film on which is formed is aligned so that the wiring pattern faces the side of the fourth plate-shaped member, and the thermosetting resin and the conductive substance are cured by applying pressure and heating to form a multilayer. The method is characterized by including a step of forming a fifth plate-shaped body having a structure and a step of peeling the second release film from the fifth plate-shaped body.

According to the third manufacturing method, the circuit component built-in module having the multilayer structure of the present invention can be easily manufactured. A fourth method for manufacturing a circuit component built-in module of the present invention is a method for manufacturing a circuit component built-in module having a multilayer structure, wherein the inorganic filler is 70% by weight to 9% by weight.
A step of processing a mixture containing 5% by weight (relative to the mixture) and an uncured thermosetting resin into a first plate-like body having a through hole, and a thermosetting conductive substance in the through hole Forming a second plate-shaped body in which a through hole is filled with a thermosetting conductive material by filling the wiring pattern, and forming a wiring pattern on one main surface of the first release film to form a wiring pattern The step of mounting the circuit component on the upper surface of the first release film, and the third plate having the circuit component embedded therein by aligning and pressing the second plate-shaped member on the main surface side of the first release film. A step of forming a plate-like body, a step of peeling the first release film from the third plate-like body to form a fourth plate-like body,
A plurality of fourth plate-shaped bodies are aligned and stacked, and a copper foil is further stacked thereon and pressed and heated to cure the thermosetting resin and the conductive substance, thereby forming a fifth structure having a multilayer structure. The method is characterized by including a step of forming a plate-like body and a step of processing the copper foil of the fifth plate-like body to form a wiring pattern.

According to the fourth manufacturing method, the circuit component built-in module having the multilayer structure of the present invention can be easily manufactured. In the first to fourth method for manufacturing a circuit component built-in module, the circuit component includes an active component,
The conductive substance is preferably composed of a conductive resin composition. Since the circuit component includes the active component, the circuit component having a desired function can be formed. In addition, when the conductive substance is made of a conductive resin composition, it is easy to fill the through holes and cure, and thus the production is facilitated.

In the first to fourth method for manufacturing a circuit component built-in module, after mounting the circuit component on the copper foil or the wiring pattern, the sealing resin is injected between the copper foil or the wiring pattern and the circuit component. It is preferable to further include a step. By this step, it is possible to prevent a space from being formed between the circuit component and the wiring pattern, and to strengthen the connection between the circuit component and the wiring pattern.

In the first to fourth methods for manufacturing a circuit component built-in module, it is preferable that the temperature at which the thermosetting resin and the conductive substance are heated and cured is 150 ° C. or more and 260 ° C. or less. By heating within this temperature range, it is possible to cure the thermosetting resin without significantly damaging the circuit components.

In the first to fourth methods for manufacturing a circuit component built-in module, when the thermosetting resin and the conductive substance are heated and cured, 10 kg / cm while heating.
It is preferable to pressurize at a pressure of ^{2 to} 200 kg / cm ² . By applying pressure while heating, a circuit component built-in module having excellent mechanical strength can be obtained.

In the first to fourth circuit component built-in module manufacturing methods, the step of forming the first plate-shaped body is
After the mixture is molded into a plate, the plate-shaped mixture is heat-treated at a temperature lower than the curing temperature of the thermosetting resin (for example, a temperature lower than the curing start temperature) to lose the tackiness of the plate-shaped mixture. It is preferable to include a step. By making the plate-shaped mixture lose its tackiness, the subsequent steps are facilitated.

In the first to fourth circuit component built-in module manufacturing methods, the step of forming the third plate-shaped body by embedding the circuit component in the second plate-shaped body is performed by using a thermosetting resin. It is preferable to carry out at a temperature lower than the curing temperature. By performing the process at a temperature lower than the curing temperature of the thermosetting resin, the thermosetting resin can be softened without being cured, so that the circuit component can be easily embedded in the second plate-shaped body. Moreover, the surface of the circuit component built-in module can be made smooth.

In the first to fourth method for manufacturing a circuit component built-in module, in the step of mounting the circuit component on the copper foil or the wiring pattern, the circuit component and the copper foil or the wiring pattern are electrically and mechanically soldered. It is preferable that the method comprises the step of connecting to. According to the above process, when heating is performed to cure the thermosetting resin, it is possible to prevent defective connection between the circuit component and the wiring pattern due to heating.

[0033] In the first to fourth method for fabricating the circuit component built-in module, when implementing the circuit component in the copper foil or the wiring pattern, and the gold bumps and the copper foil or distribution <br/> line pattern of the circuit components Are preferably electrically connected by a conductive adhesive. By using a conductive adhesive,
It is possible to prevent connection failure and displacement of parts when heating in a later process.

In the first to fourth method for manufacturing a circuit component built-in module, the thermosetting resin is epoxy resin,
It is preferable to include at least one thermosetting resin selected from a phenol resin and a cyanate resin. This is because these resins are excellent in heat resistance and electric insulation.

In the first to fourth methods for manufacturing a circuit component built-in module, the inorganic fillers are Al ₂ O ₃ and Mg.
It is preferable to include at least one inorganic filler selected from O, BN, AlN and SiO ₂ . By using these inorganic fillers, an electrically insulating substrate having excellent heat dissipation can be obtained. Also, M as an inorganic filler
When gO is used, the linear expansion coefficient of the electrically insulating substrate can be increased. Further, as an inorganic filler, Si
When O ₂ (particularly amorphous SiO ₂ ) is used, the dielectric constant of the electrically insulating substrate can be reduced. Moreover, when BN is used as the inorganic filler, the linear expansion coefficient can be lowered.

In the above-mentioned first to fourth circuit component built-in module manufacturing methods, it is preferable that the wiring pattern contains copper. This is because copper has a small electric resistance and thus a fine wiring pattern can be formed.

In the above-mentioned first to fourth method for manufacturing a circuit component built-in module, it is preferable that the wiring pattern contains a conductive resin composition. The wiring pattern can be easily formed by using the conductive resin composition.

In the first to fourth methods for manufacturing a circuit component built-in module, it is preferable that the circuit component includes a semiconductor bare chip, and the semiconductor bare chip is flip-chip bonded to the wiring pattern. By flip-chip bonding a semiconductor bare chip, semiconductor elements can be mounted at high density.

In the first to fourth methods for manufacturing a circuit component built-in module, the conductive resin composition contains, as a conductive component, metal particles containing at least one metal selected from gold, silver, copper and nickel. It is preferable to include an epoxy resin as a resin component. This is because the above metal has a low electric resistance and the epoxy resin has excellent heat resistance and electric insulation.

In the above-mentioned first to fourth methods for manufacturing a circuit component built-in module, it is preferable that the wiring pattern is a lead frame of a metal plate formed by an etching method or a punching method. This is because the lead frame made of a metal plate has a low electric resistance. By using the etching method, a fine wiring pattern can be formed. By using the punching method, the wiring pattern can be formed with simple equipment.

In the above-described first to fourth method for manufacturing a circuit component built-in module, it is preferable that the circuit component includes at least one component selected from a chip-shaped resistor, a chip-shaped capacitor, and a chip-shaped inductor. By using the chip-shaped component, the component can be easily embedded in the electrically insulating substrate.

[0042]

BEST MODE FOR CARRYING OUT THE INVENTION An example of an embodiment of the present invention will be described below with reference to the drawings. (Embodiment 1) This Embodiment 1 is an example of a circuit component built-in module of the present invention, and FIG. 1 is a perspective sectional view of a circuit component built-in module 100 of this embodiment.

Referring to FIG. 1, a circuit component built-in module 100 according to this embodiment has an electrically insulating substrate 101 and wiring patterns 102a and 102b formed on one main surface and the other main surface of the electrically insulating substrate 101. And a circuit component 103 connected to the wiring pattern 102b and arranged inside the electrically insulating substrate 101, and an inner via 104 electrically connecting the wiring patterns 102a and 102b.

The electrically insulating substrate 101 is made of a mixture containing an inorganic filler and a thermosetting resin. As the inorganic filler, for example, Al ₂ O ₃ , MgO, BN, AlN or SiO ₂ can be used. The inorganic filler is
It is preferably from 70% to 95% by weight with respect to the mixture. The average particle size of the inorganic filler is from 0.1 μm to
It is preferably 100 μm or less. As the thermosetting resin, for example, an epoxy resin, a phenol resin or a cyanate resin having high heat resistance is preferable. Epoxy resins are particularly preferable because they have particularly high heat resistance. The mixture may further contain a dispersant, a coloring agent, a coupling agent or a releasing agent.

The wiring patterns 102a and 102b are
It is made of a substance having electrical conductivity, such as a copper foil or a conductive resin composition. When a copper foil is used as the wiring pattern, for example, a copper foil having a thickness of about 18 μm to 35 μm produced by electrolytic plating can be used. Copper foil
In order to improve the adhesiveness with the electrically insulating substrate 101, it is desirable to roughen the surface in contact with the electrically insulating substrate 101. Further, as the copper foil, in order to improve adhesiveness and oxidation resistance, a copper foil whose surface is subjected to a coupling treatment or a copper foil whose surface is plated with tin, zinc or nickel may be used. Moreover, you may use the lead frame of the metal plate formed by the etching method or the punching method for the wiring patterns 102a and 102b.

The circuit component 103 is, for example, the active component 1.
03a and passive component 103b. Active component 103
As a, for example, a semiconductor element such as a transistor, IC or LSI is used. The semiconductor element may be a bare semiconductor chip. A chip-shaped resistor, a chip-shaped capacitor, a chip-shaped inductor, or the like is used as the passive component 103b. The circuit component 10
3 may be a case where the passive component 103b is not included.

Wiring pattern 102b and active component 103a
Flip chip bonding, for example, is used for the connection with. The inner via 104 is made of, for example, a thermosetting conductive material. As the thermosetting conductive substance, for example, a conductive resin composition obtained by mixing metal particles and a thermosetting resin can be used. As the metal particles, gold, silver, copper or nickel can be used. Gold, silver, copper, or nickel is preferable because it has high conductivity, and copper is particularly preferable because it has high conductivity and less migration. As the thermosetting resin, for example, epoxy resin, phenol resin or cyanate resin can be used. Epoxy resins are particularly preferable because they have high heat resistance.

In the circuit component built-in module 100 shown in the first embodiment, the wiring pattern 102a and the wiring pattern 102b are connected by the inner via 104 filled in the through hole of the electrically insulating substrate 101. Therefore, in the circuit component built-in module 100, the circuit components 103 can be mounted with high density.

In the circuit component built-in module 100, the heat generated in the circuit component is quickly conducted by the inorganic filler contained in the electrically insulating substrate 101. Therefore, a highly reliable module with built-in circuit components can be obtained.

In the circuit component built-in module 100, the linear expansion coefficient, thermal conductivity, dielectric constant, etc. of the electrically insulating substrate 101 can be easily controlled by selecting the inorganic filler used for the electrically insulating substrate 101. You can When the coefficient of linear expansion of the electrically insulating substrate 101 is substantially equal to that of the semiconductor element, it is possible to prevent the occurrence of cracks and the like due to temperature changes, so that a highly reliable circuit component built-in module is obtained. By improving the thermal conductivity of the electrically insulating substrate 101, a circuit component built-in module having high reliability can be obtained even when circuit components are mounted at a high density.
By reducing the dielectric constant of the electrically insulating substrate 101, a high-frequency circuit module with a small dielectric loss can be obtained.

In the circuit component built-in module 100, since the circuit component 103 can be shielded from the outside air by the electrically insulating substrate 101, it is possible to prevent the reliability from decreasing due to humidity.

Further, the circuit component built-in module 1 of the present invention.
00 uses a mixture of an inorganic filler and a thermosetting resin as the material of the electrically insulating substrate 101, and thus unlike the ceramic substrate, it does not need to be fired at a high temperature and is easily manufactured.

In the circuit component built-in module 100 shown in FIG. 1, the wiring pattern 102a is not embedded in the electrically insulating substrate 101, but the wiring pattern 102a is embedded in the electrically insulating substrate 101. It may be (see FIG. 3 (h)).

In the circuit component built-in module 100 shown in FIG. 1, the case where the circuit component is not mounted on the wiring pattern 102a is shown.
A circuit component may be mounted on it, and a module with a built-in circuit component may be resin-molded (the same applies in the following embodiments). By mounting the circuit component on the wiring pattern 102a, the circuit component can be mounted at a higher density.

(Embodiment 2) In Embodiment 2, FIG.
An embodiment of a method of manufacturing the circuit component built-in module shown in FIG. The materials and circuit components used in the second embodiment are those described in the first embodiment.

FIGS. 2A to 2H are sectional views showing an embodiment of the manufacturing process of the circuit component built-in module. First, as shown in FIG. 2A, a plate-shaped mixture 200 is formed by processing a mixture containing an inorganic filler and a thermosetting resin. The plate-like mixture 200 can be formed by mixing an inorganic filler and an uncured thermosetting resin into a paste-like kneaded product, and molding the paste-like kneaded product to a constant thickness.

The plate-shaped mixture 200 may be heat-treated at a temperature lower than the curing temperature of the thermosetting resin. By performing the heat treatment, the tackiness can be removed while maintaining the flexibility of the mixture 200, which facilitates the subsequent treatment. Further, in the mixture in which the thermosetting resin is dissolved by the solvent, a part of the solvent can be removed by heat treatment.

After that, as shown in FIG. 2 (b), through holes 201 are formed at desired positions of the mixture 200 to form a plate-shaped body in which the through holes 201 are formed. The through hole 201 can be formed by, for example, laser processing, drilling, or die processing. Laser processing is preferable because the through holes 201 can be formed with a fine pitch and shavings are not generated. In laser processing, if a carbon dioxide gas laser or an excimer laser is used, the processing is easy. The through holes 201 may be formed at the same time when the paste-like kneaded material is molded to form the plate-shaped mixture 200.

Thereafter, as shown in FIG. 2C, the through hole 201 is filled with the conductive resin composition 202 to form a plate-like body having the through hole 201 filled with the conductive resin composition 202. To do.

In parallel with the steps of FIGS. 2A to 2C, as shown in FIG. 2D, a circuit component 204 is flip-chip bonded to the copper foil 203. The circuit component 204 is
It is electrically connected to the copper foil 203 via the conductive adhesive 205. For the conductive adhesive 205, for example, gold,
A material obtained by kneading silver, copper, a silver-palladium alloy or the like with a thermosetting resin can be used. Further, in place of the conductive adhesive 205, bumps produced by a gold wire bonding method or bumps by solder are previously formed on the circuit component side,
Heat treatment melts gold or solder to produce circuit components 204
It is also possible to implement. Furthermore, it is also possible to use a solder bump and a conductive adhesive together.

The circuit component 20 mounted on the copper foil 203
4 may be injected between the copper foil 203 and the copper foil 203 (in the following embodiments, the sealing resin may be injected between the circuit component and the copper foil or between the circuit component and the wiring pattern). The same is true). By injecting the sealing resin, it is possible to prevent a gap from being formed between the semiconductor element and the wiring pattern when the semiconductor element is embedded in the plate-shaped body in a later step. As the sealing resin, an underfill resin used for ordinary flip chip bonding can be used.

A copper foil 206 is formed in parallel with the steps of FIGS. After that, as shown in FIG. 2F, the copper foil 203 on which the circuit component 204 is mounted, FIG.
The plate-shaped body and the copper foil 206 are aligned and stacked.

Thereafter, as shown in FIG. 2 (g), the circuit components 2 are aligned by applying pressure to the stacked components.
After forming a plate-like body in which 04 is embedded, the mixture is heated and the mixture 200 and the conductive resin composition 2 are heated.
The thermosetting resin in 02 is cured to form a plate-shaped body in which the circuit component 204 is embedded. The heating is performed at a temperature equal to or higher than the temperature at which the thermosetting resin in the mixture 200 and the conductive resin composition 202 is cured (for example, 150 ° C. to 260 ° C.), and the mixture 200 becomes the electrically insulating substrate 207 and the conductive resin composition. The object becomes the inner via 208. By this step, the copper foils 203 and 206, the circuit component 204, and the electrically insulating substrate 207 are mechanically and firmly bonded. In addition, the inner vias 208 allow the copper foils 203 and 2 to be formed.
06 is electrically connected. In addition, when the thermosetting resin in the mixture 200 and the conductive resin composition 202 is cured by heating, 10 kg / cm ² to ² with heating.
By pressurizing with a pressure of 00 kg / cm ² , the mechanical strength of the circuit component module can be improved (the same applies in the following embodiments).

Then, as shown in FIG. 2 (h), the copper foil 2
Wiring patterns 209 and 210 are formed by processing 03 and 206. In this way, the circuit component built-in module described in the first embodiment is formed. According to the above manufacturing method, the circuit component built-in module described in the first embodiment can be easily manufactured.

In the second embodiment, the conductive resin composition 202 is used as the conductive material with which the through holes 201 are filled, but any thermosetting conductive material may be used (the same applies to the following embodiments. is there).

(Third Embodiment) In the third embodiment, FIG.
Another embodiment of the method of manufacturing the circuit component built-in module shown in FIG. The materials and circuit components used in the third embodiment are those described in the first embodiment.

3A to 3H are cross-sectional views showing the manufacturing process of the circuit component built-in module according to the third embodiment. First, as shown in FIG. 3A, a plate-shaped mixture 300 is formed by processing a mixture containing an inorganic filler and a thermosetting resin. Since this step is the same as that in FIG. 2A, duplicate description will be omitted.

After that, as shown in FIG. 3B, a through hole 301 is formed at a desired position of the mixture 300. Since this step is the same as that in FIG. 2B, duplicate description will be omitted.

Thereafter, as shown in FIG. 3C, the through hole 301 is filled with the conductive resin composition 302 to form a plate-like body having the through hole 301 filled with the conductive resin composition 302. To do.

In parallel with the steps of FIGS. 3A to 3C, as shown in FIG. 3D, the wiring pattern 303 is formed on the release film 305, and the circuit component 304 is formed on the wiring pattern 303. Implement. The method of mounting the circuit component 304 is
Since the method is the same as that described with reference to FIG. 2D, duplicate description will be omitted. For the release film 305, for example,
A film of polyethylene terephthalate or polyphenylene sulfite can be used. Wiring pattern 3
03 can be formed by, for example, adhering a copper foil to the release film 305 and then performing a photolithography process and an etching process. Further, as the wiring pattern 303, a lead frame made of a metal plate formed by an etching method or a punching method may be used.

In parallel with the steps of FIGS. 3A to 3C, a wiring pattern 306 is formed on the release film 307 as shown in FIG. 3E. The wiring pattern 306 can be formed by the same method as the wiring pattern 303.

After that, as shown in FIG. 3F, the release film 305, FIG. 2 is formed so that the wiring patterns 303 and 306 and the conductive material 302 are connected at a desired portion.
The plate-shaped body (c) and the release film 307 are aligned and stacked.

Then, as shown in FIG. 3 (g), the thermosetting resins in the mixture 300 and the conductive resin composition 302 are cured by applying pressure to the aligned and superposed materials and heating them to form a circuit. A plate-shaped body in which the component 304 and the wiring patterns 303 and 306 are embedded is formed. The heating is performed at a temperature equal to or higher than the temperature at which the thermosetting resin in the mixture 300 and the conductive resin composition 302 is cured (for example, 15).
(0 ° C. to 260 ° C.), the mixture 300 becomes the electrically insulating substrate 308, and the conductive resin composition 302 becomes the inner via 309. The inner vias 309 electrically connect the wiring patterns 303 and 306.

Thereafter, as shown in FIG. 3 (h), the release films 305 and 307 are peeled off from the plate-shaped body of FIG. 3 (g). In this way, the circuit component built-in module described in the first embodiment is formed. According to the above manufacturing method, the circuit component built-in module described in the first embodiment can be easily manufactured.

In this method, since the release film 307 on which the wiring pattern 306 is formed in advance is used,
It is possible to manufacture a circuit component built-in module in which the wiring pattern 306 is embedded in the electrically insulating substrate 308 and the surface is flat.
Since the surface is flat, components can be mounted on the wiring pattern 306 with high density, so that circuit components can be mounted with higher density.

(Embodiment 4) In Embodiment 4, an embodiment of a circuit component built-in module having a multilayer structure of the present invention will be described. FIG. 4 is a perspective sectional view of the circuit component built-in module 400 of the fourth embodiment.

With reference to FIG. 4, the circuit component built-in module 400 of this embodiment is composed of the laminated electrically insulating substrates 4
01a, 401b and 401c, and wiring patterns 402a, 402b, 402c formed on the main surface and inside of the electrically insulating substrate 401.
And 402d, the circuit component 403 arranged inside the electrically insulating substrate 401 and connected to the wiring pattern 402a, 402b or 402c, and the wiring pattern 402a,
And an inner via 404 for electrically connecting 402b, 402c, and 402d.

The electrically insulating substrates 401a, 401b and 401c are made of a mixture containing an inorganic filler and a thermosetting resin. Examples of the inorganic filler include Al ₂ O ₃ and
MgO, BN, AlN, SiO ₂ or the like can be used. Inorganic filler is 70% by weight based on the mixture
It is preferably about 95% by weight. The average particle size of the inorganic filler is preferably 0.1 μm to 100 μm. As the thermosetting resin, for example, an epoxy resin, a phenol resin or a cyanate resin having high heat resistance is preferable. Epoxy resins are particularly preferable because they have particularly high heat resistance. The mixture may further contain a dispersant, a coloring agent, a coupling agent or a releasing agent.

Wiring patterns 402a, 402b, 402
Since c and 402d are the same as the wiring patterns 102a and 102b described in the first embodiment, duplicate description will be omitted.

The circuit component 403 is, for example, the active component 4
03a and passive components 403b. As the active component 403a, for example, a semiconductor element such as a transistor, IC or LSI is used. The semiconductor element may be a bare semiconductor chip. A chip-shaped resistor, a chip-shaped capacitor, a chip-shaped inductor, or the like is used as the passive component 403b. The circuit component 403 is
The passive component 403b may not be included.

Wiring patterns 402a, 402b and 4
For example, flip chip bonding is used to connect the 02c and the active component 403a. Inner beer 4
04 is made of, for example, a thermosetting conductive material. As the inner via 404, for example, a conductive resin composition in which metal particles and a thermosetting resin are mixed can be used. As a material for the metal particles, a metal such as gold, silver, copper or nickel can be used. Gold, silver, copper, or nickel is preferable because it has high conductivity, and copper is particularly preferable because it has high conductivity and less migration. As the thermosetting resin, for example, epoxy resin,
Phenolic resins or cyanate resins can be used. Epoxy resins are particularly preferable because they have high heat resistance.

In the circuit component built-in module 400 shown in FIG. 4, the wiring pattern 402d is the electrically insulating substrate 4
Although the case where the wiring pattern 402d is not embedded in 01c is shown, the wiring pattern 402d may be embedded in the electrically insulating substrate 401c (see FIG. 6G).

Although the circuit component built-in module 400 having a three-layer structure is shown in FIG. 4, it may have a multilayer structure according to the design (the same applies to the following embodiments). (Embodiment 5) In Embodiment 5, an embodiment of a method of manufacturing the circuit component built-in module shown in Embodiment 4 will be described. The materials and circuit components used in the fifth embodiment are those described in the fourth embodiment.

An example of a method of manufacturing the circuit component built-in module shown in the fourth embodiment will be described with reference to FIG. Figure 5
(A)-(h) is sectional drawing which shows the manufacturing process of the circuit component built-in module of this embodiment.

First, as shown in FIG. 5A, a plate-shaped mixture 500 is formed by processing a mixture containing an inorganic filler and a thermosetting resin, and the conductive resin composition 501 is formed in the through holes. By filling, a plate-like body having the through holes filled with the conductive resin composition 501 is formed. This step is the same as the step described with reference to FIGS. 2A to 2C, and a duplicate description will be omitted.

On the other hand, the wiring pattern 506 is formed on the release film 503, and the active component 5 is formed on the wiring pattern 506.
04 and the passive component 505 are mounted. This step is the same as that described with reference to FIG. 3D, and duplicate description will be omitted.

After that, as shown in FIG.
The plate-shaped body of (a) and the release film 503 are aligned, overlapped and pressed, and then the release film 503 is peeled off to embed the wiring pattern 506, the active component 504, and the passive component 505. Form a plate.

In parallel with the steps of FIGS. 5A and 5B, a plurality of plate-like bodies in which the wiring patterns 506 and circuit components are embedded are formed in the same steps as those of FIGS. 5A and 5B. (See FIGS. 5C and 5D and FIGS. 5E and 5F). The wiring pattern 506 and the circuit component are different for each layer depending on the design.

After that, as shown in FIG.
The plate-shaped bodies of (b), (d) and (f) are aligned and stacked, and a copper foil 507 is further stacked on the main surface of the plate-shaped body of FIG. 5 (f) on which the wiring pattern is not formed.

After that, as shown in FIG.
The plate-shaped body and the copper foil 507 stacked in (g) are pressed and heated to form a plate-shaped body having a multilayer structure. The heating is performed at a temperature equal to or higher than the temperature at which the thermosetting resin in the mixture 500 and the conductive resin composition 501 is cured (for example, 15
(0 ° C. to 260 ° C.), the mixture 500 becomes the electrically insulating substrate 508, and the conductive resin composition 501 becomes the inner via 509. By this process, the circuit components 504 and 505, the copper foil 507, and the electrically insulating substrate 508 are mechanically firmly bonded. The inner via 509 electrically connects the wiring pattern 506 and the copper foil 507. Then, the copper foil 507 is processed to form a wiring pattern 510.

In this way, a circuit component built-in module having a multilayer structure can be formed. According to the above manufacturing method, a circuit component built-in module having a multilayer structure can be easily manufactured.

(Sixth Embodiment) In the sixth embodiment, another embodiment of the method for manufacturing the circuit component built-in module described in the fourth embodiment will be described. The materials and circuit components used in the sixth embodiment are those described in the fourth embodiment.

An example of a method of manufacturing the circuit component built-in module in this embodiment will be described with reference to FIG. 6A to 6G are cross-sectional views showing the manufacturing process of the circuit component built-in module in this embodiment.

First, as shown in FIG. 6A, a plate-shaped mixture 600 is formed by processing a mixture containing an inorganic filler and a thermosetting resin, and the through-hole is filled with the conductive substance 601. Thus, a plate-shaped body having the through holes filled with the conductive resin composition 601 is formed. This process is
It is similar to that described with reference to FIGS. 2A to 2C, and redundant description will be omitted. On the other hand, the wiring pattern 606 is formed on the release film 603, and the active component 604 and the passive component 605 are mounted on the wiring pattern 606. This step is the same as that described with reference to FIG. 3D, and duplicate description will be omitted.

After that, as shown in FIG.
After the plate-shaped mixture 600 of (a) and the release film 603 are aligned and stacked and pressed, the release film 603 is formed.
Is peeled off to form a plate-shaped body in which the wiring pattern 606, the active component 604 and the passive component 605 are embedded.

In parallel with the steps of FIGS. 6A and 6B, the plate-like body in which the wiring pattern 606 and the circuit components are embedded is formed by the same steps as those of FIGS. 6A and 6B. (See FIGS. 6 (c) and (d)). The wiring pattern 606 and the circuit component are different for each layer depending on the design.

In parallel with the steps of FIGS. 6A and 6B, as shown in FIG. 6E, a wiring pattern 607 is formed on the release film 603. After that, FIG.
As shown in (f), the plate-shaped bodies of FIGS. 6 (b) and 6 (d) are aligned and overlapped, and the plate-shaped bodies of FIG. 6 (d) are placed on the main surface on which the wiring pattern 606 is not formed. , And further in FIG.
The release film 603 of (e) is overlaid so that the wiring pattern 607 is inside.

After that, as shown in FIG.
By pressing and heating the plate-shaped body and the release film 603 stacked in (f), a plate-shaped body having a multilayer structure is formed. The heating is performed at a temperature equal to or higher than the temperature at which the thermosetting resin in the mixture 600 and the conductive resin composition 601 is cured (for example, 150 ° C. to 260 ° C.), the mixture 600 becomes the electrically insulating substrate 608, and the conductive resin composition is formed. The object 601 becomes the inner via 609. By this step, the active component 604, the passive component 605, the wiring patterns 606 and 607, and the electrically insulating substrate 608 are mechanically firmly bonded. In addition, the inner vias 609 electrically connect the wiring patterns 606 and 607.

After that, the release film 603 is peeled off from the plate-like body having a multi-layered structure to form a circuit component built-in module having a multi-layered structure. In this way, according to the above manufacturing method, it is possible to easily manufacture a circuit component built-in module having a multilayer structure.

[0100]

EXAMPLES Specific examples of the present invention will be described below. (Example 1) An example of a method for producing an electrically insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin in producing the circuit component built-in module of the present invention will be described.

In this example, an electrically insulating substrate having the composition shown in Table 1 was prepared. A comparative example is shown in Sample No. 1.

[0102]

[Table 1]

In this embodiment, the liquid epoxy resin contains
Epoxy resin (WE-20 manufactured by Nippon Pernox Co., Ltd.)
25, including an acid anhydride curing agent) was used. A phenol resin (Phenolite, VH4150) manufactured by Dainippon Ink and Chemicals, Inc. was used as the phenol resin. The cyanate resin is a cyanate resin (AroCy, M, manufactured by Asahi Ciba Co., Ltd.).
-30) was used. In this example, carbon black or a dispersant was added as an additive.

To prepare the plate-like body, first, a predetermined amount of the paste-like mixture mixed with the composition shown in Table 1 is dropped on the release film. The pasty mixture was prepared by mixing the inorganic filler and the liquid thermosetting resin for about 10 minutes with a stir mixer. The stirring mixer used is one in which an inorganic filler and a liquid thermosetting resin are put into a container having a predetermined volume and revolved while rotating the container itself. Even if the viscosity of the mixture is relatively high, sufficient dispersion is achieved. The state is obtained.
A 75 μm-thick polyethylene terephthalate film was used as the release film, and the film surface was subjected to a release treatment with silicon.

Next, the release film is further stacked on the paste-like mixture on the release film, and the thickness of the release film is 50 by a pressure press.
It pressed so that it might become 0 micrometer, and obtained the plate-shaped mixture.
Next, the plate-shaped mixture sandwiched between the release films was heated together with the release film, and heat-treated under the condition that the plate-shaped mixture had no tackiness. The heat treatment is holding at a temperature of 120 ° C. for 15 minutes. By this heat treatment, the tackiness of the plate-shaped mixture is lost, so that the release film is easily peeled off.
The liquid epoxy resin used in this example has a curing temperature of 1
Since it is 30 ° C., it is in an uncured state (B stage) under this heat treatment condition.

Next, the release film was peeled off from the plate-like mixture, and the plate-like mixture was sandwiched between heat-resistant release films (PPS: polyphenylene sulfite, thickness: 75 μm),
The plate-like mixture was cured by heating at a temperature of 170 ° C. while applying a pressure of 50 kg / cm ² .

Next, the heat resistant release film was peeled off from the cured plate-like mixture to obtain an electrically insulating substrate. This electrically insulating substrate was processed into a predetermined size, and the thermal conductivity, linear expansion coefficient and the like were measured. Thermal conductivity is 10
The surface of the sample cut into mm squares was heated by bringing it into contact with a heater, and was calculated from the temperature rise on the opposite surface. The linear expansion coefficient was obtained by measuring the dimensional change of the electrically insulating substrate when the temperature was raised from room temperature to 140 ° C., and averaging the dimensional change. As for the dielectric strength, the dielectric strength when an AC voltage was applied in the thickness direction of the electrically insulating substrate was obtained, and the dielectric strength per unit thickness was calculated.

As shown in Table 1, prepared by the above method.
The electrically insulating substrate is made of Al as an inorganic filler.₂O₃For
Conventional glass-epoxy substrate (thermal conductivity
0.2w / mK ~ 0.3w / mK)
It became about 10 times or more. Al ₂O₃85% by weight or more
By setting the thermal conductivity to 2.8 w / mK or more
We were able to. Al₂O₃Has the advantage of low cost
There is also.

AlN and MgO are used as the inorganic filler.
In the case of using, the thermal conductivity equal to or higher than that in the case of using Al ₂ O ₃ was obtained. Moreover, when amorphous SiO ₂ was used as the inorganic filler, the linear expansion coefficient was closer to that of a silicon semiconductor (linear expansion coefficient 3 × 10 ⁻⁶ / ° C.). Therefore, an electrically insulating substrate using amorphous SiO ₂ as an inorganic filler is preferable as a flip chip substrate on which a semiconductor is directly mounted.

When SiO ₂ was used as the inorganic filler, an electrically insulating substrate having a low dielectric constant was obtained.
SiO ₂ also has the advantage of having a low specific gravity. A circuit component built-in module using SiO ₂ as an inorganic filler is preferable as a high frequency module such as a mobile phone.

Further, when BN was used as the inorganic filler, an electrically insulating substrate having a high thermal conductivity and a low linear expansion coefficient was obtained. As shown in the comparative example (Sample No. 1) in Table 1, the withstand voltage of the electrically insulating substrate was 10 kV, except when 60 wt% of Al ₂ O ₃ was used as the inorganic filler.
/ Mm or more. The withstand voltage of the electrically insulating substrate is an index of the adhesiveness between the inorganic filler, which is a material of the electrically insulating substrate, and the thermosetting resin. That is, if the adhesiveness between the inorganic filler and the thermosetting resin is poor, a minute gap is generated between them and the dielectric strength voltage is lowered. Such a minute gap causes a decrease in reliability of the circuit component built-in module. Generally, if the withstand voltage is 10 kV / mm or more, it can be judged that the adhesiveness between the inorganic filler and the thermosetting resin is good. Therefore, the amount of the inorganic filler is preferably 70% by weight or more.

When the content of the thermosetting resin is low, the strength of the electrically insulating substrate is lowered.
It is preferably 8% by weight or more. (Example 2) Example 2 is an example in which a circuit component built-in module is manufactured by the method described in the second embodiment.

The composition of the electrically insulating substrate used in this example was 90% by weight of Al ₂ O ₃ (AS-40 manufactured by Showa Denko KK, spherical, average particle diameter 12 μm), liquid epoxy resin (Nippon Rec EF-450 manufactured by KK is 9.5% by weight, and carbon black (manufactured by Toyo Carbon Co., Ltd.) is 0.9% by weight.
2% by weight, and 0.3% by weight of a coupling agent (manufactured by Ajinomoto Co., Inc., titanate type, 46B).

A plate-like body (thickness: 500 μm) was produced by treating the above material under the same conditions as in Example 1. The plate-like body was cut into a predetermined size, and a through hole (diameter 0.15 mm) for connecting an inner via hole was formed using a carbon dioxide laser (see FIG. 2B).

The through hole was filled with a conductive resin composition by a screen printing method (see FIG. 2 (c)). The conductive resin composition comprises spherical copper particles of 85% by weight, bisphenol A type epoxy resin (made by Yuka Shell Epoxy, Epicoat 828) 3% by weight, and glycidyl ester-based epoxy resin (made by Toto Kasei, YD-171). ) 9% by weight and 3% by weight of amine adduct curing agent (manufactured by Ajinomoto, MY-24)
It was prepared by kneading and.

Next, one surface of a copper foil having a thickness of 35 μm was roughened, and a semiconductor element was flip-chip bonded to the roughened surface using a conductive adhesive (see FIG. 2D). Next, the copper foil on which the semiconductor element is mounted, the plate-like body filled with the conductive resin composition, and the separately prepared copper foil (copper foil having one surface roughened to a thickness of 35 μm) are aligned with each other. They were overlaid (see FIG. 2 (f)). At this time, the roughened surface of the copper foil was laminated so that it was on the plate-shaped body side.

Next, this was heated and pressed by a hot press machine at a press temperature of 120 ° C. and a pressure of 10 kg / cm ² for 5 minutes. By heating at a temperature lower than the curing temperature, the thermosetting resin in the plate-shaped body was softened, so that the semiconductor element was easily embedded in the plate-shaped body.

Next, the heating temperature is raised to 6 at 175.degree.
It was heated for 0 minutes (see FIG. 2 (g)). By this heating, the epoxy resin in the plate-shaped body and the epoxy resin in the conductive resin composition were cured, and the semiconductor element and the copper foil were mechanically and firmly connected to the plate-shaped body. In addition, the conductive resin composition and the copper foil were electrically (inner via connection) and mechanically connected by this heating.

Next, the copper foil on the surface of the plate-like body in which the semiconductor elements were embedded was etched by a photolithography process and an etching process to form a wiring pattern (FIG. 2).
(See (h)). In this way, a circuit component built-in module was created.

To evaluate the reliability of the circuit component built-in module manufactured according to this example, a solder reflow test and a temperature cycle test were conducted. The solder reflow test uses a belt type reflow tester and the maximum temperature is 260
It was carried out by repeating a cycle of 10 seconds at 10 ° C. 10 times.
In the temperature cycle test, after holding at 125 ° C. for 30 minutes,
The process of maintaining the temperature at -60 ° C for 30 minutes was repeated 200 cycles.

In both the solder reflow test and the temperature cycle test, no crack was generated in the circuit component built-in module of this example, and no particular abnormality was recognized even when the ultrasonic flaw detector was used. From this test, it is found that the semiconductor element and the electrically insulating substrate are firmly bonded to each other. Further, the resistance value of the inner via connection made of the conductive resin composition also hardly changed before and after the start of the test.

Example 3 Example 3 is an example of manufacturing a circuit component built-in module by the method described in the third embodiment.

First, in the same manner as in Example 2, a plate-like body (thickness: 500 μm) having through holes filled with a conductive resin composition was prepared.
m) was produced (see FIG. 3 (c)). Next, release film (made of polyphenylene sulfite, thickness 150 μm)
Then, a copper foil having a thickness of 35 μm was adhered thereto with an adhesive. This copper foil was roughened on one side and was bonded so that the glossy side was on the adhesive side.

Next, the copper foil on the release film is etched by a photolithography process and an etching process,
A wiring pattern was formed. Further, a semiconductor element was flip-chip bonded onto this wiring pattern using solder bumps (see FIG. 3D).

Next, a sealing resin was injected into the gap between the semiconductor element mounted on the wiring pattern and the wiring pattern. Specifically, a hot plate heated to 70 ° C. is tilted, a release film having a wiring pattern on which a semiconductor element is mounted is placed on the hot plate, and then a syringe is gradually provided between the semiconductor element and the wiring pattern. The sealing resin was injected into.
The sealing resin could be injected between the semiconductor element and the wiring pattern in about 10 seconds. The heating with the hot plate is for lowering the viscosity of the sealing resin so that the sealing resin can be injected in a short time. Also, the tilting of the hot plate is to facilitate injection. EL18B manufactured by Techno Alpha Co., Ltd. was used as the sealing resin. EL18B is a one-component epoxy resin mixed with SiO ₂ powder.

On the other hand, in parallel with the above steps, a release film (manufactured by polyphenylene sulphite, thickness 150 μm) having a wiring pattern formed on one surface was produced in the same manner as in the above steps (see FIG. 3E). .

Next, the release film having the semiconductor element bonded thereto, the plate-like body having the through holes filled with the conductive resin composition, and the release film having the wiring pattern formed on one surface thereof are aligned with each other. Were stacked (see FIG. 3 (f)).

Next, this was heated and pressed by a hot press machine at a press temperature of 120 ° C. and a pressure of 10 kg / cm ² for 5 minutes. The heating at a temperature lower than the curing temperature softens the thermosetting resin in the plate, so that the semiconductor element and the wiring pattern were easily buried in the plate.

Next, the heating temperature is raised to 6 at 175.degree.
It was heated for 0 minutes (see FIG. 3 (g)). This heating cures the plate-shaped body and the epoxy resin in the conductive resin composition, so that the semiconductor element and the wiring pattern and the plate-shaped body are mechanically and firmly connected. Further, by this heating, the conductive resin composition and the wiring pattern were electrically (inner via connection) and mechanically connected. Further, due to this heating, the sealing resin injected between the semiconductor element and the wiring pattern was also cured.

Next, the release film was peeled from the plate-like body (see FIG. 3 (h)). The release film made of polyphenylene sulfite has heat resistance at the heating temperature or higher. Further, the roughened surface of the copper foil is bonded to the plate-shaped body and the inner via, and the glossy surface of the copper foil is bonded to the release film.
Therefore, since the adhesive strength between the plate-shaped body and the inner via and the copper foil is larger than the adhesive strength between the release film and the copper foil, only the release film can be peeled off. In this way, a circuit component built-in module was created.

To evaluate the reliability of the circuit component built-in module manufactured in Example 3, a solder reflow test and a temperature cycle test were conducted under the same conditions as in Example 2.

In both the solder reflow test and the temperature cycle test, no crack was generated in the circuit component built-in module of Example 3, and no particular abnormality was recognized even when the ultrasonic flaw detector was used. From this test, it is found that the semiconductor element and the electrically insulating substrate are firmly bonded to each other. Further, the resistance value of the inner via connection made of the conductive resin composition also hardly changed before and after the start of the test.

Example 4 This example 4 is the same as the fifth embodiment.
It is an example of manufacturing a circuit component built-in module having a multi-layer structure by the method described in 1.

In Example 4, semiconductor elements and chip parts were used as circuit parts. First, in the same manner as in Example 2, a plate-shaped body having through holes filled with a conductive resin composition was formed.

Next, the plate-like body having the through-hole filled with the conductive resin composition and the release film (made of polyphenylene sulfite) having the wiring pattern in which the circuit component is flip-chip bonded are aligned with each other. And overlapped (see FIG. 5 (a)).

Next, this was pressed by a hot press machine.
Temperature 120 ℃, Pressure 10kg / cm ²Heat and press for 5 minutes
did. By heating at a temperature lower than the curing temperature, plate
Since the thermosetting resin inside is softened, the circuit components are
Easily buried in. Then, release film from the plate
By peeling it off, a plate-shaped body with circuit components embedded is formed.
(See FIG. 5 (b)).

A plurality of plate-like bodies were produced to obtain a plurality of plate-like bodies.
The body and copper foil are aligned and stacked (see Figure 5 (g)).
See). Next, this is pressed at a press temperature of 1 by a hot press machine.
75 ° C, pressure 50 kg / cm ²Heat and press for 60 minutes at
It was By this heat and pressure treatment, the circuit components were buried.
Multiple plates and copper foil are integrated into one plate
Been formed. By this heat and pressure treatment,
The epoxy resin in the conductive resin composition hardens, and circuit parts
And the wiring pattern and the plate-like body are mechanically and firmly connected.
It was In addition, this heat and pressure treatment causes the copper foil and
The line pattern and the conductive resin composition are electrically
A)), mechanically connected.

Next, a wiring pattern was formed by etching the copper foil on the surface of the plate-like body in which the circuit components were embedded by a photolithography process and an etching process (see FIG. 5 (h)). In this way, a circuit component built-in module having a multilayer structure was produced.

In order to evaluate the reliability of the circuit component built-in module manufactured in Example 4, a solder reflow test and a temperature cycle test were performed under the same conditions as in Example 2.

In both the solder reflow test and the temperature cycle test, no crack was generated in the circuit component built-in module of Example 4, and no particular abnormality was recognized even when the ultrasonic flaw detector was used. From this test, it is found that the semiconductor element and the electrically insulating substrate are firmly bonded to each other. Further, the resistance value of the inner via connection made of the conductive resin composition also hardly changed before and after the start of the test.

Example 5 This example 5 is the same as the sixth embodiment.
It is an example of manufacturing a circuit component built-in module having a multi-layer structure by the method described in 1.

First, in the same manner as in Example 2, a plate-like body having through holes filled with a conductive resin composition was formed. Next, a plate-like body having a through hole filled with a conductive resin composition,
A release film (made of polyphenylene sulphite) having a wiring pattern in which circuit components were flip-chip bonded was aligned and overlapped (see FIG. 6 (a)).

Next, this was pressed by a hot press machine.
Temperature 120 ℃, Pressure 10kg / cm ²Heat and press for 5 minutes
did. By heating at a temperature lower than the curing temperature, plate
Since the thermosetting resin inside is softened, the circuit components are
Easily buried in. Then, release film from the plate
A plate-like body was formed by peeling (see Fig. 6 (b)).
See). Similarly, a plate-like body in which circuit components were embedded was formed.
(See FIG. 6 (d)).

Next, a wiring pattern was formed on one surface of the release film (made of polyphenylene sulfite) (FIG. 6).
(See (e)). Next, the two plate-shaped bodies in which the circuit components were embedded and the release film on which the wiring pattern was formed were aligned and overlapped (see FIG. 6 (f)).

Next, this was pressed by a hot press machine.
Temperature 175 ° C, pressure 50kg / cm ²Heat for 60 minutes
Pressed. By this heat and pressure treatment, the circuit components are buried.
The plurality of plate-shaped bodies and the release film are
Two plates were formed. By this heat and pressure treatment,
The epoxy resin in the plate is cured, and circuit parts and wiring
The pattern and the plate-like body were mechanically and firmly connected. Well
In addition, the heat and pressure treatment causes the energy in the conductive resin composition to
Wiring pattern and conductive resin composition
And are connected electrically (inner via connection) and mechanically
It was

Next, the release film was peeled off from the integrated plate-like body to manufacture a circuit component built-in module having a multilayer structure (see FIG. 6 (g)). In order to evaluate the reliability of the circuit component built-in module manufactured in Example 5, a solder reflow test and a temperature cycle test were performed under the same conditions as in Example 2.

In both the solder reflow test and the temperature cycle test, no crack was generated in the circuit component built-in module of Example 5, and no particular abnormality was recognized even when the ultrasonic flaw detector was used. From this test, it is found that the semiconductor element and the electrically insulating substrate are firmly bonded to each other. Further, the resistance value of the inner via connection made of the conductive resin composition also hardly changed before and after the start of the test.

[0148]

As described above, in the circuit component built-in module of the present invention, since the electrically insulating substrate made of the mixture of the inorganic filler and the thermosetting resin is used, the heat radiation is prevented.
It is possible to obtain a module with a built-in circuit component that is highly effective .

The circuit component built-in module of the present invention has a multi-layer structure, so that the circuit components can be mounted at a higher density. Further, in the circuit component built-in module of the present invention, it is possible to control the thermal conductivity, linear expansion coefficient, dielectric constant, etc. of the electrically insulating substrate by selecting the inorganic filler. Therefore, in the circuit component built-in module of the present invention, the linear expansion coefficient of the electrically insulating substrate can be made substantially the same as that of the semiconductor element, and thus it is preferable as the circuit component built-in module having the semiconductor element built therein. Further, since the thermal conductivity of the electrically insulating substrate can be improved, it is preferable as a circuit component built-in module having a built-in semiconductor element or the like that requires heat dissipation. Further, since the dielectric constant of the electrically insulating substrate can be lowered, it is preferable as a circuit component built-in module for a high frequency circuit.

According to the method of manufacturing a circuit component built-in module of the present invention, the circuit component built-in module can be easily manufactured. Further, in the method for manufacturing a circuit component built-in module of the present invention, since the wiring pattern can be embedded in the electrically insulating substrate by using the release film having the wiring pattern formed, the circuit component built-in module having a smooth surface Is obtained. Therefore, when the circuit component is further mounted on the surface wiring pattern, the circuit component can be mounted with high density.

[Brief description of drawings]

FIG. 1 is a perspective sectional view showing an embodiment of a circuit component built-in module of the present invention.

FIG. 2 is a process drawing showing an embodiment of a method for manufacturing a circuit component built-in module of the present invention.

FIG. 3 is a process drawing showing another embodiment of the method of manufacturing a circuit component built-in module of the present invention.

FIG. 4 is a perspective sectional view showing another embodiment of the circuit component built-in module of the present invention.

FIG. 5 is a process drawing showing another embodiment of the method for manufacturing a circuit component built-in module of the present invention.

FIG. 6 is a process drawing showing another embodiment of the method of manufacturing a circuit component built-in module of the present invention.

[Explanation of symbols]

100, 400 Circuit component built-in modules 101, 401, 401a, 401b, 401c
Electrically insulating substrates 102a, 102b, 402a, 402b, 402c,
402d Wiring patterns 103, 403 Circuit parts 103a, 403a Active parts 103b, 403b Passive parts 104, 404 Inner vias

Continuation of front page (56) Reference JP-A-3-69191 (JP, A) JP-A-4-18787 (JP, A) JP-A-4-71297 (JP, A) JP-A-4-283987 (JP , A) JP 5-327228 (JP, A) JP 6-120671 (JP, A) JP 6-200124 (JP, A) JP 7-30060 (JP, A) JP 9-249795 (JP, A) JP 11-26943 (JP, A) JP 60-109296 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 1/18 H05K 3/46 H01L 21/52 H01L 23/12 H01L 23/28 H01L 23/52 H01L 25/00

Claims (45)

(57) [Claims] 1. An electrically insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least one main surface of the electrically insulating substrate, and the electrically insulating substrate. embedded sexually substrate includes and electrically connected to the circuit component on the wiring pattern, the circuit
The parts and the wiring pattern are electrically connected via a conductive adhesive.
Modules with built-in circuit parts that are connected together . 2. An electrically insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least one main surface of the electrically insulating substrate, and the electrically insulating substrate. embedded sexually substrate includes and electrically connected to the circuit component on the wiring pattern, the circuit
The parts and the wiring pattern are electrically connected via bumps.
Continued circuit component built-in module. 3. An electrically insulating substrate made of a mixture containing 70% by weight to 95% by weight of an inorganic filler and a thermosetting resin, and a plurality of electrically insulating substrates formed on at least one main surface of the electrically insulating substrate. A circuit component built-in module including a wiring pattern and a circuit component embedded in the electrically insulating substrate and mounted on the wiring pattern. 4. A plurality of stacked electrically insulating substrates made of a mixture containing an inorganic filler and a thermosetting resin, and formed on at least one main surface and inside of the stacked plurality of electrically insulating substrates. a plurality of wiring patterns, wherein embedded in the plurality of stacked electrically insulating substrate and a electrically connected to the circuit component on the wiring pattern, the circuit
The parts and the wiring pattern are electrically connected via a conductive adhesive.
Modules with built-in circuit parts that are connected together . 5. A plurality of stacked electrically insulating substrates made of a mixture containing an inorganic filler and a thermosetting resin, and formed on at least one main surface and inside of the stacked plurality of electrically insulating substrates. a plurality of wiring patterns, wherein embedded in the plurality of stacked electrically insulating substrate and a electrically connected to the circuit component on the wiring pattern, the circuit
The parts and the wiring pattern are electrically connected via bumps.
Continued circuit component built-in module. 6. A plurality of laminated electrically insulating substrates made of a mixture containing 70% by weight to 95% by weight of an inorganic filler and a thermosetting resin, and at least one of the laminated plurality of electrically insulating substrates. A plurality of wiring patterns formed on the main surface and inside, and a circuit component embedded in the plurality of laminated electrically insulating substrates and mounted on the wiring pattern,
Module with built-in circuit parts. 7. The circuit component and the wiring pattern are guided by each other.
It is electrically connected via an electric adhesive and bumps
The circuit component built-in module according to claim 1 or 4 . 8. The bump is a gold bump or a solder bump
The circuit component built-in module according to any one of claims 2, 5, and 7 . 9. The circuit component is a conductive adhesive or a bun.
Is mounted on the wiring pattern using
The circuit component built-in module according to claim 3 or 6 . Wherein said electrically insulating substrate, the circuit component built according to any one of claims 1, 2, 4, and 5 made of a mixture comprising an inorganic filler 70% by weight to 95% by weight and a thermosetting resin module. 11. The circuit component built-in module according to claim 1, further comprising an inner via formed in the electrically insulating substrate and electrically connected to the wiring pattern. 12. The wiring pattern according to claim 1, wherein the wiring pattern is formed on a main surface and inside of the electrically insulating substrate .
The circuit component built-in module according to any one of the above. 13. The circuit component built-in module according to claim 11, wherein the circuit component includes an active component, and the inner via is made of a conductive resin composition. 14. The circuit component according to claim 1, which is shielded from the outside air by the electrically insulating substrate.
Circuit component built-in module of crab described. 15. The thermosetting resin is an epoxy resin,
Any of claims 1 to 6 containing at least one thermosetting resin selected from a phenol resin and a cyanate resin.
The circuit component built-in module according to claim 1. 16. The inorganic filler is Al ₂ O ₃ , Mg
O, the circuit component built-in module <br/> according to claim 1 comprising at least one inorganic filler BN, selected from AlN and SiO _2. 17. The average particle diameter of the inorganic filler is 0.
The circuit component built-in module according to any one of claims 1 to 6, which has a thickness of 1 μm to 100 μm. 18. The method of claim 1 wherein the wiring pattern comprises copper
7. The circuit component built-in module according to any one of items 6 to 6 . 19. The circuit component built-in module according to claim 1, wherein the wiring pattern contains a conductive resin composition. 20. The method of claim 19, wherein the circuit component comprises a semiconductor bare chip, the semiconductor bare chip according to claim 6 gall is flip-chip bonded to the wiring pattern
The circuit component built-in module according to any one of the above. 21. The conductive resin composition, gold, silver, comprise metal particles including one metal selected from copper and nickel as the electrically conductive component of claim 13 containing an epoxy resin as a resin component Module with built-in circuit parts. 22. The wiring pattern, the circuit component built-in module according to claim 1 comprising a lead frame of metal plate formed by etching or stamping. 23. The circuit component, chip-like resistor, chip-like capacitors and claims 1-6 noise including at least one component selected from the chip-shaped inductor
Circuit component built-in module of Rekani described. 24. said mixture, dispersing agents, colorants, circuit component built-in module according to claim 1, further comprising at least one additive selected from the coupling agents and release agents. 25. The linear expansion coefficient of the electrically insulating substrate is 8.
The circuit component according to any one of claims 1 to 6, wherein the electrical conductivity of the electrically insulating substrate is from 1 × 10 ⁻⁶ / ° C. to 20 × 10 ⁻⁶ / ° C., and the thermal conductivity of the electrical insulating substrate is from 1 w / mK to 10 w / mK. Built-in module. 26. 70% by weight to 95% by weight of inorganic filler
And a step of processing a mixture containing a thermosetting resin in an uncured state into a first plate-shaped body having a through hole, and a thermosetting conductive material being filled in the through hole, thereby thermosetting Forming a second plate-shaped body in which the conductive material is filled in the through hole, mounting a circuit component on one main surface of the first copper foil, and forming the second copper foil in the first copper foil. A third plate-shaped body in which the circuit component is embedded by aligning and stacking the second plate-shaped body on one main surface, and further stacking and pressing a second copper foil on the second plate-shaped body. And a step of heating the third plate-shaped body to cure the thermosetting resin and the conductive material, and processing the first and second copper foils to form a wiring pattern. And a method of manufacturing a module with a built-in circuit component. 27. Inorganic filler 70% by weight to 95% by weight
And a step of processing a mixture containing a thermosetting resin in an uncured state into a first plate-shaped body having a through hole, and a thermosetting conductive material being filled in the through hole, thereby thermosetting A step of forming a second plate-like body in which the conductive material is filled in the through holes, and a wiring pattern is formed on one main surface of the first release film,
A step of mounting a circuit component on the wiring pattern; a step of forming a wiring pattern on one main surface of a second release film; the first release film, the second plate-shaped body, and the first release film. Two
The release film and the release film are aligned in this order so that the wiring pattern faces the second plate-shaped body, and are overlapped and pressed to form a third plate-shaped body in which the circuit component is embedded. A step of heating the third plate-shaped body to cure the thermosetting resin and the conductive substance; and a third step of curing the first and second release films.
The method for manufacturing a circuit component built-in module, which comprises a step of peeling from the plate-shaped body. 28. A method of manufacturing a circuit component built-in module having a multi-layer structure, comprising: a mixture containing 70 wt% to 95 wt% of an inorganic filler and an uncured thermosetting resin, and having a through hole And a second plate-shaped body in which the through-hole is filled with the thermosetting conductive substance by filling the through-hole with the thermosetting conductive substance. Process and forming a wiring pattern on one main surface of the first release film,
A step of mounting a circuit component on the wiring pattern; and a step of aligning and pressing the second plate-shaped body on the one main surface side of the first release film to apply the circuit component. A step of forming an embedded third plate-like body; a step of peeling the first release film from the third plate-like body to form a fourth plate-like body; A fourth plate-shaped body is aligned and stacked, and a second release film having a wiring pattern formed on one main surface is further aligned so that the wiring pattern faces the fourth plate-shaped body side. Stacking, pressing and heating to cure the thermosetting resin and the conductive material to form a fifth plate-like body having a multilayer structure; and the second release film to the fifth release film. And a step of peeling from the plate-shaped body of Manufacturing method of circuit component built-in module. 29. A method of manufacturing a circuit component built-in module having a multi-layer structure, comprising a mixture containing 70 wt% to 95 wt% of an inorganic filler and an uncured thermosetting resin, the first mixture having a through hole. And a second plate-shaped body in which the through-hole is filled with the thermosetting conductive substance by filling the through-hole with the thermosetting conductive substance. A step of forming a wiring pattern on one main surface of a first release film and mounting a circuit component on the wiring pattern; a step of mounting the circuit component on the one main surface side of the first release film; By aligning and stacking the two plate-shaped bodies,
A step of forming a third plate-shaped body in which the circuit component is embedded, and a step of peeling the first release film from the third plate-shaped body to form a fourth plate-shaped body A plurality of the fourth plate-shaped bodies are aligned and stacked, and a copper foil is further stacked thereon and pressed and heated to cure the thermosetting resin and the conductive substance to form a multilayer structure. A method for manufacturing a circuit component built-in module, comprising: a step of forming a fifth plate-shaped body having the step; and a step of processing the copper foil of the fifth plate-shaped body to form a wiring pattern. 30. The circuit component includes an active component, and the conductive material is a conductive resin composition.
9. The method of manufacturing a circuit component built-in module according to any one of 9 above. 31. The method further comprising the step of mounting the circuit component on the copper foil or the wiring pattern and then injecting a sealing resin between the copper foil or the wiring pattern and the circuit component. 29. A method of manufacturing a circuit component built-in module according to any one of 29. 32. The temperature at which the thermosetting resin and the conductive substance are heated and cured is 150 ° C. or higher and 260.
The method for producing a circuit component built-in module according to any one of claims 26 to 29, wherein the temperature is not higher than ° C. 33. When heating and curing the thermosetting resin and the conductive substance, 10 kg /
27. Pressurizing with a pressure of cm ^{2 to} 200 kg / cm ^2.
29. A method of manufacturing a circuit component built-in module according to any one of items 29 to 29. 34. The step of forming the first plate-shaped body,
27. A step of depressurizing the plate-like mixture by heat-treating the mixture at a temperature lower than the curing temperature of the thermosetting resin after molding the mixture into a plate-like shape. 29. A method of manufacturing a circuit component built-in module according to any one of items 29 to 29. 35. The step of forming the third plate-shaped body by embedding the circuit component in the second plate-shaped body is performed at a temperature lower than the curing temperature of the thermosetting resin. A method for manufacturing a circuit component built-in module according to any one of 26 to 29. 36. The step of mounting the circuit component on the copper foil or the wiring pattern comprises a step of electrically and mechanically connecting the circuit component and the copper foil or the wiring pattern by soldering. 31. A method of manufacturing a circuit component built-in module according to any of 26 to 30. 37. When mounting the circuit component on the copper foil or the wiring pattern, the gold bumps of the circuit component and the copper foil or the wiring pattern are electrically connected by a conductive adhesive. 31. A method of manufacturing a circuit component built-in module according to any of 26 to 30. 38. The thermosetting resin is an epoxy resin,
The method for manufacturing a circuit component built-in module according to claim 26, comprising at least one thermosetting resin selected from a phenol resin and a cyanate resin. 39. The inorganic filler is Al ₂ O ₃ , Mg
The method of manufacturing a circuit component built-in module according to claim 26, comprising at least one inorganic filler selected from O, BN, AlN and SiO ₂ . 40. The method of manufacturing a circuit component built-in module according to claim 27, wherein the wiring pattern contains copper. 41. The method of manufacturing a circuit component built-in module according to claim 27, wherein the wiring pattern contains a conductive resin composition. 42. The method of manufacturing a circuit component built-in module according to claim 30, wherein the circuit component includes a semiconductor bare chip, and the semiconductor bare chip is flip-chip bonded to the copper foil or the wiring pattern. 43. The conductive resin composition contains metal particles containing at least one metal selected from gold, silver, copper and nickel as a conductive component, and an epoxy resin as a resin component. A method for manufacturing a circuit component built-in module according to. 44. The method for manufacturing a circuit component built-in module according to claim 27, wherein the wiring pattern comprises a lead frame made of a metal plate formed by an etching method or a punching method. 45. The circuit component built-in module according to claim 26, wherein the circuit component includes at least one component selected from a chip-shaped resistor, a chip-shaped capacitor, and a chip-shaped inductor. Method.