JP5110164B2 - Component built-in module and manufacturing method thereof - Google Patents

Description

  The present invention relates to a component built-in module and a manufacturing method thereof, and more particularly to a component built-in module in which a circuit component is built in a resin substrate and a manufacturing method thereof.

  Conventionally, various component built-in modules in which circuit components are built in a resin substrate have been proposed.

  For example, as shown in the cross-sectional view of FIG. 6, the circuit component 204 is mounted on the copper foil 203 via the conductive adhesive 205, and the through hole 201 is filled with the conductive resin 202. After the plate-like member 200 containing the conductive resin and the copper foil 206 are overlaid and heated to soften the plate-like member 200 and incorporate the circuit component 204 in the electrically insulating substrate 207, the wiring patterns 209 and 210 are formed. (For example, refer to Patent Document 1).

Japanese Patent Laid-Open No. 11-220262

  However, if the resin is heated in order to embed a circuit component mounted using a conductive material such as solder in the resin, the conductive material such as solder may be remelted and a short circuit may occur. Therefore, when the pitch between the terminal electrodes of the circuit component is narrow, or when the gap between the circuit components embedded in the resin is small, it is difficult to manufacture the component built-in module.

  In view of such circumstances, the present invention intends to provide a component built-in module and a method for manufacturing the same, in which a short circuit due to melting of a conductive material or the like does not occur.

  In order to solve the above problems, the present invention provides a component built-in module configured as follows.

The component built-in module includes (a) a substrate body to which a plurality of resin layers are joined, and (b) a circuit component disposed inside the substrate body , the terminal electrode and a dielectric layer covering the terminal electrode. And (c) a wiring pattern disposed in contact with the main surface of at least one of the resin layers. And the terminal electrodes of the circuit component and the wiring pattern are capacitively coupled via the dielectric layer.

  According to the above configuration, since it is not necessary to mount circuit components on the wiring pattern using a conductive material such as solder, a short circuit does not occur due to melting of the conductive material due to heating when the resin layer is bonded. .

  Preferably, a wiring pattern arranged in contact with the main surface of the resin layer is further provided. When seen through from a direction perpendicular to the main surface of the resin layer, the wiring pattern includes the circuit component.

  In this case, a wiring pattern is provided on the upper side and / or the lower side of the circuit component, and the wiring pattern is formed so that its projection plane includes the projection plane of the circuit component when viewed in plan.

  When the resin substrate formed by laminating the resin sheets is particularly flexible, if the resin substrate is deformed by an impact applied to the resin substrate, the embedded circuit component may be damaged. Therefore, by providing a wiring pattern so as to enclose the circuit component, damage to the circuit component can be minimized. Further, when the resin substrate is deformed, there is a possibility that the capacitance value formed between the terminal electrode of the circuit component and the wiring pattern may fluctuate, but the fluctuation can be minimized.

Preferably, a pair of the wiring patterns facing each other and a via-hole conductor connecting the pair of wiring patterns are provided. The circuit component is disposed between the pair of wiring patterns.

  In this case, wiring patterns are provided on the upper and lower sides of the circuit component, and the wiring patterns are connected to each other by via-hole conductors. Since the via-hole conductor functions as a support between the upper and lower wiring patterns of the circuit component, damage to the circuit component can be more effectively suppressed and the capacitance value can be stabilized.

  In order to solve the above-mentioned problems, the present invention provides a method for manufacturing a component built-in module configured as follows.

The method for manufacturing a component built-in module is a method for manufacturing a component built-in module in which circuit components are arranged inside a substrate body to which a plurality of resin layers are bonded. In the component built-in module manufacturing method, (i) a first step of laminating the resin layer with a circuit component having a terminal electrode and a dielectric layer covering the terminal electrode disposed between the resin layers. And (ii) a second step of heating and pressure-bonding the laminated resin layers. In the first step, a wiring pattern between the resin layer is disposed, in the state where the dielectric layer is in contact before Symbol circuit components wiring pattern, laminating the resin layer.

  According to the above method, the wiring pattern and the terminal electrode of the circuit component can be capacitively coupled. When capacitively coupled, there is no need to mount circuit components on the wiring pattern using a conductive material such as solder, so that a short circuit does not occur due to melting of the conductive material due to heating of the resin layer.

  Preferably, in the first step, after fixing the circuit component to one main surface of the resin layer using a fixing material, at least 1 is applied to the one main surface of the resin layer to which the circuit component is fixed. The other resin layer of the layer is laminated. The fixing material disappears before the resin layer laminated in the second step is heated and pressure-bonded.

  In this case, when the other resin layer is laminated on the one main surface of the resin layer to which the circuit component is fixed, the circuit component can be fixed so as not to move. Since the fixing material disappears after the resin layers are laminated, the laminated resin layer is heated and pressure-bonded, so that the fixing material does not remain inside the component built-in module. For this reason, the fixing material does not have an adverse effect such as being confined between the resin layers and causing cracks.

  Preferably, the fixing material is an organic solvent.

  Since the organic solvent is easily vaporized and easily lost, the operation is facilitated.

  According to the present invention, a short circuit due to melting of the conductive material does not occur. Therefore, it is possible to easily cope with the narrowing of the pitch of the terminals of the circuit components incorporated in the component built-in module.

It is sectional drawing of a component built-in module. Example 1 It is sectional drawing of a component built-in module. (Example 2) It is sectional drawing of a component built-in module. (Example 3) It is sectional drawing before joining of a component built-in module. Example 4 It is sectional drawing of a component built-in module. Example 4 It is sectional drawing which shows the manufacturing process of a component built-in module. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> The component built-in module 30 of Example 1 is demonstrated, referring FIG. FIG. 1A is a cross-sectional view of the component built-in module 30 before joining. FIG. 1B is a cross-sectional view of the component built-in module 30 after joining.

  As shown in FIG. 1, the component built-in module 30 includes wiring patterns 10a, 12a, 12b, and 14a on the inside and the surface of a substrate body 32 to which resin layers 11, 13, 15, 17, and 19 of thermoplastic resin are bonded. , 14b, 14c, 16a, 16b, 18a and through conductors 11a, 11b, 13a, 13b, 15a, 15b, 17a, 17b, 19a, 19b are formed inside the substrate body 32, such as an IC chip or a capacitor. The circuit component 2 is incorporated. The terminal electrodes 6 a and 6 b of the circuit component 2 are capacitively coupled to the wiring patterns 14 a and 14 b through the resin layer 13.

  When the terminal electrodes 6a and 6b of the circuit component 2 and the wiring patterns 14a and 14b are capacitively coupled, the terminal electrodes 6a and 6b of the circuit component 2 can be connected to the wiring pattern via a conductive material without being connected to the wiring pattern. The component 2 and the wiring pattern can be electrically connected. Therefore, there is no danger of a short circuit due to melting of the conductive material. Moreover, even if the terminal electrodes 6a and 6b of the circuit component 2 become narrow, it can be easily handled. Also, a plurality of circuit components can be incorporated with a small gap.

  The capacitance formed between the terminal electrodes 6a, 6b of the circuit component 2 and the wiring patterns 14a, 14b is another circuit element (not shown) provided in the component built-in module 30 in the same manner as the circuit component 2. In addition, it can be used as one element of a circuit constituting the component built-in module 30. For example, it can be used as a capacitance element for impedance matching. Together with the built-in inductance element, it can also be used as a capacitance element of the LC resonance circuit. It is also used as a DC component cutting element for preventing a DC voltage from being applied to circuit components when a surge voltage is applied.

  The upper wiring pattern 10a and the lower wiring pattern 16b of the embedded circuit component 2 are formed such that their projection plane includes the projection plane of the circuit component 2 when viewed in plan. That is, when seen through from a direction perpendicular to the main surface of the resin layer 11 on which the wiring pattern 10 a is arranged, the wiring pattern 10 a includes the circuit component 2. Further, when seen through from the direction perpendicular to the main surface of the resin layer 17 on which the wiring pattern 16 b is disposed, the wiring pattern 16 b includes the circuit component 2.

  Furthermore, the wiring pattern 10a provided on the upper side of the circuit component 2 and the wiring pattern 16b provided on the lower side of the circuit component 2 are connected by via-hole conductors 11b, 13b, and 15b. These via-hole conductors 11b, 13b, and 15b function as pillars of the wiring pattern 10a and the wiring pattern 16b, so that damage to the circuit component 2 can be more effectively suppressed, and the terminal electrodes 6a and 6b of the circuit component 2 The capacitance value between the wiring patterns 14a and 14b can be stabilized.

  Because of this, the wiring patterns provided above and below the circuit components are connected via via-hole conductors provided at a plurality of locations (that is, there are wiring patterns above and below the circuit components. And a structure having a plurality of via-hole conductors around the periphery of the substrate.

  Next, a method for manufacturing the component built-in module 30 will be described.

  (1) First, as shown in the sectional view of FIG. 1A, resin substrates 10, 12, 14, 16 having predetermined wiring patterns 10a, 12a, 12b, 14a, 14b, 14c, 16a, 16b, 18a. , 18 are produced.

  The resin substrates 10, 12, 14, 16, and 18 are produced using, for example, a resin sheet having a metal foil on one side. That is, a photosensitive resist is applied on the metal foil of the resin sheet, exposed and developed, a predetermined mask pattern is formed, the metal foil is etched through the mask pattern, and then the mask pattern is removed. Thus, the wiring patterns 10a, 12a, 12b, 14a, 14b, 14c, 16a, 16b, and 18a having a predetermined shape are formed on the resin layers 11, 13, 15, 17, and 19 of the resin sheet using a metal foil. A wiring pattern may be formed on the resin sheet by inkjet or plating.

  Further, after forming a through hole in the resin sheet by laser processing or drilling, the conductive material is filled into the through hole by printing or the like, and the through conductors 11a, 11b, 13a, 13b, 15a, 15b, 17a, 17b, 19a and 19b are formed.

  The resin sheet becomes the resin layers 11, 13, 15, 17, and 19. For the resin sheet, a material that is easy to process and less deformed after processing is suitable, and preferably has flexibility. For example, a thermoplastic resin such as liquid crystal polymer (LCP), polyimide, or fluorine resin is used. In particular, a liquid crystal polymer (LCP) is particularly preferable because of its low water absorption and extremely small deformation after etching. For the metal foil on the resin sheet, a material that can easily form a wiring pattern having a predetermined shape, such as copper, is used.

  (2) Next, the circuit component 2 to be incorporated, such as an IC chip or a capacitor, is mounted at a predetermined position on a predetermined resin substrate 12 and fixed using a fixing material 80.

  The fixing member 80 may be applied to the built-in circuit component 2 side, the resin substrate 12 side, or both of them. In the case of applying to the resin substrate 12 side, the application work is facilitated by applying to a certain range wider than the area where the circuit component 2 is mounted or to the entire surface of the resin substrate 12. The fixing member 80 may be applied to the terminal electrodes 6a and 6b of the circuit component 2. The fixing member 80 may be applied only to the main body 4 of the circuit component 2 and may not be applied to the terminal electrodes 6a and 6b.

  The fixing member 80 only needs to be able to fix the circuit component 2 so that the position thereof does not shift with respect to the resin substrate 12, and a general epoxy or acrylic adhesive can also be used.

  For the fixing member 80, a liquid having a high viscosity at the time of fixing may be used.

  Alternatively, the viscosity is not high when the circuit component 2 is arranged on the resin substrate 12, but the viscosity may be increased or solidified to fix the circuit component 2 when the temperature is lowered after the arrangement. In this case, after applying the fixing material 80 and arranging the circuit component 2 at a predetermined position on the resin substrate 12, the subsequent lamination process is performed in a state where the temperature is lowered and the circuit component 2 is fixed to the resin substrate 12. . For example, using a fixing material 80 having a freezing point of around 60 ° C., applying the liquid fixing material 80 to the resin substrate 12 at a temperature higher than normal temperature (for example, 80 ° C.) and mounting the circuit component 2, then returning to normal temperature. In a state where the fixing member 80 is solidified and the component 2 is fixed, the resin substrates 10, 12, 14, 16, and 18 are stacked to form a stacked body.

  If the fixing material 80 remains inside the component built-in module 30, there is a possibility of causing problems such as cracks. Therefore, after the resin substrates 10, 12, 14, 16, 18 are laminated in a subsequent process, Those that disappear before the pressure bonding are preferred. For example, an organic solvent such as ethylene glycol, glycerin, oligomer, etc., which has a higher viscosity than water and disappears at a temperature (for example, about 200 ° C.) lower than the heating temperature (for example, about 300 ° C.) in the thermocompression bonding process, The fixing material 80 can be used. Since the organic solvent is easily vaporized and easily disappears, the operation becomes easy.

  (3) Next, the resin substrates 10, 12, 14, 16 and 18 are stacked in a predetermined order to form a laminate, and the laminate is pressed in the stacking direction and evacuated, and then the resin substrates 10, 12, The thermoplastic resin of the resin layers 11, 13, 15, 17, 19 is heated to a temperature not exceeding the glass transition temperature of the resin layers 11, 13, 15, 17, 19 of the 14, 16, 18 (eg, 300 ° C.). Is softened and the resin layers 11, 13, 15, 17, 19 are pressure-bonded. At this time, the resin layer 11 superimposed on the circuit component 2 is softened and deformed so as to wrap around the circuit component 2.

  As described above, it is preferable that the fixing material 80 is vaporized and disappears before the laminated body is heated and pressed.

  Further, as illustrated in FIG. 1A, it is preferable that an opening 11 k corresponding to the shape of the circuit component 2 is formed in the resin layer 11 that wraps the circuit component 2. By providing the opening part 11k and accommodating the circuit component 2 in the opening part 11k at the time of stacking, the resin layer 11 due to the volume exclusion effect of the circuit part 2 at the time of stacking compared to the case where the opening part 11k is not provided. Can be prevented from being deformed.

  (4) Next, after heating and pressure bonding, if necessary, the wiring patterns 10a and 18a are etched or plated to complete the component built-in module 30. For example, a surface mount type component may be mounted on the wiring pattern 10 a of the component built-in module 30.

  Through the above steps, the component built-in module 30 can be manufactured using the resin substrates 10, 12, 14, 16, and 18 in which the resin layers 11, 13, 15, 17, and 19 are thermoplastic resins.

  Second Embodiment A component built-in module 30a according to a second embodiment will be described with reference to FIG. FIG. 2A is a cross-sectional view of the component built-in module 30a before joining. FIG. 2B is a cross-sectional view of the component built-in module 30a after joining.

  The component built-in module 30a according to the second embodiment is configured in substantially the same manner as the component built-in module 30 according to the first embodiment, and can be manufactured through substantially the same process. In the following description, the same reference numerals are used for the same components as in the first embodiment, and differences from the first embodiment will be mainly described.

  As shown in FIG. 2, in the component built-in module 30a according to the second embodiment, the terminal electrodes 6a and 6b of the circuit component 2 built in the substrate body 32a are joined to the electrode patterns 12s and 12t. The electrode patterns 12 s and 12 t are capacitively coupled to the wiring patterns 14 a and 14 b through the resin layer 13.

  The electrode patterns 12s and 12t to which the terminal electrodes 6a and 6b of the circuit component 2 are joined are formed separately and separately from the wiring patterns 10a, 12a, 12b, 14a, 14b, 14c, 16a, 16b, and 18a. Yes. That is, no direct current flows between the electrode patterns 12s and 12t and the wiring patterns 10a, 12a, 12b, 14a, 14b, 14c, 16a, 16b, and 18a.

  When the electrode patterns 12s and 12t joined to the terminal electrodes 6a and 6b of the circuit component 2 and the wiring patterns 14a and 14b are capacitively coupled, the facing area is increased and the capacitive coupling can be reliably performed.

  Similarly to the first embodiment, since the terminal electrodes 6a and 6b of the circuit component 2 do not need to be connected to the wiring pattern through the conductive material, there is no danger of short-circuiting due to melting of the conductive material. Moreover, even if the terminal electrodes 6a and 6b of the circuit component 2 become narrow, it can be easily handled. Also, a plurality of circuit components can be incorporated with a small gap.

  Next, a manufacturing method of the component built-in module 30a will be described.

  (1) As in the first embodiment, first, as shown in the sectional view of FIG. 2A, predetermined wiring patterns 10a, 12a, 12b, 14a, 14b, 14c, 16a, 16b, 18a and an electrode pattern 12s. , 12t and the through conductors 11a, 11b, 13a, 13b, 15a, 15b, 17a, 17b, 19a, 19b are produced. The resin substrates 10, 12, 14, 16, and 18 are formed using, for example, a thermoplastic resin sheet having a metal foil on one side. In this embodiment, a case where copper foil is used as the metal foil and the wiring patterns 10a, 12a, 12b, 14a, 14b, 14c, 16a, 16b, 18a and the electrode patterns 12s, 12t are made of Cu will be described.

  The electrode patterns 12s and 12t for joining the terminal electrodes 6a and 6b of the circuit component 2 are formed by the same method as the wiring patterns 10a, 12a, 12b, 14a, 14b, 14c, 16a, 16b, and 18a, and then the electrode pattern 12s. , 12t, for example, Au or Sn thin films 12p, 12q are formed by sputtering, plating, or the like to cover the electrode patterns 12s, 12t.

  (2) Next, the circuit component 2 to be built in such as an IC chip is fixed using the fixing material 82 as in the first embodiment. At this time, the circuit component 2 is fixed so that the terminal electrodes 6a and 6b of the circuit component 2 are opposed to and preferably in contact with the thin films 12p and 12q on the electrode patterns 12s and 12t.

  (3) Next, the resin substrates 10, 12, 14, 16, and 18 are stacked in a predetermined order to form a laminated body, lightly pressed to such an extent that the laminated body is not separated in the laminating direction, and the resin is evacuated. The resin layers 11, 13, 15, 19 of the substrates 10, 12, 14, 16, 18 are heated to a temperature that does not exceed the glass transition temperature of the thermoplastic resin (for example, 300 ° C.). The thermoplastic resins 15, 17, and 19 are softened, and the resin layers 11, 13, 15, 17, and 19 are pressed together.

  It is preferable that the fixing material 82 is vaporized and disappears before the laminated body is heated and pressed.

  The metal (for example, Au) on the surface of the terminal electrodes 6a and 6b of the circuit component 2 that is in contact and the metal (for example, Au or Sn) of the thin films 12p and 12q on the electrode patterns 12s and 12t of the resin substrate 12 are: By heating, solid phase diffusion bonding is performed, and the terminal electrodes 6a and 6b of the circuit component 2 and the electrode patterns 12s and 12t are fixed. Since the alloy layer formed by solid phase diffusion bonding does not melt at the heating temperature of the resin substrates 10, 12, 14, 16, 18, a short circuit occurs when the resin substrates 10, 12, 14, 16, 18 are heated. There is nothing.

  (4) Next, after heating and pressure bonding, the wiring patterns 10a and 18a are etched or plated as necessary to complete the component built-in module 30a.

  Through the above steps, the component built-in module 30a can be manufactured using the resin substrates 10, 12, 14, 16, and 18 in which the resin layers 11, 13, 15, 17, and 19 are thermoplastic resins.

  In this embodiment, the thin films 12p and 12q may not be formed on the electrode patterns 12s and 12t. That is, the electrode patterns 12s and 12t made of Cu and the terminal electrodes 6a and 6b of the circuit component 2 may be directly solid-phase diffusion bonded.

  <Example 3> The component built-in module 30b of Example 3 is demonstrated referring FIG. FIG. 3A is a cross-sectional view of the component built-in module 30b before joining. FIG. 3B is a cross-sectional view of the component built-in module 30b after joining.

  The component built-in module 30b according to the third embodiment is configured in substantially the same manner as the component built-in module according to the first and second embodiments, and can be manufactured through substantially the same process. Below, the same code | symbol is used for the component similar to Example 1, 2, and it demonstrates centering around difference with Example 1,2.

  In the circuit board 40, a passivation film 44 is formed around the uppermost layer wiring 42 of the semiconductor substrate 41, a terminal electrode 46 is formed on the uppermost layer wiring 42 and the surrounding passivation film 44, and the terminal electrode 46 is a dielectric layer. 48. Unlike the first and second embodiments, the terminal electrode 46 of the circuit component 40 is capacitively coupled to the electrode patterns 12 s and 12 t through the dielectric layer 48. The electrode patterns 12s and 12t may form capacitive coupling with the wiring patterns 14a and 14b via the resin layer 13, and are connected to other electrode patterns (for example, 12a and 21b) so that a direct current flows. Also good.

  The uppermost layer wiring 42 of the semiconductor substrate 41 is drawn on the passivation film 44 through the passivation film 44, and the area of the terminal electrode 46 can be made larger than the area of the uppermost layer wiring 42, and the thickness is 1 μm. Since the wiring patterns 12s and 12t are capacitively coupled via the thin dielectric layer 48 of about ˜50 μm, the capacitance value can be increased.

  Next, a manufacturing method of the component built-in module 30b will be described.

  (1) As shown in the sectional view of FIG. 3A, first, predetermined wiring patterns 10a, 12a, 12b, 14a, 14b, 14c, 16a, 16b, 18a, electrode patterns 12s, 12t, and through conductors 11a, Resin substrates 10, 12, 14, 16, 18 having 11b, 13a, 13b, 15a, 15b, 17a, 17b, 19a, 19b are prepared. The resin substrates 10, 12, 14, 16, and 18 are formed using, for example, a thermoplastic resin sheet having a metal foil on one side.

  (2) Next, the circuit component 40 in which the terminal electrode 46 is covered with the dielectric layer 48 is mounted on the electrode patterns 12 s and 12 t of the resin substrate 12 and fixed using the fixing material 84.

  The fixing member 84 does not need to fix the circuit component 40 to the resin layer 13 of the resin substrate 12. For example, an adhesive is filled in a space (indentation) in the vicinity of the uppermost layer wiring 42 of the circuit component 40, and the circuit component 40 is fixed only to the wiring patterns 12s and 12t of the resin substrate 12 by using this adhesive. May be.

  (3) Next, the resin substrates 10, 12, 14, 16, and 18 are stacked in a predetermined order to form a laminated body, lightly pressed to such an extent that the laminated body is not separated in the laminating direction, and the resin is evacuated. The resin layers 11, 13, 15, 19 of the substrates 10, 12, 14, 16, 18 are heated to a temperature that does not exceed the glass transition temperature of the thermoplastic resin (for example, 300 ° C.). The thermoplastic resins 15, 17, and 19 are softened, and the resin layers 11, 13, 15, 17, and 19 are joined to each other.

  The fixing member 84 may vaporize and disappear before the laminated body is heated and pressure-bonded.

  (4) Next, after heating and pressure bonding, the wiring patterns 10a and 18a are plated as necessary to complete the component built-in module 30b.

  Through the above steps, the component built-in module 30b can be manufactured using the resin substrates 10, 12, 14, 16, and 18 in which the resin layers 11, 13, 15, 17, and 19 are thermoplastic resins.

  <Example 4> The component built-in module 70 of Example 4 is demonstrated referring FIG.4 and FIG.5. FIG. 4 is a cross-sectional view of the component built-in module 70 before joining. FIG. 5 is a cross-sectional view of the component built-in module 70 after joining.

  In the component built-in module according to the fourth embodiment, unlike the first to third embodiments, the resin layers 51, 53, 55, 57, 59, 61, 63 are resin substrates 50, 52, 54, 56, which are thermosetting resins. 58, 60, 62 are used.

  As shown in the cross-sectional view of FIG. 5, the component built-in module 70 is connected to the inside or the surface of the substrate body 72 to which the thermosetting resin layers 51, 53, 55, 57, 59, 61, 63 are bonded. Patterns 50a, 56a, 56b, 58a, 58b, 58c, 60a, 60b, 62a, electrode patterns 56s, 56t, through conductors 51a, 51b, 59a, 59b, 61a, 61b, 63a, 63b are formed. A circuit component 2 such as an IC chip or a capacitor is disposed inside.

  The terminal electrodes 6a and 6b of the circuit component 2 built in the component built-in module 70 are joined to the electrode patterns 56s and 56t, and the electrode patterns 56s and 56t are connected to the wiring patterns 58a and 58b and the capacitance via the resin layer 57. Are connected.

  The electrode patterns 56s and 56t to which the terminal electrodes 6a and 6b of the circuit component 2 are joined are formed separately and independently from the wiring patterns 50a, 56a, 56b, 58a, 58b, 58c, 60a, 60b, and 62a. Yes. That is, no direct current flows between the electrode patterns 56s and 56t and the wiring patterns 50a, 56a, 56b, 58a, 58b, 58c, 60a, 60b, and 62a.

  When the electrode patterns 56s and 56t joined to the terminal electrodes 6a and 6b of the circuit component 2 and the wiring patterns 58a and 58b are capacitively coupled as described above, the terminal electrodes of the circuit component 2 are wired via the through conductors. Since there is no need to connect to the pattern, there is no danger of a short circuit due to melting of the conductive material. Moreover, even if the terminal electrodes 6a and 6b of the circuit component 2 become narrow, it can be easily handled. Also, a plurality of circuit components can be incorporated with a small gap.

  Next, a method for manufacturing the component built-in module 70 will be described.

  (1) As shown in the sectional view of FIG. 4, predetermined wiring patterns 50a, 56a, 56b, 58a, 58b, 58c, 60a, 60b, 62a, electrode patterns 56s, 56t, and through conductors 51a, 51b, 59a , 59b, 61a, 61b, 63a, 63b, resin substrates 50, 52, 54, 56, 58, 60, 62 are produced.

  For the wiring patterns 50a, 56a, 56b, 58a, 58b, 58c, 60a, 60b, 62a and the electrode patterns 56s, 56t, for example, a resin sheet having a metal foil such as copper on one side is prepared, and a photosensitive resist is formed on the metal foil. Is applied, exposed and developed to form a predetermined mask pattern, etched through the mask pattern, and then removed by removing the mask pattern. A wiring pattern may be formed on the resin sheet by inkjet or plating.

  The through conductors 51a, 51b, 59a, 59b, 61a, 61b, 63a, and 63b are formed by forming a through hole in a resin sheet by laser processing or drilling and filling a conductive material by printing or the like.

  The through holes 53s and 55s are formed by punching using a mold or laser processing.

  The resin sheet becomes the resin layers 51, 53, 55, 57, 59, 61, 63. For the resin sheet, a material that is easy to process and has little deformation after processing is suitable. For example, a thermosetting resin such as epoxy is used. You may add a filler to a resin sheet as needed.

  Au or Sn thin films 56p and 56q are formed on the electrode patterns 56s and 56t of the resin substrate 56 on which the circuit component 2 is mounted by sputtering or plating.

  (2) Next, the circuit component 2 to be built in such as an IC chip or a capacitor is disposed on the electrode patterns 56 s and 56 t of the resin substrate 56 and fixed using a fixing material 86. At this time, the terminal electrodes 6a and 6b of the circuit component 2 and the thin films 56p and 56q on the electrode patterns 56s and 56t of the resin substrate 56 face each other, and preferably contact each other.

  The fixing material 86 only needs to be able to fix components so that the position thereof does not shift with respect to the resin substrate, and a general epoxy or acrylic adhesive can be used. The fixing material 86 may disappear after the laminating process described later and before the heating / crimping process.

  (3) Next, the resin substrates 52, 54, 56, 58, 60, 62 are stacked in a predetermined order to form a laminate, and the laminate is pressurized in the stacking direction and evacuated, In the state where the resin layers 51, 53, 55, 57, 59, 61, 63 are pressure-bonded to each other by heating to the curing temperature (for example, 200 ° C.) of the thermosetting resin of 52, 54, 56, 58, 60, 62. The thermosetting resin is cured.

  At this time, the resin layers 53 and 55 of the resin substrates 52 and 54 in which the through holes 53 s and 55 s are formed flow around the circuit component 2 and surround the circuit component 2.

  Further, the metal (for example, Au) on the surface of the terminal electrodes 6a, 6b of the circuit component 2 and the metal (for example, Au or Sn) of the thin films 12p, 12q on the electrode patterns 12s, 12t of the resin substrate 12 come into contact. By heating, it melts in the vicinity of the interface, and the terminal electrodes 6a and 6b of the circuit component 2 and the electrode patterns 12s and 12t are fixed.

  (4) Next, after heating and pressure bonding, the wiring patterns 50a and 62a are etched or plated as necessary to complete the component built-in module 70.

  Through the above steps, the component built-in module 70 is formed by using the resin substrates 50, 52, 54, 56, 58, 60, 62 in which the resin layers 51, 53, 55, 57, 59, 61, 63 are thermosetting resins. Can be manufactured.

  <Summary> As described above, the terminal electrode of the circuit component is connected to the wiring pattern through a conductive material such as solder that is remelted by heating by capacitively coupling the terminal electrode of the circuit component and the wiring pattern. Therefore, there is no danger of a short circuit due to melting of the conductive material, and it is possible to easily cope with the narrow pitch of the electrodes.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, a wiring pattern that capacitively couples with a terminal electrode of a circuit component built in the board body may be exposed to the outside without being built in the board body.

  Further, a component built-in module may be manufactured by further bonding another resin substrate or a laminate to a laminate obtained by pressure bonding a plurality of resin substrates.

  Further, the fixing material for fixing the circuit component (semiconductor substrate or the like) to the resin layer is not the side where the terminal electrode of the circuit component is provided, but the side where the terminal electrode is not provided (if it is a semiconductor substrate, It may be fixed not on the side where the uppermost layer wiring is provided but on the top surface side of the semiconductor substrate. In this way, the circuit component is turned upside down and fixed to the surface of the resin layer, and further, a resin layer having a wiring pattern for capacitive coupling is stacked thereon, whereby the terminal electrode of the circuit component and the wiring pattern are stacked. Can also be capacitively coupled.

  Further, when an opening corresponding to the shape of the circuit component is formed in the resin layer that wraps the circuit component, first, a fixing material is provided on the bottom surface and / or the side surface of the opening (cavity portion) in the resin layer. Alternatively, after the circuit component is accommodated here, it may be sequentially laminated and pressure-bonded with another resin layer. In particular, in this case, it is preferable to fix the circuit component on the side where the terminal electrodes are not provided (in the case of a semiconductor substrate, not on the side where the uppermost layer wiring is provided, but on the top surface side of the semiconductor substrate).

2 Circuit parts 4 Body 6a, 6b Terminal electrode 10, 12, 14, 16, 18 Resin substrate 12s, 12t Electrode pattern (electrode)
12p, 12q thin film 14a, 14b wiring pattern 11, 13, 15, 17, 19 resin layer 30, 30a, 30b component built-in module 32, 32a, 32b substrate body 40 circuit component 46 terminal electrode 50, 52, 54, 56, 58 , 60, 62 Resin substrate 56s, 56t Electrode pattern (electrode)
56p, 56q thin film 58a, 58b wiring pattern 51, 53, 55, 57, 59, 61, 63 resin layer 70 component built-in module 72 substrate main body 80, 82, 84, 86 fixing material

Claims (6)

A substrate body to which a plurality of resin layers are bonded;
A circuit component having a terminal electrode and a dielectric layer covering the terminal electrode, and disposed inside the substrate body;
A wiring pattern disposed in contact with the main surface of at least one resin layer;
With
The component built-in module, wherein the terminal electrode of the circuit component and the wiring pattern are capacitively coupled via the dielectric layer . A wiring pattern disposed in contact with the main surface of the resin layer;
The component built-in module according to claim 1, wherein the wiring pattern includes the circuit component when seen through from a direction perpendicular to the main surface of the resin layer. A pair of opposing wiring patterns;
Via-hole conductors connecting the pair of wiring patterns;
With
The component built-in module according to claim 2 , wherein the circuit component is disposed between the pair of wiring patterns. A method of manufacturing a component built-in module in which circuit components are arranged inside a substrate body to which a plurality of resin layers are bonded,
A first step of laminating the resin layer with a circuit component having a terminal electrode and a dielectric layer covering the terminal electrode disposed between the resin layers;
A second step of heating and pressure-bonding the laminated resin layers;
With
Wherein in the first step, a wiring pattern between the resin layer is disposed, in the state where the dielectric layer is in contact before Symbol circuit components wiring pattern, characterized by laminating the resin layer, parts Manufacturing method of built-in module. In the first step, after fixing the circuit component to one main surface of the resin layer using a fixing material, at least one other layer on the one main surface of the resin layer to which the circuit component is fixed Of the resin layer,
5. The method of manufacturing a component built-in module according to claim 4 , wherein the fixing material disappears before the resin layer laminated in the second step is heated and pressure-bonded. The method of manufacturing a component built-in module according to claim 5 , wherein the fixing material is an organic solvent.

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