JP4619807B2 - Component built-in module and electronic device equipped with component built-in module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module with a built-in component which can be produced without necessitating a via-forming process. <P>SOLUTION: The module with a built-in component 100 has an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposite to the upper surface and a side surface 10c which joins these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface; and electronic components 32 disposed within the sheet substrate. <P>COPYRIGHT: (C)2005,JPO&amp;NCIPI

Description

  The present invention relates to a component built-in module and an electronic device including such a component built-in module, for example, a portable electronic device. Specifically, the module of the present invention is a module in which electronic components are arranged in a base.

  With recent downsizing, thinning, and high functionality of electronic equipment, there is an increasing demand for high density mounting of electronic components mounted on printed circuit boards and higher functionality of circuit boards mounted with electronic components. It is getting stronger. Under such circumstances, a component built-in module (or a component built-in circuit board) in which an electronic component is embedded in a circuit board has been developed (for example, see JP-A-11-220262 described later).

  In a component built-in module, electronic components such as active components (for example, semiconductor elements) and passive components (for example, capacitors) mounted on the surface of a printed circuit board (or a printed circuit board) are usually embedded in the substrate. The area of the substrate can be reduced. In addition, since the degree of freedom for arranging electronic components is higher than in the case of component surface mounting, improvement of high frequency characteristics can be expected by optimizing the wiring between the electronic components.

  In the field of ceramic substrates, LTCC (low temperature cofired ceramics) substrates incorporating electronic components have already been put into practical use. However, since this is heavy and easily broken, it is difficult to apply it to a large-sized substrate. Moreover, since high-temperature sintering is required, there is a great restriction such that a semiconductor element such as an LSI cannot be incorporated. Recently, a component built-in module in which a component is built in a printed circuit board using resin, unlike an LTCC board, there are few restrictions on the size of the board, and an LSI can be built in. It also has the advantage of being.

  Next, a component built-in module (or a circuit component built-in module) disclosed in Japanese Patent Application Laid-Open No. 11-220262 will be described with reference to FIG. The circuit component built-in module 400 shown in FIG. 1 includes a substrate 401 formed by laminating insulating substrates 401a, 401b and 401c, and wiring patterns (or wiring layers) 402a and 402b formed on the main surface and inside of the substrate 401. , 402c and 402d, and circuit components 403a and 403b arranged inside the substrate 401 and connected to the wiring pattern. The wiring patterns 402a, 402b, 402c and 402d are electrically connected by the inner via 404. The insulating substrates 401a, 401b, and 401c are made of a mixture containing, for example, an inorganic filler and a thermosetting resin.

Japanese Patent Laid-Open No. 11-220262

  In the circuit component built-in module 400 disclosed in Japanese Patent Laid-Open No. 11-220262, each wiring pattern (402a, 402b, 402c, 402d) is electrically connected by an inner via 404. Such an inner via connection method can be used preferably because it can connect between necessary wiring patterns and is excellent in mountability of circuit components. In the conventional component circuit board including the circuit component built-in module 400 as shown in the figure, electrical conduction between the upper main surface and the lower main surface is ensured by intervias or through holes.

  Based on the common general technical knowledge in the field of conventional printed wiring boards and build-up wiring boards, it is essential to form vias such as inner vias or through holes when manufacturing a component built-in module. Since the formation of the via requires a step of filling a conductive paste or a plating step together with a drilling step, it is complicated to perform these steps. However, since these steps are essential, it is difficult to develop a more efficient manufacturing method without the steps. Further, since connection by vias requires a connection member such as a land, the size of the module is increased by the amount occupied by the connection member. Furthermore, the degree of freedom with respect to conditions for achieving both the incorporation of electronic components and the formation of vias (for example, the viscosity of the resin mixture in the case of manufacturing an insulating substrate) is small, and therefore, for example, wire bonding is difficult. Sometimes.

  Under such circumstances, the present inventors worked on the development of a module with a built-in component that is different from the conventional type and does not require a via formation process, without being bound by conventional common general knowledge.

  The present invention has been made in view of such various points, and a main problem thereof is to provide a component built-in module that can be manufactured relatively efficiently and a manufacturing method thereof. Another object of the present invention is to provide an electronic apparatus including such a component built-in module.

In the first aspect, the present invention provides a component built-in module,
An insulating sheet-like substrate having an upper surface, a lower surface opposite to the upper surface, and a side surface connecting them;
i) a side wiring part located on at least a part of the side surface; ii) connected to the side wiring part and connected to the upper surface wiring part located on at least a part of the upper surface and the side wiring part. And at least one wiring having at least one of the lower surface wiring portions located on at least a part of the lower surface, and an electronic component disposed in the sheet-like substrate. Features.

  In the component built-in module of the present invention, the “sheet-like substrate” generally has a form in which the thickness dimension is smaller than other dimensions, and the “side surface” corresponds to a surface parallel to the thickness direction, “Upper surface” and “lower surface” correspond to surfaces perpendicular to the thickness direction, respectively. However, the sheet-like substrate may have a shape (for example, a cube) in which the thickness dimension is substantially the same as the other dimensions. In that case, the wiring located on one surface of the sheet-like substrate (which is referred to as a side surface for the sake of convenience) further extends to at least one of two parallel surfaces orthogonal to the surface. Are included in the component built-in module of the present invention, and the two surfaces orthogonal to the side surfaces are an upper surface and a lower surface. As will be described later, the sheet-like substrate may have a recess on the upper surface and / or the lower surface. When the insulating base has an opening that penetrates from the upper surface to the lower surface, the surface that defines the opening is also a side surface. In addition, the terms “upper side” and “lower side” are used for convenience to refer to two surfaces perpendicular to the thickness direction, and are not used in the sense of absolutely determining the position during use or the like. Please note that.

  The component built-in module of the present invention is characterized by having a wiring extending from the side surface to at least one of the upper surface and the lower surface on the surface of the sheet-like substrate. The wiring is located on at least a part of the side surface, which further extends on at least a part of the upper surface and / or the lower surface. In this specification, in order to distinguish this wiring from other wiring located only on the upper surface or the lower surface, it is referred to as “U / L-shaped side wiring” for convenience. Called. The U-shaped side wiring has both a side surface wiring portion located on the side surface of the sheet-like substrate, an upper surface wiring portion and a lower surface wiring portion, and a boundary between the side surface and the upper surface and a side surface and a lower surface. It is a wiring having a portion that is bent in a vertical or arcuate manner at the boundary and becomes a substantially U-shape. The L-shaped side wiring has only one of the side surface wiring portion and the upper surface wiring portion and the lower surface wiring portion, and draws an arc vertically or at the boundary between the side surface and the upper surface or the lower surface. It has a portion that is bent and is substantially L-shaped. In this specification, these wirings are collectively referred to as “U / L-shaped side wirings” using “/”. The U / L-shaped side wiring has a side wiring portion that ensures electrical continuity between the upper surface and the lower surface, or another circuit board with the lower surface (or upper surface) of the component built-in module as the mounting surface. When mounted on, the electrical connection between the upper surface (or the lower surface) and the other circuit board is ensured. In the component built-in module of the present invention, generally, a part of the U / L-shaped side wiring extends on the upper surface of the sheet-like substrate, and another part extends on the lower surface of the sheet-like substrate. The other part located between the parts of the U-side wiring extends on the side surface of the sheet-like substrate.

  When the U / L-shaped side wiring is integrated with other electrical elements (for example, a wiring pattern formed on the upper surface) and cannot be clearly distinguished from the other electrical elements, as will be described later. There is. Even in such a case, as long as it includes a wiring portion having a side wiring portion and at least one of an upper surface wiring portion and a lower surface wiring portion, a component built-in module including such a wiring portion is provided by the present invention. Included in the built-in module. Further, the U / L-shaped side wiring can be a twisted or distorted U-shape or L-shape, for example, when the side surface wiring portion does not extend in the direction parallel to the thickness direction. Included in U / L-shaped side wiring. The U / L-shaped side wiring may be branched at the side surface, for example. However, as long as the route taken by each branched wiring is substantially U-shaped or substantially L-shaped, such branched wiring is also U / L-shaped side. Included in the wiring.

  In one aspect of the component built-in module of the present invention, at least one of the upper surface and the lower surface, preferably both, of the sheet-like substrate is at least one of a wiring pattern (or wiring layer), an electrical connection element, and an electronic component. As an electric element, the U / L-shaped side wiring is connected to such an electric element at a part thereof (an end part or other part, that is, an intermediate part other than the end part). For example, in one aspect of the component built-in module, the U / L-shaped side wiring that extends between the electrical element on the upper surface and the electrical element on the lower surface via the side surface of the sheet-like substrate I.e., electrical continuity between such electrical elements is ensured by U / L-shaped side wiring.

  In one aspect, the electronic component disposed in the sheet-like substrate is electrically connected in a predetermined manner to at least one of the electric elements on the upper surface and / or the lower surface. Alternatively or in addition, the electronic component may be directly electrically connected to a part (for example, an end) of the U / L-shaped side wiring. In another aspect, the electronic component may not be electrically connected to any other part of the component built-in module, i.e., it may simply be embedded.

  Examples of electronic components incorporated in the sheet-like substrate include active components such as semiconductor elements and passive components such as capacitors, inductors, resistors, and surface acoustic wave elements. The number of built-in electronic components is not particularly limited, and the number and type of electronic components are selected so that the component built-in module functions in a predetermined manner.

  In one preferred embodiment of the component built-in module of the present invention, in order to electrically connect the electrical element on the upper surface and the electrical element on the lower surface of the module, those electrical elements are connected via the side surface of the sheet-like substrate. There are U / L-shaped side wirings extending between the upper surface and the vias penetrating from the upper surface to the lower surface as described above. That is, the U / L-shaped side wiring substitutes for the via. More preferably, there are a plurality of electrical elements on the upper surface and the lower surface, and therefore there are a plurality of U / L-shaped side wirings that replace the vias connecting them, and particularly preferably, the upper surface and the lower surface are provided. There are many electrical elements.

  A wiring pattern as an electric element is a set of predetermined wirings formed on the upper surface or lower surface of a sheet-like substrate, and a part (for example, an end portion) of a U / L-shaped side wiring is formed on a part of such wiring. ) Is connected. The electrical connection element as the electrical element means an element that is interposed to electrically connect wiring, an electronic component, and the like, and examples thereof include lands, pads, terminals, and the like. Such an electrical connection element is connected to a part of the U / L-shaped side wiring. It is generally preferable that such a wiring pattern or electrical connection element is previously formed integrally with the part of the U / L-shaped side wiring. For example, as will be described later, a single metal layer may be etched, for example, so that the U / L-shaped side wiring and the electrical elements are connected together. If not integrally formed, the U / L-shaped side wiring and the electrical element may be connected using an electrical connection material (for example, a conductive material such as solder, metal, or wire).

  Furthermore, examples of the electronic components constituting the electric element include active components such as semiconductor devices and passive components such as capacitors, inductors, resistors, and surface acoustic wave devices, and U / L type terminals are provided for such electronic components. A part (for example, end part) of the side wiring is connected directly or via the above-described electrical connection material. In one preferable aspect, a plurality of U / L-shaped side wirings are electrically connected to a plurality of terminals of the electronic component.

  In the component built-in module of the present invention, the sheet-like substrate may be made of a material containing a resin, and is preferably an insulating substrate made of a composite material containing a resin and an inorganic filler. The resin may be at least one of a curable resin (preferably a thermosetting resin) and a thermoplastic resin. In the case of the curable resin, the curable resin is substantially completely cured in the completed component built-in module. In one aspect, the upper surface or the lower surface of the sheet-like substrate has a substantially rectangular shape composed of a long side and a short side shorter than the long side.

  In one aspect, another component built-in module is laminated above and / or below the component built-in module of the present invention described above or below. This another component built-in module may be the component built-in module of the present invention, or may be another known type of component built-in module. Further, instead of another component built-in module, a normal circuit board (with no built-in components) may be laminated. In another aspect, an electronic component is mounted on at least one of the upper surface and the lower surface of the component built-in module.

  In one aspect of the component built-in module of the present invention, at least a part of the side wiring portion of the U / L-shaped side wiring is embedded in the sheet-like substrate in a direction perpendicular to the thickness direction of the sheet-like substrate. Is formed. As a result, the surface of the embedded wiring exists at a position recessed from the side surface of the sheet-like substrate. Such embedded wiring constitutes a part of the side wiring part, and preferably constitutes the entire side wiring part. In a more preferable aspect, in addition to the side surface wiring portion of the U / L-shaped side wiring, the upper surface wiring portion and the lower surface wiring portion also have a portion adjacent to the side wiring portion or the entire surface within the sheet-like substrate. It is buried and formed. As a result, the corner portion of the U / L-shaped side wiring, that is, the portion of the wiring extending around the corner portion of the sheet-like substrate is in a state of being recessed from the surface of the sheet-like substrate. In another aspect, the surface of the U / L-shaped side wiring may be flush with the surface of the sheet-like substrate.

  Therefore, in one preferable aspect in the case where the wiring portion as described above exists, the exposed surface of the side wiring portion of the U / L-shaped side wiring is entirely embedded in the sheet-like substrate, and as a result, The exposed surface of the side wiring portion of the U / L-shaped side wiring extends in a state where it is flush with the side surface of the base body or is recessed from the side face into the sheet-like base body. In a particularly preferable aspect, the end portion of the side wiring portion of the U / L-shaped side wiring, that is, the corner portion of the U / L-shaped side wiring (the portion where the upper surface or the lower surface of the substrate intersects the side surface) is also U. / The exposed surface of the L-shaped side wiring forms the bottom surface of the depression.

  In one aspect of the component built-in module of the present invention, the U / L side wiring can function as, for example, a coplanar line in the component built-in module. The U / L side wiring functioning as a coplanar line is preferably formed by being embedded in the side surface of the sheet-like substrate as described above.

  The sheet-like substrate may include a shield member in addition to the electronic component. In one example of this aspect, the sheet-like substrate incorporates electronic components on both sides of the shield member (that is, incorporates two or more electronic components facing each other with the shield member interposed therebetween), and each electronic component is Thus, the electrical elements (for example, wiring patterns) located on the upper surface are connected in a predetermined manner, and the electrical elements (for example, wiring patterns) located on the lower surface are connected in a predetermined manner.

  In one aspect of the component built-in module of the present invention, a part of the electronic component disposed in the sheet-like substrate is exposed on the sheet-like substrate. In one preferable example, the heat dissipating member is formed in contact with the exposed part of the electronic component.

In a second aspect, the present invention provides a method for manufacturing a component built-in module (also referred to as a “first component built-in module manufacturing method” for distinction from a method for manufacturing a component built-in module described later), and the method includes:
(1-A) Carrier sheet, wiring pattern and electronic component having at least one wiring arranged thereon, and insulating layer containing resin arranged on these wiring pattern and electronic component The component built-in module forming member (in order to distinguish it from the component built-in module forming member used in the manufacturing method of the component built-in module described later, this component built-in module forming member is referred to as “component built-in module forming member A” for convenience. )),
(1-B) The component-embedded module forming member is folded (or folded) so that the insulating layers are opposed to each other, and a part of the at least one wiring is opposed to each other via the opposing insulating layers; The other part of the at least one wiring is formed by a bent portion of the insulating layer, and extends on the side surface of the insulating layer after the bending; and (1-C) the module with the folded component built-in A step of curing the resin of the insulating layer of the forming member A.

  In the step (1-B), the insulating layers are preferably opposed to each other in a contact state by bending. When the insulating layers are opposed to each other, it means that the insulating layers are in an overlapping state, and the insulating layers may overlap in a state where there is a space between the insulating layers, or the insulating layers may overlap in a contact state.

Preparation of the component built-in module forming member A, that is, the step (1-A)
(1-a) preparing a laminate having a carrier sheet and a metal layer formed thereon,
(1-b) a step of processing the metal layer to form a wiring pattern having at least one wiring and, if necessary, exposing a carrier sheet located below the location where the electronic component is to be placed ,
(1-c) including a step of placing an electronic component on the exposed carrier sheet and / or wiring pattern, and (1-d) a step of forming an insulating layer containing a resin on the wiring pattern and the electronic component. It can be implemented by a manufacturing method.

  In the step (1-c), when the electronic component is arranged only on the wiring pattern and does not need to be arranged in direct contact with the carrier sheet, the electronic component is arranged in the step (1-b). It is not necessary to expose the carrier sheet at the location, and in this sense, “when necessary” is described.

  Further, if necessary, the electronic component and the wiring pattern may be electrically connected in a predetermined manner after the step (1-c) and before the step (1-d). Such electrical connection is performed when the wiring pattern and the electronic component are electrically connected by arranging the electronic component in the step (1-c) and no further connection is required. Can be omitted. In the component built-in module forming member, when it is necessary to keep the electronic components electrically independent, such an electrical connection is unnecessary.

  In this manufacturing method, the insulating layer in step (1-d) may be formed so as to cover the entire wiring pattern, or may be formed so that a part of the wiring pattern is not covered with the insulating layer. Good.

In a third aspect, the present invention provides another method for manufacturing a component built-in module (also referred to as a “second component built-in module manufacturing method” for distinction from the above-described method for manufacturing a component built-in module), and the method Is
(2-A) a carrier sheet, a wiring pattern having at least one wiring disposed thereon, an insulating layer including a resin disposed on the wiring pattern, and an insulating layer. A component built-in module forming member having an electronic component (to be distinguished from a component built-in module forming member used in the first manufacturing method described above, sometimes referred to as “component built-in module forming member B”) Preparing the process,
(2-B) The component built-in module forming member B is folded (or folded) so that the insulating layers are opposed to each other, and a part of the at least one wiring is opposed to each other via the opposing insulating layers; And the other part of the at least one wiring is formed by the bent part of the insulating layer so as to extend on the side surface of the insulating layer after the bending, and (2-C) the folded component is embedded A step of curing the resin of the insulating layer of the module forming member B. In this manufacturing method, as a result of bending, the wiring portions facing each other through the opposing insulating layers become the upper surface wiring portion and the lower surface wiring portion in the component built-in module of the present invention, and extend on the side surface of the insulating layer. The existing part becomes the side wiring part in the component built-in module of the present invention.

  In the step (2-B), the insulating layers are preferably opposed to each other in a contact state by bending. When the insulating layers are opposed to each other, it means that the insulating layers are in an overlapping state, and the insulating layers may overlap in a state where there is a space between the insulating layers, or the insulating layers may overlap in a contact state.

Preparation of the component built-in module forming member B, that is, the step (2-A)
(2-a) preparing a laminate having a carrier sheet and a metal layer formed thereon,
(2-b) processing the metal layer to form a wiring pattern having at least one wiring;
(2-c) A manufacturing method including a step of forming an insulating layer containing a resin on the wiring pattern, and (2-d) a step of arranging an electronic component on the insulating layer.

  In the manufacturing method of the component built-in module forming member B, the insulating layer is formed so as to cover the entire wiring pattern, or formed so that a part of the wiring pattern is not covered with the insulating layer but exposed. Also good. When a part of the wiring pattern is not covered with an insulating layer, the electronic component may be electrically connected to the exposed portion of the wiring pattern by an appropriate method after the electronic component is arranged.

  In one aspect, in any method for manufacturing a component built-in module, the step of folding the component built-in module forming member is performed such that at least one wiring forms a U / L-shaped side wiring. In another aspect, before the folding, the other part of the component built-in module forming member (that is, another part different from the part that forms the U / L-shaped side wiring by folding) is folded into a wiring pattern. Some of the other wirings included (referred to as “wiring s” for the sake of convenience) are opposed to each other via the insulating layers facing each other in a contact state, and the other parts of the wiring s are bent of the insulating layer. It extends on the side surface of the insulating layer after being bent, formed by the portion. Thereafter, the component built-in module forming member is folded so that at least one wiring forms a U / L-shaped side wiring, and a part of the facing wiring s is formed on the U / L-shaped side in the thickness direction of the insulating layer. The insulating layer after being bent so as to form a wiring is positioned between the upper surface and the lower surface. For example, a part of the wiring s may be opposed to the U / L-shaped side wiring through an insulating layer, and is particularly located between the upper surface wiring portion and the lower surface wiring portion of the U-shaped side wiring. You can do it. The portion of the wiring s located in the insulating layer can constitute a shield member as will be described later.

  In each of the above-described two types of first and second component built-in module manufacturing methods and component built-in module forming members A and B manufacturing methods, the materials used (for example, resin, laminate, etc.) are substantially the same type. Things can be used. The insulating layer formed on the carrier sheet preferably contains a curable resin, particularly a thermosetting resin. In that case, when the component built-in module forming member is manufactured, it is not completely cured, and is preferably in a so-called semi-cured state. When manufacturing the module with a built-in component, it is preferable that the module is completely cured when it is cured (that is, in the step (1-C) or the step (2-C)).

In any of the component built-in module manufacturing methods, the opposing insulating layers are substantially integrated by curing the resin in the step (C), thereby constituting the sheet-like substrate of the component built-in module of the present invention. Curing may be performed by any suitable means, for example by heat. In this case, the curable resin is particularly preferably a thermosetting resin (for example, epoxy resin), and may contain an inorganic filler (for example, Al ₂ O ₃ , MgO, BN, AlN, and SiC). When the resin is a thermoplastic resin, it is heated when the resin layer is formed, and the resin is melted or softened, bent in the melted or softened state, and then cured by cooling the resin. be able to.

Furthermore, the present invention provides, in the fourth aspect, another method for manufacturing a component built-in module (also referred to as “third component built-in module manufacturing method” in order to distinguish from the above-described component built-in module manufacturing method). The method is
(3-A) A component built-in module forming member having a carrier sheet, a wiring pattern having at least one wiring disposed thereon, and an electronic component (the first and second manufacturing methods described above) In order to distinguish it from the component built-in module forming member used in the above) (sometimes referred to as “component built-in module forming member C”),
(3-B) The component built-in module forming member C is bent so that a part of the at least one wiring faces each other with a wiring pattern inside, and a gap is formed between the facing parts. Process,
(3-C) a step of injecting a material comprising a curable resin into the gap to form a resin layer between the wiring patterns;
(3-D) Provided is a method for manufacturing a component built-in module, including a step of curing the resin layer, and (3-E) a step of removing a carrier sheet to expose the wiring pattern. In this manufacturing method, the U / L-shaped side wiring is first formed by bending the component built-in module forming member C, and the insulating layer includes a curable resin in the gap formed by bending the component built-in module forming member C. It is formed by injecting material and further curing. The component built-in module forming member C is obtained by performing the steps (1-a) to (1-c) in the manufacturing method of the component built-in module forming member A. The carrier sheet may be bent so that at least one wiring is U-shaped and a recess is formed. Alternatively, the carrier sheet is folded into a rectangular cylinder so that at least one wire forms a rectangular ring (ie, two U / L side wires are formed in the final module). It's okay. Alternatively, the carrier sheet may be bent in a suitable mold, and the gap formed between the wirings may be sealed with the mold and the carrier sheet. If there is no portion that leads to the gap in the carrier sheet due to bending (that is, the gap is completely surrounded by the carrier sheet and / or the mold), the carrier sheet or mold is provided with holes for resin injection. Inject the resin. By selecting an appropriate bending method, the U / L-shaped side wiring can be arranged on two or more side surfaces (for example, all four side surfaces) of the hexahedron.

  The component built-in module of the present invention can be used for any suitable electronic device, for example, a portable electronic device. In this case, the electronic device includes the component built-in module of the present invention and a housing that houses the component built-in module. Accordingly, in a fifth aspect, the present invention provides an electronic apparatus comprising the above-described component built-in module of the present invention.

  The component built-in module according to the present invention includes an insulating sheet-like substrate, an electronic component disposed in the sheet-like substrate, and extends from the upper surface of the sheet-like substrate to the lower surface via the side surface. Since there is a U / L-shaped side wiring extending from the upper surface or the lower surface to the side surface and terminating at the side surface, there is no need to form a via. Therefore, according to the present invention, it is possible to provide a component built-in module that can be manufactured more efficiently than in the past.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, components having substantially the same functions are denoted by the same reference numerals in principle for the sake of brevity and ease of understanding. In addition, this invention is not limited only to the following embodiment.

(Embodiment 1)
A component built-in module (or circuit component built-in module) 100 according to Embodiment 1 of the present invention will be described with reference to FIGS. 2 and 3. FIG. 2 is a perspective view schematically showing the configuration of the component built-in module 100 of the present embodiment, and FIG. 3 is a schematic cross-sectional view of the component built-in module 100 shown in FIG.

  The component built-in module 100 shown in FIGS. 2 and 3 includes a sheet substrate 10, electronic components 30 (32, 34) disposed in the sheet substrate 10, and a plurality of U / L-shaped side wires 20 (illustrated). In this case, the U-shaped side wiring) is included. The sheet-like substrate 10 has an upper surface 10a, a lower surface 10b that faces the upper surface 10a, and a side surface 10c that connects the upper surface 10a and the lower surface 10b. One end of the U / L-shaped side wiring 20 is connected to an electric element 20a (for example, a terminal such as a land) located on the upper surface 10a of the sheet-like substrate 10. The U / L-shaped side wiring 20 extending from the electrical element 20a passes over the side surface 10c of the sheet-like substrate 10 to the lower surface 10b and is located on the lower surface 10b of the sheet-like substrate 10 (for example, The other end of the U / L-shaped side wiring 20 is connected to a terminal 20b like a land. In the illustrated form, at least one of the plurality of U / L-shaped side wires 20 is electrically connected to the electronic component 32 via the electric element 20a and the lead (or fine metal wire) 32b as shown in FIG. It is connected. In another form, the U / L-shaped side wiring 20 is electrically connected to the electronic component 30 (32, 34) directly through only the lead (or fine metal wire) 32b or only through the electrical element 20a. May have been.

  In the example shown in FIGS. 2 and 3, a semiconductor element (for example, a bare chip or the like) is incorporated as an electronic component 32 above the sheet-like substrate 10, and a chip component (for example, a chip inductor) is located below the sheet-like substrate 10. , A chip capacitor, a chip resistor, or the like) is built in as the electronic component 34. A terminal (element terminal) 32a is formed in the semiconductor element 32, and the element terminal 32a and the land 20a are connected by a thin metal wire 32b by wire bonding. The chip part 32 is mounted on a wiring pattern (a wiring pattern including the land 20b) formed on the lower surface 10b of the sheet-like substrate 10 by, for example, solder.

  In the present embodiment, the U / L-shaped side wiring 20 is connected to the lands 20a and 20b at both ends. The lands 20a and 20b serve as terminals for connecting the component built-in module to another circuit board or a semiconductor element. In this sense, the electrical elements indicated by reference numerals 20a and 20b may be referred to as terminals. It is preferable that the U / L-shaped side wiring 20 and the lands 20a and 20b are integrally formed in advance. The upper surface 10a (and the lower surface 10b) of the sheet-like substrate 10 is substantially flat and has a substantially rectangular shape. Although details will be described later, the sheet-like substrate 10 of the present embodiment is formed by folding an insulating layer containing a semi-cured resin and then bringing the folded insulating layer containing a semi-cured resin into a fully cured state. Preferably formed. In order to express this, in FIG. 3, the overlapping surface (that is, the surface defined by the opposing insulating layer in the contact state) 11 generated when folded is indicated by a dotted line, but in reality, it is in a completely cured state. In this case, since the resin contained in the insulating layer is softened or melted and integrated, there is often no overlapping surface such as the dotted line 11.

  In the component built-in module 100 of the present embodiment, the electrical continuity between the upper surface 10a and the lower surface 10b of the sheet-like substrate 10 is performed by the U / L-shaped side wiring 20. Since the U / L-shaped side wiring 20 has a function of conducting electrical continuity between the upper surface 10a and the lower surface 10b of the sheet-like substrate 10, the sheet-like substrate 10 includes the upper surface 10a and the lower surface. A via for ensuring electrical continuity with the surface 10b is not formed. In other words, in the component built-in module 100 of the present embodiment, the via that is essential in the conventional component built-in module is not necessary.

  In this specification, the term “via” is used as a generic term including “inner via” and “through hole”. In general, “via” and “through hole” are not clearly distinguished, but “via” means a through hole that electrically connects wiring patterns to each other. It means what is formed to electrically connect the wiring patterns on both sides of the insulating layer of the multilayer wiring board, and the “through hole” is mainly formed between the wiring pattern on the upper surface and the wiring pattern on the lower surface. It means a through hole for making an electrical connection between them. As used herein, a “via” is intended to be a hole that passes through a sheet-like substrate and functions to achieve electrical continuity. Such holes may be filled with a conductive material or may have a coating formed of a conductive material.

The component built-in module 100 may be an organic component built-in module including a sheet-like substrate made of a material including an organic material such as a resin. In one embodiment, the sheet-like substrate 10 of the component built-in module according to the present embodiment is formed of a composite material including a resin (for example, a thermosetting resin and / or a thermoplastic resin) and an inorganic filler, It is preferable to use a curable resin. It is also possible to construct the sheet-like substrate 10 from only a thermosetting resin without substantially using an inorganic filler. The thermosetting resin is, for example, an epoxy resin. When an inorganic filler is added, for example, fillers such as Al ₂ O ₃ , SiO ₂ , MgO, BN, and AlN can be used. Since various physical properties of the sheet-like substrate 10 can be controlled by adding the inorganic filler, it is preferable to form the sheet-like substrate 10 from a composite material containing the inorganic filler.

  The U / L-shaped side wiring 20 is formed from, for example, a copper foil, and the thickness thereof is, for example, about 3 to 50 μm. The number of U / L-shaped side wires 20 is, for example, eight or more. In the configuration shown in FIG. 2, 18 lines are formed. In the configuration shown in FIGS. 2 and 3, in addition to the U / L-shaped side wiring 20 shown in the figure, the terminals 20a and 20b can be formed integrally by simultaneously forming a single copper foil. Further, in the illustrated module, in addition to the U / L-shaped side wiring, a U / L-shaped side wiring not connected to the terminals 20a and 20b may be formed as a dummy wiring.

  The dummy wiring can be given a role of making the wiring density uniform. It is also possible to use the dummy wiring as the inspection wiring. Further, the matching with the printed circuit board on which the component built-in module 100 is mounted is checked by dummy wiring, or the inspection component (or circuit constant adjustment component) is placed on the dummy wiring, and the component built-in module and / or The constant (for example, characteristic impedance) of the circuit board can be adjusted. The inspection component (or circuit constant adjustment component) is, for example, a chip component (chip inductor, chip resistor, chip capacitor, etc.), and the component may be removed at the final product stage or placed as it is. You may keep it.

  The maximum number of U / L-shaped side wires 20 depends on the number of terminals of the electronic component 32 such as a semiconductor element, the dimensions of the component built-in module 100, and the like. Further, the maximum number of U / L-shaped side wirings is determined in consideration of the line width and spacing (line-space; L / S) of the U / L-shaped side wiring 20. For example, in a component built-in module having a predetermined size corresponding to a general-purpose mounting area, the maximum number of U / L-shaped side wirings 20 can be about 500, for example. Naturally, it is also possible to form more or less U / L-shaped side wirings 20.

  In the configuration shown in FIG. 2, the terminals (lands) 20 a are electrical elements to which the U / L-shaped side wires 20 are connected, and are arranged in the outer edge region on the upper surface 10 a of the sheet-like substrate 10. That is, in this example, one end of the U / L-shaped side wiring 20 is connected to correspond to the arrangement of the terminals 32a of the electronic component (for example, a bare chip semiconductor element) 32 built directly under the upper surface 10a of the sheet-like substrate 10. The terminals (lands) 20a are arranged in a peripheral type. The arrangement of the terminals (lands) 20b to which the other end of the U / L-shaped side wiring 20 is connected on the lower surface 10b of the sheet-like substrate 10 corresponds to the arrangement of the chip components 34, or the component built-in module 100 is arranged. What is necessary is just to determine corresponding to the terminal arrangement of the printed circuit board (for example, motherboard) to mount. For example, the terminals 20b can be arranged in a grid pattern on the lower surface 10b of the sheet-like substrate 10. Specifically, a land grid array (LGA) shape may be used with the terminal 20b as a land, or a ball grid array (BGA) shape may be formed by placing solder balls.

The size of the component built-in module 100 includes the size and number of the electronic components 30 arranged in the component built-in module 100, the size of the printed circuit board on which the component built-in module 100 is mounted, and the number of wirings and wiring lines of the component built-in module 100. -Determined in consideration of space (L / S) and the like, and is not particularly limited. In one example, the area of the upper surface of the sheet-like substrate 10 is 200 mm ² or less.

  The sheet-like substrate 10 in the component built-in module 100 of the present embodiment has a substantially hexahedron shape (usually a rectangular parallelepiped whose thickness dimension is considerably smaller than other dimensions), and the upper surface of the sheet-like substrate 10. 10a and the lower surface 10b are substantially rectangular. Here, “substantially hexahedrons and rectangles” include not only hexahedrons and rectangles (rectangles) in the geometrical sense but also those whose corners and sides are rounded, and the faces are completely May include a curved surface or the like instead of a flat surface. In the configuration shown in FIG. 2, when the region where the side of the sheet-like substrate 10 is located is not square but rounded (that is, in the case of a chamfered shape), the U / L-shaped wiring 20 The effect which eases disconnection etc. of this is acquired.

  In the example shown in FIG. 2, the upper surface 10a of the sheet-like substrate 10 has a substantially rectangular shape having a long side 10L and a short side 10S. The length of the long side 10L is 10S. For example, 3 times or less. In the configuration of the present embodiment, the width of the U / L-shaped side wiring 20 existing on the side surface 10c of the sheet-like substrate 10 may be 0.25 mm or less, and the space between the wirings 20 may be 0.3 mm or less. . The thickness of the sheet-like substrate 10 is, for example, about 0.1 to 2 mm.

  When vias are formed in the component built-in module, the vias can be arranged most effectively when the base is square. In other words, when the substrate is an elongated rectangle or an ellipse, a large number of vias cannot be effectively provided as compared with a square shape. On the other hand, in the case of the component built-in module 100 of the present embodiment, the U / L side wiring 20 can be arranged by defining the line-space (L / S) of the U / L side wiring 20. Many U / L-shaped side wirings 20 can be effectively formed not only on a square substrate but also on a rectangle (for example, a rectangle having a long side 10L of 1.4 times or more of the short side 10S). In the form shown in FIG. 2, the U / L-shaped side wiring 20 is formed on the two side surfaces 10 c of the substantially hexahedral sheet-like substrate 10, but the surface, position, and length of the U / L-shaped side wiring extend. However, the present invention is not limited to this. For example, when more U / L-shaped side wirings 20 are formed, the U / L-shaped side wirings 20 can be formed on all the side surfaces 10c.

  Next, an aspect of a method for manufacturing the component built-in module 100 according to the present embodiment as shown in FIGS. 2 and 3 will be described with reference to FIGS. 4 to 6 are schematic cross-sectional views similar to FIG.

  4 (a) to 4 (d) and FIGS. 5 (a) to 5 (c) show steps for explaining a method of forming a sheet 15 containing a semi-cured resin as the component built-in module forming member A. FIG. . As described above, the component built-in module forming member A includes a carrier sheet, a wiring pattern and an electronic component having at least one wiring (wiring to be a U / L-shaped side wiring) disposed thereon, An insulating layer containing a curable resin disposed on these wiring patterns and electronic components is provided. The electronic component may be disposed directly on the wiring pattern (see FIG. 4C), or may be disposed directly on the carrier sheet exposed by removing the metal foil (see FIG. 4D). ).

The component built-in module forming member A is
(1-a) preparing a laminate 41 having a carrier sheet 40 and a metal layer 42 formed thereon,
(1-b) The metal layer 42 is processed to form a wiring pattern 44 having at least one wiring, and if necessary, a carrier positioned below the location where the electronic component 32 is to be disposed. Exposing the sheet,
(1-c) a step of placing the electronic component 32 on the exposed carrier sheet and / or wiring pattern, and (1-d) forming the insulating layer 15 containing a curable resin on the wiring pattern 44 and the electronic component 32. It can prepare by the method including the process to do.

  As shown in FIG. 4C, when the electronic component 32 is arranged in a predetermined manner only on the wiring pattern 44 (that is, when the electronic component does not need to be arranged in direct contact with the carrier sheet). In the step (1-b), it is not necessary to expose the carrier sheet 40 located below the portion where the electronic component 32 is to be disposed. As shown in FIG. 4D, when the electronic component 32 is directly arranged on the carrier sheet 40, the carrier sheet 40 is exposed at a portion corresponding to the place to be arranged. As a matter of course, the carrier sheet 40 is exposed at a portion where the wiring is not located due to the formation of the wiring pattern.

  Further, if necessary, after the step (1-c) and before the step (1-d), as shown in FIGS. 4C and 4D, the electronic component 32 and the wiring pattern 44 are predetermined. For example, they may be connected by a thin metal wire 32b. Such electrical connection is performed when the wiring pattern and the electronic component are electrically connected by arranging the electronic component in the step (1-c), or when the wiring pattern and the electronic component are connected. If not needed, it can be omitted.

  First, the step (1-a) of preparing a laminate is performed by preparing a carrier sheet 40 having a metal layer 42 formed on one surface, as shown in FIG. 4 (a). The metal layer 42 is made of, for example, copper foil, and the carrier sheet 40 is made of, for example, metal foil (copper foil or aluminum foil) or a resin sheet. The thicknesses of the metal layer 42 and the carrier sheet 40 are, for example, about 3 to 50 μm and 25 to 200 μm, respectively. Various types of laminates are known for manufacturing circuit boards.

  Next, the step (1-b) of processing the metal layer 42 of the above-described laminate may be performed by any appropriate known method. As shown in FIG. 4B, forming the predetermined wiring pattern 44 and removing the metal layer portion corresponding to the portion where the electronic component 32 is to be disposed to expose the carrier sheet are a patterning process. Are known. Such a process can be performed by, for example, etching using a mask.

  Next, electronic components are arranged in the step (1-c). In one aspect, as shown in FIG. 4C, electronic components 32 and 34 are arranged on the wiring pattern 44. In another embodiment, electronic components 32 and 34 are placed directly on the exposed carrier sheet 40, as shown in FIG. 4 (d). In any aspect, the wiring pattern 44 and the electronic components 32 and 34 are mounted so as to be electrically connected as necessary. In the illustrated embodiment, a land 20a formed at one end of a wiring 20 that forms a U / L-shaped side wiring in a component built-in module, and a terminal (not shown) of an electronic component (for example, a semiconductor element (bare chip)) 32 are provided. Are connected using a fine metal wire 32b by wire bonding. Further, another electronic component (for example, a chip component) 34 is connected to a land 20b formed at the other end of the wiring 20 that constitutes the U / L-shaped side wiring 20 in the component built-in module, whereby a wiring pattern is formed. 44 is electrically connected. Here, the chip component 34 can be mounted by solder bonding.

  Next, an insulating layer is formed in step (1-d). As shown in FIGS. 5A and 5B, the insulating layer 15 is formed by applying resin on the carrier sheet 40 so as to cover the electronic components 32 and 34 and the wiring pattern 44. The resin used is an electrically insulating thermosetting resin and / or a thermoplastic resin. Particularly preferred are curable resins in a semi-cured state, in particular thermosetting resins. The resin may contain a filler as described above. The thickness of the insulating layer 15 is, for example, about 50 to 100 μm.

  For example, a composite material including a thermosetting resin in a B-stage state and an inorganic filler is applied onto the carrier sheet 40. In one example, 100 parts by weight or more (preferably 140 to 180 parts by weight) of the inorganic filler is included with respect to 100 parts by weight of the thermosetting resin. The B-stage state means a state in which the curing reaction is stopped at an intermediate stage. When the resin in the B-stage state is further heated, it is once softened (melted) and then completely cured. The completely cured state is called a C-stage.

When Al ₂ O ₃ , BN, AlN or the like is added as the inorganic filler, the thermal conductivity of the component built-in module can be improved. Moreover, it is possible to adjust a thermal expansion coefficient by selecting a suitable inorganic filler. The resin component has a relatively large thermal expansion coefficient, but the thermal expansion coefficient of the insulating layer (the sheet-like substrate in the component built-in module) can be reduced by adding SiO ₂ or AlN. In some cases, the thermal expansion coefficient can be increased while improving the thermal conductivity by adding MgO. Further, SiO ₂ (in particular, amorphous SiO ₂₎ if both can be reduced thermal expansion coefficient, it is possible to lower the dielectric constant.

  When the insulating layer is formed as described above, the component built-in module forming member A can be obtained. After the step (1-d), the component built-in module forming member A is in a state having a carrier sheet, and can be used in the step (1-A) of the first manufacturing method of the component built-in module as it is.

Using the component built-in module forming member A obtained as described above,
(1-B) The component built-in module forming member A is bent so that the insulating layers of the component built-in module forming member A face each other in a contact state, and at least one part of the wiring constituting the wiring pattern is in a contact state. The side surface of the insulating layer facing in contact with the upper surface wiring portion and the lower surface wiring portion facing each other through the insulating layer facing each other, and the other portion of the at least one wiring becomes the side wiring portion A component built-in module by a first component built-in module manufacturing method including: a step of extending the upper part; and (1-C) a step of curing the resin of the insulating layer of the component built-in module forming member A in a bent state. it can.

  When carrying out the step (1-B), before folding the component built-in module forming member A, the carrier sheet 40 may be removed as shown in FIG. 5C, and the wiring pattern 44 is formed on the surface. The insulating layer 15 can be obtained in sheet form. In the sheet 15, the wiring pattern 44 is exposed on the surface, and the electronic components 32 and 34 are incorporated. When the component built-in module forming member A is manufactured, as shown in FIG. 4D, when the electronic component is arranged directly on the carrier sheet, the lower surface of the electronic component 32 is exposed.

  In step (1-B), for example, the sheet 15 is folded into a structure as shown in FIG. 6A (in the illustrated embodiment, the sheet 15 is folded in half). That is, the insulating layer 15 is bent so as to face each other in a contact state on the surface indicated by the dotted line 11, and a part (20-1 and 20-2) of at least one wiring 20 constituting the wiring pattern forms the insulating layer 15. A side wiring portion that becomes an upper surface wiring portion and a lower surface wiring portion that face each other and the other portion (20-3) of the at least one wiring extends on the side surface of the insulating layer 15 after being bent To be. Accordingly, the wiring 20 composed of the upper surface wiring portion 20-1, the lower surface wiring portion 20-2, and the side surface wiring portion 20-3 extends from the upper surface of the insulating layer 15 to the lower surface via the side surface. At least one wiring, that is, a U / L-shaped side wiring is configured. The structure shown in FIG. 6A is the component shown in FIG. 3 except that there is no U / L-shaped side wiring on the left side surface of the insulating layer 15 and that the insulating layers overlap. The structure of the built-in module 100 is substantially the same. In order to obtain the structure shown in FIG. 3, for example, the component built-in module forming member A needs to be located at two places where the U / L-shaped side wiring is formed, and the member needs to be folded at that place ( (See FIG. 8). Alternatively, it can be said that FIG. 6A shows a cross section of the component built-in module shown in FIG. 2 cut at a location where the U / L-shaped side wiring is not located on one side surface.

  Next, in the step (1-C), when the structure shown in FIG. 6A is heated and pressed to be completely cured, as shown in FIG. 6B, the stacked insulating layers form one sheet. The sheet-like substrate becomes the component built-in module 100 of the present invention. In the state shown in FIG. 6B, since the sheet-like substrate 10 is completely cured, it is a C stage. If the resin is thermoplastic, it will be cured by simply cooling after heating and pressing. Although FIG. 6B shows the contact surface 11 of the insulating layer, it may not be clearly present after curing.

  Instead of removing the carrier sheet 40 as shown in FIG. 5C before folding the component built-in module forming member as described above, the carrier sheet 40 is removed after folding the component built-in module forming member and before curing. May be. Further, the carrier sheet 40 may be removed after the component built-in module is completed, for example, after being cured, or before the component built-in module is mounted.

  In FIG. 6A, for easy understanding, a mating surface that appears when the sheet 15 is folded is indicated by a dotted line 11. After heating and pressurization, the sheet 15 is integrated into the sheet-like substrate 10, so that the mating surface 11 does not often exist but may remain.

  Next, the second component built-in module manufacturing method will be described. The second component built-in module manufacturing method is different from the first component built-in module manufacturing method in that the component built-in module forming member used in the step (2-A) is the component built-in substrate forming member B. Other points may be the same as the first component built-in module manufacturing method.

A method of manufacturing the component built-in module forming member B will be described with reference to FIGS. In this manufacturing method, similarly to the manufacturing method of the component built-in module forming member A,
(2-a) preparing a laminate comprising the carrier sheet 40 and a metal layer formed thereon; and (2-b) processing the metal layer to have at least one wiring. A step of forming the wiring pattern 44 is performed.

afterwards,
(2-c) forming an insulating layer 15 containing a resin on the wiring pattern 44, preferably an insulating layer 15 containing a curable resin (especially a thermosetting resin); and (2-d) insulation. A step of arranging the electronic component 32 on the layer 15 is performed.

  In this method, unlike the manufacturing method of the component built-in module forming member A, the insulating layer 15 is formed first, and the electronic component 32 is arranged on the formed insulating layer. The insulating layer may be formed so as to cover the entire formed wiring pattern 44 (see FIG. 56A), or formed so that a part of the wiring pattern is exposed and the remaining part is covered. It is also possible (see FIG. 57 (a)). When exposing a part of the wiring pattern, the exposed part of the wiring pattern and the arranged electronic component 32 can be electrically connected in a predetermined manner, for example, by a thin metal wire 32b. The component built-in module forming member B obtained in this way is the same as the steps (1-B) and (1-C) of the first component built-in module manufacturing method described above. Through (2-C), the component built-in module 500 of the present invention can be obtained by folding the component built-in module forming member B and curing the insulating layer.

  FIG. 56A is a schematic cross-sectional view of the component built-in module forming member B. The insulating layer 15 is formed so as to cover the entire wiring pattern 44 formed on the carrier sheet 40, and the terminal is formed on the insulating layer. An electronic component 32 having 33 is arranged. In such a component built-in module forming member, as shown in FIG. 56B, at least one wiring constituting the wiring pattern 44 forms the U / L-shaped side wiring 20 in the step (2-A). After that, the component built-in module is obtained by heating and pressurizing in the step (2-B). The component built-in module is manufactured by a method in which the carrier sheet 40 is removed from the state of the component built-in module forming member B shown in FIG. 56A, then folded as shown in FIG. 56C, and then cured. You can do it. In another form, even if the carrier sheet 40 as shown in FIG. 56 (a) is folded and cured as shown in FIG. 56 (b), the carrier sheet 40 is removed to obtain a component built-in module. Alternatively, the carrier sheet may be left until it is used as a component built-in module.

  As can be easily understood, in the step (2-A), when the component built-in module forming member B is folded and the insulating layers are opposed to each other in a contact state, the overlapping degree of the opposing insulating layers is changed. The surface of the electronic component exposed in the component built-in module forming member B (upper surface in FIG. 56 or 57) is set to one of the upper surface and the lower surface (upper surface in FIG. 56) of the component built-in module. (For example, as shown in FIG. 56, it is exposed above the component built-in module), or as shown in FIG. 57, it can be completely embedded in the component built-in module. Further, if necessary, the degree of overlapping of the insulating layers and / or the heating and pressing conditions may be adjusted so that the material constituting the insulating layers fills the region between the terminals 33 (FIG. 56A). reference).

  Further, the third component built-in module manufacturing method will be described with reference to FIG. In the third component built-in module manufacturing method, the above-described component built-in module member A manufacturing steps (1-a) to (1-c) are performed to form a component built-in module as shown in FIG. The member C is obtained (step (3-A)). Next, as shown in FIG. 58 (b), the component built-in module forming member C is bent with the wiring layer 44 on the inside so that the portion to be the U / L-shaped side wiring 20 is substantially U-shaped. (Step (3-B). Next, as shown in FIG. 58 (c), a material 15a containing a curable resin is injected into the recessed portion formed by bending (step 3-C). The composite material containing the thermosetting resin and the inorganic filler is preferably selected from the materials exemplified above as the material constituting the insulating sheet-like substrate, and the curable resin contained in the injected material is heated and After curing by pressurization (step 3-D), the carrier sheet 40 is removed to expose the wiring layer (step 3-E), whereby the component built-in module 100 of the present invention shown in FIG. 58 (d) is obtained. It is done.

  If the component built-in module is manufactured as described above, the sheet-like substrate 10 having the U / L-shaped side wiring 20 and incorporating the electronic components 32 and 34 can be obtained. Since electrical conduction between the upper surface 10a and the lower surface 10b of the sheet-like substrate 10 is ensured by the U / L-shaped side wiring 20, there is no need to form vias in the sheet-like substrate 10, and therefore The step of forming the via can be omitted.

  Thus, in the component built-in module of the present invention, since there is no need to form a via, there is no restriction on the material constituting the base sheet accompanying the processing of the via using a punch or a laser. Therefore, for example, a filler (material such as glass or silica) that hardly absorbs laser light can be mixed into the material constituting the base sheet (that is, the material forming the insulating layer). As a result, the physical properties (thermal conductivity, thermal expansion coefficient) of the base material can be adjusted using such a filler. In addition, via connection using conductive paste generally requires optimization of the viscosity of the material constituting the insulating layer and stabilization of the via shape, so voids are generated with the incorporation of electronic components. Cheap. On the other hand, in the component built-in module of the present invention, since a soft resin suitable for incorporating an electronic component can be used, generation of such voids can be suppressed. In addition, mounting methods such as wire bonding can be used relatively freely by not being restricted by the material.

  Furthermore, the method for manufacturing a module with a built-in component according to the present invention can omit the via formation process itself that requires high accuracy, thereby simplifying the manufacturing method and reducing the cost of the module. In addition, since facilities such as a puncher and a laser device are not required, the manufacturing cost of the component built-in module can be reduced in this respect. In addition, since the component built-in module is formed by folding the component built-in module forming member having the wiring pattern and the sheet-like insulating layer formed thereon, the land is formed on the upper and lower surfaces of the component built-in module, which is necessary for via connection. It is not necessary to form by alignment, and it is not necessary to perform a via and land alignment process in the case of producing a via-containing component built-in module.

  Further, the U / L-shaped side wiring 20 can be formed relatively easily by folding the component built-in module forming member, and can easily cope with a narrow pitch as compared with the via connection. Furthermore, the reliability of the component built-in module can be improved by connecting the upper surface and the lower surface not by the via but by the U / L-shaped side wiring 20. In other words, in the case of via connection, since the via portion (conductive paste or plating) and the land portion are electrically coupled to each other, the contact portion may be separated when the base is thermally expanded in the thickness direction. As a result, the reliability of the module may be reduced. On the other hand, in the case of the present invention, the upper surface and the lower surface can be connected by the U / L-shaped side wiring 20 processed from the metal layer (for example, copper foil) (that is, the U / L-shaped side wiring is integrated). Compared with via connection, the reliability can be improved. The U / L-shaped side wiring 20 is preferably formed from a laminate having an electrolytic copper foil (ED foil). When the U / L-shaped side wiring 20 is formed from the electrolytic copper foil, since the thickness of the copper foil is uniform, impedance control and / or wiring pattern formation can be advantageously performed.

  In addition, the method for manufacturing a component built-in module according to the present invention has an advantage that inspection can be performed in the middle of manufacturing. For example, since it is possible to complete the electrical connection between the electronic component and the wiring pattern in the middle of manufacturing the component built-in module forming member shown in FIG. Inspection can be performed. The inspection can be performed by checking the electrical resistance value at a predetermined location and automatically testing using, for example, a scanner and a multimeter. Furthermore, not only the electrical resistance value but also the actual operation can be confirmed. When these inspections are performed and it is determined that the connection is defective at the stage of the component built-in module forming member, the electronic component can be easily repaired (replaced). As a result, the yield in manufacturing the component built-in module can be improved. In addition, it is very convenient that repair can be performed even when a prototype type component built-in module is manufactured. On the other hand, in the conventional component built-in module 400 shown in FIG. 1, it is difficult to inspect the electrical connection between the electronic component and the wiring in the middle of manufacturing.

  According to the method for manufacturing a component built-in module of the present invention, the component built-in module can be provided without requiring a via formation step that has been essential in the past, so that the manufacturing efficiency of the component built-in module can be improved. Moreover, even if the component built-in module of the present invention has a small mounting area, it is not necessary to form vias, so that more terminals can be formed. As a result, it is possible to cope with the trend of downsizing, increasing the number of pins and narrowing the pitch. In addition, in the component built-in module of the present invention, the connection distance between the electronic components can be shortened, and the noise of the module can be reduced.

(Embodiment 2)
Next, a component built-in module according to Embodiment 2 of the present invention will be described with reference to FIGS. 7 (a) and 7 (b). FIG. 7A is a bottom view schematically showing the configuration of the component built-in module 200 of the present embodiment, and FIG. 7B is a schematic cross section of the component built-in module 200 shown in FIG. FIG. However, the position of the terminal 33 illustrated in FIG. 7B does not exactly correspond to the position of the terminal illustrated in FIG. Depending on the electronic component, the arrangement shown in FIG. 7A may be used in one form, and the arrangement shown in FIG. 7B may be used in another form. In any of the embodiments described later, the description of the components, elements, and manufacturing method described in connection with the first embodiment is omitted or simplified for the sake of simplicity.

  The component built-in module 200 shown in FIGS. 7A and 7B includes a semiconductor element 32 as an electronic component, a sheet-like substrate 10 incorporating the semiconductor element 32, an upper surface 10a of the sheet-like substrate 10, and a lower side. U / L-shaped side wiring 20 extending over the surface 10b and the side surface 10c. The semiconductor element 32 in the component built-in module 100 shown in FIG. 2 is electrically connected to the U / L side wiring 20. However, in the component built-in module 200 of this embodiment, the semiconductor element 32 is attached to the sheet-like substrate 10. Although incorporated, the semiconductor element 32 is not electrically connected to the U / L-shaped side wiring 20.

  In the component built-in module 200 of the present embodiment, the bottom surface of the semiconductor element 32 is exposed at the bottom surface (lower surface) 10b of the sheet-like substrate 10, and a plurality of terminals 33 are provided on the bottom surface of the semiconductor element 32. Dimensionally arranged. A plurality of lands 20 b connected to the U / L-shaped side wiring 20 are arranged on the bottom surface 10 b of the sheet-like substrate 10. In the component built-in module 200 according to the present embodiment, the semiconductor element 32 and the U / L-shaped side wiring 20 are not directly electrically connected. It can be mounted on a wiring board (mother board), and both can be electrically connected via the wiring board. The component built-in module of the present embodiment has an advantage that the built-in semiconductor element 32 does not need to be connected to other wiring or the like. In addition to the semiconductor element 32, a passive component (for example, the chip component 34 in FIG. 3) can be incorporated in the sheet-like substrate 10.

  The semiconductor element 32 in the present embodiment is, for example, an area lay type semiconductor package in which terminals 33 are arranged in an area array. In the example shown in FIG. 7, an area array CSP (area array chip size package) is used as the semiconductor element 32. As the area array CSP, for example, an LGA (Land Grid Array) type CSP or a BGA (Ball Grid Array) type CSP can be used. The semiconductor element (area array CSP) 32 shown in FIG. 7 is an LGA type CSP. As the area array CSP, a bare chip is mounted on an interposer (intermediate substrate), and the peripheral terminal arrangement of the bare chip is converted into an area array terminal arrangement by the interposer (for example, FBGA, FLGA, etc.), or an interposer is not used. In addition, an insulating layer is formed on the bare chip, and rewiring (wiring routing) is performed on the insulating layer to convert the peripheral terminal arrangement of the bare chip into an area array terminal arrangement (for example, RCSP, real size). CSP, etc.) can be used.

  Next, an example of a method for manufacturing the component built-in module 200 of the present embodiment will be described with reference to FIGS.

  First, the component built-in module forming member B is prepared. In the component built-in module forming member B, as shown in FIG. 8A, a wiring pattern 44 is formed on a carrier sheet 40, an insulating layer 15 is formed thereon, and a semiconductor element (electronic component) (electronic component) is formed thereon. Area array CSP) 32 is arranged. The insulating layer 15 is, for example, a semi-cured (B stage) resin layer formed on the carrier sheet 40 having the wiring pattern 44 including the wiring to be the U / L-shaped side wiring 20. Such a component built-in module forming member B covers the wiring pattern 44 as shown in FIG. 56A after forming the wiring pattern 44 as shown in FIGS. 4A to 4B. Then, the insulating layer 15 is formed on the carrier sheet 40, and then the electronic component 32 is disposed.

  Next, as shown in FIG. 8B, the insulating layer 15 on the right side of the component built-in module forming member B is bent together with the carrier sheet 40. Next, as shown in FIG. 8C, the insulating layer 15 is folded so that the insulating layers (15-1 and 15-2) face each other, thereby forming a partial shape of the sheet-like substrate 10. These insulating layers may be in contact as shown (the contact surface is indicated by a dotted line), or there may be a gap between the opposing insulating layers. By this folding, the side wiring portion of the U / L-shaped side wiring 20 extends at the bending portion of the insulating layer 15. This bent portion becomes the side surface of the sheet-like substrate 10. The insulating layer 15 on the left side of the component built-in module forming member B is similarly folded, and after the entire shape of the sheet-like substrate 10 is completed, if the folded body is heated and pressurized, the resin is completely cured, and the sheet The component built-in module 200 of the present invention including the substrate 10 is obtained.

  Next, a modified example of the component built-in module 200 will be described. In one modification, an additional electronic component can be further mounted on the component built-in module 200 of the present invention. In the component built-in module 210 shown in FIG. 9, a semiconductor package is mounted as an additional electronic component 62 on the upper surface of the component built-in module 200 shown in FIG. In the component built-in module 210 shown in FIG. 9, a terminal (land) 20 a that is located on the upper surface of the sheet substrate 10 and is connected to the U / L-shaped side wiring 20, and a terminal (lead) 63 of the semiconductor package 62. And are connected. In the embodiment shown in FIG. 9, the electronic components 32 and 62 are arranged side by side in the three-dimensional direction (that is, overlapped in the thickness direction of the sheet-like base), and the mounting area that can be practically used is enlarged. ing.

  In the configuration shown in FIG. 9, reference numeral 20a 'represents a wiring portion of a wiring pattern extending from the land 20a, and a circuit is formed including this. Further, a gap may be formed between the semiconductor package 62 and the upper surface of the sheet-like substrate 10, and a solder resist may be formed on the upper surface of the sheet-like substrate 10. Further, if the lead 63 of the semiconductor package 62 has a certain lead height (or length), another electronic component can be disposed between the semiconductor package 62 and the upper surface of the sheet-like substrate 10.

  The component built-in module 220 shown in FIG. 10 differs from the component built-in module 210 shown in FIG. 9 in the configuration of the semiconductor element 32. The component built-in module 220 shown in FIG. 10 has a configuration in which the semiconductor element 32 is a bare chip, for example, and the bare chip 32 is flip-chip mounted. The element terminal 32a of the bare chip 32 is connected to the wiring 20b 'via a connection member (for example, bump) 32c. The wiring 20b 'may be interconnected with other wiring, or may be an independent land. The wiring 20b 'may act as a terminal for connecting the component built-in module to another circuit board, and may be referred to as a "terminal" in that sense. When the wiring 20b ′ connected to the semiconductor element 32 functions as a terminal, the array may be a one-dimensional array (peripheral terminal array) or a two-dimensional array (area array terminal array). Also good. The wiring 20b ′ can be configured as a terminal (20b) to which the U / L-shaped side wiring 20 is connected, and the wiring 20b ′ and the U / L-shaped side wiring 20 are not electrically connected. It is also possible to do so. The component built-in module 220 can be manufactured by the first component built-in module manufacturing method.

  9 and 10, in addition to the semiconductor element 32, other electronic components (for example, chip components) can be incorporated. In the first and second embodiments, the configuration including the semiconductor element 32 has been described. However, the component-embedded module of the present invention includes only a passive component (such as a chip component as shown) 34 as shown in FIG. It is also possible to adopt the configuration described above or a configuration in which these are additionally incorporated. The passive component 34 shown in FIG. 11 is electrically connected to a part of the wiring 20 b ′ by the solder 70. The wiring 20b 'may be an electrical element (for example, a land) to which the end of the U / L-shaped side wiring 20 is electrically connected.

  When the wiring pattern 44 including the wiring 20 serving as the U / L-shaped side wiring is formed through the states of FIGS. 4A to 5C, the U / L-shaped side positioned on the surface of the sheet-like substrate 10. The entire wiring 20 is embedded in the surface of the sheet substrate 10. This is schematically shown in FIG. 13 in an enlarged perspective view of a part of the sheet-like substrate. That is, as illustrated, the top surface (exposed surface) 20f of the wiring 20 and the surface (for example, the side surface 10c) of the sheet-like substrate 10 are flush with each other (substantially the same surface). When the U / L-shaped side wiring 20 is arranged in this way, the wiring 20 (in particular, the corner portion 20c) is suppressed from being cut and damaged as compared with the case where the wiring 20 (particularly, the corner portion 20c) is protruded from the surface of the sheet-like substrate. The connection reliability of the wiring 20 is improved.

  Furthermore, as shown in FIG. 12, when the exposed surface 20 f of the U / L-shaped side wiring 20 is recessed from the side surface 10 c of the sheet-like substrate 10 and is located on the inner side of the sheet-like substrate 10, the exposed surface. Since the probability that 20f comes into contact with an external object is greatly reduced, cutting and breakage of the U / L-shaped side wiring 20 can be effectively prevented. In particular, the corner portion 20c of the U / L-shaped side wiring 20 is a portion where contact with the outside is likely to occur. Therefore, as shown in FIG. 12, the corner portion 20c is the surface (or edge) of the sheet-like substrate. It is particularly preferable from the viewpoint of wiring protection that it is formed to be recessed. Therefore, it is preferable that the exposed surface of the upper surface wiring portion and / or the lower surface wiring portion of the U / L-shaped side wiring 20 is also recessed from each surface as shown in the figure.

  As shown in FIG. 12, the top surface (or exposed surface) 20f of the wiring 20 is recessed from the side surface 10c of the sheet-like substrate 10 to form the step 10d by the following method. Is done. First, in the step of forming the wiring pattern 44 shown in FIG. 4B, when an unnecessary portion of the metal layer 42 (that is, a portion of the metal layer that does not form the wiring pattern) is removed, such an unnecessary portion of the metal layer. In addition, a part of the carrier sheet 40 located therebelow is also etched away to form a recess in the carrier sheet. Thereafter, when a resin application step (for example, a step of applying a composite material) for forming an insulating layer shown in FIG. 5A is performed, the resin is in contact with the surface of the wiring pattern 44 (contact between the metal layer and the carrier sheet). The component built-in module forming member that enters the recess formed in the carrier sheet 40 beyond the level of the surface) is obtained. When the carrier sheet is removed after being folded and pressurized and heated to be integrated, a step 10d is formed between the surface of the sheet-like substrate 10 and the exposed surface of the U / L-shaped side wiring 20. become. According to this method, the step 10d corresponding to the depth of the recess formed in the carrier sheet is formed.

  Alternatively, the top surface 20f of the U / L-shaped side wiring 20 and the sheet-shaped substrate are provided by applying a resin or film for protecting the U / L-shaped side wiring 20 to a portion of the sheet-shaped substrate excluding the wiring. It is also possible to provide a level difference between the top surface 20 and the top surface 20f and the surface of the sheet-like substrate 10 to be flush with each other.

  Further, in the component built-in module 100 of the present invention, the U / L-shaped side wiring 20 can be a coplanar line. Thereby, a component built-in module suitable for high-speed signal wiring can be configured. More specifically, as shown in FIG. 14, if the U / L-shaped side wiring 20s as the signal wiring and the U / L-shaped wiring 20g located on both sides thereof are formed as the ground wiring, these U / L The shape side wires 20s and 20g have a coplanar structure. Thereby, the characteristic impedance can be controlled, and the problem of the impedance mismatching portion between the via and the wiring, which has occurred in the component built-in module having the via, can be avoided.

(Embodiment 3)
In the method for manufacturing a component built-in module according to the present invention, the sheet-like base 10 is formed by folding a component built-in module forming member having a sheet 15 containing a semi-cured resin, and then bringing the sheet 15 into a completely cured state. To do. According to this method, a component built-in module having a three-dimensional structure (that is, a structure having a certain dimension in the thickness direction of the sheet) can be easily manufactured according to the folding method. For example, a component built-in module having a shape having at least one of a convex portion and a concave portion can be formed. Such a module can be formed by folding the sheet 15 so as to have a shape having at least one of a convex part and a concave part, and then completely curing the sheet 15. Here, a method for manufacturing such a component built-in module will be described as a third embodiment.

  Specifically, such a component built-in module is manufactured by a method including the steps shown in FIGS. First, as shown in FIG. 15A, a sheet (sheet containing a semi-cured resin) 15 in which the wiring pattern 44 is formed and the electronic component 32 is embedded is prepared as a component built-in module forming member A. Next, as shown in FIGS. 15B and 15C, it is bent so as to have a shape having a convex portion 55 and a concave portion 56. Thereafter, heating and pressurization are performed to obtain a component built-in module 100 having a three-dimensional shape (here, U-shaped) as shown in FIG.

  The component built-in module 100 shown in FIG. 15D can be a component built-in module that can be mounted in a three-dimensional direction, as shown in FIG. More specifically, the lower surface of the convex portion 55 of the component built-in module 100 (the lowermost surface in FIG. 15D) is mounted on the printed circuit board 60, and between the component built-in module 100 and the printed circuit board 60, Another electronic component (for example, a chip component) 64 mounted on the printed circuit board 60 may be disposed. Another electronic component (for example, a semiconductor chip) 62 is mounted on the top surface (the uppermost surface in FIG. 15D) of the component built-in module 100. That is, if the component built-in module 100 shown in FIG. 15D is used, when viewed from above, in addition to the built-in electronic component 32, another electronic components 62 and 64 are three-dimensionally formed in the same region. Can be implemented. As a result, even when the mounting area is small, more electronic components can be mounted.

  Electronic component built in the component built-in module 100 (for example, the semiconductor chip 32 in FIG. 15E) and / or electronic component placed on the component built-in module 100 (for example, the semiconductor chip 62 in FIG. 15E). In the case of using a semiconductor chip having a narrow pitch or multiple pins, for example, a semiconductor chip having a terminal pitch interval of 150 μm or less and a semiconductor chip having 16 or more terminals can be suitably used from the viewpoint of high-density mounting. . On the component built-in module 100, not only an electronic component such as a semiconductor chip but also an electronic component such as a surface mount element (chip element, for example, a chip inductor, a chip resistor, and a chip capacitor) can be mounted. Alternatively, both a semiconductor chip and a surface mount element may be mounted.

  The component built-in module 100 of the present embodiment is relatively easy to have not only the shape shown in FIG. 15D but also a shape having various irregularities depending on how it is folded. On the other hand, in the case of a component built-in module that secures conduction between the upper and lower surfaces by a via, the shape of the via may change depending on the intended shape of the module, or alignment may be difficult. As a result, connection reliability may be reduced. In addition, the component built-in module according to the present embodiment can be manufactured by folding a semi-cured resin sheet, and then bringing the folded semi-cured resin sheet into a fully cured state. Is relatively easy, and is therefore advantageous from the viewpoint of shape flexibility.

  Furthermore, in the case of a component built-in module having a via, it is difficult to freely change the thickness of the component built-in module (in particular, to increase the thickness). That is, in a component built-in module having vias, if the thickness is excessively increased, vias (through holes) with a high aspect ratio are formed, making it difficult to form vias appropriately. For example, when drilling with a laser or the like, a tapered via is easily formed. On the other hand, when drilling with a drill or the like, the via is bent or the drill is bent. May break. In the case of the component built-in module 100 according to the present embodiment, the conduction of the electrical elements on the upper and lower surfaces is ensured by the U / L-shaped side wiring 20, so that problems that occur in high aspect ratio vias can be avoided.

(Embodiment 4)
In another embodiment of the component built-in module of the present invention, as shown in FIGS. 16A and 16B, a shield member (shield layer) 35 is provided inside the component built-in module 100 depending on how the sheet 15 is folded. You can also. As shown in the figure, the shield member 35 can be formed inside the component built-in module simply by folding the sheet 15. That is, a shield member can be easily added. In this case, the shield member 35 is basically made of the same material as the U / L-shaped side wiring 20. According to this method, the shield member can be easily introduced into the component built-in module, and noise countermeasures can be easily taken.

  The component built-in module having the shield member can be manufactured by performing the folding step (B) as follows in both the first and second manufacturing methods. First, the insulating layer 15-1 on the left side of the component built-in module forming member 39 similar to that in FIG. 5 is bent together with the wiring located below the insulating layer 15-1, and as shown in FIG. And 15-2 are made to face each other, and parts 44-1 and 44-2 of the bent wiring 44 are made to face each other through the opposing insulating layers 15-1 and 15-2, and the remaining part of the wiring 44 The portion 44-3 extends on the side surfaces of the opposing insulating layers 15-1 and 15-2.

  After that, as shown in FIG. 16B, the insulating layer 15-3 in the right part is bent together with the wiring located below the insulating layer 15-3, and the insulating layer 15-3 is positioned on the wiring part 44-1. These insulating layers 15-1 to 15-3 are opposed to each other to form the U / L-shaped wiring 20, and the previously bent wiring portion 44-1 is positioned between the insulating layers to be bent first. The wiring portion 44-1 can be used as the shield member 35.

  When the shield member 35 is formed inside the component built-in module 100 (that is, inside the sheet-like substrate 10), when the component built-in module 100 is mounted on a circuit board (for example, a mother board), electromagnetic waves from the board are emitted. The electronic component 32 can be protected by blocking. Further, as shown in FIG. 16B, when the electronic components (32, 34) are arranged on both the upper surface side and the lower surface side of the sheet-like substrate of the component built-in module 100, the electronic component 32 and the electronic component When the shield member 35 is positioned between the electronic component 34 and the electronic component 32, the interference of electromagnetic waves between the electronic component 32 and the electronic component 34 that are arranged close to each other in the component built-in module 100 can be effectively suppressed.

  A plurality of the component built-in modules 100 of this embodiment may be stacked to be multistage. For example, the second component built-in module 100 may be placed on the first component built-in module 100. In this case, these modules are electrically connected in a predetermined manner. Furthermore, it is possible to make it multi-stage (three or more stages). The same type of component built-in modules 100 may be stacked, or different types of modules may be stacked. For example, a module with a built-in semiconductor memory is used as the first component built-in module 100, and a module with a built-in LSI (for example, a logic LSI) is used as the second component built-in module 100 to obtain a multistage module. It's okay. As will be described later, the multi-stage module may be assembled using a component built-in module of another form that does not have a shield member.

(Embodiment 5)
In the above embodiment, the U / L-shaped side wiring is a U-shaped side wiring extending on the upper surface and the lower surface in addition to the side surface of the sheet-like substrate. In another preferred form, the U / L-shaped side wiring does not extend on either the upper surface or the lower surface. That is, the U / L-shaped side wiring may be an L-shaped side wiring that extends on the side surface of the base sheet and on the top or bottom surface of the base sheet. In the L-shaped wiring, the exposed surface of the wiring may be substantially flush with the side surface or the upper surface or the lower surface of the base sheet, or may protrude from the side surface. Alternatively, the L-shaped wiring may be recessed from the side surface and the upper (or lower) surface of the sheet-like substrate, and such an embodiment is shown in FIG.

  In the component built-in module 100 ′ shown in FIG. 17, one end portion 20b of the U / L-shaped side wiring 20 is a lower edge of the side surface of the sheet-like substrate 10 (that is, a boundary portion between the side surface 10c and the lower surface 10b ( Or the corner part)). The U / L-shaped side wiring 20 does not extend on the lower surface 10b.

  The configuration shown in FIG. 17 is similar to the configuration shown in FIG. 12, and the exposed surface 20f of the U / L-shaped side wiring 20 located on the side surface 10c is more inside the sheet-like substrate 10 than the side surface 10c. Located on the side. Further, the exposed surface 20c of the U / L-shaped side wiring 20 located at the upper corner portion of the sheet-like substrate 10 is also located on the inner side of the sheet-like substrate 10 with respect to the surface of the corner portion.

  FIG. 18 schematically shows a form in which the component built-in module 100 ′ shown in FIG. 17 is mounted on the printed circuit board 60. A solder connection portion 70 is formed on the end portion 20b (see FIG. 17) of the U / L-shaped side wiring 20, and thereby, the component built-in module 100 ′ and the wiring pattern 61 of the printed circuit board 60 are electrically connected. ing. In the component built-in module 100 ′ shown in FIG. 17, the U / L-shaped side wiring is positioned so as to be recessed by a step 10 d from the side surface of the sheet-like substrate, so that a groove portion is formed in a part of the side surface 10 c. This groove is convenient because it functions as a dam for storing solder and as a guide when the solder connection portion is formed. Further, in the mounting method (soldering) as shown in FIG. 18, it is possible to easily confirm the degree of attachment of the solder 70 when viewed from above the printed circuit board 60 (for example, the normal direction). That is, when the component built-in module 100 ′ in which the U / L-shaped side wiring 20 is terminated at the side surface is used, it is easy to inspect the solder joint portion performed after soldering.

  FIG. 19 shows a component built-in module 100 ″ in which the side surface 10c of the sheet-like substrate 10 and the exposed surface 20f that is the top surface of the U / L-shaped side wiring 20 constitute substantially the same surface. As shown, even when there is no step 10d (or even when the top surface 20f of the U / L-shaped side wiring 20 protrudes from the side surface 10c), the solder connection portion 70 is connected to the end of the U / L-shaped side wiring 20. It is possible to provide and solder-bond the component built-in module 100 ″ and the wiring pattern 61 of the printed circuit board 60 to each other. In this case as well, the inspection of the solder joint is facilitated.

  From the viewpoint of soldering, in the component built-in modules 100 ′ and 100 ″ shown in FIG. 17 to FIG. 19, the end 20b of the U / L-shaped side wiring 20 is separated from the side surface 10c of the sheet-like substrate 10 at a constant interval. In this case, not only the end portions but also the side wiring portions of the U / L-shaped side wirings may be arranged at regular intervals on the side surface of the sheet-like substrate.

  Since the component built-in modules described above are formed so that the U / L-shaped side wiring 20 extends on the side surface 10c of the sheet-like substrate 10, it can be mounted as shown in FIG. It is. That is, for example, a connector comprising a component built-in module 100 as shown in FIG. 2 and an electronic component (for example, a chip component or a semiconductor chip) 66 mounted thereon is arranged on a printed circuit board (mother substrate) 60. (Mechanical connector) 80 can be fitted. In this case, since the side wiring portion of the U / L-shaped side wiring 20 and the connector 80 in the component built-in module 100 are electrically and physically connected, the module and the printed board 60 are electrically connected via the connector 80. Will be connected. The connector 80 is configured so that the side surface 10c of the component built-in module 100 can be fitted. With this connector, the electronic component 66 can be vertically mounted, and a large number of components are mounted in an electronic device having a small mounting area. be able to. Although FIG. 20 shows the component built-in module shown in FIG. 2, the vertical mounting can be applied to any of the component built-in modules described above and below.

  Examples of the electronic device having a small mounting area include portable electronic devices such as mobile phones and PDAs. That is, if an assembly including the electronic component 66, the component built-in module 100, the connector 80, and the printed circuit board 60 is used, the vertical mounting of the electronic component can be performed relatively easily. Depending on the wiring pattern of the component built-in module 100, the electronic component 66 can be mounted on the lower surface 10 b of the sheet-like substrate 10 of the component built-in module 100.

(Embodiment 6)
A method for continuously producing the component built-in module of the present invention will be described with reference to FIG. FIG. 21 is a schematic diagram showing steps in the method of manufacturing a component built-in module according to the present invention. The component built-in module of the present invention can be continuously manufactured by a manufacturing method including a process using a roll, for example, as shown in FIG.

  As shown in FIG. 21, a carrier sheet 40 having a predetermined wiring pattern formed by processing a metal layer is supplied from a first roll 71, and a sheet 15 made of a semi-cured resin is supplied from a second roll 72. Supplied. Thereafter, the electronic component 30 is placed on the carrier sheet 40 and / or the wiring pattern at the position of the arrow 81. Next, at the position of the arrow 82, the carrier sheet 40 and the sheet 15 are laminated between the rolls 73, whereby the electronic component 30 is embedded in the sheet 15.

  Thereafter, the laminated body of the sheet 15 containing the electronic component 30 and the carrier sheet is bent at a position indicated by an arrow 83 to have a predetermined shape, and then cut at a position indicated by an arrow 84, and then heated and pressurized. The component built-in module of the invention is obtained. When the electronic component is not electrically connected to the wiring pattern as desired even when the electronic component is arranged on the wiring pattern, or when the electronic component is arranged on the carrier sheet, the electronic component 30 is necessary. Then, the electronic component 30 may be appropriately electrically connected to the wiring pattern (not shown).

  In another aspect, the electronic component is not placed before the roll 73, but the carrier sheet 40 and the sheet 15 having a predetermined wiring pattern are integrally laminated by the roll 73, and then the electronic component is placed. The component 30 may be disposed on the sheet 15. In this case, a component built-in module as shown in FIG. 56 (c) can be manufactured.

  The manufacturing method as shown in FIG. 21 is advantageous in that the component built-in module can be continuously manufactured using a roll, and the required conveying means is simple. Further, continuously producing the component built-in module brings about effects such as shortening the standby time of the apparatus and reducing the number of personnel as compared with batch processing.

(Embodiment 7)
Various aspects of the component built-in module of the present invention will be described as Embodiment 7 with reference to FIGS. 22 to 38 and FIGS. 43 to 55 are sectional views schematically showing the structure of the component built-in module 300 of the present invention. FIGS. 39 to 42 show the component built-in module 300 of the present invention on the lower side ( It is a bottom view (or top view) schematically showing a state seen from the upper side. Note that items that are not substantially different from the items described in the above embodiment are omitted or simplified. It should be noted that the component built-in module shown in these drawings may be grasped as any modification of the above-described embodiment.

  The component built-in module 300 shown in FIG. 22 has a configuration in which a bare chip semiconductor element 32 incorporated as an electronic component is connected to a wiring 20b ′ formed on the bottom surface of the sheet-like substrate 10 via a solder ball 32d. is doing. Similar to the wiring 20b 'shown in FIG. 10, the wiring 20b' may be an independent land or may be connected to another wiring. At least one of the wirings 20b ′ connected to the electronic component (that is, some or all of the plurality of wirings 20b ′) is an electrical element to which the end of the U / L-shaped side wiring 20 is connected. That is, the terminal 20b can be used. Also in this embodiment, it is preferable that the end portion of the U / L-shaped side wiring 20 and the terminal 20b are integrated by being formed from a metal layer laminated on the carrier sheet.

  The component built-in module 300 shown in FIG. 23 has a configuration in which a semiconductor package 32 as an electronic component having a lead 32 e is built in the sheet-like substrate 10. The lead 32 e of the semiconductor package 32 is connected to the wiring 20 b ′ of the wiring pattern located on the bottom surface of the sheet-like substrate 10. As in the case of FIG. 22, at least one of the plurality of wirings 20 b ′ can be a terminal 20 b to which the U / L-shaped side wiring 20 is connected. This component built-in module 300 can be manufactured by the first component built-in module manufacturing method. In that case, after the semiconductor package 32 is connected to the wiring pattern formed on the carrier sheet by the lead 32e, the gap formed between the semiconductor package 32 and the carrier sheet becomes a material of the insulating layer by subsequent heating and pressing. Filled with. As a result, the bottom surface of the semiconductor package 32 is covered with the sheet-like base material.

  The component built-in module 300 shown in FIG. 22 may have a structure in which the top and bottom are reversed as shown in FIG. In this case, the electronic component 32 is connected to the wiring 20a 'of the wiring pattern located on the upper surface. The component built-in module 300 shown in FIG. 24 has substantially the same structure as the component built-in module shown in FIG. 22, or terminals for mounting the components and positions of the terminals for mounting on the circuit board May be different in that they are upside down

  As shown in FIG. 25, the component built-in module 300 shown in FIG. The component built-in module 300 shown in FIG. 25 has substantially the same structure as that of the component built-in module shown in FIG. 23, or the positions of the terminals for mounting the components and the terminals for mounting on the circuit board. May be different from each other in that they are upside down.

  The component built-in module 300 shown in FIG. 26 has a configuration in which a plurality of electronic components, for example, a bare chip semiconductor element 32 and a chip component 34 are included in the sheet-like substrate 10. The bare chip 32 is connected to the terminal 20a by a thin metal wire 32b. The chip component 34 is mounted in contact with the terminal 20b. Both of the terminals 20 a and 20 b are electric elements connected to the U / L-shaped side wiring 20. The chip component 34 and the terminal 20b can be electrically connected via a connecting member such as solder. This component built-in module can be manufactured by, for example, the second component built-in module manufacturing method described with reference to FIG.

  The component built-in module 300 shown in FIG. 27 has a configuration in which an additional electronic component, for example, a chip component 34 is mounted on the inside of the side surface in the sheet-like substrate 10. That is, this component built-in module 300 has a configuration in which the chip component 34 is further built in the module having the configuration shown in FIG. In this component built-in module 300, the chip component 34 is mounted in contact with the U / L-shaped side wiring 20 located on the side surface of the sheet-like substrate 10.

  The component built-in module 300 shown in FIG. 28 is the same as the component built-in module 200 shown in FIG. 7B, but both the upper surface and the lower surface of the electronic component, for example, the semiconductor element 32 are the upper surface of the sheet substrate 10. And is different in that it is exposed on the lower surface. The surface of the electronic component opposite to the surface on which the terminals 33 are formed is exposed from the sheet-like substrate 10 so that the heat dissipation of the electronic component such as the semiconductor element 32 is improved. This component built-in module can be manufactured, for example, by mounting the semiconductor element 32 on the exposed surface of the carrier sheet and performing the same process as the process shown in FIG.

  The component built-in module 300 shown in FIG. 29 is obtained by forming a metal film 35 on the upper surface of the component built-in module having the configuration shown in FIG. That is, in the configuration shown in FIG. 29, the metal film 35 functions as a heat radiating member that promotes heat radiated from the upper surface of the semiconductor element 32, thereby further improving the heat dissipation of the semiconductor element 32. The metal film 35 may be electrically insulated from the wiring pattern as at least a portion in contact with the wiring pattern. The electrical insulation between the wiring pattern and the metal film can be realized, for example, by disposing a resin film between the two. It is also possible to provide heat radiating fins on the metal film.

  The component built-in module 300 shown in FIG. 30 has a configuration in which the bottom surface of the bare chip semiconductor element 32 is exposed on the lower surface of the sheet-like substrate 10. The bare chip 32 is connected to a terminal 20b connected to the U / L-shaped side wiring 20 via a thin metal wire 32b.

  The component built-in module 300 shown in FIG. 30 may have a structure in which the top and bottom are reversed as shown in FIG. The component built-in module 300 shown in FIG. 31 has substantially the same structure as that of the component built-in module shown in FIG. 30, or positions of terminals for mounting the components and terminals for mounting on the circuit board. May be different from each other in that they are upside down.

  The component built-in module 300 shown in FIG. 32 has a configuration in which two electronic components, for example, semiconductor elements 32A and 32B are stacked in the sheet-like substrate 10 while being separated from each other. The semiconductor element (bare chip) 32A is connected to a terminal 20a connected to the U / L-shaped side wiring 20 via a thin metal wire 32b. The semiconductor element (bare chip) 32B is connected to a terminal 20b connected to the U / L-shaped side wiring 20 through a fine metal wire 32b. Furthermore, an additional electronic component (for example, a passive component (chip component)) can be disposed in the sheet-like substrate 10.

  When a plurality of electronic components 32A and 32B are built in as shown in FIG. 32, these electronic components may be directly stacked so as to contact each other as shown in FIG.

  The component built-in module 300 shown in FIG. 33 may further include an electronic component 34 such as a chip component as shown in FIG.

  The component built-in module 300 shown in FIGS. 28 to 31 has a configuration in which a part of the electronic component 32 is exposed on the surface of the sheet-like substrate 10, but the components shown in FIGS. 32 to 34 and FIGS. 35 to 38. The built-in module 300 has a configuration in which all of the semiconductor elements 32 are arranged in the sheet-like base body 10 and are not exposed from the sheet-like base body 10 (that is, in a state of being completely built-in). As is apparent from these drawings, in the present invention, the component built-in module means a module in which at least a part of at least one electronic component is located (that is, included) in the base. A person skilled in the art can easily determine whether or not an electronic component is incorporated.

  Such an electronic component built-in module includes a sheet-like substrate in which the electronic component is embedded. In this case, the term “embedding” means that at least one surface of the electronic component is exposed on the surface of the sheet-like substrate. The surface of the sheet-like substrate and the surface of the sheet-like substrate are substantially flush with each other (for example, the state shown in FIGS. 28 to 31) and the electronic component is substantially enclosed (for example, FIGS. The state shown in FIG. 38). The term “surface of the electronic component” as used herein refers to the surface of the electronic component main body, and elements protruding from the electronic component main body, such as terminals, leads, connection protruding electrodes, etc. attached to the electronic component are ignored. .

  The component built-in module 300 shown in FIG. 35 has a configuration in which a bump 32c formed on a bare chip semiconductor element 32 as an electronic component and a terminal 20b connected to the U / L-shaped side wiring 20 are connected. is doing. The bump 32c is, for example, a gold bump, and is formed on an element terminal (not shown) of the bare chip 32.

  The component built-in module 300 shown in FIG. 36 has a configuration in which a bare chip semiconductor element 32 is connected to a terminal 20b connected to the U / L-shaped side wiring 20 by a thin metal wire 32b. The component built-in module 300 can be manufactured by the second component built-in module manufacturing method described with reference to FIG.

  The component built-in module 300 shown in FIGS. 35 and 36 can also have a structure in which the top and bottom are reversed, as shown in FIGS. 37 and 38, respectively. The component built-in module 300 shown in FIGS. 37 and 38 has substantially the same structure as the component built-in module shown in FIGS. 35 and 36, or is mounted on a terminal and a circuit board for mounting components. The positions of the terminals for doing so may be different from each other, for example, upside down.

  The bottom view shown in FIG. 39 shows the arrangement of the terminals 33 on the bottom surface of the component built-in module 300 shown in FIG. 28, for example. When the terminal 33 is a solder ball, it is preferable to form a solder resist on the surface of the semiconductor element 32. Moreover, the component built-in module of the other form mentioned above may also have the same terminal arrangement | sequence in the surface. For example, in the component built-in module shown in FIG. 22, when the wiring 20b 'is formed as a terminal, the terminal arrangement is the same as that in FIG. 39, but the semiconductor element 32 is not exposed on the bottom surface. In the case of the component built-in module shown in FIG. 24, when the wiring 20a 'is formed as a terminal, the arrangement of the terminals is the same as that in FIG. 39, but the semiconductor element 32 is not exposed.

  The bottom view shown in FIG. 40 shows the arrangement of the terminals 33 on the bottom surface of the component built-in module 300 shown in FIG. 23, for example. In the case of the component built-in module 300 shown in FIG. 23, the semiconductor element 32 is not exposed in the bottom face configuration shown in FIG. 40, and the sheet-like base material covers the bottom face of the semiconductor element 32. It should be noted that the position of the semiconductor element 32 is displayed in the drawing for easy understanding. For example, in the case of the component built-in module 300 shown in FIG. 25, the terminal arrangement shown in FIG. 40 corresponds to the upper surface of the component built-in module.

  FIG. 41 is a bottom view of the component built-in module similar to FIG. 40, in that the land 20b (or 20a) and the U / L-shaped side wiring 20 in the component built-in module are arranged on four sides of the sheet-like substrate. 40 is different The land 20b shown in FIGS. 40 and 41 is a corner land. However, as shown in FIG. 39, the land 20b may be a round land, while the round land shown in FIG. 39 may be a corner land.

  FIG. 42 shows an array of land-like wirings 20b ′ (or 20a ′) connected to terminals 32a of semiconductor elements (the elements themselves are not visible because they are enclosed in a sheet-like substrate) via metal thin wires 32b, and An example of the arrangement of lands 20b (or 20a) connected to the U / L-shaped side wiring 20 is schematically shown. The terminal 32a is typically embedded in the sheet-like substrate and is not exposed (see FIG. 3 as an example). In another embodiment, the terminal 32a is exposed on the lower (or upper) surface of the sheet-like substrate. Or may protrude from such a surface. In the example shown in FIG. 42, the land-like wiring 20b ′ is not electrically connected to the U / L-shaped side wiring 20, but the land-shaped wiring 20b ′ is electrically connected to the U / L-shaped side wiring 20. Alternatively, at least one of the land-like wirings 20b ′ may be a land 20b connected to the U / L-shaped side wiring 20.

  The component built-in module 300 of the present invention shown in FIGS. 43 to 49 has a configuration in which an electronic component is placed on the upper surface thereof. Hereinafter, various forms of such a component built-in module will be described.

  The component built-in module 300 shown in FIG. 43 has a configuration in which the semiconductor package 62 is disposed on the upper surface thereof (that is, on the upper surface of the sheet-like substrate 10 incorporating the semiconductor element 32). The lead 63 of the semiconductor package 62 is connected to a terminal 20 a connected to the U / L-shaped side wiring 20. The semiconductor element (bare chip) 32 is formed on the bottom surface (lower surface) of the sheet-like substrate 10 and is independent of the land or connected to another wiring 20b ′ (or U / L-shaped side). It is connected to a land 20b) connected to the wiring 20 through a thin metal wire 32b.

  The component built-in module 300 shown in FIG. 44 has a configuration in which the bare chip 62 is disposed on the upper surface of the sheet-like substrate 10. The bare chip 62 is connected to the land 20a connected to the U / L-shaped side wiring 20 formed on the upper surface of the sheet-like substrate 10 through the fine metal wire 62b. In addition, the semiconductor element (bare chip) 32 is also connected to the land 20a connected to the U / L-shaped side wiring 20 via a thin metal wire 32b. In the configuration shown in FIG. 45, the semiconductor element (bare chip) 32 is connected to the wiring 20b '(or the land 20b connected to the U / L-shaped side wiring 20) via the thin metal wire 32b.

  The component built-in module 300 shown in FIG. 46 has a configuration in which a semiconductor element (bare chip) 62 having bumps 62 c is arranged on the upper surface of the sheet-like substrate 10. The bump 62 c is connected to a terminal 20 a connected to the U / L-shaped side wiring 20. The semiconductor element (bare chip) 32 is connected to a wiring 20b ′ that is independent in land form or connected to another wiring (or a land 20b that is connected to the U / L-shaped side wiring 20) via a thin metal wire 32b. Connected. In the example shown in FIG. 46, an underfill 64 is formed between the semiconductor element 62 c and the upper surface of the sheet-like substrate 10. The underfill 64 can suppress the generation of voids under the semiconductor element 32, and can improve the adhesive strength between the semiconductor element 32 and the sheet-like substrate 10. In addition, the difference in thermal expansion between the semiconductor element 32 and the sheet-like substrate 10 can be reduced by selecting an appropriate material.

  The component built-in module 300 shown in FIG. 47 has a configuration in which the semiconductor element 62 in which the solder ball 62d is placed on the element terminal 62a is arranged on the wiring pattern on the upper surface of the sheet-like substrate 10. The semiconductor element (bare chip) 62 is connected to a wiring 20b ′ that is independent in land form or connected to another wiring (or a land 20b that is connected to the U / L-shaped side wiring 20) via a thin metal wire 32b. Connected.

  The component built-in module 300 shown in FIG. 48 has a configuration in which two semiconductor elements 62A and 62B are provided above the sheet-like substrate 10. In the example shown in FIG. 48, in the module shown in FIG. 47, a semiconductor package 62B having leads 63 is arranged above the semiconductor element 62A, and the leads 63 are connected to the U / L-shaped side wiring 20. It is connected to the land 20a.

  In the embodiment shown in FIGS. 43 to 48, the semiconductor element 63 is placed on the upper surface of the sheet substrate 10 as an electronic component. However, as shown in FIG. 49, a passive component (chip component) 64 is used as the electronic component. It may be placed. Moreover, you may mount both a semiconductor element and passive components.

  As described above, it is also possible to obtain a multistage module by stacking a plurality of component built-in modules of the present invention. The component built-in module 300 shown in FIG. 50 has a configuration in which two component built-in modules are stacked. In this example, the upper component built-in module and the lower component built-in module are electrically connected by a connecting member (solder ball) 64d. The number of component built-in modules to be stacked is not limited to two, and three or more component built-in modules can be stacked.

  Since the component built-in module of the present invention can be formed into an arbitrary shape relatively easily as described above, as shown in FIG. 51, the component built-in module 300 including the sheet-like substrate 10 having the convex portions 22. Can be configured. Furthermore, as shown in FIG. 52, it is possible to mount the chip component 64 on the bottom surface portion of the concave portion of the sheet-like substrate 10 existing between the two convex portions 22. In another mode, as shown in FIG. 53, the component built-in module is mounted on the wiring board 60 so that the concave portion of the sheet-like substrate 10 accommodates the chip part 64 located on the wiring board (motherboard) 60. Is also possible.

  Furthermore, as shown in FIG. 54, the convex portion 22 can be formed on both the lower side and the upper side of the sheet-like substrate 10. Also, in the component built-in module 300 shown in FIG. 55, the chip component 64 is mounted on the surface of the sheet-like substrate 10 that becomes the bottom of the concave portion formed by the upper and lower convex portions 22, and the upper chip component 64 mounted is mounted. A semiconductor element 62 is disposed above. In the example shown in FIG. 55, the lead 63 of the semiconductor element 62 is connected to the U / L-shaped side wiring 20.

  The component built-in module of the present invention, for example, the component built-in module 100, 200, 300 or the like according to the above-described embodiment is housed in the casing of the portable electronic device and is portable electronic device together with other components of the portable electronic device. Can be built. The component built-in module according to the embodiment of the present invention is preferably applied to an electronic device in which a strict limitation is imposed on a mounting area among portable electronic devices, for example, a mobile phone, and other portable electronic devices (for example, PDAs). Etc.). Furthermore, the component built-in module of the present invention can be relatively efficiently manufactured by the method for manufacturing a component built-in module of the present invention.

It is a perspective view which shows the conventional component built-in module 400 typically. 1 is a perspective view schematically showing a component built-in module 100 according to Embodiment 1 of the present invention. It is sectional drawing which shows typically the component built-in module 100 which concerns on Embodiment 1 of this invention. (A)-(d) is process sectional drawing for demonstrating the manufacturing method of a component built-in module formation member. (A)-(c) is process sectional drawing for demonstrating the manufacturing method of a component built-in module formation member. (A) And (b) is process sectional drawing for demonstrating the 1st manufacturing method of a component built-in module. (A) And (b) is the bottom view and sectional view which show typically component built-in module 200 concerning Embodiment 2 of the present invention, respectively. (A)-(c) is process sectional drawing for demonstrating the manufacturing method of the component built-in module 200. FIG. It is sectional drawing which shows typically the component built-in module 210 which concerns on Embodiment 2 of this invention. It is sectional drawing which shows typically the component built-in module 220 which concerns on Embodiment 2 of this invention. It is sectional drawing which shows typically the component built-in module which concerns on Embodiment 2 of this invention. It is a principal part enlarged view of the U / L-shaped side wiring 20 in the component built-in module of this invention. It is a principal part enlarged view of the U / L-shaped side wiring 20 in the component built-in module of this invention. It is a principal part enlarged view of the U / L-shaped side wiring 20 in the component built-in module of this invention. (A)-(e) is process sectional drawing for demonstrating the manufacturing method of the component built-in module 100 which concerns on Embodiment 3 of this invention. (A) And (b) is process sectional drawing for demonstrating the method to manufacture the component built-in module 100 with which the shield member (shield layer) 35 provided in the inside based on Embodiment 4 of this invention. It is a principal part enlarged view of the U / L-shaped side wiring 20 in the component built-in module 100 'concerning Embodiment 5 of this invention. FIG. 18 is an enlarged view of a main part showing a state in which the component built-in module 100 ′ shown in FIG. It is a principal part enlarged view which shows the state which soldered the component built-in module 100 '' concerning Embodiment 5 of this invention to the printed circuit board 60. FIG. 3 is a cross-sectional view showing a configuration in which a component built-in module 100 is mounted on a printed circuit board 60 via a connector 80. It is process sectional drawing for demonstrating the manufacturing method of the component built-in module which concerns on Embodiment 6 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is a bottom view which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is a bottom view which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is a bottom view which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is a bottom view which shows typically the arrangement | sequence of the terminal of a semiconductor element and wiring in the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically an example of the component built-in module 300 which concerns on Embodiment 7 of this invention. (A)-(c) is process sectional drawing for demonstrating the 2nd manufacturing method of a component built-in module. (A)-(c) is process sectional drawing for demonstrating the 2nd manufacturing method of a component built-in module. (A)-(d) is process sectional drawing for demonstrating the 3rd manufacturing method of a component built-in module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet-like base | substrate 15 Sheet | seat 20 Wiring 22 Convex part 30 Electronic component 32 Semiconductor element 33 Terminal 32a Element terminal 32b Metal fine wire 32c Bump 33d Solder ball 33 Terminal 34 Passive component (chip component)
35 Shield member (shield layer)
40 Carrier sheet 42 Metal layer 44 Wiring pattern 60 Printed circuit board 62 Semiconductor element 63 Lead 64 Passive component (chip component)
66 Electronic component 70 Solder 71 First roll 72 Second roll 73 Roll 80 Connector 100 Component built-in module 100 ′, 100 ”Component built-in module 200, 210, 220, 300 Component built-in module 400, 500 Component built-in module

Claims (27)

An insulating sheet-like substrate having an upper surface, a lower surface opposite to the upper surface, and a side surface connecting them;
i) a side wiring part located on at least a part of the side surface; ii) connected to the side wiring part and connected to the upper surface wiring part located on at least a part of the upper surface and the side wiring part. and comprising and at least one of the lower surface wiring portion located on at least a portion of the lower surface, viewed contains at least one wiring, and electronic components arranged in sheet form in the substrate,
The module with a built- in component , wherein at least a part of the side wiring portion of the wiring is embedded in the side surface of the sheet-like substrate .   The component built-in module according to claim 1, wherein the at least one wiring electrically connects the electrical element on the upper surface and the electrical element on the lower surface.   The component built-in module according to claim 1, wherein the module does not have a via penetrating the sheet-like substrate.   The component built-in module according to claim 1, wherein at least one end of the wiring is connected to a land, and the wiring and the land are integrally formed.   The component built-in module according to claim 1, wherein the wiring and the electronic component are electrically connected.   The component built-in module according to claim 1, wherein the sheet-like substrate is made of a material containing a resin.   The component built-in module according to claim 1, wherein the sheet-like substrate is made of a composite material including a resin and an inorganic filler.   The component built-in module according to claim 6, wherein the resin is at least one of a thermosetting resin and a thermoplastic resin.   The component built-in module according to claim 1, wherein the upper surface of the sheet-like substrate has a substantially rectangular shape including a long side and a short side shorter than the long side.   The component built-in module according to claim 1, wherein the electronic component is a semiconductor element.   The component built-in module according to claim 1, wherein a plurality of types of electronic components are arranged in the sheet-like substrate, and at least one of the electronic components is a semiconductor element.   The component built-in module according to claim 1, wherein another component built-in module is stacked on at least one of an upper surface and a lower surface of the component built-in module.   The component built-in module according to claim 1, wherein an electronic component is placed on at least one of an upper surface and a lower surface of the component built-in module. 2. The component built-in module according to claim 1 , wherein a top surface of the side wiring portion of the wiring is located on an inner side of the sheet-like substrate than a side surface of the sheet-like substrate.   The component built-in module according to claim 1, wherein a portion of the wiring located at a corner portion of the sheet-like substrate is located on an inner side of the sheet-like substrate with respect to a surface of the sheet-like substrate defining the corner portion.   The component built-in module according to claim 1, wherein the plurality of wirings define a coplanar line.   The component built-in module according to claim 1, further comprising a shield member inside the sheet-like substrate. At least two electronic components are disposed in the sheet-like substrate, the at least one electronic component is located between the shield member and the upper surface of the sheet-like substrate, and the other at least one electronic component is the shield member and the sheet. The module with a built-in component according to claim 17 , which is located between the lower surface of the cylindrical substrate.   2. The component built-in module according to claim 1, wherein a part of the electronic component is exposed on a surface of the sheet-like substrate, and a heat dissipation member is disposed so as to contact the exposed part of the electronic component.   2. The component built-in module according to claim 1, wherein the sheet-like substrate is formed by folding a sheet containing a resin in a semi-cured state, and then completely curing the folded sheet. The component built-in module according to claim 20 , wherein a sheet including resin has a wiring pattern including the wiring as a part thereof.   An electronic device comprising the component built-in module according to claim 1 and a housing for housing the module. A method of manufacturing a component built-in module,
(1-A) Carrier sheet, wiring pattern and electronic component having at least one wiring arranged thereon, and insulating layer containing resin arranged on these wiring pattern and electronic component A step of preparing a component built-in module forming member,
(1-B) The component built-in module forming member is folded so that the insulating layers are opposed to each other, and a part of the at least one wiring is opposed to each other via the opposing insulating layer, and the at least one The other part of the wiring is formed by the bent part of the insulating layer, and extends on the side surface of the insulating layer after bending; and (1-C) the insulating layer of the folded component built-in module forming member A method of manufacturing a component built-in module comprising a step of curing the resin. The component built-in module forming member
(1-a) preparing a laminate having a carrier sheet and a metal layer formed thereon,
(1-b) a step of processing the metal layer to form a wiring pattern having at least one wiring and, if necessary, exposing a carrier sheet located below the location where the electronic component is to be placed ,
(1-c) including a step of placing an electronic component on the exposed carrier sheet and / or wiring pattern, and (1-d) a step of forming an insulating layer containing a resin on the wiring pattern and the electronic component. The method for manufacturing a component built-in module according to claim 23 , which is prepared by a method for manufacturing a component built-in module forming member. A method of manufacturing a component built-in module,
(2-A) A carrier sheet, a wiring pattern having at least one wiring arranged thereon, an insulating layer including a resin arranged on the wiring pattern, and arranged on the insulating layer A step of preparing a component built-in module forming member comprising the electronic component
(2-B) The component built-in module forming member is folded so that the insulating layers are opposed to each other, and a part of the at least one wiring is opposed to each other via the opposing insulating layer, and the at least one The other part of the wiring is formed by the bent portion of the insulating layer, and extends on the side surface of the insulating layer after the bending; and (2-C) the insulating layer of the folded component built-in module forming member A method of manufacturing a component built-in module comprising a step of curing the resin. The component built-in module forming member
(2-a) preparing a laminate having a carrier sheet and a metal layer formed thereon,
(2-b) processing the metal layer to form a wiring pattern having at least one wiring;
(2-c) Prepared by a method for producing a component built-in module forming member, including a step of forming an insulating layer containing a resin on a wiring pattern, and (2-d) a step of placing an electronic component on the insulating layer The method for manufacturing a component built-in module according to claim 25 . A method of manufacturing a component built-in module,
(3-A) preparing a component built-in module forming member having a carrier sheet, a wiring pattern having at least one wiring disposed thereon, and an electronic component;
(3-B) A step of bending the component built-in module forming member with the wiring pattern inside, so that a part of the at least one wiring faces each other, and a gap is formed between the facing parts. ,
(3-C) a step of injecting a material comprising a curable resin into the gap to form a resin layer;
(3-D) A method of manufacturing a connection member, comprising: curing the resin layer to form an electrical insulating layer; and (3-E) removing the carrier sheet to expose the wiring layer.

Images