CN105722337A - Method for installing and reinforcing high-density mixed printed circuit assembly containing BGA device - Google Patents
Method for installing and reinforcing high-density mixed printed circuit assembly containing BGA device Download PDFInfo
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- CN105722337A CN105722337A CN201410719610.7A CN201410719610A CN105722337A CN 105722337 A CN105722337 A CN 105722337A CN 201410719610 A CN201410719610 A CN 201410719610A CN 105722337 A CN105722337 A CN 105722337A
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- printed circuit
- circuit assembly
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Abstract
A method for installing and reinforcing a high-density mixed printed circuit assembly containing a BGA device comprises the following steps: (1) reflow-soldering a BGA chip, a surface-mounted chip and/or a resistance-capacitance device to a printed board; (2) using pressure-sensitive adhesive to bond a cold-rolled plate to the printed board welded with the BGA chip, the surface-mounted chip and/or the resistance-capacitance device in step (1); and (3) carrying out wave soldering of via devices on the printed board obtained in step (2). The consistency and reliability of mixed circuit module welding quality are improved, and problems of printed circuit assembly reinforcing and cooling are solved effectively.
Description
Technical field
The invention belongs to computer circuit assembly technical field, relate to a kind of high density containing BGA device and load in mixture printed circuit assembly dress connection reinforcement means.
Background technology
The purpose of the bonding cold drawing of printed circuit board (aluminium sheet) is to play reinforcing and thermolysis, and at present, in printed circuit assembly dress connection technique, cold drawing, as a part for printed board, is all first bonding cold drawing, then carries out the welding of components and parts, and Fig. 1 is shown in technological process.During bonding cold drawing, printed board is bare board, need not consider the factor of device time bonding；Intermediate temperature setting adhesive selected by adhesives, and the mode that positions adopts perusal, fixes with adhesive tape and pin；Cold drawing technique for sticking flow process is shown in Fig. 2.Along with integrated circuit is to miniaturization and highdensity development, the surface mounting component in printed board gets more and more, and takes manual welding, and not only efficiency is low, it is impossible to ensure the concordance of welding quality, also cannot meet the requirement of batch production simultaneously.Particularly when assembly has BGA device, manual brush soldering paste need to be adopted to carry out Reflow Soldering again, owing to cold drawing temperature distortion can cause the deformation of BGA periphery pad to strengthen, additionally, the quick heat radiating characteristic of cold drawing can make the welding temperature at BGA device place lose, and BGA welding quality both can be made to ensure.For high-density printed circuit assembly, adopting adhesive bonding, when glue is overflow in cleaning, the pipe lower limb easily damaging very thin, it addition, unnecessary glue also can pollute pad, cleaning is unclean, affects welding quality.At present, two ways is usually taken for mixed circuit assembly: one, continue to use traditional approach, first bonding cold drawing, welds device afterwards, and in the method, surface mounting component is intended to manual welding, (owing to there is difference in height in cold drawing face and the printed board face of solder side, cannot be carried out Reflow Soldering, manual welding can only be taked), therefore cannot ensure the concordance of welding quality；Its two, module does not fill cold drawing, the problem that there is module heat dissipating and reinforcing.Therefore need to select a kind of not only to can guarantee that welding quality but also a kind of assembling method loading in mixture printed circuit assembly of module heat dissipating reinforcement effect can be played.
Summary of the invention
Load in mixture printed circuit assembly cannot apply the bonding technical problem with reflow soldering of cold drawing simultaneously in order to what solve background technology exists, the invention provides the concordance and reliability that can improve mixed circuit module welding quality and can effectively solve printed circuit assembly and reinforce and the high density containing BGA device of heat dissipation problem loads in mixture printed circuit assembly dress connection reinforcement means.
The technical solution of the present invention is: the invention provides a kind of high density containing BGA device and load in mixture printed circuit assembly dress connection reinforcement means, it is characterized in that and said method comprising the steps of:
1) bga chip, Surface Mount chip and/or capacitance resistance ware and printed board are carried out reflow soldering；
2) adopt pressure sensitive adhesive that cold drawing is bonded in step 1) be welded with bga chip, Surface Mount chip and/or capacitance resistance ware printed board on；
3) to step 2) obtained printed board carries out the wave soldering of via devices.
Above-mentioned steps 2) in the pressure sensitive adhesive that adopts be that acrylic compounds is without base material pressure-sensitive adhesive film.
Aforesaid propylene acids is 0.05mm～0.25mm without the thicknesses of layers of base material pressure-sensitive adhesive film；Temperature resistant range is-55 DEG C～+270 DEG C.
Above-mentioned steps 2) and step 3) between also include step that the printed board being bonded with cold drawing is compressed.
The above-mentioned compression time is not less than 30 minutes.
The invention have the advantage that
The invention provides a kind of high density containing BGA device and load in mixture printed circuit assembly dress connection reinforcement means, the method flow process is the reflow soldering of the surface mounting component such as BGA first carrying out cold drawing face, then the cold drawing carrying out assembly is bonding, finally carries out the wave soldering of via devices.The present invention will be equipped with the manual welding of the surface mounting components such as the BGA in the mixed circuit of cold drawing and changes reflow soldering into, improves stability and the reliability of welding quality；Decline owing to cold drawing temperature distortion causes the deformation of BGA periphery pad to strengthen the welding quality caused when avoiding the device welding such as BGA；Reduce labour force, improve production efficiency；Adopting high-strength pressure-sensitive, technique for sticking is easy, easily implement, intensity is high, the cycle is short；Avoid and use the excessive glue that adhesive occurs to cause the blocking of pad and gel resin to easily cause damaging of intensive surface mounting component pipe lower limb.The invention solves and load in mixture printed circuit and cannot apply a difficult problem for cold drawing adhesive technology and reflow solder technique simultaneously.The wherein bonding employing high-strength pressure-sensitive of cold drawing, it is to avoid use adhesive that starved occurs, overflow glue and gel resin causes the damage of pipe lower limb.The method achieve the dress connection reinforcement technique containing BGA device mixed circuit assembly with cold drawing, improve stability and the reliability of mixed circuit welding quality, improve production efficiency.
Accompanying drawing explanation
Fig. 1 is existing dress joined process flow figure；
Fig. 2 is dress joined process flow schematic diagram provided by the present invention；
Fig. 3 is existing adhesive technique for sticking flow chart；
Fig. 4 is Performance of Pressure Sensitive Adhesive process chart of the present invention.
Detailed description of the invention
The invention provides a kind of high density containing BGA device and load in mixture printed circuit assembly dress connection reinforcement means, the method applies cold drawing adhesive technology and reflow solder technique simultaneously；Key step includes:
1) apply cold drawing adhesive technology and reflow solder technique simultaneously；First carrying out the Reflow Soldering of the surface mounting components such as BGA, then the cold drawing carrying out assembly is bonding, finally carries out the wave soldering of via devices, Fig. 2 is shown in technological process.2) printed circuit assembly of welding equipment device carrying out cold drawing bonding, bonding cold plate process flow process is shown in Fig. 4；High-strength high temperature-resistant pressure sensitive adhesive selected by adhesives；3) for reducing device to bonding adverse effect, employing special tooling positions, utilize frock to carry out precise positioning, dodge device and carry out crimping bonding, the adhesive effect not only playing positioning action but also playing between sticky object (location, bonding once complete).
Cold drawing adhesive technology, adopts pressure sensitive adhesive to carry out bonding the mixed circuit of welding equipment surface mounting component, uses frock to carry out precise positioning simultaneously.
Pressure-sensitive adhesive material be a kind of acrylic compounds without base material pressure-sensitive adhesive film, its thicknesses of layers is 0.05mm～0.25mm, temperature resistant range-55 DEG C～+270 DEG C.
Cold drawing is compressed by the adopted positioning tool of the present invention, and positioning tool is detachable frock, is made up of base plate and cover plate, and cover plate embeds in base plate, forms double buckle structure, and both should keep agreeing with the bonding plane of assembly；For the device of welding equipment on mixed circuit, the mode of perforate or fluting should be adopted in frock, dodge.
Below in conjunction with specific embodiment, the technical scheme described in the present invention is described in detail:
Embodiment 1:
In XX product power driver module, 3 bga chips and 23 table note chips, 22 via devices, and Surface Mount capacitance resistance ware are contained in this modules A face；3, B face through hole socket and table note capacitance resistance ware；Cold drawing is positioned at A face.This module is implemented the method, and step is as follows:
1) reflow soldering of the bga chip in A face and the capacitance resistance ware of Surface Mount is first carried out；
2) pressure sensitive adhesive is carried out bonding with cold drawing, and carry out cutting glued membrane according to cold drawing shape；
3) the printing assembly being welded with surface mounting component being put into tool base plate, A faces up, then the cold drawing being stained with pressure sensitive adhesive is put thereon, fits with modules A face；
4) frock cover plate being embedded in base plate, closely agree with, compress after placing 30 minutes, assembly is bonding completes for cold drawing and printing.
5) wave soldering and the through hole socket craft repair welding of 3, B face of the resistance-capacitance device of A face via devices and B face Surface Mount are finally carried out.
Embodiment 2:
In XX product DIO module, 1 bga chip and 19 Surface Mount chips and 4 dual-in-line chips and Surface Mount capacitance resistance ware are contained in this modules A face；There are 15 Surface Mount chips and Surface Mount capacitance resistance ware in B face；Cold drawing is positioned at A face.This module is implemented the method, and step is as follows:
1) the dual reflux welding of the Surface Mount chip in A face bga chip, Surface Mount chip, B face is first carried out；
2) pressure sensitive adhesive is carried out bonding with cold drawing, and carry out cutting glued membrane according to cold drawing shape；
3) the printing assembly being welded with surface mounting component being put into tool base plate, A faces up, then the cold drawing being stained with pressure sensitive adhesive is put thereon, fits with modules A face；
4) frock cover plate being embedded in base plate, closely agree with, compress after placing 30 minutes, assembly is bonding completes for cold drawing and printing.
5) the manual repair welding of 4 via devices in A face is finally carried out；
Embodiment 3:
In XX product G I/O module, 1 bga chip and 21 Surface Mount chips, 52 via devices and Surface Mount capacitance resistance ware are contained in this modules A face；B face is the capacitance resistance ware of 11 Surface Mount chips and more Surface Mount；Cold drawing is positioned at A face.This module is implemented the method, and step is as follows:
1) bga chip in A face and the reflow soldering of 21 Surface Mount chips, capacitance resistance ware are first carried out；
2) pressure sensitive adhesive is carried out bonding with cold drawing, and carry out cutting glued membrane according to cold drawing shape；
3) the printing assembly being welded with surface mounting component is put into tool base plate, then the cold drawing being stained with pressure sensitive adhesive is put thereon, fit with modules A face；
4) frock cover plate being embedded in base plate, closely agree with, compress after placing 30 minutes, assembly is bonding completes for cold drawing and printing.
5) the manual repair welding of 11 Surface Mount chips of wave soldering and B face of A face via devices and B face capacitance resistance ware is finally carried out.
Claims (5)
1. the high density containing BGA device loads in mixture printed circuit assembly dress connection reinforcement means, it is characterised in that: said method comprising the steps of:
1) bga chip, Surface Mount chip and/or capacitance resistance ware and printed board are carried out reflow soldering；
2) adopt pressure sensitive adhesive that cold drawing is bonded in step 1) be welded with bga chip, Surface Mount chip and/or capacitance resistance ware printed board on；
3) to step 2) obtained printed board carries out the wave soldering of via devices.
2. the high density containing BGA device according to claim 1 loads in mixture printed circuit assembly dress connection reinforcement means, it is characterised in that: described step 2) in the pressure sensitive adhesive that adopts be that acrylic compounds is without base material pressure-sensitive adhesive film.
3. the high density containing BGA device according to claim 2 loads in mixture printed circuit assembly dress connection reinforcement means, it is characterised in that: described acrylic compounds is 0.05mm～0.25mm without the thicknesses of layers of base material pressure-sensitive adhesive film；Temperature resistant range is-55 DEG C～+270 DEG C.
4. the high density containing BGA device according to claim 3 loads in mixture printed circuit assembly dress connection reinforcement means, it is characterised in that: described step 2) and step 3) between also include step that the printed board being bonded with cold drawing is compressed.
5. the high density containing BGA device according to claim 4 loads in mixture printed circuit assembly dress connection reinforcement means, it is characterised in that: the described compression time is not less than 30 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410719610.7A CN105722337A (en) | 2014-12-01 | 2014-12-01 | Method for installing and reinforcing high-density mixed printed circuit assembly containing BGA device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410719610.7A CN105722337A (en) | 2014-12-01 | 2014-12-01 | Method for installing and reinforcing high-density mixed printed circuit assembly containing BGA device |
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| CN105722337A true CN105722337A (en) | 2016-06-29 |
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| CN201410719610.7A Pending CN105722337A (en) | 2014-12-01 | 2014-12-01 | Method for installing and reinforcing high-density mixed printed circuit assembly containing BGA device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
| CN106535481A (en) * | 2016-12-08 | 2017-03-22 | 苏州长风航空电子有限公司 | Method for pasting heat dissipating board |
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| CN102065646A (en) * | 2011-01-18 | 2011-05-18 | 武汉正维电子技术有限公司 | Surface mount technology of ratio frequency power amplification mainboard |
| CN102164455A (en) * | 2011-01-18 | 2011-08-24 | 武汉正维电子技术有限公司 | Process for assembling radio frequency power amplifier circuit board |
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN103079352A (en) * | 2012-12-29 | 2013-05-01 | 中国航空工业集团公司第六三一研究所 | Reinforcing method for printed plate |
| CN103442522A (en) * | 2013-08-05 | 2013-12-11 | 江苏云意电气股份有限公司 | Welding assembly process of regulator of automotive generator |
| CN104135841A (en) * | 2014-08-06 | 2014-11-05 | 连云港杰瑞电子有限公司 | Brick type DC/DC power module built-in electromagnetic screen and installing method thereof |
| CN104159414A (en) * | 2014-09-10 | 2014-11-19 | 深圳市九八八电子有限公司 | Circuit board assembly method |
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2014
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102065646A (en) * | 2011-01-18 | 2011-05-18 | 武汉正维电子技术有限公司 | Surface mount technology of ratio frequency power amplification mainboard |
| CN102164455A (en) * | 2011-01-18 | 2011-08-24 | 武汉正维电子技术有限公司 | Process for assembling radio frequency power amplifier circuit board |
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN103079352A (en) * | 2012-12-29 | 2013-05-01 | 中国航空工业集团公司第六三一研究所 | Reinforcing method for printed plate |
| CN103442522A (en) * | 2013-08-05 | 2013-12-11 | 江苏云意电气股份有限公司 | Welding assembly process of regulator of automotive generator |
| CN104135841A (en) * | 2014-08-06 | 2014-11-05 | 连云港杰瑞电子有限公司 | Brick type DC/DC power module built-in electromagnetic screen and installing method thereof |
| CN104159414A (en) * | 2014-09-10 | 2014-11-19 | 深圳市九八八电子有限公司 | Circuit board assembly method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
| CN106255313B (en) * | 2016-08-30 | 2018-10-02 | 无锡市同步电子制造有限公司 | A kind of preparation of circuit board heat dissipation cold plate and adhering method |
| CN106535481A (en) * | 2016-12-08 | 2017-03-22 | 苏州长风航空电子有限公司 | Method for pasting heat dissipating board |
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