CN110267433A - A kind of circuit board reinforcement process and circuit board - Google Patents
A kind of circuit board reinforcement process and circuit board Download PDFInfo
- Publication number
- CN110267433A CN110267433A CN201910561339.1A CN201910561339A CN110267433A CN 110267433 A CN110267433 A CN 110267433A CN 201910561339 A CN201910561339 A CN 201910561339A CN 110267433 A CN110267433 A CN 110267433A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- steel disc
- pressing
- reinforcement process
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of circuit board reinforcement process and circuit board, circuit board reinforcement process includes the jig for preparing circuit board and carrying out reinforcement, and the jig includes bottom plate, cover board and the backing plate connecting with cover board, and bottom plate is equipped with windowing slot；The circuit board for posting steel disc is placed on jig；Cover board push, circuit board two sides respectively with backing plate and contacts baseplate；Curing process is carried out after the completion of pressing；Circuit board is made of above-mentioned reinforcement process.Jig is equipped with the windowing slot for keep away to steel disc position, it can prevent steel disc and circuit board from occurring collapsing or being recessed when being pressed, and under the compound action of cover board and backing plate, improve the contact area of steel disc and cover board, it reduces in bonding processes to pressure suffered by steel disc, because cover board applies press power to steel disc by gasket, keeps the stress of steel disc more uniform, improve flatness and reinforcement quality to circuit board.
Description
Technical field
The present invention relates to circuit board making technical field more particularly to a kind of circuit board reinforcement process and circuit board.
Background technique
Flexible electric circuit board (FPC) is also known as flexible circuit, is using mylar or polyimides as one kind made of substrate
With height reliability, excellent flexible printed circuit.This circuit board can be arbitrarily bent, and folding is light-weight, small in size, be dissipated
It is hot strong, facilitate installation, therefore be used widely in electronics, communications industry and pay attention to increasingly.But just because the characteristics of FPC is light
It is thin short and small, therefore it is easy to happen that discounting, scar, mechanical strength is small, the problems such as being easily cracked during use.So needs pair
FPC carries out reinforcement steel disc, and the purpose is to the mechanical strengths to reinforce FPC, facilitates surface actual load operation etc..But common line plate
During reinforcement, the phenomenon that being easy to appear circuit board unbalance stress, cause the flatness of circuit board low, reduce circuit board plus
Working medium amount.
Summary of the invention
The purpose of the present invention is to provide a kind of circuit board reinforcement process and circuit board, to overcome available circuit plate reinforcement
Flatness is low afterwards, second-rate defect.
The technical proposal adopted by the invention to solve the above technical problems is that:
A kind of circuit board reinforcement process, includes the following steps,
Preparing circuit board and carries out the jig of reinforcement, the jig includes bottom plate, cover board and the backing plate connecting with cover board,
Bottom plate is equipped with windowing slot；
The circuit board for posting steel disc is placed on jig；
Pressing: cover board push, circuit board two sides respectively with backing plate and contacts baseplate；
Curing process is carried out after the completion of pressing.
In a preferred embodiment, in the one side attaching steel disc of circuit board, pressing, steel disc insertion bottom plate is opened
In window slot.
In a preferred embodiment, steel disc being attached on the two sides of circuit board, the backing plate is equipped with windowing slot,
After pressing, the steel disc is respectively embedded into the windowing slot of backing plate and bottom plate.
In a preferred embodiment, it is additionally provided with hard plate below the bottom plate, when pressing, circuit board two sides
Steel disc is contacted with hard plate and cover board respectively.
In a preferred embodiment, it first attaches steel disc in circuit board one side to be pressed, then another in circuit board
The attached steel disc of face paste is pressed；Or after the two sides of circuit board attaches steel disc, while being pressed.
In a preferred embodiment, release film is attached on the two sides of circuit board, the top of hard plate is equipped with buffering
Layer.
In a preferred embodiment, the precompressed first carried out before pressing.
In a preferred embodiment, before pressing, preliminary drying is carried out to circuit board.
In a preferred embodiment, mode is pressed to be pressed together fastly using vacuum.
The present invention also provides a kind of circuit boards, are made of above-mentioned circuit board reinforcement process.
The present invention at least has the following beneficial effects:
Jig is equipped with the windowing slot for keep away to steel disk position, can prevent steel disc and circuit board surface when being pressed
Appearance collapses or is recessed, and under the compound action of cover board and backing plate, improves the contact area of steel disc and cover board, reduces pressing
Pressure suffered by steel disc is kept the stress of steel disc more uniform, mentioned because cover board applies press power to steel disc by gasket in the process
Flatness and reinforcement quality of the height to circuit board.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the flow diagram of circuit board reinforcement process one embodiment；
Fig. 2 is the structural schematic diagram of jig and laminar structure one embodiment.
Specific embodiment
It is carried out below with reference to technical effect of the embodiment and attached drawing to design of the invention, specific structure and generation clear
Chu is fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this hair
Bright a part of the embodiment, rather than whole embodiments, based on the embodiment of the present invention, those skilled in the art are not being paid
Other embodiments obtained, belong to the scope of protection of the invention under the premise of creative work.In addition, being related in patent
All connection/connection relationships, not singly refer to that component directly connects, and refer to can according to specific implementation situation, by addition or
Reduce couple auxiliary, Lai Zucheng more preferably coupling structure.Each technical characteristic in the present invention, before not conflicting conflict
Putting can be with combination of interactions.
Referring to Fig.1, circuit board reinforcement process includes the following steps,
S10 prepares circuit board in advance and carries out the jig of reinforcement, which includes bottom plate, cover board and connect with cover board
Backing plate, bottom plate be equipped with windowing slot, keep away position for carrying out to steel disc；
S20 attaches steel disc to reinforcement position in circuit board in advance；
Circuit board is placed on jig by S30；
S40；Pressing: cover board pushes, and the two sides of circuit board is respectively with backing plate and contacts baseplate and by the pressing masterpiece of the two
With fitting closely steel disc with circuit board；
S50；Curing process is carried out to the circuit board that pressing is completed.
It is handled specifically, the fast press of vacuum can be used in above-mentioned bonding processes, before being pressed, jig is placed in
On the fast press of vacuum, the fast press of vacuum is equipped with hard plate, and bottom plate is placed in the top of hard plate.
In one embodiment, the one side (circuit board below) of circuit board is pasted with steel disc, when being pressed, steel disc by
Into the windowing slot of gasket pressure force to be administered insertion bottom plate so that the lower section of steel disc is contacted with hard plate, therefore steel disc by
To the active force upward from the downward active force of backing plate and hardboard, and in backing plate and the hard plate effect of being laminated
Under, it is fitted closely with circuit board.
In another embodiment, windowing slot, two sides (upper surface of circuit board and the following table of circuit board are provided on backing plate
Face) it is pasted with steel disc, when being pressed, the steel disc of circuit board is by cover board pressure force insertion backing plate to be administered
Windowing slot in so that the steel disc is contacted with cover board, and the pressure force downward by cover board, the steel disc below wiring board is padded
Piece is given in the windowing slot of pressure force insertion bottom plate of circuit board, so that the steel disc and contacts baseplate, and upward by bottom plate
Pressure force is realized so that the steel disc and the steel disc below circuit board of circuit board are fitted closely with circuit board in electricity
Road plate two sides are bonded the purpose of steel disc.
Preferably, the steel disc reinforcement of foregoing circuit plate two sides first can attach steel disc in the one side of circuit board and be pressed,
Then steel disc is attached in the another side of circuit board to be pressed again；Or it is carried out after the two sides of circuit board has attached steel disc same
Step pressing.It can be according to actual processing demand flexible choice.
When being pressed, the pressure head of the fast press of vacuum covers cover board first, and then this is covered power and is applied to pad by cover board
On plate, and to attach and improve connecing for cover board and steel disc by the way that backing plate is arranged with the steel disc and pad contact of circuit board
Contacting surface product, because pressure head does not contact directly with steel disc, reduces the pressure that pressure head gives steel disc, cover board is made to be applied to the power on steel disc
More uniformly, optimization steel disc and circuit board is bonded quality.
Preferably, FR4 plate (epoxy glass-fiber-fabric substrate) can be used in the bottom plate in jig and cover board, with preferable surface
Planarization, and surface is smooth, and electrical insulation capability is stablized.Backing plate uses aluminum or aluminum alloy material, backing plate and circuit in pressing
Plate contact avoids the edge of steel disc and circuit board when pressing from occurring collapsing or be recessed, makes circuit board surface and steel disc and circuit board
Fitting have more planarization, improve fitting quality.
Preferably, it is additionally provided with buffer layer above hard plate, release film and circuit board is avoided to be scratched by hard plate.The buffering
Layer can be the flexible materials such as glass-fiber-fabric, release film, non-woven fabrics, buffer layer with a thickness of 100-120 μm, guaranteeing that there is buffering
Under the premise of effect, make the circuit board uniform stressed being positioned above.The heat-conducting plate structure of hard, such as iron can be used in hard plate
Plate, aluminium sheet, resin plate etc..
Preferably, steel disc is attached on circuit board by adhesive glue, which preferably uses epoxide-resin glue, opposite
There is higher bond strength in existing acrylic compounds glue, so that reinforcement steel disc is not easily to fall off.
Preferably, preliminary drying being carried out to the junction of circuit board and steel disc before being pressed, temperature is 70 DEG C -90 DEG C, when
Between be 30min, remove the steam in adhesive glue, prevent in pressing, adhesive glue between circuit board and steel disc overflows.
Referring to Fig. 2, hard plate 10, bottom plate 20, backing plate 30 and cover board 40 are sequentially stacked from top to bottom, and circuit board 100 is placed
Reinforcement is carried out between backing plate 30 and bottom plate 20, and windowing slot 21 is equipped on backing plate 30, bottom plate 20 and cover board 40.Steel disc passes through
When adhesive glue is attached on circuit board 100, the two is only preliminary fitting, therebetween there is also bubble and gap, needs applying
Fitting closely for the two is realized after plus-pressure.Specifically, paying in the burning of the fast press of vacuum and being placed on iron plate 50 before being pressed
The jig, hard plate 10 is placed in the top burnt and pay iron plate 50, and the circuit board 100 for being bonded steel disc is placed in backing plate 30 and bottom plate
In reinforcement region between 20；The first release film 60 is covered in the upper surface of circuit board 100, is covered in the lower surface of circuit board 100
The second release film of lid 70 overflows to avoid the adhesive glue between bonding processes circuit board 100 and steel disc, colloid is caused to be adhered to
On stitching surface between backing plate 30 and bottom plate 20, the flatness of pressing is reduced, and can prevent adhesive glue from adhering to foreign matter；Vacuum
Press takes the air in bonding operation area away so that press can be realized under lesser pressure circuit board 100 and steel disc is close
The purpose of fitting provides good operating environment for pressing area；And the fast press of vacuum has the higher setting element of precision, such as
CCD positioning mechanism, treats reinforcement region and steel disc position is accurately positioned.
Preferably, before being pressed the fast press of heating, vacuum pressure head, and 80 DEG C -150 DEG C are heated to, then to circuit
Plate carries out precompressed 5-15s, is then pressed, pressing time 120s-600s, and briquetting pressure is 3 ± 0.5MPa, pressing-in temp
It is 180 DEG C ± 5 DEG C, in carrying out bonding processes, the adhesive glue between circuit board and steel disc is in enough pressure forces and pressing
Under time, is flowed because temperature increases, make to be bonded more closely between circuit board and steel disc, guarantee steel disc and circuit board
Between good coating performance.
The production of TPX (4- methylpentene) material can be used in first release film 60 and the second release film 70, has preferable
Shape effect and high temperature resistance are covered, can guarantee the flatness in bonding processes circuit board, and is reduced at steel disc marginal position
The spill-out of adhesive glue.
Above-mentioned vacuum lamination structure further includes vacuum air bag 80 on the basis of tool for stitching, and is located at vacuum and presses fastly
In effective pressing area of machine.Specifically, it is release to be sequentially stacked vacuum air bag 80, cover board 40, backing plate 30, first from top to bottom
Film 60, the second release film 70, bottom plate 20, hard plate 10 and burning pay an iron plate 50, and vacuum air bag 80 pushes under the action of pressure head, to
Cover board 40 applies down force, carries out to steel disc, the circuit board 100 between the first release film 60 and the second release film 70
Reinforcement prevents the laminar structure in bonding processes under the interaction between cover board 40 and backing plate 30, backing plate 30 and bottom plate 20
In, steel disc edge is recessed with 100 surface of circuit board, and in the compound action of the first release film 60 and the second release film 70
Under, it prevents in bonding processes, the adhesive glue between circuit board 100 and steel disc overflows, and the flatness of pressing is influenced, thus raising pair
The reinforcement quality of circuit board.
Preferably, upper hot pressboard is equipped with above vacuum air bag 80, the lower section for burning pair iron plate 50 is additionally provided with lower hot pressing board, upper heat
Pressing plate and lower hot pressing board are the high temperature heat source of tool for stitching, improve backing plate and bottom plate to the pressing-in temp of circuit board and steel disc, mention
Height pressing quality.
Specifically, curing process is that circuit board and steel disc are placed in baking oven to toast, keep adhesive glue between the two solid
Change, keeps the switching performance of circuit board and steel disc more stable.Solidification temperature is 150-160 DEG C, curing time 1h-2h, to protect
Adhesive glue is fully hardened between card wiring board and steel disc.
The present invention also provides a kind of circuit board, which is made of above-mentioned circuit board reinforcement process, from
And improve the mechanical strength of circuit board and the surface smoothness of circuit board.
It is to be illustrated to presently preferred embodiments of the present invention, but the present invention is not limited to the embodiment above,
Those skilled in the art can also make various equivalent deformation or replacement on the premise of without prejudice to spirit of the invention, this
Equivalent deformation or replacement are all included in the scope defined by the claims of the present application a bit.
Claims (10)
1. a kind of circuit board reinforcement process, which is characterized in that include the following steps,
Prepare circuit board and carry out the jig of reinforcement, the jig includes bottom plate, cover board and the backing plate connecting with cover board, bottom plate
It is equipped with windowing slot；
The circuit board for posting steel disc is placed on jig；
Pressing: cover board push, circuit board two sides respectively with backing plate and contacts baseplate；
Curing process is carried out after the completion of pressing.
2. circuit board reinforcement process according to claim 1, which is characterized in that attach steel disc, pressure in the one side of circuit board
When conjunction, steel disc is embedded in the windowing slot of bottom plate.
3. circuit board reinforcement process according to claim 1, which is characterized in that steel disc is attached on the two sides of circuit board,
The backing plate is equipped with windowing slot, and after pressing, the steel disc is respectively embedded into the windowing slot of backing plate and bottom plate.
4. circuit board reinforcement process according to claim 3, which is characterized in that be additionally provided with hard below the bottom plate
Plate, when pressing, the steel disc on circuit board two sides is contacted with hard plate and cover board respectively.
5. circuit board reinforcement process according to any one of claims 1 to 4, which is characterized in that first in one face paste of circuit board
Attached steel disc is pressed, then is attached steel disc in circuit board another side and pressed；Or steel disc is attached on the two sides of circuit board
Afterwards, it while being pressed.
6. circuit board reinforcement process according to claim 4, which is characterized in that release film is attached on the two sides of circuit board,
The top of hard plate is equipped with buffer layer.
7. circuit board reinforcement process according to claim 1, which is characterized in that first carry out precompressed before pressing.
8. circuit board reinforcement process according to claim 1, which is characterized in that before pressing, carry out preliminary drying to circuit board.
9. circuit board reinforcement process according to claim 1, which is characterized in that press mode to carry out at pressing fastly using vacuum
Reason.
10. a kind of circuit board, which is characterized in that using the described in any item circuit board reinforcement process systems of claim 1-9
Make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910561339.1A CN110267433A (en) | 2019-06-26 | 2019-06-26 | A kind of circuit board reinforcement process and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910561339.1A CN110267433A (en) | 2019-06-26 | 2019-06-26 | A kind of circuit board reinforcement process and circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN110267433A true CN110267433A (en) | 2019-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910561339.1A Pending CN110267433A (en) | 2019-06-26 | 2019-06-26 | A kind of circuit board reinforcement process and circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111615264A (en) * | 2020-05-27 | 2020-09-01 | 珠海景旺柔性电路有限公司 | Method and device for laminating and pressing 3D steel sheet on FPC (Flexible printed Circuit) mainboard |
| CN115955783A (en) * | 2022-12-30 | 2023-04-11 | 福莱盈电子股份有限公司 | Method for improving size stability of LCM soft and hard board ACF golden finger |
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| CN103929882A (en) * | 2013-01-10 | 2014-07-16 | 北大方正集团有限公司 | Metal base printed circuit board, and method and apparatus for laminating same |
| CN205071471U (en) * | 2015-08-28 | 2016-03-02 | 淳华科技(昆山)有限公司 | Two -sided laminating reinforcement tool of flexible line way board |
| CN106341951A (en) * | 2016-11-02 | 2017-01-18 | 江苏弘信华印电路科技有限公司 | High-efficiency steel disk laminating tool and laminating method using the tool |
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2019
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01121738A (en) * | 1987-11-05 | 1989-05-15 | Hitachi Electron Eng Co Ltd | Sheet suction table for surface inspecting device |
| CN103929882A (en) * | 2013-01-10 | 2014-07-16 | 北大方正集团有限公司 | Metal base printed circuit board, and method and apparatus for laminating same |
| CN205071471U (en) * | 2015-08-28 | 2016-03-02 | 淳华科技(昆山)有限公司 | Two -sided laminating reinforcement tool of flexible line way board |
| CN106341951A (en) * | 2016-11-02 | 2017-01-18 | 江苏弘信华印电路科技有限公司 | High-efficiency steel disk laminating tool and laminating method using the tool |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111615264A (en) * | 2020-05-27 | 2020-09-01 | 珠海景旺柔性电路有限公司 | Method and device for laminating and pressing 3D steel sheet on FPC (Flexible printed Circuit) mainboard |
| CN115955783A (en) * | 2022-12-30 | 2023-04-11 | 福莱盈电子股份有限公司 | Method for improving size stability of LCM soft and hard board ACF golden finger |
| CN115955783B (en) * | 2022-12-30 | 2024-03-08 | 福莱盈电子股份有限公司 | Method for improving size stability of ACF golden finger of LCM soft and hard plate |
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Application publication date: 20190920 |
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| RJ01 | Rejection of invention patent application after publication |