TWM559505U - Composite offline type jig module - Google Patents

Composite offline type jig module Download PDF

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Publication number
TWM559505U
TWM559505U TW106216787U TW106216787U TWM559505U TW M559505 U TWM559505 U TW M559505U TW 106216787 U TW106216787 U TW 106216787U TW 106216787 U TW106216787 U TW 106216787U TW M559505 U TWM559505 U TW M559505U
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Taiwan
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heat
plate
module structure
composite
workpiece
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TW106216787U
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Chinese (zh)
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Zheng-Ren Shi
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Shi zheng ren
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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

本新型在於提供一種能對加工件與電路基板進行加工,以快速結合,有利於大量生產化的複合型離線式冶具模組結構。其技術手段:為一種複合型離線式冶具模組結構,其能移入壓合機後再施以加壓加熱手段,讓加工件與電路基板受熱受壓後穩固結合為一體,其特徵在於:冶具模組結構,其包括底板、冶具、下和第二耐熱墊及金屬頂板;底板由金屬板及墊板組成;冶具在嵌入於墊板的模槽後,水平面會高於模槽頂面,冶具設置了凸出於冶具表面的定位銷;第一耐熱墊覆蓋在墊板上,並以定位銷加以定位;定位銷能供加工件及電路基板定位後,再以第二耐熱墊覆蓋在第一耐熱墊上,且以定位銷加以定位;以及金屬頂板壓在第二耐熱墊上,使電路基板與加工件能被穩固壓著。 The present invention provides a composite off-line tooling module structure capable of processing a workpiece and a circuit substrate for quick integration and mass production. The technical means is a composite off-line tooling module structure, which can be moved into a press machine and then applied with a pressurized heating means, so that the workpiece and the circuit substrate are firmly combined after being heated and pressed, and the feature is: The module structure comprises a bottom plate, a metallizing tool, a lower and a second heat-resistant pad and a metal top plate; the bottom plate is composed of a metal plate and a backing plate; after the metallurgical tool is embedded in the cavity of the backing plate, the water level is higher than the top surface of the cavity, the tooling a positioning pin protruding from the surface of the tool is disposed; the first heat-resistant pad is covered on the pad plate and positioned by the positioning pin; the positioning pin can be used for positioning the workpiece and the circuit substrate, and then covered with the second heat-resistant pad. The heat-resistant pad is positioned by the positioning pin; and the metal top plate is pressed against the second heat-resistant pad, so that the circuit substrate and the workpiece can be firmly pressed.

Description

複合型離線式冶具模組結構Composite offline tooling module structure

本新型涉及一種應用於電路基板加工上的冶具結構,尤指一種複合型離線式冶具模組結構。 The invention relates to a tooling structure applied to a circuit substrate processing, in particular to a composite off-line tooling module structure.

現今電子產業的興盛,電子裝置成為人類生活不可或缺的一部分。 Nowadays, the electronics industry is booming, and electronic devices have become an indispensable part of human life.

電子裝置中,電路基板佔有非常重要的地位,其表面大多需要結合加工件,當加工件為絕緣材或遮蔽導電材時,為了將能固定結合在電路基板上,其技術手段大都為以下三種方式,第一種為烙鐵加熱、第二種熨斗加熱、第三種固定壓合機加熱等技術手段。 In the electronic device, the circuit substrate occupies a very important position, and most of the surface needs to be combined with the processed piece. When the processed piece is an insulating material or a shielded conductive material, in order to be fixedly bonded to the circuit substrate, the technical means are mostly the following three ways. The first type is a technical means such as soldering iron heating, second iron heating, and third fixed pressing machine heating.

第一種施作方式中烙鐵加溫至200℃、時間約2秒鐘,第三種施作方式中熨斗是加溫至180℃、時間約3秒鐘,第三種施作方式中固定壓合機是以加熱板加壓加熱,加熱溫度為140℃、加壓為0.1MPa、時間為5秒。 In the first embodiment, the soldering iron is heated to 200 ° C for about 2 seconds. In the third application mode, the iron is heated to 180 ° C for about 3 seconds, and the third application mode is fixed pressure. The machine was heated under pressure with a hot plate at a heating temperature of 140 ° C, a pressurization of 0.1 MPa, and a time of 5 seconds.

以上三種施作方式,在實際施作時,都需要大量的人力來作業,導致無法提高生產速度,同時還包含以下問題點。 The above three methods of application require a large amount of manpower to work in actual application, resulting in an inability to increase production speed, and also include the following problems.

第一種施作方式中,在壓合時屏蔽膜可能發生移位、起皺、外觀不良和錯位等問題,而且手工單片作業,非常不利於大量生產化。 In the first application mode, the shielding film may be displaced, wrinkled, poor in appearance, and misaligned during pressing, and the manual operation is very unfavorable for mass production.

第二種施作方式中,實施前必須確保加熱溫度穩定保持在180℃,但熨斗的設計,導致溫度無法始終處於高溫狀態,所以溫度無法穩定,以致於加工件與電路基板的結合效果不確實,再加上手工、及單片處 理這兩點,整體而言,不利於大量生產化。 In the second application mode, it is necessary to ensure that the heating temperature is stably maintained at 180 °C before implementation, but the design of the iron causes the temperature to be always at a high temperature, so the temperature cannot be stabilized, so that the bonding effect between the workpiece and the circuit substrate is not true. , plus manual, and single-piece These two points, on the whole, are not conducive to mass production.

第三種施作方式中,更換模具並不容易,應用流程中,時常發生工人被燙傷的意外,重要的是尺寸漲縮控制不穩定,導致只能單一料號處理,同樣不利於大量生產化。 In the third mode of operation, it is not easy to change the mold. In the application process, accidents in which the worker is burnt often occur. What is important is that the dimensional expansion and contraction control is unstable, resulting in only a single item number processing, which is also disadvantageous for mass production. .

有鑑於此,如何提供一種能解決前述問題的複合型離線式冶具模組結構,便成為本新型欲改進的課題。 In view of this, how to provide a composite off-line tooling module structure that can solve the aforementioned problems has become a subject of the present invention.

本新型目的在於提供一種能對加工件與電路基板進行加工,以快速結合,有利於大量生產化的複合型離線式冶具模組結構。 The purpose of the present invention is to provide a composite off-line tooling module structure capable of processing a workpiece and a circuit substrate for quick integration and mass production.

為解決上述問題及達到本新型的目的,本新型的技術手段是這樣實現的,為一種複合型離線式冶具模組結構,其能移入壓合機後再施以加壓加熱手段,讓加工件(10)與電路基板(20)受熱受壓後穩固結合為一體,其特徵在於:所述冶具模組結構(100),其包括有一底板(1)、至少一個冶具(2)、一第一耐熱墊(3)、一第二耐熱墊(4)、及一金屬頂板(5);所述底板(11),其是包括有一金屬板(11)、及一結合在該金屬板(11)上的墊板(12)所組成,該墊板(12)具有對應於該冶具(2)的模槽(121);所述冶具(2),其設置有數個凸出於表面的定位銷(21),厚度大於該墊板(12)厚度,以於嵌入於對應的該模槽(13)後,讓頂端面高出於該模槽(13)頂面,另該定位銷(21)還能供定位該加工件(10)後、再定位該電路基板(20)用;所述第一耐熱墊(3),其覆蓋設置於該墊板(12)一側面,並將各個該冶具(2)覆蓋,並具有數個能各自與相應該定位銷(21)配合的第一孔(31);所述第二耐熱墊(4),其覆蓋設置於該第一耐熱墊(3)上,並將該加工件(10)與該電路基板(20)覆蓋,具有並具有數個能各自與相應該定位銷(21)配合的第二孔(41);所述金屬頂板(5),其對應該金屬板(11)而設置,並壓著在該第二耐熱墊(4)上,能供穩固定位該加工件 (10)與該電路基板(20)用。 In order to solve the above problems and achieve the object of the present invention, the technical means of the novel is realized in this way, which is a composite off-line tooling module structure, which can be moved into a press machine and then applied with a pressurized heating means to make the workpiece (10) integrally integrated with the circuit substrate (20) after being subjected to heat and pressure, characterized in that: the tooling module structure (100) comprises a bottom plate (1), at least one tool (2), and a first a heat-resistant mat (3), a second heat-resistant mat (4), and a metal top plate (5); the bottom plate (11) including a metal plate (11), and a metal plate (11) bonded thereto The upper plate (12) has a cavity (121) corresponding to the tool (2); the tool (2) is provided with a plurality of positioning pins protruding from the surface ( 21), the thickness is greater than the thickness of the backing plate (12), so as to be embedded in the corresponding cavity (13), the top surface is higher than the top surface of the cavity (13), and the positioning pin (21) is further The first heat-resistant pad (3) is disposed on a side of the backing plate (12) and the respective tooling tool (for the positioning of the workpiece (10); 2) Coverage, and Having a plurality of first holes (31) each capable of cooperating with the corresponding positioning pin (21); the second heat-resistant pad (4) covering the first heat-resistant pad (3) and processing the same The device (10) is covered with the circuit substrate (20) and has a plurality of second holes (41) each of which can cooperate with the corresponding positioning pin (21); the metal top plate (5) corresponding to the metal plate (11) is disposed and pressed against the second heat-resistant mat (4) to secure the fixed position of the workpiece (10) Used with the circuit board (20).

更優選的是,所述底板(1),其還包括有數個銷(14),該銷(14)能連接該金屬板(11)與該墊板(12),且該銷(14)的自由端,還凸出於該墊板(12);所述金屬頂板(5),其還具有相對應於該銷(14),能與該銷(14)對應配合的銷孔(51)。 More preferably, the bottom plate (1) further includes a plurality of pins (14), the pin (14) being connectable to the metal plate (11) and the backing plate (12), and the pin (14) The free end is also protruded from the backing plate (12); the metal top plate (5) further has a pin hole (51) corresponding to the pin (14) and corresponding to the pin (14).

更優選的是,所述冶具(2),其還包括有數個各自套設於相對應該定位銷(21)外的墊圈(22),該墊圈(22)能供與該第一耐熱墊(3)接觸用。 More preferably, the tool (2) further includes a plurality of washers (22) respectively disposed outside the corresponding positioning pins (21), and the washers (22) can be provided with the first heat-resistant pads (3) ) for contact.

更優選的是,所述墊圈(22),其是為絕緣的不織布墊圈。 More preferably, the gasket (22) is an insulating nonwoven gasket.

更優選的是,所述墊板(12)為不易熱形變的板體。 More preferably, the backing plate (12) is a plate body that is not easily deformed by heat.

更優選的是,所述第一耐熱墊(3)與該第二耐熱墊(4),其兩者皆是為軟性的緩衝塑膠片體。 More preferably, the first heat-resistant mat (3) and the second heat-resistant mat (4), both of which are soft cushioning plastic sheets.

更優選的是,所述加工件(10)選自於下列其中之一,絕緣麥拉片、絕緣紙、華司、保護膜、3M膠帶、熱融膠、EMI遮蔽導電材料。 More preferably, the processing member (10) is selected from the group consisting of an insulating Mylar sheet, an insulating paper, a washer, a protective film, a 3M tape, a hot melt adhesive, and an EMI shielding conductive material.

更優選的是,所述EMI遮蔽導電材料,選自下列其中之一,導電布、泡棉、導電網、銅箔、銀箔、鋁箔。 More preferably, the EMI shielding conductive material is selected from the group consisting of conductive cloth, foam, conductive mesh, copper foil, silver foil, and aluminum foil.

與現有技術相比,本新型的效果如下所示: Compared with the prior art, the effects of the present invention are as follows:

第一點:本新型冶具模組結構(100),是在離線狀態下,將加工件、電路基板置入冶具模組結構(100)內,然後再移入加壓加熱機內,這種在離線作業下的搭配組合方式,能便於操作者擺置大量加工件、及電路基板,且在組合後還能便於移入加壓加熱機內。 The first point: the new tooling module structure (100) is to place the workpiece and the circuit substrate into the mold module structure (100) under the offline state, and then move into the pressure heating machine, which is offline. The combination method under the operation can facilitate the operator to place a large number of processed parts and the circuit board, and can be easily moved into the pressure heating machine after being combined.

第二點:本新型冶具模組結構(100),冶具模組為不同材質的元件組合,所以是一種複合式的冶具模組,這能達到絕緣、避免熱脹冷縮、防止形變、及具有良好熱傳導的功效。 The second point: the new tooling module structure (100), the tooling module is a combination of components of different materials, so it is a composite tooling module, which can achieve insulation, avoid thermal expansion and contraction, prevent deformation, and have Good heat transfer.

第三點:本新型冶具模組結構(100),能提供大面積範圍給 大型單片電路基板與多個加工件一次性結合,相對於傳統僅只能針對一小電路基板施作,生產效率大大提升,更能達到快速大量生產化的目的。 The third point: the new mold module structure (100) can provide a large area to The large single-chip circuit substrate and a plurality of processing parts are combined at one time, and the utility model can only be applied to a small circuit substrate, and the production efficiency is greatly improved, and the purpose of rapid mass production can be achieved.

第四點:本新型冶具模組結構(100),同材質壓合時,在同溫同壓狀態下,可同時生產多種料號、多機種電路基板,所以能大量及快速生產,相對而言產能高。 The fourth point: the new type of tooling module structure (100), when pressed with the same material, can produce a variety of material numbers and multi-type circuit boards at the same temperature and the same pressure state, so it can be produced in large quantities and relatively quickly. High production capacity.

第五點:本新型冶具模組結構(100),在上下雙面加壓加熱的狀態下,能使加工件與電路基板的貼合均勻穩固,故能避免剝離,防止假貼合出現。 The fifth point: the new mold tool module structure (100), in the state of upper and lower double-sided pressure heating, can make the processing of the workpiece and the circuit substrate uniform and stable, so it can avoid peeling and prevent false fit.

第六點:本新型冶具模組結構(100),能適用於各種不同材質、類型的加工件貼合於電路基板表面,其只需適當控制好加壓及加熱溫度,就能達到良好結合效果。 Sixth point: The new mold tool module structure (100) can be applied to various materials and types of processing parts to be attached to the surface of the circuit board, and only a proper control of the pressure and heating temperature can achieve a good combination effect. .

1‧‧‧底板 1‧‧‧floor

11‧‧‧金屬板 11‧‧‧Metal plates

12‧‧‧墊板 12‧‧‧ pads

13‧‧‧模槽 13‧‧‧Mold groove

14‧‧‧銷 14‧‧ ‧ sales

2‧‧‧冶具 2‧‧‧

21‧‧‧定位銷 21‧‧‧Locating pin

22‧‧‧墊圈 22‧‧‧ Washer

3‧‧‧第一耐熱墊 3‧‧‧First heat resistant pad

31‧‧‧第一孔 31‧‧‧ first hole

4‧‧‧第二耐熱墊 4‧‧‧second heat resistant mat

41‧‧‧第二孔 41‧‧‧ second hole

5‧‧‧金屬頂板 5‧‧‧Metal top plate

51‧‧‧銷孔 51‧‧‧ pinhole

6‧‧‧上加壓加熱板 6‧‧‧Upper pressure heating plate

7‧‧‧下加熱板 7‧‧‧ Lower heating plate

10‧‧‧加工件 10‧‧‧Processing parts

101‧‧‧第一定位孔 101‧‧‧First positioning hole

20‧‧‧電路基板 20‧‧‧ circuit board

201‧‧‧第二定位孔 201‧‧‧Second positioning hole

100‧‧‧冶具模組結構 100‧‧‧Molding module structure

第1圖:本新型與加工件、電路基板配合後的立體示意圖。 Fig. 1 is a perspective view of the new type after mating with a workpiece and a circuit board.

第2圖:本新型與加工件、電路基板配合後的部分立體剖面圖。 Fig. 2 is a partial perspective cross-sectional view of the present invention in combination with a workpiece and a circuit board.

第3圖:為第2圖的部分放大示意圖。 Fig. 3 is a partially enlarged schematic view of Fig. 2.

第4圖:本新型的立體分解示意圖。 Figure 4: Schematic exploded view of the novel.

第5圖:本新型與加工件、電路基板配合後的立體分解示意圖。 Fig. 5 is a perspective exploded view of the new type after mating with the workpiece and the circuit board.

第6圖:本新型的實施示意圖。 Figure 6: Schematic diagram of the implementation of the novel.

第7圖:本新型與加工件、電路基板配合後的剖面示意圖。 Figure 7: Schematic diagram of the new type of work with the workpiece and circuit board.

第8圖:為第6圖的部分放大示意圖。 Fig. 8 is a partially enlarged schematic view of Fig. 6.

以下依據圖面所示的實施例詳細說明如後:如第1圖至第6圖所示,圖中揭示出,為一種複合型離線式冶 具模組結構,其能移入壓合機後再施以加壓加熱手段,讓加工件(10)與電路基板(20)受熱受壓後穩固結合為一體,其特徵在於:所述冶具模組結構(100),其包括有一底板(1)、至少一個冶具(2)、一第一耐熱墊(3)、一第二耐熱墊(4)、及一金屬頂板(5);所述底板(11),其是包括有一金屬板(11)、及一結合在該金屬板(11)上的墊板(12)所組成,該墊板(12)具有對應於該冶具(2)的模槽(121);所述冶具(2),其設置有數個凸出於表面的定位銷(21),厚度大於該墊板(12)厚度,以於嵌入於對應的該模槽(13)後,讓頂端面高出於該模槽(13)頂面,另該定位銷(21)還能供定位該加工件(10)後、再定位該電路基板(20)用;所述第一耐熱墊(3),其覆蓋設置於該墊板(12)一側面,並將各個該冶具(2)覆蓋,並具有數個能各自與相應該定位銷(21)配合的第一孔(31);所述第二耐熱墊(4),其覆蓋設置於該第一耐熱墊(3)上,並將該加工件(10)與該電路基板(20)覆蓋,具有並具有數個能各自與相應該定位銷(21)配合的第二孔(41);所述金屬頂板(5),其對應該金屬板(11)而設置,並壓著在該第二耐熱墊(4)上,能供穩固定位該加工件(10)與該電路基板(20)用。 The following is a detailed description of the following embodiments according to the drawings: as shown in Figures 1 to 6, the figure reveals that it is a composite off-line metallurgy. The utility model has a module structure, which can be moved into the press machine and then applied with a pressure heating means, so that the workpiece (10) and the circuit board (20) are firmly combined and integrated by the heat and pressure, and the feature is: the tooling module The structure (100) comprises a bottom plate (1), at least one metallurgical tool (2), a first heat-resistant mat (3), a second heat-resistant mat (4), and a metal top plate (5); 11) comprising a metal plate (11) and a backing plate (12) coupled to the metal plate (11), the backing plate (12) having a cavity corresponding to the tooling (2) (121); the tool (2) is provided with a plurality of positioning pins (21) protruding from the surface, the thickness is greater than the thickness of the pad (12), so as to be embedded in the corresponding cavity (13), The top surface is raised from the top surface of the cavity (13), and the positioning pin (21) is further configured to position the workpiece (10) and then reposition the circuit substrate (20); the first heat-resistant pad (3), the cover is disposed on a side of the backing plate (12), and each of the tool (2) is covered, and has a plurality of first holes (31) each of which can cooperate with the corresponding positioning pin (21); The second heat-resistant mat (4) is covered by the first a thermal pad (3), and covering the workpiece (10) with the circuit substrate (20), having and having a plurality of second holes (41) each capable of mating with the corresponding positioning pin (21); The metal top plate (5) is disposed corresponding to the metal plate (11) and is pressed against the second heat-resistant pad (4) to securely fix the workpiece (10) and the circuit substrate (20).

其中,本新型冶具模組結構(100),因各層材質的不同,能達到絕緣、避免熱脹冷縮、防止形變、及具有良好熱傳導的功效。 Among them, the new mold tool module structure (100), due to the different materials of each layer, can achieve insulation, avoid thermal expansion and contraction, prevent deformation, and have good heat conduction effect.

其次,本新型冶具模組結構(100),讓操作員能在離線狀態下,將電路基板(10)、加工件(20)置入本新型冶具模組結構(100)內,組合後再移入加壓加熱機內,這種在離線作業下的搭配組合方式,能便於操作者擺置大量電路基板(10)及加工件(20)。 Secondly, the new tooling module structure (100) allows the operator to place the circuit board (10) and the machined part (20) into the new tooling module structure (100) in an off-line state, and then move in after combining. In the pressure heating machine, this combination of the offline operation can facilitate the operator to place a large number of circuit substrates (10) and workpieces (20).

另外,同材質壓合時,在同溫同壓狀態下,可同時生產多種料號、多機種電路基板,所以能大量及快速生產,產能高;當應用各種不同材質、類型的加工件,來貼合於電路基板表面,只需適當控制好加壓及加熱溫度,就能達到良好結合效果。 In addition, when pressed with the same material, it can simultaneously produce a variety of material numbers and multi-type circuit boards under the same temperature and pressure conditions, so it can be produced in large quantities and quickly, with high productivity; when applying various materials and types of processed parts, Bonding to the surface of the circuit board requires only proper control of the pressurization and heating temperature to achieve a good bonding effect.

還有,在上下雙面加壓加熱的狀態下,能使加工件(20)與電路基板(10)的貼合均勻穩固,故避免出現假貼合。 Further, in the state in which the upper and lower sides are pressurized and heated, the bonding between the workpiece (20) and the circuit board (10) can be made uniform and stable, so that false bonding is avoided.

如第6圖至第8圖所示,圖中揭示出,本新型冶具模組結構(100)的組合及施工方式: As shown in Figures 6 to 8, the figure shows the combination and construction of the new tooling module structure (100):

一、首先墊板(12)必須設置與冶具(2)相同形狀的模槽(13),冶具(2)也必須先設置定位銷(21);之後,將金屬板(11)、與墊板(12)結合成底板(1),且以數支銷(14)固定組合,另將冶具(20)嵌入模槽(13)內,然後在每一定位銷(21)上串設墊圈(22)。 First, the backing plate (12) must be provided with a mold groove (13) of the same shape as the metallurgical tool (2). The metallurgical tool (2) must also be provided with a positioning pin (21); thereafter, the metal plate (11), and the backing plate (12) combined into a bottom plate (1), and fixedly combined by a plurality of pins (14), another mold (20) is embedded in the cavity (13), and then a washer is arranged on each of the positioning pins (21) (22) ).

二、將第一耐熱墊(3)覆蓋在上述墊板(12)上,並使定位銷(21)穿過孔(31),使第一耐熱墊(3)不會移動。 2. The first heat-resistant pad (3) is covered on the above-mentioned pad (12), and the positioning pin (21) is passed through the hole (31) so that the first heat-resistant pad (3) does not move.

三、在第一耐熱墊(3)表面上平放加工件(20),加工件本身也具有第一定位孔(101),所以能供定位銷(21)穿過後使加工件(20)定位不動。 3. The workpiece (20) is laid flat on the surface of the first heat-resistant mat (3), and the workpiece itself also has a first positioning hole (101), so that the positioning pin (21) can be passed through to position the workpiece (20). Do not move.

四、再將電路基板(10)置放於上述已放置加工件(20)的第一耐熱墊(3)上,使加工件(20)與對應的電路基板(10)密切配合,該電路基板(10)也具有第二定位孔(201),在供定位銷(21)穿入後就能定位不動。 Fourth, the circuit substrate (10) is placed on the first heat-resistant pad (3) of the above-mentioned processed workpiece (20), so that the workpiece (20) is closely matched with the corresponding circuit substrate (10), the circuit substrate (10) also has a second positioning hole (201) which can be positioned after the positioning pin (21) is inserted.

五、將第二耐熱墊(4)放置於電路基板(10)上。 5. Place the second heat-resistant mat (4) on the circuit substrate (10).

六、再將金屬頂板(5)放置在第二耐熱墊(4)上,該金屬頂板(5)具有銷孔(51),能供對應的銷(14)穿入後,使金屬頂板(5)與底板(1)保持密切組合,進而成為一冶具模組結構(100)。 6. The metal top plate (5) is placed on the second heat-resistant mat (4), and the metal top plate (5) has a pin hole (51) for allowing the corresponding pin (14) to penetrate and the metal top plate (5). ) is closely combined with the bottom plate (1) to become a tooling module structure (100).

七、最後,將上述已完成密切組合的冶具模組結構(100)移至加壓加熱機內,如第6圖所示,經上加壓加熱板(6)及下加熱板(7)的加壓加熱,而使冶具模組結構(100)內的加工件(20)與電路基板(10)急速密切貼合,當卸下金屬頂板(5)及第二耐熱墊(4)後,就能將已貼合加工件(20)的電路基板(10)取下。 7. Finally, move the above-mentioned closely-assembled tooling module structure (100) into the pressure heating machine, as shown in Fig. 6, through the upper pressing heating plate (6) and the lower heating plate (7) Pressurizing and heating, so that the workpiece (20) in the mold module structure (100) and the circuit board (10) are closely and closely attached. When the metal top plate (5) and the second heat-resistant pad (4) are removed, The circuit board (10) to which the workpiece (20) has been attached can be removed.

通過不斷往復實施上述三至七施工步驟,就能達到大量生產化的需求,使生產速度加快,人力成本降低,而且電路基板(10)與加工件(20)的結合效果也非常良好。 By continuously performing the above three to seven construction steps, the demand for mass production can be achieved, the production speed is increased, the labor cost is reduced, and the combined effect of the circuit substrate (10) and the workpiece (20) is also very good.

請參閱第3圖至第5圖,所述底板(1),其還包括有數個銷(14),該銷(14)能連接該金屬板(11)與該墊板(12),且該銷(14)的自由端,還凸出於該墊板(12);所述金屬頂板(5),其還具有相對應於該銷(14),能與該銷(14)對應配合的銷孔(51)。 Referring to Figures 3 to 5, the bottom plate (1) further includes a plurality of pins (14), the pin (14) being connectable to the metal plate (11) and the backing plate (12), and The free end of the pin (14) also protrudes from the backing plate (12); the metal top plate (5) further has a pin corresponding to the pin (14) and corresponding to the pin (14) Hole (51).

其中,通過此種銷(14)和銷孔(51)的配合,達到一便於定位的效果,降低操作人員的操作負擔,此外還能防呆,讓金屬板(11)能順利地與墊板(12)配合,讓整體的不良率。 Through the cooperation of the pin (14) and the pin hole (51), an easy positioning effect is achieved, the operation burden of the operator is reduced, and the anti-stay can be prevented, so that the metal plate (11) can smoothly and the pad (12) Cooperate to make the overall bad rate.

請參閱第2圖和第3圖,所述冶具(2),其還包括有數個各自套設於相對應該定位銷(21)外的墊圈(22),該墊圈(22)能供與該第一耐熱墊(3)接觸用。 Referring to Figures 2 and 3, the tool (2) further includes a plurality of washers (22) respectively disposed outside the corresponding positioning pins (21), the washers (22) being capable of being provided with the first A heat resistant pad (3) is used for contact.

其中,通過墊圈(22)的應用,以隔開第一耐熱墊(3),避免第一耐熱墊(3)和第二耐熱墊(4)沾黏在一起,影響到後續的加工動作,同時還能夠避免溫度的傳遞,影響到加工,提高良率。 Wherein, by the application of the gasket (22), the first heat-resistant pad (3) is separated to prevent the first heat-resistant pad (3) and the second heat-resistant pad (4) from sticking together, thereby affecting subsequent processing operations, and simultaneously It also avoids the transfer of temperature, affects processing and improves yield.

上述中,所述墊圈(22),其是為絕緣的不織布墊圈;通過此種墊圈(22)的設置,能避免加工時的靜電影響產品,讓不良率降低。 In the above, the gasket (22) is an insulating non-woven gasket; by the arrangement of the gasket (22), it is possible to prevent static electricity during processing from affecting the product, and the defect rate is lowered.

上述中,所述墊板(12)為不易熱形變的板體;如石墨板等,具有絕緣及受熱後不變形的優點,除了具有穩定效果,也具有將冶具(2)定位的功能。 In the above, the backing plate (12) is a plate body which is not easily deformed by heat; for example, a graphite plate or the like has the advantages of insulation and no deformation after being heated, and has a function of positioning the metallurgical tool (2) in addition to the stabilizing effect.

上述中,所述第一耐熱墊(3)與該第二耐熱墊(4),其兩者皆是為軟性的緩衝塑膠片體。 In the above, the first heat-resistant pad (3) and the second heat-resistant pad (4) are both soft buffer plastic sheets.

其中,應用緩衝塑膠片體能獲得適當的彈性,以在後續實施 加壓加熱時使電路基板(10)與加工件(20),提供一優良的穩定效果。 Among them, the application of the buffer plastic sheet body can obtain appropriate elasticity for subsequent implementation. The circuit board (10) and the workpiece (20) provide an excellent stabilizing effect when pressurized and heated.

上述中,所述加工件(10)選自於下列其中之一,絕緣麥拉片、絕緣紙、華司、保護膜、3M膠帶、熱融膠、EMI遮蔽導電材料。 In the above, the processing member (10) is selected from one of the following, an insulating Mylar sheet, an insulating paper, a washer, a protective film, a 3M tape, a hot melt adhesive, and an EMI shielding conductive material.

其中,根據加工件(10)的不同,當要與電路基板(10)結合時,必須調整施加的壓力與溫度,以完整的貼合於電路基板(10)上,減少不良品的產生。 Among them, depending on the workpiece (10), when it is to be combined with the circuit substrate (10), it is necessary to adjust the applied pressure and temperature to completely fit on the circuit substrate (10) to reduce the occurrence of defective products.

上述中,所述EMI遮蔽導電材料,選自下列其中之一,導電布、泡棉、導電網、銅箔、銀箔、鋁箔。 In the above, the EMI shielding conductive material is selected from the group consisting of conductive cloth, foam, conductive mesh, copper foil, silver foil, and aluminum foil.

其中,根據應用需求,能應用不同的EMI遮蔽導電材料,讓加工件(10)發揮作用,提高良率。 Among them, according to the application requirements, different EMI shielding conductive materials can be applied to allow the workpiece (10) to function and improve the yield.

以上依據圖式所示的實施例詳細說明本新型的構造、特徵及作用效果;惟以上所述僅為本新型之較佳實施例,但本新型不以圖面所示限定實施範圍,因此舉凡與本新型意旨相符的修飾性變化,只要在均等效果的範圍內都應涵屬於本新型專利範圍內。 The structure, features and effects of the present invention are described in detail above with reference to the embodiments shown in the drawings. However, the above description is only a preferred embodiment of the present invention, but the present invention does not limit the scope of implementation as shown in the drawings. Modification changes consistent with the meaning of the present invention are intended to fall within the scope of the present invention as long as they are within the scope of equal effect.

Claims (8)

一種複合型離線式冶具模組結構,其能移入壓合機後再施以加壓加熱手段,讓加工件(10)與電路基板(20)受熱受壓後穩固結合為一體,其特徵在於:所述冶具模組結構(100),其包括有一底板(1)、至少一個冶具(2)、一第一耐熱墊(3)、一第二耐熱墊(4)、及一金屬頂板(5);所述底板(11),其是包括有一金屬板(11)、及一結合在該金屬板(11)上的墊板(12)所組成,該墊板(12)具有對應於該冶具(2)的模槽(121);所述冶具(2),其設置有數個凸出於表面的定位銷(21),厚度大於該墊板(12)厚度,以於嵌入於對應的該模槽(13)後,讓頂端面高出於該模槽(13)頂面,另該定位銷(21)還能供定位該加工件(10)後、再定位該電路基板(20)用;所述第一耐熱墊(3),其覆蓋設置於該墊板(12)一側面,並將各個該冶具(2)覆蓋,並具有數個能各自與相應該定位銷(21)配合的第一孔(31);所述第二耐熱墊(4),其覆蓋設置於該第一耐熱墊(3)上,並將該加工件(10)與該電路基板(20)覆蓋,具有並具有數個能各自與相應該定位銷(21)配合的第二孔(41);所述金屬頂板(5),其對應該金屬板(11)而設置,並壓著在該第二耐熱墊(4)上,能供穩固定位該加工件(10)與該電路基板(20)用。 The utility model relates to a composite off-line tooling module structure, which can be moved into a press machine and then applied with a pressure heating means, so that the workpiece (10) and the circuit substrate (20) are firmly combined after being heated and pressed, and the characteristics are: The tooling module structure (100) comprises a bottom plate (1), at least one metallurgical tool (2), a first heat-resistant mat (3), a second heat-resistant mat (4), and a metal top plate (5) The bottom plate (11) is composed of a metal plate (11) and a backing plate (12) coupled to the metal plate (11), the backing plate (12) having a corresponding tool (12) 2) a mold groove (121); the tooling (2) is provided with a plurality of locating pins (21) protruding from the surface, the thickness being greater than the thickness of the backing plate (12) for embedding in the corresponding cavity (13), the top surface is raised from the top surface of the cavity (13), and the positioning pin (21) is further configured to position the workpiece (10) and then reposition the circuit substrate (20); a first heat-resistant mat (3) covering a side of the backing plate (12) and covering each of the molds (2), and having a plurality of first ones that can respectively cooperate with the corresponding positioning pins (21) a hole (31); the second heat-resistant pad (4), Covering the first heat-resistant mat (3), covering the workpiece (10) and the circuit substrate (20), having a plurality of second holes that can respectively cooperate with the corresponding positioning pins (21) (41); the metal top plate (5), which is disposed corresponding to the metal plate (11), and pressed against the second heat-resistant pad (4), can stably fix the workpiece (10) and the circuit Used for the substrate (20). 如請求項1所述的複合型離線式冶具模組結構,其中:所述底板(1),其還包括有數個銷(14),該銷(14)能連接該金屬板(11)與該墊板(12),且該銷(14)的自由端,還凸出於該墊板(12);所述金屬頂板(5),其還具有相對應於該銷(14),能與該銷(14)對應配合的銷孔(51)。 The composite off-line tooling module structure according to claim 1, wherein: the bottom plate (1) further comprises a plurality of pins (14), the pin (14) being connectable to the metal plate (11) and the a backing plate (12), and the free end of the pin (14) also protrudes from the backing plate (12); the metal top plate (5) further has a corresponding pin (14), The pin (14) corresponds to the corresponding pin hole (51). 如請求項2所述的複合型離線式冶具模組結構,其中:所述冶具(2),其還包括有數個各自套設於相對應該定位銷(21)外的墊圈(22),該墊圈(22)能供與該第一耐熱墊(3)接觸用。 The composite off-line tooling module structure according to claim 2, wherein: the tool (2) further comprises a plurality of washers (22) respectively sleeved outside the corresponding positioning pins (21), the washers (22) can be used in contact with the first heat-resistant mat (3). 如請求項3所述的複合型離線式冶具模組結構,其中:所述墊圈(22),其是為絕緣的不織布墊圈。 The composite off-line tooling module structure of claim 3, wherein: the gasket (22) is an insulated non-woven gasket. 如請求項4所述的複合型離線式冶具模組結構,其中:所述墊板(12)為不易熱形變的板體。 The composite off-line tooling module structure according to claim 4, wherein the backing plate (12) is a plate body that is not easily deformed by heat. 如請求項5所述的複合型離線式冶具模組結構,其中:所述第一耐熱墊(3)與該第二耐熱墊(4),其兩者皆是為軟性的緩衝塑膠片體。 The composite off-line tooling module structure according to claim 5, wherein the first heat-resistant pad (3) and the second heat-resistant pad (4) are both soft buffer plastic sheets. 如請求項6所述的複合型離線式冶具模組結構,其中:所述加工件(10)選自於下列其中之一,絕緣麥拉片、絕緣紙、華司、保護膜、3M膠帶、熱融膠、EMI遮蔽導電材料。 The composite off-line tooling module structure according to claim 6, wherein: the processing member (10) is selected from one of the following, an insulating Mylar sheet, an insulating paper, a washer, a protective film, a 3M tape, Hot melt adhesive, EMI shielding conductive material. 如請求項7所述的複合型離線式冶具模組結構,其中:所述EMI遮蔽導電材料,選自下列其中之一,導電布、泡棉、導電網、銅箔、銀箔、鋁箔。 The composite off-line tooling module structure according to claim 7, wherein: the EMI shielding conductive material is selected from the group consisting of conductive cloth, foam, conductive mesh, copper foil, silver foil, and aluminum foil.
TW106216787U 2017-11-10 2017-11-10 Composite offline type jig module TWM559505U (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109551779A (en) * 2018-11-28 2019-04-02 惠阳航空螺旋桨有限责任公司 A kind of shaping jig of blade deicing heating film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109551779A (en) * 2018-11-28 2019-04-02 惠阳航空螺旋桨有限责任公司 A kind of shaping jig of blade deicing heating film
CN109551779B (en) * 2018-11-28 2024-02-13 惠阳航空螺旋桨有限责任公司 Forming tool for blade deicing heating film

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