M354849 八、新型說明： 【新型所屬之技術領域】 本新型涉及-種使加工件與電路基板加工結合的離線 ' 冶具模組。 ： 【先前技術】 按’電路基板表面常需結合加工件，這些加工件通常為絕 材，遮蔽導電材，為了將加工件固定結合在電路基板上，其技術 春手段大都為以下三種方式’分別為烙鐵加熱、熨斗加熱、 壓合機加熱等技術手段。 上。述將加工件m著在電路基板上的施1方式如下，烙鐵加溫 至20(TC、時間約2秒鐘’而褽斗是加溫至峨、時間約3秒鐘二 臨時固定壓合機是以加熱板加壓加熱，加熱溫度為 140°C、加壓 為0. IMPa、時間為5秒。 【新型内容】 一、所欲解決的問題點：M354849 VIII. New description: [New technical field] The new type relates to an off-line tooling module that combines machining parts with circuit board processing. : [Prior Art] According to the 'circuit board surface, it is often necessary to combine machining parts. These parts are usually made of solid materials and shielded with conductive materials. In order to fix the workpieces on the circuit board, the technical spring means are mostly the following three ways. For the soldering iron heating, iron heating, press heating and other technical means. on. The method of applying the workpiece m to the circuit board is as follows. The soldering iron is heated to 20 (TC, time is about 2 seconds) and the bucket is heated to 峨, and the time is about 3 seconds. The temporary fixing press is The heating plate is heated under pressure, the heating temperature is 140 ° C, the pressure is 0. IMPa, the time is 5 seconds. [New content] First, the problem to be solved:
上述三種加巧段除了需大量人卫健聽法加速生產外， 逛包含以下問題點： 加熱：在壓合時屏蔽膜可能發生移位、起皺、外觀不良 曰^斗門題’而且手工單片作業，非常不利於大量生產化。 ['加熱：實施前必須確保加熱溫度在18〇。〇，但褽斗不能 t終處在高溫狀態，因此溫度常錢化，加工件與電路基板的結 合效果不確實，n p Λ w 再加上手工及单片處理，也非常不利於大量生產 化。 固定壓合機··換模不易 操作時人工易遭燙傷，而且尺寸漲 5 M354849 且該固定銷（14)是凸出於墊板⑽上；所述金屬頂板⑽）則 與前述固定銷（14)對應配合的銷孔(51)。 根據上述使加功與魏練加卫齡的轉複合式冶具模 ，組，所述冶具(20)的每根定位銷⑵）都穿套了軟性塾圈⑵;，、夢 •由墊圈（22)來與下耐熱墊(30)接觸。 a 根據上述使加功與電職板加球合的轉複合式冶具模 組，所述軟性墊圈（22)為絕緣的不織布。 〇<、果 _上舰加X倾電絲板加讀合__合式冶具模 組’所述下耐熱墊⑽與上耐熱墊⑽是軟性的緩衝塑片。口、、 根據上述使加功與電路基板加工結合_線複合式冶具模 組，所述加工件⑽選自於下列其一，絕緣麥拉片、絕緣^、、= 司、保護膜、3M膠帶、熱融膠、EMI遮蔽導電材料。 根據上述使加工件與電路基板加工結合的離線複合式冶具模 組’所述EMI遮蔽導電材料為下列其一，導電布、泡棉、導電網: 銅箔、銀箔、銘箔。 • 根據上述使加工件與電路基板加工結合的離線複合式冶具模 組，所述墊板(12)為不易熱形變的板材。 三、對照先前技術的效用： 藉由本新型的實施可獲得下列優點： 本新型;α具模組疋在離線狀態下，將加工件、電路基板置入 冶具模組内，然後再移入加壓加熱機内，這種在離線作業下的搭 配組合方式，能便於操作者擺置大量加工件、及電路基板，且在 組合後還能便於移入加壓加熱機内；又，冶具模組為不同材質的 7C件組合，所以是一種複合式的冶具模組，這能達到絕緣、避免 7 M354849 熱脹冷縮、防止形變、及具有良好熱傳導的功效。 本新型冶具模組能提供大面積範圍給大型單片電路基板與多 個加工件—次性結合，換言之，大型單片電路基板是等於多個小 電路基板(料號)的組合，故比倾僅針對—小電路基板施工的作 業’更能達到快速大量生產化的目的，使生產效率大大提升。 又本新型於同材質壓合時，在同溫同壓狀態下，可同時生產 夕種料號、多機種電路基板’所以能大量及快速生產，因此生產 效率高、產能為傳統的多倍。 本新型冶具模組在上下雙面加壓加熱的狀態下，能使加工件 /、電路基板的貼合均勻穩固，故能避免剝離，防止假貼合出現。 本新型冶具模組能適用於各種不同材質、類型的加工件貼合 於電路基板表面，其只需適當控制好加壓及加熱溫度，就能達到 良好結合效果。 【實施方式】 以下即依據圖面所示的實施例詳細說明如後： 圖1所示為本新型冶具模組的立體分解圖，圖2所示為圖工 冶具模組與加工件、電路基板配合後的立體分解圖，圖3所示為 圖2冶具模組與加工件、電路基板於組合後的斷面圖，圖4所示 是圖3的局部放大圖。 圖中揭示出一種冶具模組（1〇〇)，其包括：一複合底板（1〇)， 疋由一金屬底板（11)、一結合在上述金屬底板（n)上的墊板(12) 所組成，該墊板(12)設置了與冶具相同形狀的模槽（13);至少一 個冶具(20)，其厚度大於墊板(12)厚度，在嵌入於上述墊板的模 槽（13)後，水平面會高出於模槽頂面，該冶具並設置了定位 M354849 緣及受熱後不變形的優點’除了具有穩定效果，也具有將冶具(2〇) 定位的功能。 本新型複合式冶具模組(100)，因各層材質的不同，遂能達到 ' 絕緣、避免熱脹冷縮、防止形變、及具有良好熱傳導的功效。又 • 本新型是在離線狀態下，將大量加工件(60)、電路基板(70)置入 冶具模組内，組合後再移入加壓加熱機内，這種在離線作業下的 搭配組合方式，能便於操作者擺置大量加工件、及電路基板。 Φ 以下，介紹本新型冶具模組（100)的組合及施工方式： 1. 首先墊板(12)必須設置與冶具(20)相同形狀的模槽（13)， 冶具(20)也必須先設置定位銷（21);之後，將金屬底板（η)、與 墊板（12)結合成複合底板(1〇)，且以數支固定銷（μ)固定組合， 另將冶具(20)嵌入模槽（13)内，然後在每一定位銷（21)上串設軟 性墊圈（22)。 2. 將下耐熱片（3〇)覆蓋在上述墊板（12)上，並使定位銷（21) 穿過穿孔(31)，使下耐熱片（3〇)不會移動。 • 3.在下耐熱墊（30)表面上平放加工件（60)，加工件本身也具 有定位孔（61)，所以能供定位銷（21)穿過後使加工件（6〇)定位不 動。 4. 再將電路基板(7〇)置放於上述已放置加工件（6〇)的下耐熱 塾(30)上’使加工件（60)與對應的電路基板(7〇)密切配合，該電 路基板(70)也具有定位孔(71)，在供定位銷（21)穿入後就能定位 不動。 5. 將上耐熱墊(4〇)放置於電路基板(7〇)上。 6. 再將金屬頂板(50)放置在上耐熱墊(40)上，該金屬頂板(5〇) M354849 具有銷孔(51)，能供對應的固定銷〇4)穿入後，使金屬頂板(5〇) 與複合底板（10)保持密切組合，進而成為一冶具模組（1〇〇)。 7·最後’將上述已完成密切組合的冶具模組〇〇〇)移至加壓加 熱機内，如圖5所示，經上加壓加熱板(8〇)及下加熱板(9〇)的加 壓加熱，而使冶具模組（100)内的加工件（6〇)與電路基板(7〇)急速 密切貼合，當卸下金屬頂板⑽及切熱墊(购後，就能將已貼 合加工件（60)的電路基板(70)取下。In addition to the large number of people's health and sound-sensing methods to accelerate production, the above-mentioned three types of acceleration include: The heating: the shielding film may be displaced, wrinkled, and the appearance is poor when pressing, and the hand-made single piece Homework is very unfavorable for mass production. ['Heating: Make sure the heating temperature is 18 前 before implementation. Oh, but the bucket can't end up in a high temperature state, so the temperature is often cheap, and the bonding effect between the workpiece and the circuit board is not correct. n p Λ w plus manual and single-chip processing is also very unfavorable for mass production. Fixed press machine · Manually susceptible to burns when changing molds, and the size is increased by 5 M354849 and the fixing pin (14) protrudes from the backing plate (10); the metal top plate (10) is fixed with the aforementioned fixing pin (14) ) Corresponding to the pin hole (51). According to the above-mentioned rotary composite mold mold for the addition of power and Wei Lianjia, the locating pin (2) of the tool (20) is covered with a soft loop (2); ) to come into contact with the lower heat-resistant pad (30). a According to the above-mentioned rotary compounding tooling set that combines the work and the electric board, the soft washer (22) is an insulated non-woven fabric. 〇<, fruit_上上上+X inclined electric wire plate plus reading __合式冶模模组' The lower heat-resistant pad (10) and the upper heat-resistant pad (10) are soft cushioning plastic sheets. According to the above, the work is combined with the circuit board processing to form a _ line composite tooling module, and the workpiece (10) is selected from the following ones, an insulating Mylar, an insulating ^, a = division, a protective film, a 3M tape. , hot melt adhesive, EMI shielding conductive materials. According to the above-mentioned off-line composite tooling mold assembly for processing workpieces and circuit substrate processing, the EMI shielding conductive material is one of the following: conductive cloth, foam, conductive mesh: copper foil, silver foil, and inlaid foil. • According to the above-described off-line composite tooling mold that combines a workpiece and a circuit substrate, the backing plate (12) is a sheet that is not easily thermally deformed. Third, the utility of the prior art: With the implementation of the present invention, the following advantages can be obtained: The present invention; the alpha module 疋 is placed in the tooling module under the offline state, and then moved into the pressure heating In the machine, this combination of offline operation can facilitate the operator to place a large number of processed parts and circuit boards, and can be easily moved into the pressure heating machine after combination; and the tooling module is 7C of different materials. The combination is a composite tooling module that achieves insulation, avoids thermal expansion and contraction of 7 M354849, prevents deformation, and has good heat transfer. The new tooling module can provide a large area to a large single-chip circuit substrate and a plurality of processing parts-secondary combination, in other words, a large single-chip circuit substrate is equal to a combination of a plurality of small circuit substrates (items), so Only for the operation of small circuit substrate construction can achieve the purpose of rapid mass production, and greatly improve production efficiency. In addition, when the same type of material is pressed together, it can simultaneously produce the circuit material number and multi-type circuit board under the same temperature and the same pressure state, so it can be mass-produced and quickly produced, so the production efficiency is high and the production capacity is many times conventional. In the state of the upper and lower double-sided pressurized heating, the new type of tooling module can make the bonding of the workpiece/the circuit board even and stable, so that peeling can be avoided and false bonding can be prevented. The new tooling module can be applied to various workpieces of different materials and types to be attached to the surface of the circuit board, and only a proper control of the pressure and heating temperature can achieve a good bonding effect. [Embodiment] The following is a detailed description of the following embodiments according to the drawings: Figure 1 is an exploded perspective view of the new tooling module, and Figure 2 is a drawing tooling module, a processing component, and a circuit substrate. FIG. 3 is a cross-sectional view of the mold assembly, the workpiece, and the circuit board of FIG. 2, and FIG. 4 is a partial enlarged view of FIG. The figure discloses a tooling module (1〇〇) comprising: a composite bottom plate (1〇), a metal base plate (11), and a backing plate (12) coupled to the metal bottom plate (n) Composition, the backing plate (12) is provided with a cavity (13) having the same shape as the metallurgical tool; at least one metallurgical tool (20) having a thickness greater than the thickness of the backing plate (12), in a cavity (13) embedded in the above-mentioned backing plate After that, the water level will be higher than the top surface of the cavity, and the tool has the advantage of positioning the M354849 edge and not deforming after being heated. In addition to the stabilizing effect, it also has the function of positioning the tool (2〇). The new composite tooling module (100) can achieve the functions of 'insulation, avoiding thermal expansion and contraction, preventing deformation, and having good heat conduction due to different materials of each layer. In addition, this new type is to put a large number of workpieces (60) and circuit boards (70) into the tooling module under the offline state, and then combine them into the pressure heating machine. This combination mode under offline operation, It can facilitate the operator to place a large number of processed parts and circuit boards. Φ The following describes the combination and construction method of the new tooling module (100): 1. First, the backing plate (12) must be provided with the same shape of the mold (20), and the tooling (20) must also be set first. Positioning pin (21); after that, the metal base plate (η) and the backing plate (12) are combined into a composite bottom plate (1〇), and fixedly combined by a plurality of fixing pins (μ), and the mold (20) is embedded in the mold. Inside the groove (13), a flexible gasket (22) is then placed on each of the positioning pins (21). 2. Cover the lower heat-resistant sheet (3〇) on the above-mentioned backing plate (12) and pass the positioning pin (21) through the through hole (31) so that the lower heat-resistant sheet (3〇) does not move. • 3. The workpiece (60) is laid flat on the surface of the lower heat-resistant pad (30). The workpiece itself also has a positioning hole (61), so that the positioning pin (21) can be passed through to position the workpiece (6〇). 4. Place the circuit substrate (7〇) on the lower heat-resistant cymbal (30) of the placed workpiece (6〇) to make the workpiece (60) closely match the corresponding circuit substrate (7〇). The circuit board (70) also has a positioning hole (71) which can be positioned after the positioning pin (21) is inserted. 5. Place the upper heat-resistant pad (4〇) on the circuit board (7〇). 6. Place the metal top plate (50) on the upper heat-resistant pad (40). The metal top plate (5〇) M354849 has a pin hole (51), which can be inserted into the corresponding fixing pin 4) to make the metal top plate. (5〇) It is closely combined with the composite base plate (10) to become a tooling module (1〇〇). 7. Finally, 'the above-mentioned close-assembled tooling module 〇〇〇) is moved into the pressure heating machine, as shown in Fig. 5, through the upper pressure heating plate (8 〇) and the lower heating plate (9 〇) Pressurizing and heating, so that the workpiece (6〇) in the tooling module (100) and the circuit board (7〇) are quickly and closely attached, when the metal top plate (10) and the heat-insulating pad are removed (after purchase, the The circuit board (70) to which the workpiece (60) is attached is removed.
藉由不斷往復實施上述第3〜7施工步驟，就能達到大量生產 化的需求’使生產速度加快，人力成本降低，而且加工件(⑼)與 電路基板(70)的結合效果也非常良好。 以上 ，依據圖式所示的實施例詳細說明了本新型的構造、特 徵及作用效果’惟上賴舉僅為本新型的較佳實施例，作本新^ 並不以圖面所祕定棚，凡—讀本_創作意旨相符的修飾 性變化或等效變更’只要在均等範_都應涵屬於本新型專= M354849 【圖式簡單說明】 圖1所示為本新型冶具模組的立體八解圖 =2所示為圖丨冶具模組與加叫、電=板配合後的立體 分解圖。 圖3所不為圖2冶具模組與加玉件、電路基板於組合後的斷 面圖。 圖4所示是圖3的局部放大圖。By continuously performing the above-mentioned third to seventh construction steps, it is possible to achieve a large amount of production demand, and the production speed is increased, the labor cost is lowered, and the combined effect of the workpiece ((9)) and the circuit board (70) is also very good. In the above, the structure, features and effects of the present invention are described in detail based on the embodiments shown in the drawings. The present invention is merely a preferred embodiment of the present invention. Modifications or equivalent changes in the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The solution diagram = 2 shows the exploded view of the figure and the tooling module combined with the call and the electric plate. Figure 3 is a cross-sectional view of the mold set, the jade piece, and the circuit board of Figure 2 in combination. Fig. 4 is a partial enlarged view of Fig. 3.
ϋ 5 ㈣冶具模組進行加壓加熱的示意圖ϋ 5 (4) Schematic diagram of pressure heating of the tooling module
【主要元件符號說明】 100 冶具模組 10 複合底板 11 金屬底板 12 墊板 13 模槽 14 固定銷 20 冶具 21 定位銷 22 軟性絕緣聲圈 30 下耐熱塾 31 穿孔 40 上耐熱塾 41 穿孔 50 金屬頂板 51 銷孔 12[Main component symbol description] 100 Metallurgy module 10 Composite base plate 11 Metal base plate 12 Back plate 13 Mold groove 14 Fixing pin 20 Tooling 21 Locating pin 22 Flexible insulating voice coil 30 Heat-resistant 塾 31 Perforation 40 Heat-resistant 塾 41 Perforation 50 Metal top plate 51 pin hole 12