CN104869751A - PCB and production process thereof - Google Patents
PCB and production process thereof Download PDFInfo
- Publication number
- CN104869751A CN104869751A CN201510257286.6A CN201510257286A CN104869751A CN 104869751 A CN104869751 A CN 104869751A CN 201510257286 A CN201510257286 A CN 201510257286A CN 104869751 A CN104869751 A CN 104869751A
- Authority
- CN
- China
- Prior art keywords
- carrier substrate
- pcb
- parts
- components
- radiating block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a PCB and the production process thereof. The PCB comprises a PCB carrier substrate, a packaging component and a heat radiation block are arranged on the PCB carrier substrate, and the component and the heat radiation block are tightly attached to the PCB carrier substrate and laminated on the PCB carrier substrate. During working, the component or the PCB carrier substrate transfer heat to the heat radiation block for heat radiating. Since the PCB, the heat radiation copper block and the component are laminated on the PCB carrier substrate, heat generated by the PCB carrier substrate or other components during working can be rapidly transmitted to the outside, thereby enhancing the heat radiation effect of the PCB and prolonging the service lifetime. The PCB production process includes placing a packaging component and a heat radiation block on corresponding positions on the PCB carrier substrate, tightly attaching the component and heat radiation block to the PCB carrier substrate, and laminating the component and the heat radiation block onto the PCB carrier substrate.
Description
Technical field
The present invention relates to pcb board technical field, particularly relate to a kind of pcb board and production technology thereof.
Background technology
At present, PCB (Printed circuit board, the printed circuit board (PCB)) sheet material of extensive use covers copper/epoxy glass fabric base material or phenolic resins glass cloth base material, in addition, also has a small amount of paper-based copper-coated board material used.
Although these base materials have excellent electric property and processing characteristics, thermal diffusivity is relatively poor, therefore, the sinking path of the components and parts of high heating on pcb board, generally, be difficult to carry out heat conduction by the resin of pcb board own, but mainly dispel the heat from the surface of components and parts towards periphery air.
But along with electronic product has entered into parts miniaturization, high-density installation, thermalization occurred frequently assembling epoch, if it is very inadequate that the component surface that only Pictest area is very little dispels the heat, radiating effect is poor, particularly a large amount of uses of the surface mount device such as QFP, BGA, the heat that components and parts produce also can pass to pcb board in large quantities, and work under long hot environment, easily cause pcb board impairment in useful life, bring loss to equipment.
Radiating block to be mainly arranged on pcb board by welding or to increase the heat radiator dedicated of by the position of heater members on pcb board and height customization or pluck out different element high and low positions on a large flat radiator by existing pcb board.Heat dissipating housing entirety is buckled on component side, contacts with each element and dispel the heat.This technological means cost is high, and radiating effect is poor.
Summary of the invention
Based on this, be necessary, radiating effect poor high for cost in prior art, a kind of pcb board and production technology thereof are provided.
A kind of pcb board, comprises PCB carrier substrate, described PCB carrier substrate encapsulates components and parts and radiating block;
Described components and parts and radiating block and described PCB carrier substrate are close to and are connected and are pressed together on described PCB carrier substrate, and during work, heat is delivered to described radiating block and dispels the heat by described components and parts or PCB carrier substrate.
Above-mentioned pcb board, heat radiation copper billet and components and parts are pressed together on described PCB carrier substrate, like this, operationally, the heat that PCB carrier substrate or other components and parts produce will be derived faster by radiating block, strengthen the radiating effect of pcb board, and can increase the service life.
A production technology for pcb board, comprising:
On PCB carrier substrate, correspondence position places encapsulation components and parts and radiating block, components and parts and radiating block is close to described PCB carrier substrate, components and parts and radiating block is pressed together on described PCB carrier substrate by pressing mode.
Encapsulation components and parts and radiating block are first put into correspondence position by the production technology of above-mentioned pcb board, and components and parts and radiating block are pressed together on described PCB carrier substrate by pressing mode.By the mode of pressing, some specific components and parts or radiating block are connected with PCB carrier substrate by the mode of pressing, substantially reduce technological process, reduce cost, and improve the operating efficiency of radiating block, enhance the life-span of pcb board.
Accompanying drawing explanation
Fig. 1 is the structural representation of the pcb board pressing being an example.
Embodiment
Below the embodiment of pcb board of the present invention and production technology thereof is set forth.
Pcb board provided by the invention, comprises PCB carrier substrate, and described PCB carrier substrate encapsulates components and parts and radiating block; Radiating block mentioned here can be radiating copper block.
Wherein, described components and parts and radiating block and described PCB carrier substrate are close to and are connected and are pressed together on described PCB carrier substrate, and during work, heat is delivered to described radiating block and dispels the heat by described components and parts or PCB carrier substrate.
As can be seen here, different from existing pcb board, in technical solution of the present invention, heat radiation copper billet and components and parts are pressed together on described PCB carrier substrate, like this, operationally, the heat that PCB carrier substrate or other components and parts produce will be derived faster by radiating block, strengthen the radiating effect of pcb board, and can increase the service life.
In one embodiment, described components and parts and radiating block are bonded on described PCB carrier substrate by adhesives.
In one embodiment, described parts under high-temperature and high-pressure conditions, and are bonded on described PCB carrier substrate with pressing mode.
The production technology of pcb board provided by the invention, mainly comprises the steps:
On PCB carrier substrate, correspondence position places encapsulation components and parts and radiating block, components and parts and radiating block is close to described PCB carrier substrate, components and parts and radiating block is pressed together on described PCB carrier substrate by pressing mode.
As can be seen here, encapsulation components and parts and radiating block are first put into correspondence position by the production technology of pcb board provided by the invention, and components and parts and radiating block are pressed together on described PCB carrier substrate by pressing mode.By the mode of pressing, some specific components and parts or radiating block are connected with PCB carrier substrate by the mode of pressing, substantially reduce technological process, reduce cost, and improve the operating efficiency of radiating block, enhance the life-span of pcb board.
In one embodiment, components and parts and radiating block can also be fixed on PCB carrier substrate by Die and mould plate by the production technology of pcb board of the present invention, and components and parts and radiating block shape are mated with the Outer structural shape of described components and parts or the copper billet that dispels the heat.
In one embodiment, the production technology of pcb board of the present invention, can also at PCB carrier substrate upper berth one deck adhesives; Components and parts and radiating block are put into Die and mould plate, and is fixed on PCB carrier substrate; On the upper and lower surface of PCB carrier substrate, folded one deck covers shaped material protection respectively; By pressing mode, components and parts are connected with PCB carrier substrate with radiating block, and remove after pressing completes and cover shaped material, Die and mould plate.
Further, on preceding embodiment basis, the production technology of pcb board of the present invention, can also fold one deck high temperature release film up and down respectively at the described shaped material that covers; By being connected with PCB carrier substrate with radiating block by components and parts in HTHP mode under vacuum, after pressing completes, remove high temperature release film.
In one embodiment, described adhesives can be the adhering materials such as prepreg, double faced adhesive tape (as 3M glue) or conducting resinl; The described shaped material that covers can be silicon rubber or pressing pad etc.
In sum, some specific components and parts or radiating block are connected with PCB carrier substrate by the mode of pressing, substantially reduce technological process, reduce cost, and improve the operating efficiency of radiating block, enhance the life-span of pcb board.
Further, in bonding processes, by the protective effect fixed, cover shaped material of mold materials and the connection function of adhesives, heat radiation copper billet is allowed to be connected with PCB carrier substrate by the square formula better of pressing.
In order to the production technology of more clear pcb board of the present invention, set forth an embody rule example below in conjunction with accompanying drawing.
Shown in figure 1, Fig. 1 is the structural representation of the pcb board pressing being an example, in figure, PCB carrier substrate 01, play the Die and mould plate 03 of fixation, required components and parts or radiating block 05 just in time put in by its shape, cover shaped material 02, high temperature release film 04, components and parts or be one deck adhesives between radiating block 05 and PCB carrier substrate 01.Die and mould plate 03 is the shape of milling sky, and can just put down the object such as components and parts or radiating block 05.Further, adhesives only needs suitable with the shape of components and parts or radiating block 05.
By PCB carrier substrate 01, Die and mould plate 03, components and parts or radiating block 05, cover shaped material 02, object such as high temperature release film 04 grade is folded according to mode shown in Fig. 1, then under vacuo in HTHP mode by components and parts or radiating block 05 and PCB carrier substrate 01 pressing adhesion, after pressing completes, to cover the objects such as shaped material 02, Die and mould plate 03 and high temperature release film 04 to remove, such components and parts or radiating block 05 have just been bonded on PCB carrier substrate 01.
Based on the technical scheme of above-mentioned application example, solve the installation by having welded radiating block, the high and heat-conducting effect of cost compare is not problem clearly; By the mode of pressing, radiating block is connected with PCB carrier, makes it closely be connected, greatly reduce and be produced into cost reduction operating process, and effectively improve the heat-conducting effect of radiating block, extend the useful life of PCB carrier substrate.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a pcb board, is characterized in that, comprises PCB carrier substrate, and described PCB carrier substrate encapsulates components and parts and radiating block;
Described components and parts and radiating block and described PCB carrier substrate are close to and are connected and are pressed together on described PCB carrier substrate, and during work, heat is delivered to described radiating block and dispels the heat by described components and parts or PCB carrier substrate.
2. pcb board according to claim 1, is characterized in that, described components and parts and radiating block are bonded on described PCB carrier substrate by adhesives.
3. pcb board according to claim 1, is characterized in that, described parts under high-temperature and high-pressure conditions, and are bonded on described PCB carrier substrate with pressing mode.
4. pcb board according to claim 1, is characterized in that, described radiating block is heat radiation copper billet.
5. a production technology for pcb board, is characterized in that, comprising:
On PCB carrier substrate, correspondence position places encapsulation components and parts and radiating block, components and parts and radiating block is close to described PCB carrier substrate, components and parts and radiating block is pressed together on described PCB carrier substrate by pressing mode.
6. the production technology of pcb board according to claim 5, it is characterized in that, also comprise: be fixed on PCB carrier substrate by Die and mould plate by components and parts and radiating block, components and parts and radiating block shape are mated with the Outer structural shape of described components and parts or the copper billet that dispels the heat.
7. the production technology of pcb board according to claim 6, is characterized in that, comprising:
At PCB carrier substrate upper berth one deck adhesives;
Components and parts and radiating block are put into Die and mould plate, and is fixed on PCB carrier substrate;
On the upper and lower surface of PCB carrier substrate, folded one deck covers shaped material protection respectively;
By pressing mode, components and parts are connected with PCB carrier substrate with radiating block, and remove after pressing completes and cover shaped material, Die and mould plate.
8. the production technology of pcb board according to claim 7, is characterized in that, folds one deck high temperature release film respectively up and down at the described shaped material that covers; In HTHP mode, components and parts are connected with PCB carrier substrate with radiating block under vacuum, after pressing completes, remove high temperature release film.
9. the production technology of pcb board according to claim 8, is characterized in that, described adhesives comprises: prepreg, double faced adhesive tape or conducting resinl.
10. the production technology of pcb board according to claim 7, is characterized in that, described in cover shaped material and comprise: silicon rubber or pressing pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510257286.6A CN104869751A (en) | 2015-05-19 | 2015-05-19 | PCB and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510257286.6A CN104869751A (en) | 2015-05-19 | 2015-05-19 | PCB and production process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104869751A true CN104869751A (en) | 2015-08-26 |
Family
ID=53915139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510257286.6A Pending CN104869751A (en) | 2015-05-19 | 2015-05-19 | PCB and production process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104869751A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107960012A (en) * | 2017-11-20 | 2018-04-24 | 珠海杰赛科技有限公司 | A kind of embedded aluminium sheet laminated mould preparation method |
| CN109788633A (en) * | 2019-03-08 | 2019-05-21 | 皆利士多层线路版(中山)有限公司 | Printed wiring board and preparation method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012992A (en) * | 1996-06-21 | 1998-01-16 | Sony Corp | Mounting method and electronic component housing pallet |
| CN201115232Y (en) * | 2007-06-12 | 2008-09-10 | 研华股份有限公司 | Heat radiation module |
| CN101315918A (en) * | 2007-06-01 | 2008-12-03 | 松下电器产业株式会社 | Semiconductor device and method of manufacturing the same |
| CN101356644A (en) * | 2006-02-10 | 2009-01-28 | 温德克工业股份有限公司 | Electronic assembly with detachable components |
| CN201804859U (en) * | 2010-08-19 | 2011-04-20 | 欣兴电子股份有限公司 | Circuit board |
| TWI406620B (en) * | 2010-12-29 | 2013-08-21 | ||
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
| CN204217201U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Bury copper billet heat radiation PCB structure |
-
2015
- 2015-05-19 CN CN201510257286.6A patent/CN104869751A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012992A (en) * | 1996-06-21 | 1998-01-16 | Sony Corp | Mounting method and electronic component housing pallet |
| CN101356644A (en) * | 2006-02-10 | 2009-01-28 | 温德克工业股份有限公司 | Electronic assembly with detachable components |
| CN101315918A (en) * | 2007-06-01 | 2008-12-03 | 松下电器产业株式会社 | Semiconductor device and method of manufacturing the same |
| CN201115232Y (en) * | 2007-06-12 | 2008-09-10 | 研华股份有限公司 | Heat radiation module |
| CN201804859U (en) * | 2010-08-19 | 2011-04-20 | 欣兴电子股份有限公司 | Circuit board |
| TWI406620B (en) * | 2010-12-29 | 2013-08-21 | ||
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
| CN204217201U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Bury copper billet heat radiation PCB structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107960012A (en) * | 2017-11-20 | 2018-04-24 | 珠海杰赛科技有限公司 | A kind of embedded aluminium sheet laminated mould preparation method |
| CN109788633A (en) * | 2019-03-08 | 2019-05-21 | 皆利士多层线路版(中山)有限公司 | Printed wiring board and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150826 |