TWI406620B - - Google Patents

Info

Publication number
TWI406620B
TWI406620B TW99146555A TW99146555A TWI406620B TW I406620 B TWI406620 B TW I406620B TW 99146555 A TW99146555 A TW 99146555A TW 99146555 A TW99146555 A TW 99146555A TW I406620 B TWI406620 B TW I406620B
Authority
TW
Taiwan
Prior art keywords
circuit board
flexible circuit
heat dissipation
insulation layer
dissipation unit
Prior art date
Application number
TW99146555A
Other languages
Chinese (zh)
Other versions
TW201228508A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW99146555A priority Critical patent/TW201228508A/en
Publication of TW201228508A publication Critical patent/TW201228508A/en
Application granted granted Critical
Publication of TWI406620B publication Critical patent/TWI406620B/zh

Links

Abstract

A mobile electronic device containing heat dissipative flexible circuit board structure and its manufacturing method are disclosed. The heat dissipative flexible circuit board structure comprises a flexible circuit board and a heat dissipation unit. While in manufacture, the first insulation layer is pressed with the copper layer, and a circuit layout zone is formed on the copper layer. The second insulation layer is adhered to the circuit layout zone so that both ends of the circuit layout zone form a connecting interface and contacts respectively. A through hole is placed between the contacts to form a flexible circuit board, and a bump is placed on a copper material to form a heat dissipation unit. The bump is correspondingly disposed in the through hole. A third insulation layer is disposed between the first insulation layer and the heat dissipation unit. Finally, a projecting mechanism is electrically connected to the contacts to allow the bottom to touch with the bump. Accordingly, the flexible circuit board and the heat dissipation unit can be performed with miniaturization and foldable design to easily assemble in the internal space of the mobile electronic products, thereby achieving the effect of matching different kinds of mobile electronic products.
TW99146555A 2010-12-29 2010-12-29 Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof TW201228508A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99146555A TW201228508A (en) 2010-12-29 2010-12-29 Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99146555A TW201228508A (en) 2010-12-29 2010-12-29 Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201228508A TW201228508A (en) 2012-07-01
TWI406620B true TWI406620B (en) 2013-08-21

Family

ID=46933660

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99146555A TW201228508A (en) 2010-12-29 2010-12-29 Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TW201228508A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104869751A (en) * 2015-05-19 2015-08-26 广州杰赛科技股份有限公司 PCB and production process thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200616265A (en) * 2004-10-04 2006-05-16 Toshiba Kk Light emitting device, lighting equipment or liquid crystal display device using such light emitting device
TWM328671U (en) * 2007-09-19 2008-03-11 Flexium Interconnect Inc Heat-dissipation flexible circuit board for backlight module
JP2009069473A (en) * 2007-09-13 2009-04-02 Panasonic Corp Plasma display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200616265A (en) * 2004-10-04 2006-05-16 Toshiba Kk Light emitting device, lighting equipment or liquid crystal display device using such light emitting device
JP2009069473A (en) * 2007-09-13 2009-04-02 Panasonic Corp Plasma display device
TWM328671U (en) * 2007-09-19 2008-03-11 Flexium Interconnect Inc Heat-dissipation flexible circuit board for backlight module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104869751A (en) * 2015-05-19 2015-08-26 广州杰赛科技股份有限公司 PCB and production process thereof

Also Published As

Publication number Publication date
TW201228508A (en) 2012-07-01

Similar Documents

Publication Publication Date Title
IN2012DN03251A (en)
JP2013527434A5 (en)
JP2012028771A5 (en)
WO2009057654A1 (en) Part built-in wiring board, and manufacturing method for the part built-in wiring board
JP2016192568A5 (en)
TWI260056B (en) Module structure having an embedded chip
MY169393A (en) Electronic control unit and electric power steering apparatus having the same
JP2014063159A5 (en)
ATE554640T1 (en) CIRCUIT MODULE AND POWER LINE COMMUNICATION DEVICE
TW200717551A (en) Embedded inductor and the application thereof
WO2010068515A3 (en) Electronic devices including flexible electrical circuits and related methods
WO2008146603A1 (en) Semiconductor device and its manufacturing method, and display and its manufacturing method
WO2013032670A3 (en) Laminated flex circuit layers for electronic device components
JP2013542548A5 (en)
ATE508617T1 (en) CIRCUIT BOARD AND PRODUCTION PROCESS THEREOF
EP2728981A3 (en) Connecting structure between circuit boards and battery pack having the same
TW200733537A (en) High power module with open frame package
WO2012154510A3 (en) Low inductance light source module
WO2009066504A1 (en) Module with embedded components
WO2009048154A1 (en) Semiconductor device and method for designing the same
WO2011112409A3 (en) Wiring substrate with customization layers
WO2011140141A3 (en) Printed circuit board with embossed hollow heatsink pad
WO2011115440A3 (en) Large capacity memory module mounting device for portable terminal
TW200741895A (en) Package using array capacitor core
WO2009054105A1 (en) Part built-in printed wiring board, and its manufacturing method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees