201228508 六、發明說明： 【發明所屬之技術領域】 本發明是有_-種行動電子產品具散熱之可撓性電路 板結構及其製作方法’尤指—種可使可撓性電路板、散熱單元 之薄型似及可折型設計，進而易於域在行㈣子產品之内 部帥’而達到可符合各式行動電子產品進行組裝之功效者。 【先前技術】 _ 按，一般習用之行動電子產品具散熱之可撓性電路板結構 4 (如第1 1圖），其係由一硬質電路板41、一電性連接於 硬質電路板41上之投影機構4 2、及一電性連接於硬質電路 板41上之連接介面4 3所構成；藉此，可使該投影結構4結 合於行動電子產品内部且進行電性連接，而讓行動電子產品利 用該投影結構4產生投影之效果。 但是由於該連接介面4 3係具有一預定之高度，故當該連 •接介面43設於硬質電路板4丄上之後，則會因連接介面43 使得投影結構4無法達到薄型化之設計，且由於該投影結構4 之硬質電路板41並無法加以折型，因此，當該投影結構4組 裝在行動電子產品之内部空間時，常會因為凸起之連接介面4 3而與行動電子產品之内部空間產生干涉，且亦無法針對該内 空間將硬質電路板4 1加以折型，導致實際使用時必須更改 订動電子產品殼體之機構設計，而造成實際使用上之困擾。 【發明内容】 201228508 本發明之主要目的係在於，可使可撓性電路板、散熱單元 之薄型化以及可折型設計，進而易於組裝在行動電子產品之内 部空間，而_可符合各式行動電子產品進行_之功效。 為達上述之目的，本發明係一種行動電子產品具散熱之可 撓性電路板結_包含有：-面上具#電料局區之可挽性電 路板，該電路佈局區之_端係具有連接介面，另端係具有相對 應之接點，各接點之間係具有_貫穿可撓性電路板之穿孔；一 設於可撓性電路板-面上之散鮮元，該賴單元係具有一基 座、及-設於基座-面上之凸塊，該基座與可撓性電路板貼 合，該凸塊係與穿孔對應且延伸至穿孔内，而該散熱單元面積 小於該可撓性電路板。 於本發明具散熱之可撓性電路板結構之一實施例中該可 撓性電路板係包含有-第—絕緣層一設於第—絕緣層一面上 之銅層、⑦於銅層上之第二絕緣層、及_設於第—絕緣層與 散熱單獅之第三絕緣層，而所述之局區餘於銅層之 面上，且該第二絕緣層係黏貼於電路佈局區上。 可撓性f路板結構之—實施射，該可 撓性電路板係呈一長條型之平板狀。 於本發明具散熱之可撓性電路板結構之一實施例中 ，該可 撓性電路板係可加崎型，且其連接介面下方係可設置有一補 強板。 該可撓性電路板係呈一 於本發明投影結構之一實施例中 L型之平板狀。 構之一實施例中，該散 於本發明具散熱之可撓丨 熱早元係可為一銅材質。 201228508 ”於本發明具散熱之可撓性電路板結構之一實施例中，該散 ·’、、單元之凸塊設於穿孔後，t玄凸塊之高度係與可挽性電路板之 表面一致。 於本發明具散熱之可撓性電路板結構之一實施例中，該可 撓性電路板之-面上更可_接點進—步雜連接有投影機 構，且該投韻構之底關與散鮮紅&塊接觸。 於本發明具散熱之可撓性電路板結構之一實施例中，該投 影機構係可為LED元件或〇led元件。 而本發月係’種行動電子產品具散熱之可換性電路板製 作方法包係含有下列步驟： 步驟一.將一第一絕緣層與一銅層加以壓合； 步驟二：於該銅層之一f面上形成一電路佈局區； 步驟三：係於銅層之電路佈局區上黏貼一第二絕緣 層’使該電路佈局區之-端形成有連接介面，另端係具有相對 應之接點； 步驟四·再於各接點之間沖設出一穿孔，藉以形成一 可撓性電路板，而該穿孔係貫穿該可撓性電路板； 步驟五：取一銅材質，並於該銅材質之一面上形成一 凸塊，藉以形成一散熱單元； 步驟六.將該散熱單元一面之凸塊對應設於可繞性電 路板之穿孔巾，並於第-絕緣層與散熱單元之間設置一第三絕 緣層；以及 步驟七.最後再將-娜麟設於可撓性電路板之一 面上並與接點電性連接，且使該投影機構之底面與凸塊接觸。 於本發明具散熱之可撓性電路板製作方法之一實施例 201228508 中’該電路佈局區係以蝕刻方式成形於該銅層之一面上。 於本發明具散熱之可撓性電路板製作方法之一實施例 中，該可撓性電路板係呈一長條型之平板狀。 於本發明具散熱之可撓性電路板製作方法之一實施例 中’該可撓性電路板係可利用銅層之延展性加以折型，且其連 接介面下方係可設置有一補強板。 於本發明具散熱之可撓性電路板製作方法之一實施例 中’該可撓性電路板係呈一 L型之平板狀。 於本發明投影結構製作方法之一實施例中，該投影機構係 可為LED元件或〇LED元件。 【實施方式】 一明參閱第1圖〜第9圖』所示，係分別為本發明之外觀 不意圖、本發明步驟一之示意圖、本發明步驟二之示意圖本 發明步驟三之示意圖、本發明步驟四之示意圖、本發明步驟五 $意圖、本發明步驟六之示意圖、本發％步称七之示意圖及 本發明步驟七之側視狀態示意圖。如圖所示：本發明係-種 =電子產品具散熱之可撓性電路板結構及其製作方法: 所二：：板1、一敎熱單元2及-投影機構3 而該投影結構製作方法，包括有下列步驟： 第將一第一絕緣層11與一銅層12加以壓合（如 局巴="^^銅層1 2之—面上以_方式形成一電路佈 句區1 3 (如第3圖所示）。 201228508 步驟三：係於銅層12之一電路佈局區13上黏貼一第二 絕緣層1 4，使該電路佈局區13之一端形成有連接介面13 1，另端係具有相對應之接點i 3 2 (如第4圖所示）。 步驟四：再於各接點13 2之間沖設出一穿孔15，藉以 形成-可撓性t路板1，而該穿孔丄5係貫穿該可撓性電路板 1，並於該連接介面131下方係可設置有一補強板13 3， 且該可撓性電路板1係呈-長細之平板狀（如帛5圖所示）。 步驟五：取一銅材質之基座21，並於該基座21之一面 上形成一凸塊2 2，藉以形成一散熱單元2，且該散熱單元2 之面積係小於該可撓性電路板1 (如第6圖所示）》 步驟六：將該散熱單元2 —面之凸塊2 2對應設於可撓性 電路板1之穿孔15巾’且使凸塊22設於穿孔15後，該凸 塊22之高度係與可撓性電路板丄之表面一致，而不超過可撓 性電路板1，並於第一絕緣層1i與散熱單元2之間設置一第 三絕緣層16 (如第γ圖及第8圖所示）。 步驟七.最後再將一投影機構3設於可挽性電路杯1夕一 面亡並與接點13 2電性連接，且使該投影機構3之底面與散 熱單疋2之凸塊2 2接觸（如第9@所示），而該投影機構3 係可為LED元件或〇LED元件。 如此’即可藉由上述之步驟構成一行動電子產品具散熱之 可撓性電路板結構，可利用可撓性電路板丄、 影機構3之配合而構成薄型化之設計（而不會有不.當之$ 物），讓本發明使用時可易於組裝在行動電子產品（^未示） 之内部空間’而不會與行動電子產品之内部空間產生干涉了藉 以不需更改行_子產品㈣之機構設計，而翻可符合各^ 201228508 行動電子產品進行組裝之功效；更可於投影機構3運作時，利 用散熱單元2進行糊之散熱。 明參閱『第1〇圖』所示，係本發明之另一使用狀態示意 圖°如圖所示··當本發明於實際使用時，係可使該可撓性電路 板1係利用銅層12之延展性加以折型，而使該可撓性電路板 1之可折型設計可易於組裝在行動電子產品（圖未示）之内部 空間，而不會與行動電子產品之内㈣間產生干涉，藉以不需 更改行動電子產品殼體之機構設計，而達到可符合各式行動電 子產品進行組裝之功效。 立凊參閱『第11圖』所示，係本發明另一實施例之外觀示 :圖。如圖所示：本發明之可撓性電路板1除可為-長條型之 二板狀外，更可為本實施例之構型，而其所不同之處係在於， 該可挽性電魏1 3紅—L奴平她，減，係可讓本發 明使用時可易於組裝在行動電子產品（圖未示）之内部空間， 而不會與行動電子產品之產奸涉，且亦可㈣可祷 :之機細’而達到可符合各式行動電子產品進行組裝之功 構及:&製:二二:月仃動電子產品具散熱之可撓性電路板結 ^及d作方柯有效改善料之鋪 =熱單㈣恤柯她⑼，獅^= 之内部空間，而達到可符合各式行動電子 進而使本發明之產生能更進步、更實用、更符:； 專利申請。 辑利以之要件，爰依法提出 201228508 =以上所述者’僅為本發明之較佳實施例而已，當不能以 此，疋本發明^之範圍；故，凡依本發明中請專利範圍及發 2兒月：内讀作之簡單的等效變化與修飾，皆應仍屬本發明 專利涵蓋之範圍内。 【圖式簡單說明】 第1圖’係本發明之外觀示意圖。 第2圖，係本發明步驟-之示意圖。 第3圖，係本發明步驟二之示意圖。 第4圖，係本發明步驟三之示意圖。 第5圖’係本發明步驟四之示意圖。 第6圖，係本發明步驟五之示意圖。 第7圖，係本發明步驟六之示意圖。 第8圖，係本發明步驟七之示意圖。 第9圖，係本發明步驟七之側視狀態示意圖。 第10圖’係本發明之另—使用狀態示意圖。 第11圖’係本發明另—實施例之外觀示意圖。 第12圖’係習用之外觀示意圖。 【主要元件符號說明】 (本發明部分） 可撓性電路板1、工a 第一絕緣層11 銅層1 2 電路佈局區13 201228508 連接介面131 接點1 3 2 補強板13 3 第二絕緣層14 穿孔1 5 散熱單元2 基座2 1 凸塊2 2 投影機構3 (習用部分） 投影結構4 硬質電路板41 投影機構4 2 連接介面4 3201228508 VI. Description of the Invention: [Technical Field] The present invention is a flexible circuit board structure with heat dissipation for mobile electronic products, and a manufacturing method thereof, in particular, a flexible circuit board and heat dissipation The thin and configurable design of the unit makes it easy for the domain to be in the interior of the (four) sub-products to achieve the function of assembling various mobile electronic products. [Prior Art] _ Press, the conventional mobile electronic product has a heat-dissipating flexible circuit board structure 4 (as shown in FIG. 1), which is electrically connected to the hard circuit board 41 by a hard circuit board 41. The projection mechanism 4 2 and a connection interface 43 electrically connected to the hard circuit board 41; thereby, the projection structure 4 can be integrated into the mobile electronic product and electrically connected, and the mobile electronic device The product utilizes the projection structure 4 to produce a projection effect. However, since the connection interface 43 has a predetermined height, when the connection interface 43 is disposed on the hard circuit board 4, the projection structure 4 cannot be thinned due to the connection interface 43, and Since the rigid circuit board 41 of the projection structure 4 cannot be folded, when the projection structure 4 is assembled in the internal space of the mobile electronic product, the internal space of the mobile electronic product is often caused by the protruding connection interface 43. Interference is generated, and the hard circuit board 4 1 cannot be folded for the inner space, so that the mechanical design of the housing of the electronic product must be changed in actual use, which causes troubles in practical use. SUMMARY OF THE INVENTION 201228508 The main object of the present invention is to make a flexible circuit board, a heat dissipation unit thin and a foldable design, and to be easily assembled in the internal space of a mobile electronic product, and _ can conform to various actions The effect of electronic products. In order to achieve the above object, the present invention relates to a flexible circuit board junction for a mobile electronic product having heat dissipation, comprising: a - - - - - - - - - - - - - - - - - - Having a connection interface, the other end has corresponding contacts, each of the contacts has a perforation through the flexible circuit board; a disperse element disposed on the surface of the flexible circuit board, the Lai unit The utility model has a base and a protrusion disposed on the base-surface, the base is attached to the flexible circuit board, and the protrusion corresponds to the through hole and extends into the through hole, and the heat dissipation unit has a smaller area The flexible circuit board. In one embodiment of the flexible circuit board structure with heat dissipation of the present invention, the flexible circuit board comprises a -first insulating layer, a copper layer disposed on one side of the first insulating layer, and 7 on the copper layer. a second insulating layer, and a third insulating layer disposed on the first insulating layer and the heat dissipation single lion, wherein the local area is on the surface of the copper layer, and the second insulating layer is adhered to the circuit layout area . In the flexible f-board structure, the flexible circuit board is in the form of a long strip. In an embodiment of the flexible circuit board structure with heat dissipation of the present invention, the flexible circuit board can be of a Kawasaki type, and a reinforcing plate can be disposed under the connection interface. The flexible circuit board is in the form of an L-shaped flat plate in one embodiment of the projection structure of the present invention. In one embodiment, the flexible heat-dissipating system of the present invention having heat dissipation may be a copper material. 201228508" In an embodiment of the flexible circuit board structure with heat dissipation of the present invention, the bump of the unit is disposed after the perforation, and the height of the t-bump is the surface of the flexible circuit board In one embodiment of the flexible circuit board structure with heat dissipation of the present invention, the surface of the flexible circuit board is further connected with a projection mechanism, and the projection mechanism is In the embodiment of the present invention, the projection mechanism can be an LED element or a 〇led element. The product has a heat dissipation and replaceability circuit board manufacturing method package comprising the following steps: Step 1. Pressing a first insulating layer and a copper layer; Step 2: forming a circuit layout on one of the copper layers Step 3: attaching a second insulating layer on the circuit layout area of the copper layer 'so that the end of the circuit layout area is formed with a connection interface, and the other end has a corresponding contact point; Step 4· a perforation is formed between the contacts to form a flexible a circuit board, and the through hole is penetrated through the flexible circuit board; Step 5: taking a copper material and forming a bump on one side of the copper material to form a heat dissipation unit; Step 6. The bump corresponds to the perforated towel disposed on the flexible circuit board, and a third insulating layer is disposed between the first insulating layer and the heat dissipating unit; and step 7. Finally, the Nalin is disposed on the flexible circuit board. One side is electrically connected to the contact, and the bottom surface of the projection mechanism is in contact with the bump. In one embodiment of the method for fabricating a heat-dissipating flexible circuit board of the present invention, 201228508, the circuit layout is etched. The method is formed on one surface of the copper layer. In one embodiment of the method for fabricating a flexible circuit board with heat dissipation according to the present invention, the flexible circuit board has a long strip shape. In one embodiment of the flexible circuit board manufacturing method, the flexible circuit board can be folded by the ductility of the copper layer, and a reinforcing plate can be disposed under the connection interface. Flexible circuit board In one embodiment of the method, the flexible circuit board is in the form of an L-shaped flat plate. In one embodiment of the method for fabricating the projection structure of the present invention, the projection mechanism can be an LED element or a 〇 LED element. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is not intended to be a schematic view of the first aspect of the present invention, a schematic diagram of the first step of the present invention, and a schematic diagram of the second step of the present invention. 4 is a schematic diagram of the present invention, a fifth step of the present invention, a schematic diagram of the sixth step of the present invention, a schematic diagram of the present invention, and a side view of the seventh step of the present invention. As shown in the figure: the present invention is a type of electronic product. Flexible circuit board structure with heat dissipation and manufacturing method thereof: second:: board 1, a heat unit 2 and a projection mechanism 3, and the method for manufacturing the projection structure comprises the following steps: first, a first insulating layer 11 is pressed with a copper layer 12 (for example, the surface of the copper layer < ^^ copper layer 1 2 forms a circuit sentence area 1 3 (as shown in Fig. 3). 201228508 Step 3: A second insulating layer 14 is adhered to one of the circuit layout areas 13 of the copper layer 12, so that one end of the circuit layout area 13 is formed with a connection interface 13 1 and the other end has a corresponding contact point i 3 2 (as shown in Figure 4). Step 4: A perforation 15 is punched out between the contacts 13 2 to form a flexible t-board 1 , and the perforated crucible 5 extends through the flexible circuit board 1 and is connected to the connection interface A reinforcing plate 13 3 may be disposed under the 131, and the flexible circuit board 1 is in the form of a flat-length flat plate (as shown in FIG. 5). Step 5: Take a base 21 of copper material, and form a bump 2 2 on one surface of the base 21 to form a heat dissipation unit 2, and the area of the heat dissipation unit 2 is smaller than the flexible circuit board. 1 (as shown in FIG. 6) Step 6: The bump 2 2 of the heat dissipating unit 2 is correspondingly disposed on the through hole 15 of the flexible circuit board 1 and the bump 22 is disposed on the through hole 15 The height of the bump 22 is consistent with the surface of the flexible circuit board, without exceeding the flexible circuit board 1, and a third insulating layer 16 is disposed between the first insulating layer 1i and the heat dissipation unit 2 (eg Figure γ and Figure 8). Step 7. Finally, a projection mechanism 3 is disposed on the detachable circuit cup 1 and is electrically connected to the contact 13 2 , and the bottom surface of the projection mechanism 3 is in contact with the bump 2 2 of the heat dissipation unit 2 (As shown in Fig. 9@), the projection mechanism 3 can be an LED element or a 〇LED element. Thus, the flexible circuit board structure in which the mobile electronic product has heat dissipation can be constructed by the above steps, and the flexible circuit board and the shadow mechanism 3 can be used to form a thinned design (without When it is used, the invention can be easily assembled in the internal space of the mobile electronic product (not shown) without interfering with the internal space of the mobile electronic product, so that there is no need to change the line _ sub-product (4) The mechanism design can be used to meet the assembly effect of each of the 201228508 mobile electronic products; and the heat dissipation unit 2 can be used to dissipate the heat during the operation of the projection mechanism 3. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing another use state of the present invention. As shown in the drawings, when the present invention is actually used, the flexible circuit board 1 can be made of a copper layer 12 . The ductility of the flexible circuit board 1 can be easily assembled into the internal space of the mobile electronic product (not shown) without interfering with the inside (4) of the mobile electronic product. In order to achieve the assembly function of various mobile electronic products without changing the mechanism design of the mobile electronic device housing. The present invention is shown in Fig. 11 and is a view showing the appearance of another embodiment of the present invention. As shown in the figure, the flexible circuit board 1 of the present invention can be in the form of a two-plate shape of a long strip type, and can be configured in the present embodiment, and the difference is that the tractability is The electric Wei 1 3 red-L nu ping she, the reduction, can make the invention easy to assemble in the internal space of mobile electronic products (not shown), and will not be involved in the production of mobile electronic products, and (4) Prayer: The machine is fine', and it can meet the requirements of various mobile electronic products for assembly and assembly: & system: 22: month, the electronic product has a heat-dissipating flexible circuit board and ^ Fang Ke effectively improved the shop of the material = hot single (four) shirt Ke She (9), the internal space of the lion ^ =, and reached the various action electronics to make the invention more progressive, more practical, more consistent:; . The requirements of the stipulations, 爰 提出 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 Hair 2 months: The simple equivalent changes and modifications of the readings are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the appearance of the present invention. Figure 2 is a schematic illustration of the steps of the present invention. Figure 3 is a schematic diagram of the second step of the present invention. Figure 4 is a schematic view of the third step of the present invention. Figure 5 is a schematic view of the fourth step of the present invention. Figure 6 is a schematic diagram of the fifth step of the present invention. Figure 7 is a schematic diagram of the sixth step of the present invention. Figure 8 is a schematic view of the seventh step of the present invention. Figure 9 is a schematic side view of the seventh step of the present invention. Figure 10 is a schematic view of another state of use of the present invention. Figure 11 is a schematic view showing the appearance of another embodiment of the present invention. Figure 12 is a schematic view of the appearance of the application. [Description of main component symbols] (Part of the present invention) Flexible circuit board 1, work a First insulating layer 11 Copper layer 1 2 Circuit layout area 13 201228508 Connection interface 131 Contact 1 3 2 Reinforcing plate 13 3 Second insulating layer 14 Perforation 1 5 Heat sink unit 2 Base 2 1 Bump 2 2 Projection mechanism 3 (used part) Projection structure 4 Hard board 41 Projection mechanism 4 2 Connection interface 4 3
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