CN212752722U - Battery protection board and mobile terminal - Google Patents

Battery protection board and mobile terminal Download PDF

Info

Publication number
CN212752722U
CN212752722U CN202021357539.XU CN202021357539U CN212752722U CN 212752722 U CN212752722 U CN 212752722U CN 202021357539 U CN202021357539 U CN 202021357539U CN 212752722 U CN212752722 U CN 212752722U
Authority
CN
China
Prior art keywords
board
hard
battery protection
soft
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021357539.XU
Other languages
Chinese (zh)
Inventor
张利华
张伟杰
张强波
骆延昕
张胜林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sky Chip Interconnection Technology Co Ltd
Original Assignee
Sky Chip Interconnection Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sky Chip Interconnection Technology Co Ltd filed Critical Sky Chip Interconnection Technology Co Ltd
Application granted granted Critical
Publication of CN212752722U publication Critical patent/CN212752722U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00302—Overcharge protection
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00304—Overcurrent protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

The utility model provides a battery protection shield, mobile terminal, the battery protection shield includes: the electronic device comprises a hard board and a soft board, wherein the soft board and the hard board are connected with each other, and an electronic component is attached to one surface of the hard board. And the packaging layer covers one side surface of the hard board loaded with the electronic component and is matched with the hard board to package the electronic component. The packaging layer packages the electronic component, and the heat dissipation capability and waterproof capability of the battery protection board are improved.

Description

Battery protection board and mobile terminal
Technical Field
The utility model relates to a battery technology field especially relates to a battery protection shield, mobile terminal.
Background
The battery protection board is used as a necessary component in the modern mobile phone and is mainly used for overcharge and overcurrent protection. The battery protection plate structure proposed in the current market is mainly to mount elements on the surface of a hard plate first and then weld a soft plate structure. However, the main problems of the hard board surface element mounting and the soft board structure re-welding are poor reliability of a soldering point and temperature rise, and the existing battery protection board element is exposed, so that the waterproof performance and the heat dissipation performance are poor.
In order to solve the above problem, the utility model provides a novel battery protection shield.
SUMMERY OF THE UTILITY MODEL
The utility model mainly provides a battery protection shield, mobile terminal to solve the poor problem of current battery protection shield waterproof nature and thermal diffusivity.
In order to solve the technical problem, the utility model discloses a technical scheme be: provided is a battery protection plate including: the flexible printed circuit board comprises a hard board and a soft board, wherein the soft board is connected with the hard board; one surface of the hard board is attached with an electronic component; and the packaging layer covers one side surface of the electronic component loaded on the hard board and is matched with the hard board to package the electronic component.
The rigid-flex printed circuit board comprises a rigid-flex printed circuit board body and a flexible printed circuit board body, wherein the rigid-flex printed circuit board body comprises a rigid-flex printed circuit board body and a flexible printed circuit board body, the rigid-flex printed circuit board body comprises a rigid-flex printed circuit board, the rigid-flex printed circuit board body and the flexible.
Wherein, electronic components includes: one or any combination of a resistor, a capacitor, an inductor, an integrated chip and an MOS tube.
The surface of the hard board, which is far away from the electronic component, is provided with a first electrode area and a second electrode area which are used for connecting the positive electrode and the negative electrode of the battery.
And a connector is arranged at one end of the soft board far away from the hard board and used for connecting equipment to be powered.
The hard board is made of hard materials, the soft board is made of soft materials, and the hard board and the soft board are both provided with circuit layers.
For solving the technical problem, the utility model discloses a another technical scheme be: there is provided a mobile terminal including the battery protection board as set forth in any one of the above.
The utility model has the advantages that: be different from prior art's condition, the utility model provides a battery protection shield, include: interconnect's soft board and hardboard, and the electronic components is equipped with in the subsides of hardboard surface, and the hardboard loading has electronic components's a side surface has the encapsulated layer, and the encapsulated layer cooperation hardboard encapsulates electronic components to this improves radiating effect, improves waterproof nature through the encapsulated layer.
Drawings
Fig. 1 is a schematic structural view of a battery protection plate in the prior art;
fig. 2 is a schematic structural diagram of an embodiment of the battery protection plate of the present invention;
fig. 3 is a schematic structural diagram of the mobile terminal of the present invention.
Detailed Description
The battery protection plate structure proposed in the current market is as shown in fig. 1, a hard plate is firstly made, components are pasted on the surface of the hard plate, and then a soft plate structure is welded.
In the battery protection board structure shown in fig. 1, after a hard board 11 is manufactured, an electronic component is mounted on one surface of the hard board, and then a soft board 12 is welded to one end of the hard board 11. In general, soldering is performed using a solder during soldering, but the reliability of the soldering point is poor and the temperature rises. And current panel backplate electronic components exposes, and it can cause waterproof nature and poor problem of thermal diffusivity.
Therefore, the battery protection plate in the prior art has problems and needs to be improved. Based on the problem, the utility model provides a novel battery protection plate structure, it can solve the soldering point reliability difference of the structure shown in figure 1, the problem of the poor problem of temperature rise and waterproof nature, thermal diffusivity.
Specifically, the utility model discloses a battery protection shield includes rigid-flex printed circuit board, interconnect's hardboard and soft board promptly, and wherein, the hardboard facing is equipped with electronic components, and the hardboard loading has one side of electronic components to be provided with the encapsulation layer to encapsulate electronic components, with this radiating effect and waterproof nature that improves battery protection shield. The rigid-flex combined plate is formed by the soft plate and the hard plate, so that tin solder can be prevented from being used for welding, the reliability of the battery protection plate is improved, and the performance of the battery protection plate is improved.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the ordinary skilled person without creative work all belong to the protection scope of the present invention.
The following explains and explains a specific embodiment of the present invention with reference to the drawings.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of the battery protection plate of the present invention. Comprises a hard board 11 and a soft board 12, wherein the hard board 11 and the soft board 12 are connected with each other.
The hard board 11 is made of a hard material, and is specifically made of a core board copper-clad plate, wherein the core board is made of a paper substrate, a glass fiber cloth substrate, a synthetic fiber cloth substrate, a non-woven fabric substrate, a composite substrate and other materials which are soaked with resin to prepare bonding sheets, the bonding sheets are combined by a plurality of bonding sheets, a copper foil is coated on one side or two sides of the prepared substrate board, and then the core board copper-clad plate is prepared by hot-pressing and curing. And pressing the manufactured core board copper-clad plate through a prepreg to form a stacked structure of the multilayer core board copper-clad plate. The prepreg is an interlayer bonding layer during lamination, specifically, the prepreg mainly comprises resin and a reinforcing material, when a multilayer circuit board is manufactured, glass fiber cloth is usually used as the reinforcing material, the glass fiber cloth is soaked in resin glue solution and is subjected to heat treatment and pre-baking to form a sheet, the sheet is softened under heating and pressurization and is solidified after cooling, and the sheet has viscosity, and two adjacent layers can be bonded in a high-temperature pressing process.
The flexible board 12 is made of a flexible material and is made of a polyimide copper clad material. In particular, printed circuit boards made with flexible dielectric substrates (mainly polyimide or polyester films) have many advantages not found in rigid printed circuit boards. For example, it can be freely bent, rolled, folded. The Flexible Printed Circuit (FPC) is utilized, namely the flexible board, so that the size of the electronic product can be greatly reduced, and the requirements of the electronic product on the development of high density, miniaturization and high reliability are met.
In this embodiment, the rigid-flex board is composed of the hard board 11 and the soft board 12. Specifically, the soft board 12 is partially embedded in the hard board 11 at the connecting position of the hard board 11 and the soft board 12. This prevents the soft board 12 and the hard board 11 from being connected by welding, thereby improving reliability and the like.
Specifically, an electronic component 13 is attached to one surface of the hard board 11, and the electronic component 13 specifically includes: one or any combination of a resistor, a capacitor, an inductor, an integrated chip and an MOS tube. The integrated chip is used for receiving signals and feeding the signals back to electronic components 13 such as MOS tubes and the like so as to make the electronic components react correspondingly and further protect the battery. Specifically, if the integrated chip detects a voltage overshoot, the voltage overshoot is reflected to the other electronic components 13, and the MOS transistor is turned off, so that power supply is stopped, and the battery is protected.
Wherein, a packaging layer 14 is further arranged on the surface of one side of the hard board 11 loaded with the electronic component 13, and the packaging layer 14 is matched with the hard board 11 to package the electronic component 13. Therefore, when the electronic component 13 works, the generated heat can be dissipated through the packaging layer 14, and the heat dissipation effect of the packaging layer 14 is better than that of air. In addition, the encapsulation layer 14 has a good waterproof effect, which can further protect the battery. Specifically, the encapsulation layer 14 may be made of a plastic molding material, such as epoxy resin.
Furthermore, a first electrode region 15 and a second electrode region 16 are provided on a surface of the hard sheet 11 on a side away from the electronic component 13. In one embodiment, the first electrode region 15 is a positive electrode, and the second electrode region 16 is a negative electrode, which is used to connect with the positive and negative electrodes of the battery.
The first electrode region 15 and the second electrode region 16 are flush with the surface of the hard plate 11 on the side away from the electronic component 13.
The end of the soft board 12, which is far away from the hard board 11, is further provided with a connector 17, and the connector 17 is used for connecting to-be-powered equipment, such as a mobile phone, a tablet computer, and the like, so that a battery is loaded in the to-be-powered equipment to supply power to the to-be-powered equipment.
In the battery protection board provided by the embodiment, the hard board 11 and the soft board 12 are integrally formed, which avoids welding the hard board 11 and the soft board 12, thereby improving the reliability of the battery protection board. In addition, the battery protection board of this embodiment is provided with the encapsulating layer 14 on the surface of the side where the hard board 11 is attached to the electronic component 13, and the encapsulating layer 14 can improve heat dissipation capability and accelerate the dissipation of heat generated by the electronic component 13, and can play a role in waterproofing on the other hand, thereby protecting the battery.
Please refer to fig. 3, which is a schematic structural diagram of the mobile terminal of the present invention. The mobile terminal 61 includes a battery protection board 62, wherein the battery protection board 62 includes the battery protection board 62 shown in fig. 2.
The mobile terminal 61 refers to a computer device that can be used in mobile, and broadly includes a mobile phone, a notebook, a tablet computer, a POS machine, and even a vehicle-mounted computer.
The utility model provides a battery protection shield and preparation method thereof through constituteing hardboard and soft board rigid-flex printed circuit board, avoids welding hardboard and soft board, and then improves battery protection shield's reliability. In addition, an electronic component is pasted on one surface of the hard board, and the electronic component is packaged by the packaging layer, so that the packaging layer can improve the heat dissipation capacity of the battery protection board relative to air, and further the heat generated by the electronic component is rapidly dissipated.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims (7)

1. A battery protection plate, comprising:
the flexible printed circuit board comprises a hard board and a soft board, wherein the soft board is connected with the hard board;
one surface of the hard board is attached with an electronic component;
and the packaging layer covers one side surface of the electronic component loaded on the hard board and is matched with the hard board to package the electronic component.
2. The battery protection board according to claim 1, wherein the hard board and the soft board constitute a rigid-flex board, and the soft board is partially embedded in the hard board.
3. The battery protection plate according to claim 1, wherein the electronic component includes: one or any combination of a resistor, a capacitor, an inductor, an integrated chip and an MOS tube.
4. The battery protection plate as claimed in claim 1, wherein the surface of the hard plate away from the electronic component has a first electrode region and a second electrode region for connecting the positive electrode and the negative electrode of the battery.
5. The battery protection plate as claimed in claim 1, wherein an end of the flexible board away from the hard board is provided with a connector for connecting a device to be powered.
6. The battery protection plate as claimed in claim 1, wherein the hard plate is made of a hard material, the soft plate is made of a soft material, and the hard plate and the soft plate have a circuit layer thereon.
7. A mobile terminal characterized by comprising the battery protection board as recited in claim 1 to claim 6.
CN202021357539.XU 2019-10-28 2020-07-10 Battery protection board and mobile terminal Active CN212752722U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2019110331554 2019-10-28
CN201911033155 2019-10-28

Publications (1)

Publication Number Publication Date
CN212752722U true CN212752722U (en) 2021-03-19

Family

ID=75021617

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202021357539.XU Active CN212752722U (en) 2019-10-28 2020-07-10 Battery protection board and mobile terminal
CN202010664205.5A Pending CN112738974A (en) 2019-10-28 2020-07-10 Battery protection plate, manufacturing method thereof and mobile terminal

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202010664205.5A Pending CN112738974A (en) 2019-10-28 2020-07-10 Battery protection plate, manufacturing method thereof and mobile terminal

Country Status (2)

Country Link
CN (2) CN212752722U (en)
WO (1) WO2021083159A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113727522B (en) * 2021-08-23 2022-11-01 深圳市尚亿芯科技有限公司 Assembled lithium battery protection board
CN114222419A (en) * 2021-12-22 2022-03-22 维沃移动通信有限公司 Circuit board assembly and electronic device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208241984U (en) * 2018-06-13 2018-12-14 珠海市宏广科技有限公司 Flexible and hard combined circuit board
CN108879000A (en) * 2018-06-29 2018-11-23 努比亚技术有限公司 A kind of battery protecting plate, battery and mobile terminal
CN208423037U (en) * 2018-08-13 2019-01-22 Oppo广东移动通信有限公司 Built-in battery and electronic equipment with it
CN109348611B (en) * 2018-09-18 2020-09-04 深圳欣旺达智能科技有限公司 Battery protection plate
CN209282287U (en) * 2018-11-02 2019-08-20 福建飞毛腿动力科技有限公司 A kind of conducting wire for Waterproof battery
CN109728215B (en) * 2018-11-23 2021-09-21 深圳欣旺达智能科技有限公司 Battery core and battery protection board packaging structure

Also Published As

Publication number Publication date
CN112738974A (en) 2021-04-30
WO2021083159A1 (en) 2021-05-06

Similar Documents

Publication Publication Date Title
JP6496571B2 (en) Ultra-thin embedded semiconductor device package and manufacturing method thereof
US20110019370A1 (en) Flexible circuit module
JPH07307574A (en) Multilayered metal printed board and molded module
JP2002076589A5 (en)
CN212752722U (en) Battery protection board and mobile terminal
WO2023005392A1 (en) Battery protection plate and manufacturing method therefor, battery, and electronic device
KR101676815B1 (en) Emi shielding and thermal dissipation for semiconductor device
CN211045436U (en) Circuit board
JP2004179232A (en) Semiconductor device, manufacturing method thereof, and electronic apparatus
JP2004128418A (en) Semiconductor device and manufacturing method thereof
JP2005191156A (en) Wiring plate containing electric component, and its manufacturing method
JP3951409B2 (en) IC card and its manufacturing method
KR20150035251A (en) External connection terminal and Semi-conductor package having external connection terminal and Methods thereof
KR20180090941A (en) Manufacturing Method of Flexible Printed Circuit Board Using Temporary Bonding and De-bonding Adhesives
US8168471B2 (en) Semiconductor device and manufacturing method of a semiconductor device
CN212393046U (en) Flexible circuit board and semiconductor packaging structure
KR20120017564A (en) Memory card and method for fabricating the same
JP2009246144A (en) Electronic component-incorporating substrate and method of manufacturing the same, and semiconductor device using the same
JP2000307055A (en) Semiconductor device, its manufacture, circuit substrate, and electronics
JP2002246745A (en) Three-dimensional mounting package and its manufacturing method, and adhesive therefor
JP4198245B2 (en) Electronic circuit board, electronic circuit and manufacturing method thereof
CN107634078B (en) Bottom plate of camera module and camera module
JP3838524B2 (en) Semiconductor device
JP2770485B2 (en) Circuit board
CN215266271U (en) Front and back chip integrated packaging structure based on copper foil carrier plate

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant