CN112738974A - Battery protection plate, manufacturing method thereof and mobile terminal - Google Patents

Battery protection plate, manufacturing method thereof and mobile terminal Download PDF

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Publication number
CN112738974A
CN112738974A CN202010664205.5A CN202010664205A CN112738974A CN 112738974 A CN112738974 A CN 112738974A CN 202010664205 A CN202010664205 A CN 202010664205A CN 112738974 A CN112738974 A CN 112738974A
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CN
China
Prior art keywords
board
hard
soft
battery protection
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010664205.5A
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Chinese (zh)
Inventor
张利华
张伟杰
张强波
骆延昕
张胜林
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Sky Chip Interconnection Technology Co Ltd
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Sky Chip Interconnection Technology Co Ltd
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Filing date
Publication date
Application filed by Sky Chip Interconnection Technology Co Ltd filed Critical Sky Chip Interconnection Technology Co Ltd
Publication of CN112738974A publication Critical patent/CN112738974A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00302—Overcharge protection
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00304—Overcurrent protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Battery Mounting, Suspending (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The invention provides a battery protection plate and a manufacturing method thereof, wherein the battery protection plate comprises: the electronic device comprises a hard board and a soft board, wherein the soft board and the hard board are connected with each other, and an electronic component is attached to one surface of the hard board. And the packaging layer covers one side surface of the hard board loaded with the electronic component and is matched with the hard board to package the electronic component. The packaging layer packages the electronic component, and the heat dissipation capability and waterproof capability of the battery protection board are improved.

Description

Battery protection plate, manufacturing method thereof and mobile terminal
Technical Field
The invention relates to the technical field of batteries, in particular to a battery protection plate, a manufacturing method thereof and a mobile terminal.
Background
The battery protection board is used as a necessary component in the modern mobile phone and is mainly used for overcharge and overcurrent protection. The battery protection plate structure proposed in the current market is mainly to mount elements on the surface of a hard plate first and then weld a soft plate structure. However, the main problems of the hard board surface element mounting and the soft board structure re-welding are poor reliability of a soldering point and temperature rise, and the existing battery protection board element is exposed, so that the waterproof performance and the heat dissipation performance are poor.
In order to solve the problems, the application provides a novel battery protection plate.
Disclosure of Invention
The application mainly provides a battery protection plate, a manufacturing method thereof and a mobile terminal, and aims to solve the problem that an existing battery protection plate is poor in waterproofness and heat dissipation performance.
In order to solve the technical problems, the invention adopts a technical scheme that: provided is a battery protection plate including: the flexible printed circuit board comprises a hard board and a soft board, wherein the soft board is connected with the hard board; one surface of the hard board is attached with an electronic component; and the packaging layer covers one side surface of the electronic component loaded on the hard board and is matched with the hard board to package the electronic component.
The rigid-flex printed circuit board comprises a rigid-flex printed circuit board body and a flexible printed circuit board body, wherein the rigid-flex printed circuit board body comprises a rigid-flex printed circuit board body and a flexible printed circuit board body, the rigid-flex printed circuit board body comprises a rigid-flex printed circuit board, the rigid-flex printed circuit board body and the flexible.
Wherein, electronic components includes: one or any combination of a resistor, a capacitor, an inductor, an integrated chip and an MOS tube.
The surface of the hard board, which is far away from the electronic component, is provided with a first electrode area and a second electrode area which are used for connecting the positive electrode and the negative electrode of the battery.
And a connector is arranged at one end of the soft board far away from the hard board and used for connecting equipment to be powered.
The hard board is made of hard materials, the soft board is made of soft materials, and the hard board and the soft board are both provided with circuit layers.
In order to solve the technical problems, the invention adopts a technical scheme that: provided is a method for manufacturing a battery protection plate, including: manufacturing a hard board and a soft board which are connected with each other; an electronic component is pasted on one surface of the hard plate; arranging an encapsulation layer covering the hard board and the soft board on one side of the hard board loaded with the electronic component; and removing the packaging layer at the position of the soft board to expose the soft board.
Wherein, the step of making the hard board and the soft board which are connected with each other comprises: the rigid-flex printed circuit board is characterized in that the rigid board and the flexible board form a rigid-flex printed circuit board; arranging cover plates which are flush with the surface of the hard board on two surfaces of the soft board so as to protect the soft board; the step of removing the encapsulation layer at the position of the flexible printed circuit board to expose the flexible printed circuit board further comprises: and removing the cover plates on two surfaces of the soft board to expose the soft board.
Wherein the step of fabricating the interconnected hard and soft boards further comprises: arranging a first electrode area and a second electrode area on one surface of the hard board far away from the surface loaded with the electronic component; the removing of the cover plate on both surfaces of the flexible printed circuit board to expose the flexible printed circuit board further comprises: and arranging a connector at one end of the soft board far away from the hard board so as to connect the battery protection board with equipment to be powered.
In order to solve the technical problem, the invention adopts another technical scheme as follows: there is provided a mobile terminal including the battery protection board as set forth in any one of the above.
The invention has the beneficial effects that: in contrast to the state of the art, the present invention provides a battery protection plate including: interconnect's soft board and hardboard, and the electronic components is equipped with in the subsides of hardboard surface, and the hardboard loading has electronic components's a side surface has the encapsulated layer, and the encapsulated layer cooperation hardboard encapsulates electronic components to this improves radiating effect, improves waterproof nature through the encapsulated layer.
Drawings
Fig. 1 is a schematic structural view of a battery protection plate in the prior art;
FIG. 2 is a schematic structural diagram of a battery protection plate according to an embodiment of the present invention;
fig. 3 is a schematic flow chart of a first embodiment of a method for manufacturing a battery protection plate according to the present invention;
FIGS. 4a to 4c are schematic process flow diagrams of a method for manufacturing a battery protection plate according to the present invention;
fig. 5 is a schematic structural diagram of the mobile terminal of the present invention.
Detailed Description
The battery protection plate structure proposed in the current market is as shown in fig. 1, a hard plate is firstly made, components are pasted on the surface of the hard plate, and then a soft plate structure is welded.
In the battery protection board structure shown in fig. 1, after a hard board 11 is manufactured, an electronic component is mounted on one surface of the hard board, and then a soft board 12 is welded to one end of the hard board 11. In general, soldering is performed using a solder during soldering, but the reliability of the soldering point is poor and the temperature rises. And current panel backplate electronic components exposes, and it can cause waterproof nature and poor problem of thermal diffusivity.
Therefore, the battery protection plate in the prior art has problems and needs to be improved. In view of the above problems, the present invention provides a novel battery protection plate structure that can solve the problems of poor reliability of soldering points, temperature rise, and poor water resistance and heat dissipation of the structure shown in fig. 1.
Specifically, the battery protection board comprises a rigid-flex board, namely a hard board and a soft board which are connected with each other, wherein electronic components are attached to the hard board, and an encapsulation layer is arranged on one side of the hard board, which is loaded with the electronic components, so as to encapsulate the electronic components, so that the heat dissipation effect and the water resistance of the battery protection board are improved. The rigid-flex combined plate is formed by the soft plate and the hard plate, so that tin solder can be prevented from being used for welding, the reliability of the battery protection plate is improved, and the performance of the battery protection plate is improved.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art without any creative effort based on the embodiments in the present application belong to the protection scope of the present application.
Specific embodiments of the present invention will be explained and illustrated below with reference to the accompanying drawings.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a battery protection plate according to an embodiment of the present invention. Comprises a hard board 11 and a soft board 12, wherein the hard board 11 and the soft board 12 are connected with each other.
The hard board 11 is made of a hard material, and is specifically made of a core board copper-clad plate, wherein the core board is made of a paper substrate, a glass fiber cloth substrate, a synthetic fiber cloth substrate, a non-woven fabric substrate, a composite substrate and other materials which are soaked with resin to prepare bonding sheets, the bonding sheets are combined by a plurality of bonding sheets, a copper foil is coated on one side or two sides of the prepared substrate board, and then the core board copper-clad plate is prepared by hot-pressing and curing. And pressing the manufactured core board copper-clad plate through a prepreg to form a stacked structure of the multilayer core board copper-clad plate. The prepreg is an interlayer bonding layer during lamination, specifically, the prepreg mainly comprises resin and a reinforcing material, when a multilayer circuit board is manufactured, glass fiber cloth is usually used as the reinforcing material, the glass fiber cloth is soaked in resin glue solution and is subjected to heat treatment and pre-baking to form a sheet, the sheet is softened under heating and pressurization and is solidified after cooling, and the sheet has viscosity, and two adjacent layers can be bonded in a high-temperature pressing process.
The flexible board 12 is made of a flexible material and is made of a polyimide copper clad material. In particular, printed circuit boards made with flexible dielectric substrates (mainly polyimide or polyester films) have many advantages not found in rigid printed circuit boards. For example, it can be freely bent, rolled, folded. The Flexible Printed Circuit (FPC) is utilized, namely the flexible board, so that the size of the electronic product can be greatly reduced, and the requirements of the electronic product on the development of high density, miniaturization and high reliability are met.
In this embodiment, the rigid-flex board is composed of the hard board 11 and the soft board 12. Specifically, the soft board 12 is partially embedded in the hard board 11 at the connecting position of the hard board 11 and the soft board 12. This prevents the soft board 12 and the hard board 11 from being connected by welding, thereby improving reliability and the like.
Specifically, an electronic component 13 is attached to one surface of the hard board 11, and the electronic component 13 specifically includes: one or any combination of a resistor, a capacitor, an inductor, an integrated chip and an MOS tube. The integrated chip is used for receiving signals and feeding the signals back to electronic components 13 such as MOS tubes and the like so as to make the electronic components react correspondingly and further protect the battery. Specifically, if the integrated chip detects a voltage overshoot, the voltage overshoot is reflected to the other electronic components 13, and the MOS transistor is turned off, so that power supply is stopped, and the battery is protected.
Wherein, a packaging layer 14 is further arranged on the surface of one side of the hard board 11 loaded with the electronic component 13, and the packaging layer 14 is matched with the hard board 11 to package the electronic component 13. Therefore, when the electronic component 13 works, the generated heat can be dissipated through the packaging layer 14, and the heat dissipation effect of the packaging layer 14 is better than that of air. In addition, the encapsulation layer 14 has a good waterproof effect, which can further protect the battery. Specifically, the encapsulation layer 14 may be made of a plastic molding material, such as epoxy resin.
Furthermore, a first electrode region 15 and a second electrode region 16 are provided on a surface of the hard sheet 11 on a side away from the electronic component 13. In one embodiment, the first electrode region 15 is a positive electrode, and the second electrode region 16 is a negative electrode, which is used to connect with the positive and negative electrodes of the battery.
The first electrode region 15 and the second electrode region 16 are flush with the surface of the hard plate 11 on the side away from the electronic component 13.
The end of the soft board 12, which is far away from the hard board 11, is further provided with a connector 17, and the connector 17 is used for connecting to-be-powered equipment, such as a mobile phone, a tablet computer, and the like, so that a battery is loaded in the to-be-powered equipment to supply power to the to-be-powered equipment.
In the battery protection board provided by the embodiment, the hard board 11 and the soft board 12 are integrally formed, which avoids welding the hard board 11 and the soft board 12, thereby improving the reliability of the battery protection board. In addition, the battery protection board of this embodiment is provided with the encapsulating layer 14 on the surface of the side where the hard board 11 is attached to the electronic component 13, and the encapsulating layer 14 can improve heat dissipation capability and accelerate the dissipation of heat generated by the electronic component 13, and can play a role in waterproofing on the other hand, thereby protecting the battery.
Fig. 3 is a schematic structural diagram of a method for manufacturing a battery protection plate according to a first embodiment of the present invention. The method comprises the following steps:
step S41: and manufacturing the hard board and the soft board which are connected with each other.
Referring to fig. 4a, in the embodiment, the first embodiment is shown. The soft board 52 and the hard board 51 are integrally formed, and in a specific embodiment, the thickness of the hard board 51 is greater than that of the soft board 52. When the hard board 51 and the soft board 52 are manufactured, the cover plates 53 are disposed on two sides of the soft board 52 and are flush with two surfaces of the hard board 51, so as to protect the soft board 52.
The hard board 51 is made of hard material, and is specifically made of a core board copper-clad plate, wherein the core board is made of a paper substrate, a glass fiber cloth substrate, a synthetic fiber cloth substrate, a non-woven fabric substrate, a composite substrate and other materials which are soaked with resin to prepare bonding sheets, the bonding sheets are combined by a plurality of bonding sheets, a copper foil is coated on one side or two sides of the prepared substrate board, and then the core board copper-clad plate is prepared by hot-pressing and curing. And pressing the manufactured core board copper-clad plate through a prepreg to form a stacked structure of the multilayer core board copper-clad plate. The prepreg is an interlayer bonding layer during lamination, specifically, the prepreg mainly comprises resin and a reinforcing material, when a multilayer circuit board is manufactured, glass fiber cloth is usually used as the reinforcing material, the glass fiber cloth is soaked in resin glue solution and is subjected to heat treatment and pre-baking to form a sheet, the sheet is softened under heating and pressurization and is solidified after cooling, and the sheet has viscosity, and two adjacent layers can be bonded in a high-temperature pressing process.
The flexible board 52 is made of a flexible material and is made of a polyimide copper clad material. In particular, printed circuit boards made with flexible dielectric substrates (mainly polyimide or polyester films) have many advantages not found in rigid printed circuit boards. For example, it can be freely bent, rolled, folded. The Flexible Printed Circuit (FPC) is utilized, namely the flexible board, so that the size of the electronic product can be greatly reduced, and the requirements of the electronic product on the development of high density, miniaturization and high reliability are met.
Specifically, in this step, when the hard plate 51 is manufactured, the first electrode region 54 and the second electrode region 55 are further required to be manufactured on a surface of the hard plate 51, wherein the first electrode region 54 and the second electrode region 55 are flush with a surface of the hard plate 51.
The hard plate 51 and the soft plate 52 are integrally formed, so that the reliability of the battery protection plate can be improved.
Step S42: and an electronic component is pasted on one surface of the hard board.
Specifically referring to fig. 4b, an electronic component 56 is mounted on a surface of the hard plate 51 away from the first electrode region 54 and the second electrode region 55, where the electronic component 56 includes one or any combination of a resistor, a capacitor, an inductor, an integrated chip, and a MOS transistor.
Step S43: an encapsulation layer covering the hard board and the soft board is arranged on one side of the hard board loaded with the electronic components.
With reference to fig. 4b, an encapsulation layer 57 covering the hard board 51, the soft board 52 and the electronic component 56 is disposed on the side where the electronic component 56 is mounted. The encapsulation layer 57 is a plastic material, such as epoxy resin.
Step S44: and removing the packaging layer at the position of the soft board to expose the soft board.
Referring to fig. 4c, in the step of uncapping the flexible board 52 and removing the encapsulation layer 57 at the corresponding position of the flexible board 52, in order to expose the flexible board 52, uncapping both surfaces of the flexible board 52 and removing the cover plates 53 at both surfaces of the flexible board 52 are required.
In one embodiment, after the cover plate 53 is removed to expose the flexible board 52, a connector 58 is provided at an end of the flexible board 52 remote from the rigid board 51. The connector 58 is used to connect a device to be powered.
Fig. 5 is a schematic structural diagram of a mobile terminal according to the present invention. The mobile terminal 61 includes a battery protection board 62, wherein the battery protection board 62 includes the battery protection board 62 shown in fig. 2.
The mobile terminal 61 refers to a computer device that can be used in mobile, and broadly includes a mobile phone, a notebook, a tablet computer, a POS machine, and even a vehicle-mounted computer.
According to the battery protection board and the manufacturing method thereof, the rigid-flexible combined board is formed by the hard board and the soft board, so that the hard board and the soft board are prevented from being welded, and the reliability of the battery protection board is improved. In addition, an electronic component is pasted on one surface of the hard board, and the electronic component is packaged by the packaging layer, so that the packaging layer can improve the heat dissipation capacity of the battery protection board relative to air, and further the heat generated by the electronic component is rapidly dissipated.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A battery protection plate, comprising:
the flexible printed circuit board comprises a hard board and a soft board, wherein the soft board is connected with the hard board;
one surface of the hard board is attached with an electronic component;
and the packaging layer covers one side surface of the electronic component loaded on the hard board and is matched with the hard board to package the electronic component.
2. The battery protection board according to claim 1, wherein the hard board and the soft board constitute a rigid-flex board, and the soft board is partially embedded in the hard board.
3. The battery protection plate according to claim 1, wherein the electronic component includes: one or any combination of a resistor, a capacitor, an inductor, an integrated chip and an MOS tube.
4. The battery protection plate as claimed in claim 1, wherein the surface of the hard plate away from the electronic component has a first electrode region and a second electrode region for connecting the positive electrode and the negative electrode of the battery.
5. The battery protection plate as claimed in claim 1, wherein an end of the flexible board away from the hard board is provided with a connector for connecting a device to be powered.
6. The battery protection plate as claimed in claim 1, wherein the hard plate is made of a hard material, the soft plate is made of a soft material, and the hard plate and the soft plate have a circuit layer thereon.
7. A method for manufacturing a battery protection plate is characterized by comprising the following steps:
manufacturing a hard board and a soft board which are connected with each other;
an electronic component is pasted on one surface of the hard plate;
arranging an encapsulation layer covering the hard board and the soft board on one side of the hard board loaded with the electronic component;
and removing the packaging layer at the position of the soft board to expose the soft board.
8. The method for manufacturing a battery protection sheet according to claim 7,
the step of manufacturing the interconnected hard board and soft board comprises the following steps:
the rigid-flex printed circuit board is characterized in that the rigid board and the flexible board form a rigid-flex printed circuit board;
arranging cover plates which are flush with the surface of the hard board on two surfaces of the soft board so as to protect the soft board;
the step of removing the encapsulation layer at the position of the flexible printed circuit board to expose the flexible printed circuit board further comprises:
and removing the cover plates on two surfaces of the soft board to expose the soft board.
9. The method for manufacturing a battery protection sheet according to claim 8,
the step of manufacturing the interconnected hard board and soft board further comprises:
arranging a first electrode area and a second electrode area on one surface of the hard board far away from the surface loaded with the electronic component;
the removing of the cover plate on both surfaces of the flexible printed circuit board to expose the flexible printed circuit board further comprises:
and arranging a connector at one end of the soft board far away from the hard board so as to connect the battery protection board with equipment to be powered.
10. A mobile terminal characterized by comprising the battery protection board as recited in claim 1 to claim 6.
CN202010664205.5A 2019-10-28 2020-07-10 Battery protection plate, manufacturing method thereof and mobile terminal Pending CN112738974A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911033155 2019-10-28
CN2019110331554 2019-10-28

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Publication Number Publication Date
CN112738974A true CN112738974A (en) 2021-04-30

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CN202021357539.XU Active CN212752722U (en) 2019-10-28 2020-07-10 Battery protection board and mobile terminal

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WO (1) WO2021083159A1 (en)

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CN112738974A (en) * 2019-10-28 2021-04-30 天芯互联科技有限公司 Battery protection plate, manufacturing method thereof and mobile terminal
CN113473704A (en) * 2021-05-25 2021-10-01 菲尼萨光电通讯(上海)有限公司 Optical module based on double-layer rigid-flex board design
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