CN219028824U

CN219028824U - Press fit die

Info

Publication number: CN219028824U
Application number: CN202223405370.2U
Authority: CN
Inventors: 黄保钦
Original assignee: Liding Semiconductor Technology Shenzhen Co ltd; Liding Semiconductor Technology Qinhuangdao Co ltd
Current assignee: Liding Semiconductor Technology Shenzhen Co ltd; Liding Semiconductor Technology Qinhuangdao Co ltd
Priority date: 2022-12-19
Filing date: 2022-12-19
Publication date: 2023-05-16
Anticipated expiration: 2032-12-19

Abstract

The application provides a press fit die for laminate base plate raw material, base plate raw material includes dielectric layer and conducting layer that fold along first direction, press fit die includes first mould and second mould, first mould includes first bottom plate and first locating part, first bottom plate is the heat conduction board and including being used for towards the first surface of second mould, first surface is located to first locating part protrusion, first locating part and first surface surround and form first spacing chamber, first spacing chamber is used for the holding at least part base plate raw material, the second mould includes the second bottom plate, the second bottom plate includes the second surface, the second surface is used for bearing the base plate raw material of placing in first spacing intracavity, at least first locating part is used for supporting dielectric layer and conducting layer along the second direction of perpendicular to first direction, first bottom plate and/or the second bottom plate that is adjacent the conducting layer are the heat conduction board. The utility model provides a laminating mould can solve the problem of base plate side glue overflow.

Description

Press fit die

Technical Field

The application relates to the field of molding processing, in particular to a pressing die.

Background

The substrate of the conventional circuit board is usually formed by using a steel plate as a mold and processing stacked blanks in a hot press by high-temperature high-pressure molding. However, in the molding process, the dielectric layer in the blank is heated in the hot press to soften the overflow, so that the glue overflows from the side of the substrate, and the yield of the substrate is affected.

Disclosure of Invention

In view of this, the present application provides a bonding mold capable of solving the problem of glue overflow on the side of the substrate.

The application provides a press fit die for pressing on base plate raw material, base plate raw material includes dielectric layer and conducting layer of following first direction and stacking, press fit die includes first mould and second mould, first mould includes first bottom plate and first locating part, first bottom plate is the heat conduction board and including being used for orientation the first surface of second mould, first locating part is protruding to be located first surface, first locating part with first surface surrounds and forms first spacing chamber, first spacing chamber is used for the holding at least part base plate raw material, the second mould includes the second bottom plate, the second bottom plate includes the second surface, the second surface is used for bearing and is arranged in first spacing intracavity base plate raw material, at least first locating part is used for following the perpendicular to the second direction of first direction supports dielectric layer and conducting layer, the second bottom plate adjacent the conducting layer is the heat conduction board.

Optionally, the base plate material further includes a reinforcing layer disposed between the dielectric layer and the conductive layer, the second mold further includes a second limiting member corresponding to the first limiting member, the second limiting member is convexly disposed on the second surface, a second limiting cavity communicated with the first limiting cavity is formed by surrounding the second limiting member and the second surface, and the second limiting member is used for propping against the reinforcing layer, the conductive layer and the dielectric layer along the second direction.

Optionally, the first bottom plate includes a third surface facing away from the first surface, the second bottom plate includes a fourth surface facing away from the second surface, and a first buffer is disposed on the third surface and/or the fourth surface, and the first buffer includes a first glass fiber layer and a first silica gel layer that are stacked.

Optionally, the number of the first silica gel layers is two, the first glass fiber layer is disposed between the two first silica gel layers, and the third surface is connected to the first silica gel layer adjacent to the third surface and/or the fourth surface is connected to the first silica gel layer adjacent to the fourth surface.

Optionally, in the second direction, the first limiting member is spaced from an edge of the first surface.

Optionally, the number of the first mold and the second mold is at least two, the first mold and the second mold are alternately arranged in turn, the first bottom plate further comprises a third surface opposite to the first surface, the second bottom plate and the first bottom plate are both heat conducting plates, the second bottom plate further comprises a fourth surface opposite to the second surface, the second mold further comprises a second limiting piece protruding from the fourth surface, a second limiting cavity for accommodating another substrate raw material is formed by surrounding the second limiting piece and the fourth surface, the second limiting piece is used for abutting against the third surface of the other first mold adjacent to the second limiting piece, the third surface is used for bearing the substrate raw material placed in the second limiting cavity, and the second limiting piece is further used for abutting against at least the dielectric layer and the conductive layer placed in the second limiting cavity along the second direction.

Optionally, the pressing mold further includes two second buffer members, where the first mold and the second mold are disposed between the two second buffer members, one second buffer member is disposed on the third surface adjacent to the second buffer member, and the other second buffer member is used for bearing the substrate raw material adjacent to the first limiting cavity or the second limiting cavity of the second buffer member.

Optionally, the pressing mold further includes a third buffer member, where the third buffer member is disposed between the two second buffer members and between the first mold and the second mold, and the third buffer member is used to bear the substrate raw material adjacent to the first limiting cavity or the second limiting cavity of the third buffer member.

Optionally, at least one of the second buffer and the third buffer comprises a second fiberglass layer and a second silicone layer stacked.

Optionally, the number of the second silica gel layers is two, the second glass fiber layer is disposed between the two second silica gel layers, and the second silica gel layers are connected to the first mold and/or the second mold.

Compared with the prior art, the first limiting piece or the first limiting piece on the first bottom plate and the lower die are propped against the dielectric layer and the conductive layer along the second direction, so that the dielectric layer cannot overflow from one side adjacent to the first limiting piece during hot pressing. And the flow uniformity of the dielectric layer is improved. The problem of glue overflow on the side edge of the substrate can be solved.

Drawings

FIG. 1 is a cross-sectional view of a pressing die for pressing a substrate material according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a first mold of the press mold shown in fig. 1;

FIG. 3 is a schematic diagram of a second mold of the pressing mold shown in FIG. 1;

fig. 4 is a cross-sectional view of a pressing die pressing a base plate according to another embodiment of the present disclosure.

Description of the main reference signs

Compression mold 100,200 first mold 10

First surface 111 of first base plate 11

Third surface 112 first stop member 12

First spacing chamber 121 second die 20

Second surface 211 of second base plate 21

Fourth surface 212 second spacing cavities 221,221'

Second limiting member 22,22' first cushioning member 30

First silica gel layer 31 first glass fiber layer 32

Substrate web 40 conductive layer 41

Dielectric layer 42 reinforcing layer 43

Second cushioning member 50 a second silica gel layer 51

Second fiberglass layer 52 third cushioning member 60

Second silica gel layer 61 second glass fiber layer 62

First direction X second direction Y

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Example 1:

referring to fig. 1, the present application provides a press mold 100. The bonding mold 100 is used for bonding the substrate raw material 40 to form a composite substrate, such as a copper-clad substrate. The substrate log 40 includes a dielectric layer 42 and a conductive layer 41 stacked in a first direction X. Specifically, the dielectric layer 42 may be a prepreg, and the material of the prepreg includes a thermoplastic resin, such as an acryl resin or an epoxy resin. The material of the conductive layer 41 may be copper foil. The press mold 100 includes a first mold 10 and a second mold 20.

Referring to fig. 1 and 2, the first mold 10 includes a first base plate 11 and a first stopper 12. The first base plate 11 comprises a first surface 111 for facing the second mould 20. The material of the first base plate 11 may be one of steel or a metal material. The first limiting member 12 is protruding on the first surface 111, and a first limiting cavity 121 is formed by surrounding the first limiting member 12 and the first surface 111. The first limiting cavity 121 is configured to receive at least a portion of the substrate raw material 40 and make the first surface 111 face the conductive layer 41. The material of the first limiting member 12 may be one of steel or metal.

Referring to fig. 1 and 3, the second mold 20 includes a second base plate 21. The second base plate 21 comprises a second surface 211. The second surface 211 is used for carrying the substrate raw material 40 placed in the first limiting cavity 121. At least the first limiting member 12 is configured to abut the dielectric layer 42 and the conductive layer 41 along a second direction Y perpendicular to the first direction X. The first chassis 11 and/or the second chassis 21 adjacent to the conductive layer 41 are heat conductive plates. The material of the heat conducting plate is steel or metal material. In this embodiment, the first base plate 11 and the second base plate 21 are both heat conductive plates.

At the time of hot press molding, a hot press conducts heat to the first chassis 11 and/or the second chassis 21 adjacent to the conductive layer 41 and to the dielectric layer 42 via the conductive layer 41, so that the dielectric layer 42 and the conductive layer 41 are fixedly connected to form the composite substrate.

At least the first limiting member 12 is configured to abut against the dielectric layer 42 and the conductive layer 41 along the second direction Y, so that the dielectric layer 42 does not overflow from a side adjacent to the first limiting member 12 during hot pressing. Facilitating improved flow uniformity of the dielectric layer 42. The problem of glue overflow on the side edge of the substrate can be solved.

In this embodiment, the number of the dielectric layers 42 and the number of the conductive layers 41 are two. In other embodiments, the number of the dielectric layers 42 and the conductive layers 41 may be one or plural.

In some embodiments, referring to fig. 1, the substrate stock 40 further includes a reinforcing layer 43. The reinforcing layer 43 may be one of an epoxy glass cloth substrate, a ceramic substrate, or a metal substrate. The enhancement layer 43 is disposed between the dielectric layer 42 and the conductive layer 41. Referring to fig. 1 and 3, the second mold 20 further includes a second stopper 22 corresponding to the first stopper 12. The second limiting member 22 is protruding on the second surface 211, and the second limiting member 22 and the second surface 211 form a second limiting cavity 221 that is communicated with the first limiting cavity 121. The material of the second limiting member 22 may be one of steel or metal. The second limiting member 22 is configured to abut against the reinforcing layer 43, the conductive layer 41, and the dielectric layer 42 along the second direction Y. The first limiting member 12 and the second limiting member 22 are abutted against one side of the reinforcing layer 43, so as to facilitate preventing the dielectric layer 42 or the conductive layer 41 from being deformed in a direction perpendicular to the hot pressing direction.

In other embodiments, the second mold 20 may not include the second limiting member 22, and the second bottom plate 21 is used to abut against the first limiting member 12. Therefore, only the first stopper 12 is used to abut the dielectric layer 42 and the conductive layer 41 of the substrate log 40.

In some embodiments, referring to fig. 1, the first base plate 11 includes a third surface 112 facing away from the first surface 111. The second base plate 21 comprises a fourth surface 212 facing away from the second surface 211. The third surface 112 and the fourth surface 212 are each provided with a first cushioning member 30. The first buffer member 30 includes a first glass fiber layer 32 and a first silica gel layer 31 stacked. Specifically, the number of the first silica gel layers 31 is two. The first glass fiber layer 32 is disposed between the two first silica gel layers 31. The third surface 112 is connected to the first layer 31 of silicone adhesive adjacent to the third surface 112. The fourth surface 212 is connected to the first layer 31 of silicone adhesive adjacent to the fourth surface 212.

The first glass fiber layer 32 is disposed between the two first silica gel layers 31, which is beneficial to improving the buffering effect of the first buffer member 30. In addition, since the adhesive property of the silica gel is relatively weak, the first silica gel layer 31 is connected with the first mold 10 and/or the second mold 20, so as to facilitate the disassembly and assembly of the first buffer member 30.

In other embodiments, the first buffer 30 may be disposed on the third surface 112 or the fourth surface 212.

In further embodiments, the number of the first silica gel layers 31 and the first glass fiber layers 32 may vary. The first fiberglass layer 32 of the first buffer 30 may be fixed to the first mold 10 or the second mold 20 by glue.

In other embodiments, the first cushioning member 30 may be configured to be a kraft paper or a sponge board.

In the hot pressing, two hot pressing heads may be used, each of which presses against one of the first buffers 30. It is also possible to use a thermal compression head pressed against one of said first buffers 30.

In further embodiments, the compression mold 100 does not include the first buffer 30.

In some embodiments, referring to fig. 1 and 2, the first stop 12 is spaced from an edge of the first surface 111.

In some embodiments, referring to fig. 1 and 3, in the second direction Y, the second stopper 22 is spaced apart from an edge of the second surface 211.

Example 2:

referring to fig. 4, the present application provides a press-fit die 200, which is different from the press-fit die 100 of embodiment 1 in that in embodiment 2, the number of the first die 10 and the second die 20 is at least two. The first mold 10 and the second mold 20 are alternately arranged in sequence. The second limiting member 22' is protruding from the fourth surface 212. The second limiting member 22 'and the fourth surface 212 surround to form the second limiting chamber 221' for accommodating another substrate raw material 40. The second limiting member 22 'is configured to abut against the third surface 112 of the other first mold 10 adjacent to the second limiting member 22'. The third surface 112 is configured to carry the substrate log 40 disposed in the second limiting cavity 221'. The second limiting member 22 'is further configured to at least abut against the dielectric layer 42 and the conductive layer 41 disposed in the second limiting cavity 221' along the second direction Y.

In this embodiment, the substrate raw material 40 may include the reinforcing layer 43, or may include only the dielectric layer 42 and the conductive layer 41.

In some embodiments, referring to fig. 4, the compression mold 200 further includes two second buffers 50. The first mold 10 and the second mold 20 are disposed between the two second buffers 50. One of the second bumpers 50 is disposed on the third surface 112 adjacent to the second bumpers 50. The other second buffer member 50 is used for carrying the substrate raw material 40 in the first spacing cavity 121 or the second spacing cavity 221' adjacent to the second buffer member 50.

Illustratively, when the number of the first die 10 and the second die 20 is two, the other second buffer 50 is used to carry the substrate log 40 in the second spacing cavity 221' adjacent to the second buffer 50. When the number of the first dies 10 is two and the number of the second dies 20 is three, the other second buffer 50 is used for carrying the substrate raw material 40 in the first limiting cavity 121 adjacent to the second buffer 50.

The buffer force of the pressing mold 200 can be improved by disposing the first mold 10 and the second mold 20 alternately between the two second buffers 50.

In some embodiments, the second buffer 50 includes a second fiberglass layer 52 and a second silicone layer 51 stacked.

In this embodiment, the number of the second silica gel layers 51 is two. The second glass fiber layer 52 is disposed between the two second silica gel layers 51. The second silicone layer 51 of one of the second cushioning members 50 is attached to the third surface 112 adjacent to the second silicone layer 51. The second silica gel layer 51 of the other second buffer member 50 is used for connecting the second limiting member 22 'of the second mold 20 and carrying the substrate raw material 40 in the second limiting cavity 221'.

In further embodiments, the second silicone layer 51 of the second buffer 50 for carrying the substrate web 40 is connected to the first stop 12 of the first die 10.

In some embodiments, the compression mold 200 further includes a third bumper 60. The third cushioning members 60 are disposed between the two second cushioning members 50 and between the first mold 10 and the second mold 20. The third buffer member 60 is configured to carry the substrate raw material 40 adjacent to the first spacing cavity 121 or the second spacing cavity 221' of the third buffer member 60. The third buffer member 60 and the second buffer members 50 cooperate to further enhance the buffering effect of the pressing mold 200.

In some embodiments, the third buffer 60 includes a second fiberglass layer 62 and a second silicone layer 61 stacked.

In this embodiment, the number of the second silica gel layers 61 is two. The second glass fiber layer 62 is disposed between the two second silica gel layers 61. The two second silica gel layers 61 of the third buffer member 60 are respectively connected to the second limiting member 22' of the second mold 20 and the third surface 112 of the first mold 10.

In further embodiments, two second silicone layers 61 of the third buffer 60 are respectively connected to the first stopper 12 of the first mold 10 and the second surface 211 of the second mold 20.

In other embodiments, the second buffer member 50 or the third buffer member 60 may be formed by stacking glass fiber layers and silica gel layers.

In other embodiments, the structures of the second cushioning member 50 and the third cushioning member 60 may be changed, and may be one of kraft paper or sponge board.

In further embodiments, the compression mold 200 is not provided with the second buffer 50 and the third buffer 60.

The above description is only one preferred embodiment of the present application, but is not limited to this embodiment during actual application. Other variations and modifications of the present application, which are apparent to those of ordinary skill in the art, are intended to be within the scope of the present application.

Claims

1. A laminating die for laminating a substrate stock including a dielectric layer and a conductive layer laminated along a first direction is characterized in that,

the pressing mold comprises a first mold and a second mold, wherein the first mold comprises a first bottom plate and a first limiting piece, the first bottom plate is a heat conducting plate and comprises a first surface used for being oriented to the second mold, the first limiting piece is arranged on the first surface in a protruding mode, a first limiting cavity is formed by surrounding the first limiting piece and the first surface, the first limiting cavity is used for accommodating at least part of base plate raw materials, the second mold comprises a second bottom plate, the second bottom plate comprises a second surface, the second surface is used for bearing the base plate raw materials placed in the first limiting cavity, at least the first limiting piece is used for propping against the dielectric layer and the conductive layer along a second direction perpendicular to the first direction, and the first bottom plate and/or the second bottom plate adjacent to the conductive layer are/is the heat conducting plate.

2. The bonding mold of claim 1, wherein the substrate stock further comprises a reinforcing layer disposed between the dielectric layer and the conductive layer, the second mold further comprises a second limiting member corresponding to the first limiting member, the second limiting member is protruding from the second surface, a second limiting cavity communicating with the first limiting cavity is formed by surrounding the second limiting member and the second surface, and the second limiting member is configured to abut against the reinforcing layer, the conductive layer, and the dielectric layer in the second direction.

3. The bonding mold according to claim 2, wherein the first bottom plate comprises a third surface facing away from the first surface, the second bottom plate comprises a fourth surface facing away from the second surface, and a first buffer member is arranged on the third surface and/or the fourth surface, and the first buffer member comprises a first glass fiber layer and a first silica gel layer which are stacked.

4. A pressing mold according to claim 3, wherein the number of the first silica gel layers is two, the first glass fiber layer is disposed between the two first silica gel layers, and the third surface is connected to the first silica gel layer adjacent to the third surface and/or the fourth surface is connected to the first silica gel layer adjacent to the fourth surface.

5. The bonding die of claim 1, wherein the first stop is spaced from an edge of the first surface in the second direction.

6. The press-fit die set according to claim 1, wherein the number of the first die set and the number of the second die set are at least two, the first die set and the second die set are alternately arranged in turn, the first bottom plate further comprises a third surface facing away from the first surface, the second bottom plate and the first bottom plate are both heat conducting plates, the second bottom plate further comprises a fourth surface facing away from the second surface, the second die set further comprises a second limiting member protruding from the fourth surface, a second limiting cavity for accommodating another substrate raw material is formed by surrounding the second limiting member and the fourth surface, the second limiting member is used for abutting against the third surface of another first die set adjacent to the second limiting member, the third surface is used for bearing the substrate raw material placed in the second limiting cavity, and the second limiting member is further used for abutting against at least the second limiting layer and the dielectric layer placed in the second cavity along the second direction.

7. The bonding tool of claim 6, further comprising two second buffers, the first and second tools being disposed between the two second buffers, one second buffer being disposed on the third surface adjacent to the second buffer, the other second buffer being configured to carry the substrate web within the first or second spacing cavities adjacent to the second buffer.

8. The bonding tool of claim 7, further comprising a third buffer disposed between the two second buffers and between the first and second dies, the third buffer configured to carry the substrate web within the first or second spacing cavities adjacent to the third buffer.

9. The bonding mold of claim 8, wherein at least one of the second buffer and the third buffer comprises a second fiberglass layer and a second silicone layer stacked.

10. The bonding mold according to claim 9, wherein the number of the second silica gel layers is two, the second glass fiber layer is disposed between the two second silica gel layers, and the second silica gel layers are connected to the first mold and/or the second mold.