CN210821190U - Novel environment-friendly composite board - Google Patents

Novel environment-friendly composite board Download PDF

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Publication number
CN210821190U
CN210821190U CN201921600098.9U CN201921600098U CN210821190U CN 210821190 U CN210821190 U CN 210821190U CN 201921600098 U CN201921600098 U CN 201921600098U CN 210821190 U CN210821190 U CN 210821190U
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CN
China
Prior art keywords
core
board
thermal bonding
composite board
surface layer
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Expired - Fee Related
Application number
CN201921600098.9U
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Chinese (zh)
Inventor
刘敬军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Hengshenglong Glue Products Co ltd
Original Assignee
Shenzhen Hengshenglong Glue Products Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Hengshenglong Glue Products Co ltd filed Critical Shenzhen Hengshenglong Glue Products Co ltd
Priority to CN201921600098.9U priority Critical patent/CN210821190U/en
Application granted granted Critical
Publication of CN210821190U publication Critical patent/CN210821190U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model is suitable for a composite board technical field. The utility model discloses a novel environmental protection composite board, including the board core and with the at least one fixed surface's of board core top sheet, be equipped with the thermobonding membrane between top sheet and board core. In the manufacturing process, the thermal bonding film is melted by heating to bond the plate core and the surface layer sheet, and then the plate core and the surface layer sheet are cooled to the temperature of curing the melted thermal bonding film, such as normal temperature, and then fixed and reliable bonding is formed. When the composite board is manufactured, only the thermal bonding film with uniform thickness is laid between the board core and the surface layer sheet, and the gluing operation is not needed, so that the phenomenon that the board core and the surface layer sheet are poor in bonding stability due to uneven distribution in the gluing process is avoided, the process difficulty is reduced, and the bonding reliability of the composite board is improved. Meanwhile, the thermal bonding films with different thicknesses are selected according to the characteristics of the surface layer sheet and the plate core, so that the waste of the thermal bonding films can be avoided.

Description

Novel environment-friendly composite board
Technical Field
The utility model relates to a composite board technical field, in particular to novel environmental protection composite board.
Background
Due to the use of a large amount of wood, great negative effects are brought to the ecological environment. However, wood is used in production and life, and for example, in the decoration industry, wood boards are used for cabinets, sound insulation, partitions and the like.
In order to improve the durability of the material and reduce the amount of wood, a surface sheet material, such as stainless steel, copper, aluminum, plastic sheet material, is usually laminated or bonded with a core board to form a composite board, wherein the core board usually adopts chipboard, fiberboard, solid wood particle board, the composite material has high strength and effectively utilizes wood chip resources, but the composite board usually needs to be bonded and fixed with an adhesive, the requirement for uniformity of the adhesive to be coated on the surface of the surface sheet material or the core board is high in the bonding process, otherwise, phenomena such as cracking, bulging and the like easily occur between the surface sheet material and the core board in the use process, especially when the requirement for the weight of the composite board is high, a honeycomb board with light weight is usually adopted as the core board, because the surface of the honeycomb board has more gaps, the adhesive is difficult to be uniformly coated on the surface of the honeycomb board directly, when the surface sheet is coated with the adhesive, the amount of the adhesive used is increased, which results in waste.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a novel environmental protection board, and this environmental protection composite board avoids leading to the bonding stability poor because of the adhesive coating is inhomogeneous, avoids using the waste that the excessive use adhesive caused simultaneously.
In order to solve the problem, the utility model provides an environmental protection composite board, this environmental protection composite board include the board core and with at least one fixed surface's of board core top sheet, be equipped with the thermal bonding membrane between top sheet and board core.
Further, the thickness of the thermal bonding film is 0.1-05 CM.
Further, the board core includes a honeycomb board core.
Further, the surface sheet adhesive surface is provided with a guide groove matched with the honeycomb plate core contact fixing surface.
Further, the honeycomb plate core fixing surface is provided with a containing groove.
Furthermore, a plurality of glue overflow openings are distributed on the accommodating groove.
Further, the honeycomb panel core comprises an aluminum honeycomb panel core.
Further, the thermal bonding film is provided with a network in conformity with the fixing face of the honeycomb panel core.
The utility model discloses environmental protection composite board, including the board core and with at least one fixed surface's of board core top sheet, be equipped with the thermal bonding membrane between top sheet and board core. In the manufacturing process, the thermal bonding film is melted by heating to bond the plate core and the surface layer sheet, and then the plate core and the surface layer sheet are cooled to the temperature of curing the melted thermal bonding film, such as normal temperature, and then fixed and reliable bonding is formed. When the composite board is manufactured, only the thermal bonding film with uniform thickness is laid between the board core and the surface layer sheet, and the gluing operation is not needed, so that the phenomenon that the board core and the surface layer sheet are poor in bonding stability due to uneven distribution in the gluing process is avoided, the process difficulty is reduced, and the bonding reliability of the composite board is improved. Meanwhile, the thermal bonding films with different thicknesses are selected according to the characteristics of the surface layer sheet and the plate core, so that the waste of the thermal bonding films can be avoided.
Drawings
In order to illustrate more clearly the embodiments of the invention or the solutions of the prior art, reference will now be made briefly to the attached drawings that are needed in the description of the embodiments or the prior art, it being understood that the drawings in the description illustrate only some embodiments of the invention and are therefore not to be considered limiting of its scope, and that, to a person skilled in the art, other related drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic view of a cross-sectional structure along the vertical direction of the upper and lower surfaces of a composite board.
Fig. 2 is a schematic structural view of the honeycomb panel core in a direction perpendicular to the upper and lower surfaces.
Fig. 3 is an enlarged schematic view of a portion a of fig. 2.
Fig. 4 is a schematic sectional view along the direction B-B in fig. 2.
Fig. 5 is a schematic view of a thermally bonded film structure.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
To more clearly illustrate the technical solution of the present invention, the following claims are made in further detail with reference to specific embodiments and drawings, and it is understood that the following drawings only show some embodiments of the present invention, and therefore should not be considered as limiting the scope, and any person who makes limited number of modifications within the scope of the claims of the present invention is still within the scope of the claims of the present invention.
It should be understood that in the description of the present invention, it is to be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that the products of the present invention are conventionally placed when in use, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
As shown in fig. 1, the present invention provides an embodiment of a novel environment-friendly composite board.
This novel environmental protection composite board includes: the plate core 1 and a surface sheet 2 fixed to at least one surface of the plate core 1, and a thermal adhesive film 3 is provided between the surface sheet 2 and the plate core 1.
Specifically, the core is selected according to the application of the core, such as particle board, fiber board, solid wood particle board, and the embodiment is described with a honeycomb core, such as an aluminum honeycomb core. The surface sheet 2 is selected according to the application, and stainless steel, PVC, color steel, etc. may be used. The thickness of the thermoadhesive film 3 is selected according to the nature of the adhesive material and may generally be between 0.1 and 05 CM. The thermal bonding film may be an existing hot melt adhesive, such as EVA glue, PA glue, PES glue, PO glue, or TPU glue. The thermal bonding film can be flatly laid on two or two surfaces of the plate core for fixing the surface layer sheet material, and also can be flatly laid on the surface layer sheet material fixed with the plate core.
During manufacturing, the thermal bonding film 3 is arranged between the board core 1 and the surface sheet 2, the board core 1 and the surface sheet 2 are uniformly clamped and placed in a certain temperature place, the thermal bonding film is melted, the board core 1 and the surface sheet 2 are placed and cooled, the thermal bonding film is solidified, and the board core 1 and the surface sheet 2 are bonded to form the required composite board. The specific melting temperature and cooling temperature are determined according to the selected hot melt adhesive characteristics, for example, the cooling temperature can be normal temperature. When the thermal bonding film is melted to the curing process, uniform pressure is applied to all parts of the surfaces of the board core 1 and the surface layer sheet 2 and is kept until the hot melt adhesive is cured, so that the flat surface of the composite board obtained by compounding can be ensured. A small amount of hot melt adhesive is present between the skin sheet 2 and the honeycomb panel core fixing surface.
When the composite board is manufactured, only the thermal bonding film with uniform thickness is laid between the board core 1 and the surface layer sheet 2, and the gluing operation is not needed, so that the phenomenon that the board core and the surface layer sheet are poor in bonding stability due to uneven distribution in the gluing process is avoided, the process difficulty is reduced, and the bonding reliability of the composite board is improved.
In order to further improve the bonding strength between the core 1 and the surface sheet 2 and the stability, as shown in fig. 2-4, the present invention provides another embodiment based on the above embodiment.
The honeycomb panel core fixing surface 11 is provided with the accommodating groove 12, when the thermal bonding film is melted, because the thermal bonding film has a certain thickness, part of the hot melt adhesive enters the accommodating groove 12, so that the bonding area of the thermal bonding film and the honeycomb panel core can be increased, and the bonding strength is further improved.
In order to increase the contact area between the thermal bonding film and the surface sheet 2, the accommodating groove 12 is provided with an overflow glue opening 13, the overflow glue opening 13 can discharge redundant hot melt glue from the accommodating groove 12, the hot melt glue discharged from the overflow glue opening 13 is contacted with the surface sheet 2 and is connected with the hot melt glue in the accommodating groove 12 into a whole, the contact area between the honeycomb plate core and the surface sheet 2 can be increased after curing, and the bonding reliability is further improved.
If necessary, a guide groove (reference numeral) for engaging with the honeycomb core fixing surface may be provided on the adhesive surface of the skin sheet 2. Redundant hot melt adhesive overflows from the honeycomb panel core fixing surface and contacts with the guide slot when the hot melt adhesive is manufactured, and when the hot melt adhesive is solidified, the contact area of the hot melt adhesive and the surface layer sheet 2 is increased, so that the effect can be achieved.
In order to avoid the waste of the thermal bonding film, the thermal bonding film is provided with a network consistent with the fixing surface of the honeycomb plate core, as shown in fig. 5, when the honeycomb plate core is fixed, the thermal bonding film is superposed with the fixing surface of the honeycomb plate core, so that the fixing effect is achieved, the consumption of the thermal bonding film can be reduced, and the honeycomb plate core fixing device is more environment-friendly.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: it is to be understood that modifications may be made to the above-described arrangements in the embodiments or equivalents may be substituted for some of the features of the embodiments without departing from the spirit or scope of the present invention.

Claims (6)

1. The utility model provides a novel environmental protection composite board which characterized in that, including the board core and with at least one fixed surface's of board core top sheet, be equipped with the thermal bonding membrane between top sheet and board core, the board core includes the honeycomb core, the thermal bonding membrane is equipped with the network unanimous with the fixed surface of honeycomb core.
2. The novel environmentally friendly composite panel of claim 1, wherein the thermal bonding film has a thickness of 0.1 CM to 05 CM.
3. The novel environment-friendly composite board as claimed in claim 1, wherein the surface sheet adhesive surface is provided with a guide groove matched with the honeycomb board core contact fixing surface.
4. The novel environment-friendly composite board as claimed in claim 3, wherein the fixing surface of the honeycomb core is provided with a receiving groove.
5. The novel environment-friendly composite board as claimed in claim 4, wherein a plurality of glue overflow openings are distributed on the receiving groove.
6. The novel environmentally friendly composite panel of claim 1, wherein the honeycomb panel core comprises an aluminum honeycomb panel core.
CN201921600098.9U 2019-09-21 2019-09-21 Novel environment-friendly composite board Expired - Fee Related CN210821190U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921600098.9U CN210821190U (en) 2019-09-21 2019-09-21 Novel environment-friendly composite board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921600098.9U CN210821190U (en) 2019-09-21 2019-09-21 Novel environment-friendly composite board

Publications (1)

Publication Number Publication Date
CN210821190U true CN210821190U (en) 2020-06-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921600098.9U Expired - Fee Related CN210821190U (en) 2019-09-21 2019-09-21 Novel environment-friendly composite board

Country Status (1)

Country Link
CN (1) CN210821190U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115157782A (en) * 2022-07-21 2022-10-11 黎明国际智能家具(深州)有限公司 Aluminum core plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115157782A (en) * 2022-07-21 2022-10-11 黎明国际智能家具(深州)有限公司 Aluminum core plate

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200623

Termination date: 20210921