CN115955783A - Method for improving size stability of LCM soft and hard board ACF golden finger - Google Patents
Method for improving size stability of LCM soft and hard board ACF golden finger Download PDFInfo
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- CN115955783A CN115955783A CN202211734705.7A CN202211734705A CN115955783A CN 115955783 A CN115955783 A CN 115955783A CN 202211734705 A CN202211734705 A CN 202211734705A CN 115955783 A CN115955783 A CN 115955783A
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- Prior art keywords
- circuit board
- acf
- lcm
- board
- improving
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- 238000000034 method Methods 0.000 title claims abstract description 41
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000010931 gold Substances 0.000 claims abstract description 36
- 229910052737 gold Inorganic materials 0.000 claims abstract description 36
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 29
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 28
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 229910052742 iron Inorganic materials 0.000 claims abstract description 13
- 238000010030 laminating Methods 0.000 claims abstract description 13
- 230000001681 protective effect Effects 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000004744 fabric Substances 0.000 claims abstract description 6
- 239000003365 glass fiber Substances 0.000 claims abstract description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 6
- 239000007769 metal material Substances 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 1
- 238000007731 hot pressing Methods 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
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Abstract
The invention discloses a method for improving the dimensional stability of an ACF (anisotropic conductive film) golden finger of an LCM (liquid crystal module) soft and hard board, which comprises the steps of manufacturing an inner-layer circuit board, and adding a golden finger lead in the inner-layer circuit board; laminating the inner layer circuit board added with the gold finger lead with a protective film through high-temperature pressing; the inner-layer circuit board is arranged above the bottom surface of the fast press, the bottom surface comprises a gasket layer and an auxiliary material mechanism which are stacked from top to bottom, the gasket layer is made of metal materials, the auxiliary material mechanism comprises a baked iron plate and glass fiber cloth covering the surface of the baked iron plate, and an aluminum sheet conducts heat rapidly, so that the plate is heated more uniformly, and the problems of plate warping and the like are prevented; the aluminum sheet has both rigidity and plasticity, and can effectively buffer the influence of the hot-pressing deformation of the rubber layer on the expansion and shrinkage of the sheet, so that the stability of the expansion and shrinkage size of the ACFA golden finger can be controlled to reach CPK (process capability index) not less than 1.33 when the protective film is laminated on the inner layer, and the manufacturing quality and reliability of the golden finger can be improved.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for improving the dimensional stability of an ACF (anisotropic conductive film) golden finger of an LCM (liquid crystal display module) soft and hard board.
Background
The liquid crystal display screen has wide application fields, from mobile phones, notebooks, flat panels to vehicle-mounted products, industrial control products, electronic wearable products and the like, and from the original CRT display to the narrow frame and the thin screen of the current LCM display screen, the liquid crystal display screen is lighter. At present, LCM display modules have a plurality of components, wherein the most important components are TCON and FPC, and the TCON and FPC drive the whole display screen to light up.
In the prior art, the protective film is pressed and combined by a fast press under the pressure of a hand press at the high temperature of 180 ℃, the auxiliary material of the fast press is a sintered iron plate wrapping glass fiber cloth, and the dimensional change of the expansion and shrinkage of the ACF golden finger of the board is difficult to stabilize due to the influence of high temperature on the thermal expansion and shrinkage of the board and the deformation of a rubber layer of the sintered iron plate in a hot-pressing state.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a method for improving the dimensional stability of an ACF (anisotropic conductive film) gold finger of an LCM (liquid crystal display) soft and hard board, wherein the stability of the expansion and contraction size of the ACF gold finger is controlled to reach CPK (process capability index) which is more than or equal to 1.33 when a protective film is laminated on an inner layer.
The invention discloses a method for improving the dimensional stability of an LCM soft and hard board ACF golden finger, which comprises the following steps:
manufacturing an inner layer circuit board, and adding a gold finger lead in the inner layer circuit board;
laminating the inner layer circuit board added with the gold finger lead with a protective film through high-temperature pressing;
stacking PP layers, curing PP glue at high temperature, and pressing to obtain a multilayer board;
drilling holes in the multilayer board, and carrying out copper deposition and electroplating processes to form metallized holes;
manufacturing an outer layer circuit board on the surface of one side, far away from the inner layer circuit board, of the multilayer board to form a multilayer circuit board;
a solder mask is arranged on the surface of one side, far away from the inner circuit board, of the outer circuit board, a golden finger PAD is arranged in a windowing area of the solder mask, and the metallization hole is connected with the golden finger PAD and the golden finger lead;
the laminating temperature in the step of laminating the inner layer circuit board added with the gold finger lead and the protective film through high-temperature laminating is 180-200 ℃, the inner layer circuit board is arranged above the bottom surface of the rapid pressing machine, the bottom surface comprises a gasket layer and an auxiliary material mechanism which are stacked from top to bottom, the gasket layer is made of metal materials, and the auxiliary material mechanism comprises a baked iron plate and glass fiber cloth covering the surface of the baked iron plate.
Further, according to the method for improving the dimensional stability of the LCM soft and hard board ACF golden finger, the thickness of the baking iron plate is 3.0mm.
Further, in the method for improving the dimensional stability of the LCM soft and hard board ACF golden finger, the gasket layer is an aluminum sheet.
Further, according to the method for improving the dimensional stability of the LCM soft and hard board ACF golden finger, the thickness of the aluminum sheet is 0.15mm.
Furthermore, according to the method for improving the dimensional stability of the LCM soft and hard board ACF golden finger, the aluminum sheet is made of pure aluminum.
Further, according to the method for improving the dimensional stability of the LCM soft and hard board ACF golden finger, the tensile strength of the aluminum sheet is 200-220MPa, the yield strength of the aluminum sheet is 190-210MPa, and the elongation of the aluminum sheet is 3%.
Further, in the method for improving the dimensional stability of the golden fingers of the soft and hard LCM ACF, the number of the golden finger leads and the number of the metallized holes are the same as the number of the golden finger PADs, and each metallized hole is electrically connected with one golden finger lead and one golden finger PAD.
Further, in the method for improving the dimensional stability of the ACF gold fingers of the LCM soft and hard boards, the step of drilling the multilayer board, and performing copper deposition and electroplating processes to form metallized holes is carried out, wherein the metallized holes are 0.1-0.15mm in size.
Furthermore, the method for improving the dimensional stability of the LCM soft and hard board ACF gold finger also comprises a gold melting and silver pressing film process after the step of arranging the solder mask on the surface of one side of the outer layer circuit board far away from the inner layer circuit board.
The invention has the following beneficial effects:
1. according to the method for improving the dimensional stability of the ACF golden finger of the LCM soft and hard board, the aluminum sheet conducts heat rapidly, so that the board is heated more uniformly; the occurrence of the problems of plate warping and the like is prevented;
2. in the method for improving the dimensional stability of the ACF golden finger of the LCM soft and hard board, the aluminum sheet has rigidity and plasticity, and can effectively buffer the influence of the hot-pressing deformation of the rubber layer on the expansion and shrinkage of the board, so that the stability of the expansion and shrinkage size of the ACFA golden finger can be controlled to be more than or equal to 1.33 when the protective film is laminated on the inner layer, and the method is favorable for improving the manufacturing quality and reliability of the golden finger.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flow chart of ACF gold finger fabrication steps in an embodiment of the present invention;
FIG. 2 is a schematic diagram of a pressing mechanism for high temperature pressing according to an embodiment of the present invention;
FIG. 3 is a CPK data graph of the ACF gold finger expansion and contraction dimensions after the aluminum pad is added in the embodiment of the invention.
Reference numerals of the above figures: 1-baking the plate; 2-glass fiber cloth; 3-aluminum sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
The invention discloses a method for improving the dimensional stability of an LCM soft and hard board ACF golden finger, which comprises the following steps: .
Manufacturing an inner layer circuit board, and adding a gold finger lead in the inner layer circuit board;
laminating the inner layer circuit board added with the gold finger lead with a protective film through high-temperature pressing;
stacking PP layers, curing PP glue at high temperature, and pressing to obtain a multilayer board; in the non-golden finger area of the inner layer circuit board; stacking 1 to 2 layers according to the number of the PCB layers;
drilling holes in the multilayer board, performing copper deposition and electroplating processes to form metallized holes, drilling holes in the area of the multilayer board, drilling through PP and the inner-layer and outer-layer circuit boards after the board is subjected to layer addition, and conducting for 0.1-0.15mm through subsequent hole metallization;
manufacturing an outer layer circuit board on the surface of one side, far away from the inner layer circuit board, of the multilayer board to form a multilayer circuit board;
arranging a solder mask on the surface of one side, far away from the inner-layer circuit board, of the outer-layer circuit board, arranging a gold finger PAD in a windowing area of the solder mask, and connecting the gold finger PAD with the gold finger lead through the metallization hole;
the laminating temperature in the step of laminating the inner layer circuit board added with the gold finger lead and the protective film through high-temperature laminating is that the inner layer circuit board is arranged above the bottom surface of the rapid pressing machine at the temperature of 180-200 ℃, the bottom surface comprises a gasket layer and an auxiliary material mechanism which are stacked from top to bottom, wherein the gasket layer is made of a metal material, and the auxiliary material mechanism comprises a baked iron plate 1 and glass fiber cloth 2 covering the surface of the baked iron plate 1.
By the method, the aluminum sheet in the invention conducts heat quickly, so that the plate is heated more uniformly; the occurrence of the problems of plate warping and the like is prevented; the aluminum sheet has both rigidity and plasticity, and can effectively buffer the influence of the hot-pressing deformation of the rubber layer on the expansion and shrinkage of the sheet, so that the stability of the expansion and shrinkage size of the ACFA golden finger can be controlled to reach CPK (process capability index) not less than 1.33 when the protective film is laminated on the inner layer, and the manufacturing quality and reliability of the golden finger can be improved.
Specifically, in the present embodiment, the thickness of the baked iron plate 1 is 3.0mm.
Specifically, in this embodiment, the gasket layer is an aluminum sheet 3.
Specifically, in the present embodiment, the aluminum sheet 3 has a thickness of 0.15mm.
Specifically, in this embodiment, the aluminum sheet 3 is made of pure aluminum.
Specifically, in this embodiment, the tensile strength of the aluminum sheet 3 is 200 to 220MPa, the yield strength of the aluminum sheet is 190 to 210MPa, and the elongation of the aluminum sheet is 3%.
Specifically, in this embodiment, the number of the gold finger leads and the number of the metallization holes are equal to 5 of the gold finger PADs, and each metallization hole is electrically connected to one gold finger lead and one gold finger PAD.
Specifically, in this embodiment, in the step of "drilling a hole in the multilayer board, and performing a copper deposition and electroplating process to form a metalized hole", the metalized hole has a size of 0.1-0.15mm.
Specifically, in this embodiment, after the step of "providing a solder resist layer on a surface of the outer layer circuit board on a side away from the inner layer circuit board", a gold plating and silver plating process is further included.
0 the principles and embodiments of the present invention have been described using specific embodiments, the above description of which has been presented for purposes of illustration and description
But only to facilitate an understanding of the method of the invention and its core ideas; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (9)
1. A method for improving the dimensional stability of an ACF (anisotropic conductive film) golden finger of an LCM (liquid crystal display module) soft and hard board is characterized by comprising the following steps:
manufacturing an inner layer circuit board, and adding a gold finger lead in the inner layer circuit board;
laminating the inner layer circuit board added with the gold finger lead with a protective film through high-temperature pressing;
stacking PP layers, curing PP glue at high temperature, and pressing to obtain a multilayer board;
drilling holes in the multilayer board, and carrying out copper deposition and electroplating processes to form metallized holes;
manufacturing an outer-layer circuit board on the surface of one side, far away from the inner-layer circuit board, of the multilayer board to form a multilayer circuit board;
a solder mask is arranged on the surface of one side, far away from the inner circuit board, of the outer circuit board, a golden finger PAD is arranged in a windowing area of the solder mask, and the metallization hole is connected with the golden finger PAD and the golden finger lead;
the laminating temperature in the step of laminating the inner layer circuit board added with the gold finger lead and the protective film through high-temperature laminating is 180-200 ℃, the inner layer circuit board is arranged above the bottom surface of the rapid pressing machine, the bottom surface comprises a gasket layer and an auxiliary material mechanism which are stacked from top to bottom, the gasket layer is made of metal materials, and the auxiliary material mechanism comprises a baked iron plate and glass fiber cloth covering the surface of the baked iron plate.
2. The method for improving the dimensional stability of the LCM soft and hard board ACF gold fingers of claim 1, wherein the thickness of the baking iron plate is 3.0mm.
3. The method for improving the dimensional stability of LCM soft and hard board ACF gold fingers according to claim 1, wherein the spacer layer is an aluminum sheet.
4. The method for improving the dimensional stability of the LCM softboard ACF gold fingers according to claim 3, wherein the aluminum sheet has a thickness of 0.15mm.
5. The method for improving the dimensional stability of the ACF fingers on the LCM hardboard as claimed in claim 3, wherein the aluminum sheet is made of pure aluminum.
6. The method for improving the dimensional stability of the LCM soft and hard board ACF gold fingers of claim 3, wherein the tensile strength of the aluminum sheet is 200-220MPa, the yield strength of the aluminum sheet is 190-210MPa, and the elongation of the aluminum sheet is 3%.
7. The method for improving the dimensional stability of the LCM soft and hard board ACF gold fingers according to claim 1, wherein the number of the gold finger leads and the number of the metallized holes are the same as the number of the gold finger PADs, and each metallized hole is electrically connected with one gold finger lead and one gold finger PAD.
8. The method for improving the dimensional stability of the ACF fingers of the LCM soft and hard boards as claimed in claim 1, wherein the step of drilling holes on the multi-layer board and performing copper deposition and electroplating processes to form the metallized holes is performed, and the size of the metallized holes is 0.1-0.15mm.
9. The method for improving the dimensional stability of the LCM soft and hard board ACF gold fingers according to claim 1, further comprising a gold melting and silver pressing film process after the step of arranging a solder mask layer on the surface of one side of the outer layer circuit board far away from the inner layer circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211734705.7A CN115955783B (en) | 2022-12-30 | 2022-12-30 | Method for improving size stability of ACF golden finger of LCM soft and hard plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211734705.7A CN115955783B (en) | 2022-12-30 | 2022-12-30 | Method for improving size stability of ACF golden finger of LCM soft and hard plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115955783A true CN115955783A (en) | 2023-04-11 |
| CN115955783B CN115955783B (en) | 2024-03-08 |
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| CN202211734705.7A Active CN115955783B (en) | 2022-12-30 | 2022-12-30 | Method for improving size stability of ACF golden finger of LCM soft and hard plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0757386A2 (en) * | 1995-08-02 | 1997-02-05 | International Business Machines Corporation | Systems interconnected by bumps of joining material |
| US20110201157A1 (en) * | 2008-03-25 | 2011-08-18 | Bridge Semiconductor Corporation. | Method of making a semiconductor chip assembly with a post/base heat spreader and a multilevel conductive trace |
| CN203251519U (en) * | 2013-05-30 | 2013-10-23 | 双鸿电子(惠州)有限公司 | Press-fit auxiliary structure of quick press machine |
| CN104039093A (en) * | 2014-06-25 | 2014-09-10 | 惠州市金百泽电路科技有限公司 | Manufacturing method for magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes |
| CN107072054A (en) * | 2017-05-24 | 2017-08-18 | 厦门华天华电子有限公司 | A kind of process for pressing of flexible circuit |
| CN108925034A (en) * | 2018-07-09 | 2018-11-30 | 湖北金禄科技有限公司 | A kind of processing method and golden finger multilayer circuit board of golden finger |
| CN109152212A (en) * | 2017-06-28 | 2019-01-04 | 久裕电子科技（江苏）有限公司 | A kind of burn pays iron plate |
| CN110267433A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of circuit board reinforcement process and circuit board |
| CN210168297U (en) * | 2019-07-01 | 2020-03-20 | 苏州维信电子有限公司 | Pressing and stacking structure of vacuum quick-pressing flexible circuit board |
| CN115334761A (en) * | 2022-09-01 | 2022-11-11 | 广州源康精密电子股份有限公司 | Ultrathin single-sided FPC module product and manufacturing process thereof |
-
2022
- 2022-12-30 CN CN202211734705.7A patent/CN115955783B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0757386A2 (en) * | 1995-08-02 | 1997-02-05 | International Business Machines Corporation | Systems interconnected by bumps of joining material |
| US20110201157A1 (en) * | 2008-03-25 | 2011-08-18 | Bridge Semiconductor Corporation. | Method of making a semiconductor chip assembly with a post/base heat spreader and a multilevel conductive trace |
| CN203251519U (en) * | 2013-05-30 | 2013-10-23 | 双鸿电子(惠州)有限公司 | Press-fit auxiliary structure of quick press machine |
| CN104039093A (en) * | 2014-06-25 | 2014-09-10 | 惠州市金百泽电路科技有限公司 | Manufacturing method for magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes |
| CN107072054A (en) * | 2017-05-24 | 2017-08-18 | 厦门华天华电子有限公司 | A kind of process for pressing of flexible circuit |
| CN109152212A (en) * | 2017-06-28 | 2019-01-04 | 久裕电子科技（江苏）有限公司 | A kind of burn pays iron plate |
| CN108925034A (en) * | 2018-07-09 | 2018-11-30 | 湖北金禄科技有限公司 | A kind of processing method and golden finger multilayer circuit board of golden finger |
| CN110267433A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of circuit board reinforcement process and circuit board |
| CN210168297U (en) * | 2019-07-01 | 2020-03-20 | 苏州维信电子有限公司 | Pressing and stacking structure of vacuum quick-pressing flexible circuit board |
| CN115334761A (en) * | 2022-09-01 | 2022-11-11 | 广州源康精密电子股份有限公司 | Ultrathin single-sided FPC module product and manufacturing process thereof |
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| CN115955783B (en) | 2024-03-08 |
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