CN101365298B - Manufacturing method for semi-flexible printed circuit board - Google Patents
Manufacturing method for semi-flexible printed circuit board Download PDFInfo
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- CN101365298B CN101365298B CN 200810030306 CN200810030306A CN101365298B CN 101365298 B CN101365298 B CN 101365298B CN 200810030306 CN200810030306 CN 200810030306 CN 200810030306 A CN200810030306 A CN 200810030306A CN 101365298 B CN101365298 B CN 101365298B
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Abstract
A production method of a semi-flexible printed circuit board comprises the following steps of: (1) preparing a sheet metal; (2) dividing the sheet metal into a molding area and a shaping area; (3) dividing the molding area into a plate area and a flexible area in advance in the molding area; (4) processing the sheet medal as follows: (4.1) processing of the pattern of the sheet metal and (4.2) processing the flexible bent area of the sheet metal so that the flexible area becomes thinner and can be bent; and (5) removing the shaping area and getting the semi-flexible printed circuit board. Theinvention adopts cheap general rigid materials such as glass fabric-epoxide resin copper pour foil, and the like to replace expensive flexible copper pour plate materials such as polyimide, and the like, thereby greatly reducing the cost. At the same time, the invention has the advantages of simple machinery process, high rate of finished products and high reliability. The semi-flexible printed circuit board produced by the method particularly suits vehicle-borne products with higher reliability requirement.
Description
Technical field
The present invention relates to a kind of manufacture method of printed circuit board, more particularly, relate to a kind of manufacture method of semi-flexible printed circuit board.
Background technology
Existing printed circuit board generally comprises flexible printed-circuit board, rigid printed circuit boards and firm-flexible printed-circuit board.
Flexible printed-circuit board (Flexible Printed Circuit Board, abbreviation FPC) is mainly used in electronic component mounting, as elements such as integrated circuit (IC) chip, resistance, electric capacity, connectors, so that electronic product can be brought into play set function, be applied in the fields such as connection between small-sized or thin type electronic mechanism and hardboard usually.The application of flexible printed-circuit board is very extensive, as aspects such as computer, communication equipment, instrument and meter, medicine equipment, military and space.The development of flexible printed-circuit board and extensive use are that its structure is flexible, volume is little, (being made of film) in light weight because it has significant superiority.It can do dynamic deflection, curl and folding etc., has the flexibility of height.
From the structural analysis of flexible printed-circuit board, the material that constitutes flexible printed-circuit board has insulating substrate, metal conductor layer (Copper Foil), adhesive and cover layer.The material of main part of flexible printed-circuit board must be the insulation film of deflection, and it should have favorable mechanical and electric property as carrier.Conventional general material has polyester and polyimide film.But the carrier of using many flexible printed-circuit boards is a polyimide film series.
Rigid printed circuit boards is the printed board made from rigid substrate, generally by the insulation, heat insulation, do not allow flexible material made.The tiny line material that can see on the surface is a Copper Foil, and Copper Foil covers on the whole plank originally, and the part Copper Foil is etched in manufacture process, and the Copper Foil that stays just becomes latticed tiny circuit.These circuits are referred to as lead (Conductor Pattern), and the circuit that is used to provide components and parts on the printed circuit board connects.The material of main part of rigid printed circuit boards generally adopts glass cloth-epoxy resin copper coated foil plate (FR-4 also cries the epoxy glass fabric copper-clad plate), and rigid printed circuit boards generally can not deflection.
Flexible printed-circuit board is that used baseplate material is different with the maximum differential of rigid printed circuit boards, and the film substrate of flexible printed-circuit board is fit to bending fold, and rigid printed circuit boards base material be not suitable for bending fold.In addition; the less employing solder resist in flexible printed-circuit board surface is outside the protective layer, more is that the employing coverlay is a protective layer, and the coverlay protective layer is more solid and reliable than solder resist protective layer; this coverlay is the film identical with the base material kind, through heat pressure adhesive in the plate face.
Just-and flexible printed-circuit board comprises rigid printed circuit boards and flexible printed-circuit board, connects by flexible printed-circuit board between two rigid printed circuit boards, thereby constitutes flexible folding printed circuit board; Just-manufacturing of flexible printed-circuit board comprised the technology of rigid printed circuit boards and flexible printed-circuit board, at first, process the rigid element and the flex section of printed circuit board respectively, machine the rigid element conductor fig with the rigidity copper clad foil substrate, machine the flex section conductor fig with the flexible copper-clad foil substrate; Then, rigid element and flex section are pressed together, by processing such as boring and plated-through holes the segment conductor between rigid element and the flex section is interconnected again, form complete circuit, carry out necessary surface treatment and sharp processing at last.
At present, some electronic products, for example, the vehicle-mounted product that reliability requirement is higher, this electronic product does not need to bear the dynamic bending load as folding cell phone, its printed circuit board is repeatedly bending in packaging part, just bears first and second bending in assembling process, this class bending is referred to as static buckling, and the printed circuit board of this electronic product has adopted just-flexible printed-circuit board usually.
And in the manufacture process of firm-flexible printed-circuit board, exist the technological process complexity, product material expense costliness, cost height, technique controlling difficulty height, shortcomings such as product reliability is low, still advise that this type of printed circuit board can adopt half flexible printed circuit board.Semi-flexible printed circuit board is to adopt rigid material to replace flex plate by special processing, has been applied in firm-flexible printed-circuit board product, can realize bending performance several times too.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of manufacture method of half flexible print wiring board.
In order to solve the problems of the technologies described above, the technical solution used in the present invention is as follows:
A kind of manufacture method of semi-flexible printed circuit board may further comprise the steps:
(1) prepares plate;
(2) plate is divided in advance shaping area and external form district;
(3) in shaping area, plate is divided into dull and stereotyped district and flexible bending district in advance;
(4) plate is processed, being comprised:
(4.1) plate is carried out figure processing,
(4.2) the flexible bending district to plate processes, make flexible bending district the thickness attenuation and can bending;
(5) remove the external form district, produce semi-flexible printed circuit board.
Above-mentioned dull and stereotyped district is used for electronic component mounting, and flexible bending district is used for bending and is connected with circuit.
As first kind of optimal technical scheme of the present invention: described plate is a stiff baseplate, and described figure processing to plate is the outer field figure processing of stiff baseplate; Described processing to the flexible bending of plate district, be the milling processing of adopting milling cutter to carry out in the flexible bending of stiff baseplate district, thereby mill the part material (the part material and the copper foil layer of resin bed) in the flexible bending of stiff baseplate district, make the flexible bending of stiff baseplate district's attenuation and can bending, this method is called the milling method.
As second kind of optimal technical scheme of the present invention: described plate comprises stiff baseplate, central layer and prepreg, and central layer is pressed together on the stiff baseplate by prepreg; Described figure processing to plate comprises:
(4.1.1) before stiff baseplate, central layer and prepreg pressing, the processing of the figure of stiff baseplate stitching surface and central layer stitching surface,
(4.1.2) after stiff baseplate, central layer and prepreg pressing, the outer and outer field figure processing of central layer of stiff baseplate.
In above-mentioned second kind of optimal technical scheme can be by the following technical solutions to the processing in the flexible bending of plate district: described processing to the flexible bending of plate district, be the milling processing of adopting the flexible bending of milling cutter plate after pressing district to carry out, thereby mill the part material in the flexible bending of plate district after the pressing, make the flexible bending of plate district after the pressing the thickness attenuation and can bending, this method is also referred to as the milling method.
In above-mentioned second kind of optimal technical scheme also can be by the following technical solutions to the processing in the flexible bending of plate district: described processing to the flexible bending of plate district may further comprise the steps:
(4.2.1) when stiff baseplate stitching surface and central layer stitching surface being carried out figure processing, the conductive layer in flexible bending district on the stiff baseplate stitching surface is etched away;
(4.2.2) before the pressing of central layer, prepreg and stiff baseplate, with the removal of windowing of the material in flexible bending district on central layer and the prepreg;
(4.2.3) after the pressing of central layer, prepreg and stiff baseplate, the flexible bending district on the stiff baseplate reveals by the instrument window.This method is called fenestration.
In the pressing process, because the resin in the prepreg can flow in the instrument window, pollute, so in order to prevent excessive glue pollution, described prepreg preferably adopts low fluidity prepreg (No FLOW).
In above-mentioned second kind of optimal technical scheme can also be by the following technical solutions to the processing in the flexible bending of plate district: described processing to the flexible bending of plate district may further comprise the steps:
(4.2.1) when the stitching surface to stiff baseplate stitching surface and central layer carries out figure processing, the conductive layer in flexible bending district on the stiff baseplate stitching surface is etched away;
(4.2.2) before the pressing of central layer, prepreg and stiff baseplate, with the removal of windowing of the material in flexible bending district on the prepreg;
(4.2.3) before the pressing of central layer, prepreg and stiff baseplate, by the gong channel process, gong goes out two parallel bar holes in the flexible bending district of central layer and external form district, the edge of above-mentioned two bar holes lays respectively at flexible bending district and the dull and stereotyped junction of distinguishing, and the end of two bar holes is positioned in the central layer external form district; Promptly the length of two bar holes is greater than the width in flexible bending district; Above-mentioned gong channel process is a prior art;
(4.2.4) after the pressing of central layer, prepreg and stiff baseplate, respectively along other two opposite side in the flexible bending of central layer district, gong goes out the parallel bar hole of two other in central layer external form district, above-mentioned four bar holes communicate, the material in the flexible bending of central layer district is separated with the material in flat board district, external form district, remove the material in the flexible bending of central layer district, the flexible bending district on the stiff baseplate is revealed.This method is called the gong channel process.
Described stiff baseplate preferably adopts glass cloth-epoxy resin copper coated foil plate, and this glass cloth-epoxy resin copper coated foil plate is a double sided board, comprises conductive layer, intermediate insulating layer and lower conductiving layer, and last conductive layer presses together by intermediate insulating layer and lower conductiving layer.
Described central layer is individual layer central layer or multilayer central layer, and individual layer central layer and individual layer central layer are made the multilayer central layer by the prepreg pressing, and elder generation carries out figure processing with the stitching surface of individual layer central layer before pressing; Described individual layer central layer preferably adopts glass cloth-epoxy resin copper coated foil plate, and this glass cloth-epoxy resin copper coated foil plate is a double sided board, comprises conductive layer, intermediate insulating layer and lower conductiving layer, and last conductive layer presses together by intermediate insulating layer and lower conductiving layer.。Above-mentioned compression method is a prior art.
Described upper and lower conductive layer is a copper foil layer, and above-mentioned intermediate insulating layer is a resin bed.
Glass cloth-epoxy resin copper coated foil plate is to be reinforcing material with the electronic-grade glass fiber cloth, and with epoxy resin as adhesive, its good electric property, mechanical strength height, variation affected by environment are little.Glass cloth-epoxy resin copper coated foil plate majority is used to make double-clad board and multilayer printed board, is applied in the durable electronic equipments such as computer, communication equipment, business machine and industrial instrumentation.Along with to epoxy resin modification, the electrical property of glass cloth-epoxy resin copper coated foil plate becomes more excellent and becomes higher with thermal endurance, and high-performance glass cloth-epoxy resin copper coated foil plate is applied at digitalization high frequency high speed equipment.
After the flexible bending district of plate processed, the thickness in described flexible bending district was preferably between the 15 μ m-200 μ m, and such thickness promptly is convenient to the flexible bending of rigid plate, can improve the bending number of times in flexible bending district again; The width in described flexible bending district is preferably between 3mm-20mm, and above-mentioned width mainly is to determine according to the crooked process radius of rigid plate actual needs.
The conduction number of plies in described flexible bending district preferably is less than or equal to 2 floor, and copper foil layer preferably adopts rolled copper foil, and copper face preferably increases flexible solder mask (as the PSR-9000FLX501 model of sun printing ink Co., Ltd).
The present invention's beneficial effect against existing technologies is, because the present invention adopts cheap flexible copper-clad panel materials at high price such as common rigid material replacement polyimides such as glass cloth-epoxy resin copper coated foil plate, so, reduced product cost significantly.With just-and the manufacture method of flexible printed-circuit board compares, and the present invention can reduce welding and count, and reduces the encapsulation number of doing over again, and can overcome the high shortcoming of polyimides water absorption rate again, does not need baking before the encapsulation, and work flow is simple; Simultaneously, also solve property differences such as thermal endurance because of different materials, the coefficient of expansion and cause interlayer, improved the rate of finished products and the reliability of product widely in conjunction with product defects problems such as bad and through hole reliability decrease.The semi-flexible printed circuit board of manufacturing of the present invention is specially adapted to for example higher vehicle-mounted product of reliability requirement, the printed circuit board of this electronic product is repeatedly bending in packaging part, just in assembling process, bear first and second bending, therefore, in this electronic product, use the semi-flexible printed circuit board that the present invention makes, can either realize bending performance several times, can reduce cost widely again.
The present invention is described further below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is the structural representation of stiff baseplate in the preferred embodiment of the present invention 1;
Fig. 2 is the structural representation when in the preferred embodiment of the present invention 1 stiff baseplate being carried out milling;
Fig. 3 is a stereogram of removing the semi-flexible printed circuit board of making behind the external form district in the preferred embodiment of the present invention 1;
Fig. 4 is the structural representation of the semi-flexible printed circuit board that produces of the preferred embodiment of the present invention 1 when crooked;
Fig. 5 is the structural representation of plate after the pressing in the preferred embodiment of the present invention 2;
Fig. 6 is to the structural representation during the plate milling after the pressing in the preferred embodiment of the present invention 2;
Fig. 7 be in the preferred embodiment of the present invention 2 after the pressing plate milling finish and remove structural representation behind the external form district;
Fig. 8 is the structural representation of the semi-flexible printed circuit board that produces of the preferred embodiment of the present invention 2 when crooked;
Fig. 9 is the structural representation before stiff baseplate in the preferred embodiment of the present invention 3, central layer and the prepreg pressing;
Figure 10 is the structural representation after stiff baseplate in the preferred embodiment of the present invention 3, central layer and the prepreg pressing;
Figure 11 is the vertical view of Figure 10;
Figure 12 is a stereogram of removing the semi-flexible printed circuit board of making behind the external form district in the preferred embodiment of the present invention 3;
Figure 13 is the structural representation of the semi-flexible printed circuit board that produces of the preferred embodiment of the present invention 3 when crooked;
Figure 14 is the vertical view before stiff baseplate in the preferred embodiment of the present invention 4, central layer and the prepreg pressing;
Figure 15 is that A-A in the vertical view of Figure 14 is to cutaway view;
Figure 16 is the structural representation after stiff baseplate in the preferred embodiment of the present invention 4, central layer and the prepreg pressing;
Figure 17 is the vertical view of printed circuit board behind twice gong groove in the preferred embodiment of the present invention 4;
Figure 18 is a structural representation of removing the part material in flexible bending district among Figure 17;
Figure 19 be remove in the preferred embodiment of the present invention 4 semi-flexible printed circuit board made behind the external form district structural representation;
Figure 20 is the structural representation of the semi-flexible printed circuit board that produces of the preferred embodiment of the present invention 4 when crooked.
Embodiment
As shown in Figures 1 to 4, the manufacture method of the semi-flexible printed circuit board in this preferred embodiment (milling method) may further comprise the steps:
(1) prepare plate, this plate is a stiff baseplate 1; As shown in Figure 1, above-mentioned stiff baseplate 1 adopts glass cloth-epoxy resin copper coated foil plate, this glass cloth-epoxy resin copper coated foil plate is a double sided board, comprises conductive layer 11, intermediate insulating layer 10 and lower conductiving layer 12, and last conductive layer 11 presses together by intermediate insulating layer 10 and lower conductiving layer 12.Above-mentioned upper and lower conductive layer 11,12 is a copper foil layer, and above-mentioned intermediate insulating layer 10 is a resin bed.
(2) stiff baseplate 1 is divided in advance shaping area 8 (dotted line is with interior zone) and external form district 9 (zone beyond the dotted line);
(3) in shaping area 8, stiff baseplate 1 is divided into dull and stereotyped district 2 and flexible bending district 3 in advance;
(4-1) carries out figure processing to stiff baseplate 1, and promptly the upper and lower conductive layer 11,12 to stiff baseplate 1 carries out figure processing;
(4-2) as shown in Figure 2, carry out milling processing in flexible bending district 3 with milling cutter 4, mill the part material (the part material and the copper foil layer of resin bed) in stiff baseplate 1 flexible bending district 3, the width in flexible bending district 3 is 3mm's, as shown in Figure 3, after the milling processing, the thickness in flexible bending district 3 becomes 15 μ m and can bending;
(5) as shown in Figure 3, remove external form district 9, thereby produce semi-flexible printed circuit board, as shown in Figure 4, semi-flexible printed circuit board can be used for bending and be connected with circuit.
To shown in Figure 8, the manufacture method of the semi-flexible printed circuit board among the embodiment 2 (milling method) may further comprise the steps as Fig. 5:
(1) prepare plate, this plate comprises stiff baseplate 1, central layer 5 and prepreg 6, and above-mentioned central layer 5 is an individual layer central layer 51; As shown in Figure 5, above-mentioned stiff baseplate 1 is identical with the stiff baseplate of implementing in 11, and above-mentioned individual layer central layer 51 is also basic identical with the stiff baseplate of implementing in 11, just the call difference.
(2) stiff baseplate 1, central layer 5 and prepreg 6 are divided into shaping area 8 and external form district 9 in advance;
(3) in shaping area 8, stiff baseplate 1, central layer 5 and prepreg 6 are divided into dull and stereotyped district 2 and flexible bending district 3 in advance;
(4-1) is that the stitching surface of the last conductive layer 11 of stiff baseplate 1 and central layer 5 is that the lower conductiving layer 512 of individual layer central layer 51 carries out figure processing with the stitching surface of stiff baseplate 1;
(4-2) carry out pressing with stiff baseplate 1 and central layer 5 by prepreg 6 as shown in Figure 5;
(4-3) to pressing after the skin of plate be that the lower conductiving layer 12 of stiff baseplate 1 and the last conductive layer 511 of individual layer central layer 51 carry out figure processing;
(4-4) as shown in Figure 6, carry out milling processing in flexible bending district 3 with milling cutter 4, mill the material in central layer 5 flexible bending districts 3 and the part material (the part material and the copper foil layer of resin bed) in stiff baseplate 1 flexible bending district 3, the width in flexible bending district 3 is 20mm, after the milling processing, the thickness in flexible bending district 3 becomes 20 μ m and can bending;
(5) as shown in Figure 7, remove external form district 9, thereby produce semi-flexible printed circuit board, as shown in Figure 8, semi-flexible printed circuit board can be used for bending and be connected with circuit.
If make more multi-layered semi-flexible printed circuit board, can adopt the central layer 5 that constitutes by the multilayer central layer by prepreg 6 and stiff baseplate 1 pressing, utilize above-mentioned milling method to make again.
To shown in Figure 13, the manufacture method of the semi-flexible printed circuit board among the embodiment 3 (fenestration) may further comprise the steps as Fig. 9:
(1) prepare plate, this plate comprises stiff baseplate 1, central layer 5 and prepreg 7; The structure of stiff baseplate 1 is identical with the stiff baseplate of implementing in 11, above-mentioned central layer 5 adopts two layers of central layer, this central layer 5 is made the multilayer central layer by individual layer central layer 51 and individual layer central layer 52 by prepreg 6 pressings, elder generation carries out figure processing with the stitching surface 511,522 of individual layer central layer 51,52 before pressing, certainly, above-mentioned central layer 5 also can adopt individual layer central layer 51 or the multilayer central layer more than two layers; Above-mentioned prepreg 7 adopts low fluidity prepreg (No FLOW);
(2) stiff baseplate 1, central layer 5 and prepreg 7 are divided into shaping area 8 and external form district 9 in advance;
(3) in shaping area 8, stiff baseplate 1, central layer 5 and prepreg 7 are divided into dull and stereotyped district 2 and flexible bending district 3 in advance;
(4-1) is that the stitching surface of the last conductive layer 11 of stiff baseplate 1 and central layer 5 is that the lower conductiving layer 512 of individual layer central layer 51 carries out figure processing with stiff baseplate 1 stitching surface, and the last conductive layer 11 in stiff baseplate 1 flexible bending district 3 is etched away;
(4-2) are with the removal of windowing of the material in flexible bending district 3 on central layer 5 and the prepreg 7;
(4-3) carry out pressing with stiff baseplate 1 and central layer 5 by prepreg 7, and after the pressing, the flexible bending district 3 on the stiff baseplate 1 is that flexible bending district 3 reveals by the instrument window;
(4-4) to pressing after the skin of plate be that the lower conductiving layer 12 of stiff baseplate 1 and the last conductive layer 521 of individual layer central layer 52 carry out figure processing;
(5) as shown in figure 12, remove external form district 9, produce semi-flexible printed circuit board.As shown in figure 13, semi-flexible printed circuit board can be used for crooked being connected with circuit.
If make more multi-layered semi-flexible printed circuit board, can adopt stiff baseplate 1, prepreg 7 and, utilize above-mentioned fenestration to make again by the central layer 5 that the multilayer central layer constitutes.
To shown in Figure 20, the manufacture method of the semi-flexible printed circuit board among the embodiment 4 (gong channel process) may further comprise the steps as Figure 14:
(1) prepare plate, this plate comprises stiff baseplate 1, central layer 5 and prepreg 7; Above-mentioned stiff baseplate 1, central layer 5 and prepreg 7 have identical structure with stiff baseplate 1, central layer 5 and the prepreg 7 implemented in 3 respectively;
(2) stiff baseplate 1, central layer 5 and prepreg 7 are divided in advance shaping area 8 (dotted line is with interior zone) and external form district 9 (zone beyond the dotted line);
(3) in shaping area 8, stiff baseplate 1, central layer 5 and prepreg 7 are divided into dull and stereotyped district 2 and flexible bending district 3 in advance;
(4-1) is that the stitching surface of the last conductive layer 11 of stiff baseplate 1 and central layer 5 is that the lower conductiving layer 512 of individual layer central layer 51 carries out figure processing with stiff baseplate 1 stitching surface, and the last conductive layer 11 in stiff baseplate 1 flexible bending district 3 is etched away;
(4-2) are with the removal of windowing of the material in flexible bending district 3 on the prepreg 7;
(4-3) are by the gong channel process, gong goes out two parallel bar holes 31,32 in the flexible bending district 3 of central layer 5 and external form district 9, the edge of above-mentioned two bar holes 31,32 lays respectively at flexible bending district 3 and dull and stereotyped 2 the junction of distinguishing, article two, the end of bar hole 31,32 is positioned in the internal layer core 5 plate external form districts 9, and promptly the length of two bar holes 31,32 is greater than the width in flexible bending district 3; Above-mentioned gong channel process is a prior art;
(4-4) carry out pressing with stiff baseplate 1 and central layer 5 by prepreg 7;
After (4-5) pressing, again respectively along other two opposite side in central layer 5 flexible bending districts 3, gong goes out the parallel bar hole of two other 33,34 in central layer 5 external form districts 9, above-mentioned four bar holes 31,32,33,34 communicate, the material in central layer 5 flexible bending districts 3 is separated with the material in flat board district 2, external form district 9, remove the material in central layer 5 flexible bending districts 3, the flexible bending district 3 on the stiff baseplate 1 is revealed;
(4-6) to pressing after the skin of plate be that the lower conductiving layer 12 of stiff baseplate 1 and the last conductive layer 521 of individual layer central layer 52 carry out figure processing;
(5) as shown in figure 19, remove external form district 9, produce semi-flexible printed circuit board.As shown in figure 20, semi-flexible printed circuit board can be used for crooked being connected with circuit.
If make more multi-layered semi-flexible printed circuit board, can adopt stiff baseplate 1, prepreg 7 and, utilize above-mentioned gong channel process to make again by the central layer 5 that the multilayer central layer constitutes.
Claims (10)
1. the manufacture method of a semi-flexible printed circuit board may further comprise the steps:
(1) prepares plate;
(2) plate is divided in advance shaping area and external form district;
(3) in shaping area, plate is divided into dull and stereotyped district and flexible bending district in advance;
(4) plate is processed, being comprised:
(4.1) plate is carried out figure processing,
(4.2) the flexible bending district to plate processes, make flexible bending district the thickness attenuation and can bending;
(5) remove the external form district, produce semi-flexible printed circuit board.
2. the manufacture method of semi-flexible printed circuit board as claimed in claim 1, it is characterized in that: described plate is a stiff baseplate, described figure processing to plate is the outer field figure processing of stiff baseplate; Described processing to the flexible bending of plate district is the milling processing of adopting milling cutter to carry out in the flexible bending of stiff baseplate district, thereby mills the part material in the flexible bending of stiff baseplate district, makes the flexible bending of stiff baseplate district's attenuation and can bending.
3. the manufacture method of semi-flexible printed circuit board as claimed in claim 1, it is characterized in that: described plate comprises stiff baseplate, central layer and prepreg, central layer is pressed together on the stiff baseplate by prepreg; Described figure processing to plate comprises:
(4.1.1) before stiff baseplate, central layer and prepreg pressing, the processing of the figure of stiff baseplate stitching surface and central layer stitching surface,
(4.1.2) after stiff baseplate, central layer and prepreg pressing, the outer and outer field figure processing of central layer of stiff baseplate.
4. the manufacture method of semi-flexible printed circuit board as claimed in claim 3, it is characterized in that: described processing the flexible bending of plate district, be the milling processing of adopting the flexible bending of milling cutter plate after pressing district to carry out, thereby mill the part material in the flexible bending of plate district after the pressing, make the flexible bending of plate district after the pressing the thickness attenuation and can bending.
5. the manufacture method of semi-flexible printed circuit board as claimed in claim 3, it is characterized in that: described processing to the flexible bending of plate district may further comprise the steps:
(4.2.1) when stiff baseplate stitching surface and central layer stitching surface being carried out figure processing, the conductive layer in flexible bending district on the stiff baseplate stitching surface is etched away;
(4.2.2) before the pressing of central layer, prepreg and stiff baseplate, with the removal of windowing of the material in flexible bending district on central layer and the prepreg;
(4.2.3) after the pressing of central layer, prepreg and stiff baseplate, the flexible bending district on the stiff baseplate reveals by the instrument window.
6. the manufacture method of semi-flexible printed circuit board as claimed in claim 5 is characterized in that: the low fluidity prepreg of described prepreg employing.
7. the manufacture method of semi-flexible printed circuit board as claimed in claim 3, it is characterized in that: described processing to the flexible bending of plate district may further comprise the steps:
(4.2.1) when the stitching surface to stiff baseplate stitching surface and central layer carries out figure processing, the conductive layer in flexible bending district on the stiff baseplate stitching surface is etched away;
(4.2.2) before the pressing of central layer, prepreg and stiff baseplate, with the removal of windowing of the material in flexible bending district on the prepreg;
(4.2.3) before the pressing of central layer, prepreg and stiff baseplate, by the gong channel process, gong goes out two parallel bar holes in the flexible bending district of central layer and external form district, the edge of above-mentioned two bar holes lays respectively at flexible bending district and the dull and stereotyped junction of distinguishing, and the end of two bar holes is positioned in the central layer external form district;
(4.2.4) after the pressing of central layer, prepreg and stiff baseplate, respectively along other two opposite side in the flexible bending of central layer district, gong goes out the parallel bar hole of two other in central layer external form district, above-mentioned four bar holes communicate, the material in the flexible bending of central layer district is separated with the material in flat board district, external form district, remove the material in the flexible bending of central layer district, the flexible bending district on the stiff baseplate is revealed.
8. as the manufacture method of claim 2 or 3 described semi-flexible printed circuit boards, it is characterized in that: described stiff baseplate adopts glass cloth-epoxy resin copper coated foil plate, this glass cloth-epoxy resin copper coated foil plate is a double sided board, comprise conductive layer, intermediate insulating layer and lower conductiving layer, last conductive layer presses together by intermediate insulating layer and lower conductiving layer.
9. the manufacture method of semi-flexible printed circuit board as claimed in claim 3, it is characterized in that: described central layer is individual layer central layer or multilayer central layer, individual layer central layer and individual layer central layer are made the multilayer central layer by the prepreg pressing, and elder generation carries out figure processing with the stitching surface of individual layer central layer before pressing; Described individual layer central layer adopts glass cloth-epoxy resin copper coated foil plate, and this glass cloth-epoxy resin copper coated foil plate is a double sided board, comprises conductive layer, intermediate insulating layer and lower conductiving layer, and last conductive layer presses together by intermediate insulating layer and lower conductiving layer.
10. as the manufacture method of claim 2 or 4 or 5 or 7 described semi-flexible printed circuit boards, it is characterized in that: after the flexible bending district of plate is processed, the thickness in described flexible bending zone is between 15 μ m-20 μ m, and the width in described flexible bending zone is between 3mm-20mm.
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| CN 200810030306 CN101365298B (en) | 2008-08-22 | 2008-08-22 | Manufacturing method for semi-flexible printed circuit board |
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| CN 200810030306 CN101365298B (en) | 2008-08-22 | 2008-08-22 | Manufacturing method for semi-flexible printed circuit board |
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| CN101365298A CN101365298A (en) | 2009-02-11 |
| CN101365298B true CN101365298B (en) | 2011-03-30 |
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| CN102946688B (en) * | 2012-11-22 | 2015-02-25 | 高德(苏州)电子有限公司 | Flexible circuit board |
| CN103281864B (en) * | 2013-05-02 | 2016-03-23 | 深圳崇达多层线路板有限公司 | A kind of static state is destroyed or force to yield the manufacture method of ladder wiring board |
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-
2008
- 2008-08-22 CN CN 200810030306 patent/CN101365298B/en not_active Expired - Fee Related
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| CN101365298A (en) | 2009-02-11 |
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