CN115665976A - Semi-flexible Printed Circuit Board (PCB) structure and manufacturing method thereof - Google Patents

Semi-flexible Printed Circuit Board (PCB) structure and manufacturing method thereof Download PDF

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Publication number
CN115665976A
CN115665976A CN202211313435.2A CN202211313435A CN115665976A CN 115665976 A CN115665976 A CN 115665976A CN 202211313435 A CN202211313435 A CN 202211313435A CN 115665976 A CN115665976 A CN 115665976A
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CN
China
Prior art keywords
sinking
groove
semi
flexible pcb
sinking groove
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CN202211313435.2A
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Chinese (zh)
Inventor
杨建成
李伟
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Qingyuan Fuying Electronic Co ltd
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Qingyuan Fuying Electronic Co ltd
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Priority to CN202211313435.2A priority Critical patent/CN115665976A/en
Publication of CN115665976A publication Critical patent/CN115665976A/en
Pending legal-status Critical Current

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Abstract

The invention provides a semi-flexible PCB structure and a manufacturing method thereof, wherein the semi-flexible PCB structure comprises a board body, two sinking grooves are concavely arranged on the top surface of the board body, two ends of each sinking groove extend to the edge of the board body, a space is reserved between the two sinking grooves, and a supporting strip is formed at the uncut part between the two sinking grooves; a space is reserved between the bottom of the sinking groove and the embedded circuit metal layer, the space between the bottom of the sinking groove and the bottom surface of the plate body is 0.13-0.28 mm, and the sinking groove is used as a bending deformation part of the plate body; the manufacturing method comprises the following steps: s1, prefabricating a multilayer substrate with an embedded circuit, and carrying out layout design according to subsequent board splitting requirements; s2, milling a preset part, wherein the milling length of a corresponding sink groove region exceeds two ends of the preset sink groove part; s3, deeply cutting the preset board dividing path to obtain cutting marks for subsequent breaking; the structure is novel, the flexible part is arranged, and the bending deformation can be carried out; the processing and manufacturing method is simple, the production efficiency can be improved, and the production cost can be reduced.

Description

Semi-flexible Printed Circuit Board (PCB) structure and manufacturing method thereof
Technical Field
The invention relates to the field of PCB (printed circuit board), in particular to a semi-flexible PCB structure and a manufacturing method thereof.
Background
With the high-speed development of electronic information, more and more electronic components are required to be carried on a circuit board, the circuit board is forced to be developed towards high density, miniaturization and integration, and a circuit hard board in the prior art often uses a large number of flat cables for circuit connection because the circuit hard board cannot reach a certain bending degree, so that the connection function required to be achieved is realized in the next time; the requirement also promotes the birth and development of the hard board and the flexible board, and urges the generation of a new product of a soft and hard combined board, although the product can meet the bending and the function of replacing flat cable connection, the manufacturing flow is complex, the manufacturing cost is very high, the requirement of quick update and the cost competitive advantage of electronic products are not facilitated, the flexible board only plays a conducting effect, the bending part does not have supporting force, a circuit original required by welding can not be added, and the effect is single and needs to be improved.
Disclosure of Invention
In order to overcome the defects of the prior art, the technical problem to be solved by the invention is to provide a semi-flexible PCB structure and a manufacturing method thereof, wherein the semi-flexible PCB structure is novel in structure, has flexible parts, can be bent and deformed, and meets the required installation form; the processing and manufacturing method is simple, the production efficiency can be improved, and the production cost can be reduced.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a semi-flexible PCB structure, which comprises a board body, wherein two sinking grooves are concavely arranged on the top surface of the board body, two ends of each sinking groove extend to the edge of the board body, a space is reserved between the two sinking grooves, and a supporting strip is formed at the uncut part between the two sinking grooves; the distance is reserved between the bottom of the sinking groove and the embedded circuit metal layer, the distance between the bottom of the sinking groove and the bottom surface of the plate body is 0.13-0.28 mm, and the sinking groove is used as a bending deformation part of the plate body.
In the preferred technical scheme of the invention, the width of the supporting strip is 3 mm-5 mm.
In the preferred technical scheme of the invention, the width of the sinking groove is 6-8 mm.
In a preferred technical scheme of the invention, a reinforcing rib is arranged at the joint of the groove wall and the groove bottom of the sinking groove.
In a preferred technical scheme of the invention, one side of the reinforcing rib, which is close to the center of the sinking groove, is of an inclined surface structure, and the inclined surface and the horizontal surface form an included angle of 45 degrees; the minimum distance between the two reinforcing ribs is 5.8 mm-6.6 mm.
The invention also provides a manufacturing method of the semi-flexible PCB structure, which comprises the following steps:
s1, prefabricating a multilayer substrate with an embedded circuit, and carrying out layout design according to subsequent board splitting requirements;
s2, milling a preset part, wherein the milling length of a corresponding sink groove region exceeds two ends of the preset sink groove part;
and S3, deeply cutting the preset board dividing path to obtain cutting marks for subsequent breaking.
Further, in the step S2, two ends of the milling portion respectively exceed two ends of the preset sink, and the length of the exceeding is 1.5mm to 2mm.
The invention has the beneficial effects that:
the invention provides a semi-flexible PCB structure and a manufacturing method thereof, the structure is novel, the plate body is provided with sinking grooves, two ends of the sinking grooves extend to the edge of the plate body, and the distance between the bottom of the sinking grooves and the bottom surface of the plate body is 0.13-0.28 mm, so that the sinking grooves are in a sheet shape to form flexible parts, the bending deformation can be carried out, the required installation form is met by bending, and the practicability is improved; moreover, the hard board is used as a base structure, the structural strength of the flexible board is stronger than that of a traditional flexible board, the flexible board has a certain supporting force, and the required deformation state can be maintained to a certain extent;
moreover, a supporting strip is arranged between the two sinking grooves, so that the structural strength of the sinking grooves can be enhanced to a certain extent; the support bars can be used for separation, and bending deformation with symmetrical sides is carried out, or a certain sinking groove is used as a deformation part, so that different bending deformation requirements can be better met; in addition, the supporting strips can also be used as welding parts of the electric device to participate in the whole circuit, so that different circuit requirements and installation requirements are further met;
the manufacturing method mainly comprises the step of milling the required sink groove at the corresponding part of the prefabricated multilayer circuit board, so that the processing and manufacturing are simple, the production efficiency can be effectively improved, and the production cost is reduced.
Drawings
FIG. 1 is a top view of a semi-flexible PCB structure provided in an embodiment of the present invention;
FIG. 2 is a front view of the sink groove and support bar locations provided in an embodiment of the present invention;
FIG. 3 is a schematic view of a first bending mode provided in an embodiment of the present invention;
FIG. 4 is a schematic diagram of a second bending manner provided in an embodiment of the present invention;
FIG. 5 is a flow chart of a method for fabricating a semi-flexible PCB structure in accordance with an embodiment of the present invention;
fig. 6 is a top view of a multilayer substrate in a method of fabrication provided in an embodiment of the invention.
In the figure:
100. a plate body; 200. sinking a groove; 300. a supporting strip; 400. reinforcing ribs; 500. a multilayer substrate; 600. cutting marks; 700. and (5) mounting the component.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
As shown in fig. 1 and 2, in the embodiment of the present invention, a semi-flexible PCB structure is disclosed, which includes a board body 100, two sinking grooves 200 are recessed downward on the top surface of the board body 100, two ends of the sinking grooves 200 extend to the edge of the board body 100, a space is left between the two sinking grooves 200, and a supporting strip 300 is formed at an uncut portion between the two sinking grooves 200; the distance is reserved between the bottom of the sinking groove 200 and the embedded circuit metal layer, the distance between the bottom of the sinking groove and the bottom surface of the plate body is 0.13-0.28 mm, and the sinking groove is used as a bending deformation part of the plate body.
The semi-flexible PCB structure is novel in structure, the plate body is provided with the sinking grooves, two ends of each sinking groove extend to the edge of the plate body, and the distance between the bottom of each sinking groove and the bottom surface of the plate body is 0.13-0.28 mm, so that the sinking groove parts are in a thin sheet shape to form flexible parts, the flexible parts can be bent and deformed, the required installation form is met by bending, and the practicability is improved; moreover, the hard board is used as a base structure, the structural strength of the flexible board is stronger than that of a traditional flexible board, the flexible board has a certain supporting force, and the required deformation state can be maintained to a certain extent; it should be noted that, although the slot is formed with a sheet structure, the conductive circuit and the ground layer in the circuit metal layer can both pass through the sheet residual thickness portion smoothly, so as to maintain the normal conduction and use of the circuit;
moreover, a supporting strip is arranged between the two sinking grooves, so that the structural strength of the sinking grooves can be enhanced to a certain extent; the support bars can be used for separation, and bending deformation with symmetrical sides is carried out, or a certain sinking groove is used as a deformation part, so that different bending deformation requirements can be better met; in addition, the supporting bars can also be used as welding parts of the electric devices to participate in the whole circuit, and further meet different circuit requirements and installation requirements.
It should be noted that, as shown in fig. 3, when the board is bent at a small angle and the external mounting portion can provide a fixed supporting limit, the board can be directly fixed on the mounting member 700, and the required deformation angle is maintained by the support of the external structure;
as shown in fig. 4, if the circuit board with the prefabricated bending angle needs to be manufactured, the sinking groove portion can be heated, the structural strength of the region is further weakened in a heating mode, then the circuit board is bent to the required angle, the bent angle state can be maintained after the circuit board is cooled, and then the circuit board is mounted on the required equipment.
Furthermore, the width of the supporting strip 300 is 3 mm-5 mm, and the supporting strip has a certain width, so that the supporting strip can achieve the effect of strengthening the supporting, and can also be used as a part for welding an electric element, thereby meeting the actual use requirements.
Furthermore, the width of the sinking groove 200 is 6 mm-8 mm, the sinking groove is used as the main part of bending deformation, and the width design can facilitate the bending deformation; and the minimum width of heavy groove is also greater than the maximum width of support bar, further enlarges the bending deformation scope of plate body to and can carry out multiple mode of buckling, satisfy different equipment fixing demands.
Further, the joint of the groove wall and the groove bottom of the sinking groove 200 is provided with a reinforcing rib 400, and the thin-wall structure formed at the sinking groove can be structurally reinforced by the design of the reinforcing rib, so that the corner position of the edge is prevented from being broken.
Furthermore, one side of the reinforcing rib 400 close to the center of the sinking groove is of an inclined plane structure, and the inclined plane and the horizontal plane form an included angle of 45 degrees, so that relatively gentle transition can be performed, the occurrence of a step part is prevented, and the position of a step edge is prevented from being broken; the minimum distance between the two reinforcing ribs is 5.8-6.6 mm, so that the structural strength of the sinking groove part can be enhanced through the reinforcing strips, the free area of the sinking groove can be ensured to be bent and deformed enough, and the required bending requirement can be met.
The invention discloses a manufacturing method of a semi-flexible PCB structure, which comprises the following steps as shown in figures 5 and 6:
s1, prefabricating a multilayer substrate 500 with an embedded circuit, and carrying out layout design according to subsequent board splitting requirements;
s2, milling a preset part, wherein the milling length of a corresponding sink groove region exceeds two ends of the preset sink groove part;
and S3, deeply cutting the preset board dividing path to obtain a cut mark 600 for subsequent breaking.
In the step S1, a specific circuit, a specific board distribution area and a specific milling part need to be designed; the manufacturing method mainly comprises the steps of milling the required sink groove at the corresponding part of the prefabricated multilayer circuit board, and has simple processing and manufacturing, thereby effectively improving the production efficiency and reducing the production cost; it should be noted that the milling in the step S2 is mainly performed by a numerically controlled milling machine, the deep cutting in the step S3 is mainly performed by a laser device, and both the numerically controlled milling machine and the laser cutting device are common mechanical devices for processing circuit boards, and the specific structure and the using method are not described in detail.
Further, in the step S2, the two ends of the milling portion respectively exceed the two ends of the preset sinking groove, the length of the milling portion exceeds 1.5 mm-2 mm, the milling portion exceeds the end of the sinking groove, the sinking groove portion of the plate body manufactured subsequently can be ensured to completely penetrate through the two sides of the plate body, and therefore the smooth bending deformation effect of the sinking groove region can be ensured.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not intended to be limited to the specific embodiments disclosed herein, but other embodiments falling within the scope of the appended claims are intended to be within the scope of the present invention.

Claims (7)

1. The utility model provides a half soft PCB plate structure which characterized in that:
the plate comprises a plate body (100), wherein two sinking grooves (200) are formed in the top surface of the plate body (100) in a downward concave mode, two ends of each sinking groove (200) extend to the edge of the plate body (100), a space is reserved between the two sinking grooves (200), and a supporting strip (300) is formed at the uncut part between the two sinking grooves (200);
a space is reserved between the bottom of the sinking groove (200) and the embedded circuit metal layer, the space between the bottom of the sinking groove and the bottom surface of the plate body is 0.13-0.28 mm, and the sinking groove is used as a deformation part for bending the plate body.
2. The semi-flexible PCB board structure of claim 1, wherein:
the width of the supporting strip (300) is 3 mm-5 mm.
3. The semi-flexible PCB board structure of claim 1, wherein:
the width of the sinking groove (200) is 6 mm-8 mm.
4. The semi-flexible PCB board structure of claim 1, wherein:
the joint of the groove wall and the groove bottom of the sinking groove (200) is provided with a reinforcing rib (400).
5. The semi-flexible PCB board structure of claim 4, wherein:
one side of the reinforcing rib close to the center of the sinking groove is of an inclined surface structure, and the inclined surface and the horizontal surface form an included angle of 45 degrees; the minimum distance between the two reinforcing ribs (400) is 5.8 mm-6.6 mm.
6. A method of making the semi-flexible PCB panel structure of claim 1, wherein:
the method comprises the following steps:
s1, prefabricating a multilayer substrate with an embedded circuit, and carrying out layout design according to subsequent board splitting requirements;
s2, milling a preset part, wherein the milling length of a corresponding sink groove region exceeds two ends of the preset sink groove part;
and S3, deeply cutting the preset board dividing path to form cutting marks for subsequent breaking.
7. The method of manufacturing a semi-flexible PCB structure of claim 6, wherein:
in the step S2, two ends of the milling part respectively exceed two ends of the preset sink, and the exceeding length is 1.5 mm-2 mm.
CN202211313435.2A 2022-10-25 2022-10-25 Semi-flexible Printed Circuit Board (PCB) structure and manufacturing method thereof Pending CN115665976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211313435.2A CN115665976A (en) 2022-10-25 2022-10-25 Semi-flexible Printed Circuit Board (PCB) structure and manufacturing method thereof

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Application Number Priority Date Filing Date Title
CN202211313435.2A CN115665976A (en) 2022-10-25 2022-10-25 Semi-flexible Printed Circuit Board (PCB) structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN115665976A true CN115665976A (en) 2023-01-31

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050092519A1 (en) * 2003-11-05 2005-05-05 Beauchamp John K. Partially flexible circuit board
WO2007087981A1 (en) * 2006-01-31 2007-08-09 Häusermann GmbH Flexible printed circuit board with additional functional element and a milled notch, method of production and use
CN101365298A (en) * 2008-08-22 2009-02-11 汕头超声印制板公司 Manufacturing method for semi-flexible printed circuit board
CN209731696U (en) * 2019-02-27 2019-12-03 浙江万正电子科技有限公司 The soft or hard combination multilayer circuit board of glass fabric of epoxy resin semi-flexible
CN210928119U (en) * 2019-08-16 2020-07-03 鹤山市中富兴业电路有限公司 Semi-flexible plate with depth control belt R angle
CN113115524A (en) * 2021-03-09 2021-07-13 胜宏科技(惠州)股份有限公司 Manufacturing method of semi-flexible static flexible circuit board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050092519A1 (en) * 2003-11-05 2005-05-05 Beauchamp John K. Partially flexible circuit board
WO2007087981A1 (en) * 2006-01-31 2007-08-09 Häusermann GmbH Flexible printed circuit board with additional functional element and a milled notch, method of production and use
CN101365298A (en) * 2008-08-22 2009-02-11 汕头超声印制板公司 Manufacturing method for semi-flexible printed circuit board
CN209731696U (en) * 2019-02-27 2019-12-03 浙江万正电子科技有限公司 The soft or hard combination multilayer circuit board of glass fabric of epoxy resin semi-flexible
CN210928119U (en) * 2019-08-16 2020-07-03 鹤山市中富兴业电路有限公司 Semi-flexible plate with depth control belt R angle
CN113115524A (en) * 2021-03-09 2021-07-13 胜宏科技(惠州)股份有限公司 Manufacturing method of semi-flexible static flexible circuit board

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