CN113115524A - Manufacturing method of semi-flexible static flexible circuit board - Google Patents
Manufacturing method of semi-flexible static flexible circuit board Download PDFInfo
- Publication number
- CN113115524A CN113115524A CN202110252617.2A CN202110252617A CN113115524A CN 113115524 A CN113115524 A CN 113115524A CN 202110252617 A CN202110252617 A CN 202110252617A CN 113115524 A CN113115524 A CN 113115524A
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- Prior art keywords
- static
- circuit board
- flexible
- welding
- manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing method of a semi-flexible static flexible circuit board, which sequentially comprises the following steps: pre-flow processing; solder and text prevention: determining the position of the static bending area, performing anti-welding windowing on the other surface of the circuit board opposite to the static bending area, and performing screen printing, exposure development and curing on soft board ink at the position of the anti-welding windowing area to form a soft board ink layer; normally welding the rest areas of the upper surface and the lower surface of the circuit board to form a welding resistance layer; the welding-proof windowing is larger than the single edge of the joint of the bottom surface of the static flexible folding area and the rigid plate; forming one and forming two: a second forming step of routing a static bending area by using a milling cutter to control depth, wherein the static bending area is a blind hole, and the milling cutter is a flat-bottomed double-edged cutter; the two ends of the bottom surface of the static bending area are both provided with a convex part which is a part of the rigid plate; and (5) post-flow processing. The invention optimizes the manufacturing process of the existing flexible circuit board, can shorten the processing flow, improve the efficiency and reduce the cost, and the formed static flexible area can prevent tearing.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a manufacturing method of a semi-flexible static flexible circuit board.
Background
Along with the development of circuit boards, a novel rigid static flexible folding plate is provided in the industry, the rigid flexible folding plate has flexibility at a certain angle, the rigid flexible folding plate has many similarities with the rigid flexible folding plate in the industry at present, and similar manufacturing processes and technologies are provided in the manufacturing technology, for example, a covering layer of a soft plate is adopted in a static flexible folding area, glue is dispensed at a static flexible folding connecting rib, the glue can prevent the soft plate from being torn in a connecting area, the manufacturing process of the rigid flexible folding plate is long, the technology is complex, such as no-flow glue PP window opening, cover opening in the flexible folding area and the like, and the covering layer manufactured by the existing flexible folding circuit board needs to be subjected to covering layer window opening, covering layer alignment, covering layer and rigid plate pre-laminating and covering layer laminating and the like, and more special equipment needs to be invested in the early stage.
Disclosure of Invention
The invention provides a manufacturing method of a semi-flexible static flexible circuit board, aiming at solving the problems of complex manufacturing method, long flow time and high cost of the existing static flexible circuit board.
A manufacturing method of a semi-flexible static flexible circuit board sequentially comprises the following steps:
pre-flow processing: the circuit board processed and manufactured in the previous process comprises a rigid board, wherein the upper surface and the lower surface of the rigid board are both provided with circuits;
solder and text prevention: determining the position of the static bending area, performing anti-welding windowing on the other surface of the circuit board opposite to the static bending area, and performing screen printing, exposure development and curing on soft board ink at the position of the anti-welding windowing area to form a soft board ink layer; normally welding the rest areas of the upper surface and the lower surface of the circuit board to form a welding resistance layer; the welding-proof windowing is larger than the single edge of the joint of the bottom surface of the static flexible folding area and the rigid plate;
forming one and forming two: forming II, routing a static bending area by adopting milling cutter depth control, wherein the static bending area is a blind hole, the lower end surface of the milling cutter is parallel to a horizontal plane, two opposite side surfaces of the milling cutter are respectively provided with a cutting edge, and an included angle between the cutting edge and a vertical surface is an acute angle; the two ends of the bottom surface of the static bending area are both provided with a convex part which is a part of the rigid plate;
and (5) post-flow processing. The manufacturing process is optimized, the production efficiency is improved, and the cost is reduced.
Optionally, the previous process includes cutting, inner layer patterning, inner layer AOI, pressing, cutting, drilling, plate electroplating, outer layer patterning, and outer layer AOI in sequence.
Optionally, the post-process treatment sequentially comprises FQC, OQC, and packaging.
Optionally, the residual thickness of the blind hole is controlled to be 0.24-0.26 mm.
Optionally, a central line of the position of the solder-proof windowing overlaps a central line of the static folding area.
Optionally, the included angle between the blade and the vertical surface is 45 degrees.
Optionally, the solder mask window is 10-20 mil larger than a single side of a joint of the bottom surface of the static flexible folding area and the rigid plate.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a method for manufacturing a flexible static flexible circuit board, which optimizes the manufacturing process of the existing flexible circuit board, can shorten the processing flow, improve the efficiency and reduce the cost; a special milling cutter is adopted to control depth to gong out a static bending area, and the formed static bending area can prevent tearing; the soft board ink layer is formed on the other surface of the circuit board corresponding to the static flexible folding area by adopting the soft board ink, so that the manufacturing process is simple, and the efficiency is improved and the cost is reduced; compared with the conventional process, the equipment investment cost can be saved in the manufacturing process, and the application range of the manufactured static flexible circuit board is wider and wider.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a semi-flexible static flexible circuit board according to the present invention;
fig. 2 is a schematic structural diagram of a semi-flexible static flexible circuit board according to the present invention.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments.
Referring to the attached drawings 1-2, a manufacturing method of a semi-flexible static flexible circuit board sequentially comprises the following steps:
pre-flow processing: the front flow processing sequentially comprises cutting, inner layer pattern, inner layer AOI, pressing, cutting and grinding, drilling, plate electric, outer layer pattern and outer layer AOI. The circuit board processed and manufactured by the previous process comprises a rigid board 1, and circuits 2 are arranged on the upper surface and the lower surface of the rigid board 1. Specifically, at least two rigid substrates are cut into appropriate sizes by cutting, and the inner layer patterns and the outer layer patterns are respectively manufactured into inner layer circuits and outer layer circuits.
Solder and text prevention: determining the position of the static bending area, performing anti-welding windowing on the other surface of the circuit board opposite to the static bending area, and performing screen printing, exposure, development and curing on soft board ink at the position of the anti-welding windowing to form a soft board ink layer 3; normally welding the rest areas of the upper and lower surfaces of the circuit board to form a welding resistance layer 4, namely forming the welding resistance layer on the circuit; the solder mask is larger than a single side of the joint of the bottom surface of the static flexible folding area and the rigid plate, in some embodiments, a central line of the solder mask is overlapped with a central line of the static folding area, and the solder mask is 10-20 mils larger than the single side of the joint of the bottom surface of the static flexible folding area and the rigid plate.
Forming one and forming two: a milling cutter is used for controlling depth to form a static bending area 5 in a milling mode, the static bending area 5 is a blind hole, the lower end face of the milling cutter is parallel to the horizontal plane, two opposite side faces of the milling cutter are provided with a cutting edge, and the included angle between the cutting edge and the vertical plane is an acute angle; both ends of the bottom surface of the static bending area 5 are provided with convex parts which are part of the rigid plate 1; in some embodiments, the blade edge is angled at 45 degrees from vertical. In some embodiments, the residual thickness of the blind hole is controlled to be 0.24-0.26 mm, that is, the thickness of the bottom surface of the blind hole from the outer surface of the solder mask layer 4 is 0.24-0.26 mm, and the outer surface of the flexographic ink layer 3 and the outer surface of the solder mask layer 4 adjacent to the outer surface are located on the same horizontal plane.
Specifically, the first forming is normally performed according to a conventional flow, the structure of the milling cutter enables the two ends of the bottom surface of the static bending area to form the protruding portions, namely the connecting surface of the bottom surface of the blind hole and the side wall of the blind hole is an inclined plane relative to the horizontal plane, the static bending area 5 can be prevented from being torn, the processing is easy, the efficiency is improved compared with the existing glue dispensing process, glue dispensing equipment and a glue dispensing flow are omitted, and the cost is reduced. The milling cutter adopts a flat-bottomed double-edged cutter, can mill a static bending area and simultaneously forms a convex part, and has simple manufacture and high efficiency.
Post-process treatment: the post-process treatment sequentially comprises FQC, OQC and packaging.
The invention provides a method for manufacturing a flexible static flexible circuit board, which optimizes the manufacturing process of the existing flexible circuit board, can shorten the processing flow, improve the efficiency and reduce the cost; a special milling cutter is adopted to control depth to gong out a static bending area, and the formed static bending area can prevent tearing; the soft board ink layer is formed on the other surface of the circuit board corresponding to the static flexible folding area by adopting the soft board ink, so that the manufacturing process is simple, and the efficiency is improved and the cost is reduced; compared with the conventional process, the equipment investment cost can be saved in the manufacturing process, and the application range of the manufactured static flexible circuit board is wider and wider.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (7)
1. A manufacturing method of a semi-flexible static flexible circuit board is characterized in that: the method sequentially comprises the following steps:
pre-flow processing: the circuit board processed and manufactured in the previous process comprises a rigid board (1), wherein circuits (2) are arranged on the upper surface and the lower surface of the rigid board (1);
solder and text prevention: determining the position of the static bending area, performing anti-welding windowing on the other surface of the circuit board opposite to the static bending area, and performing screen printing, exposure, development and curing on soft board ink at the position of the anti-welding windowing to form a soft board ink layer (3); normally welding the rest areas of the upper and lower surfaces of the circuit board to form a welding resistance layer (4); the welding-proof windowing is larger than the single edge of the joint of the bottom surface of the static flexible folding area (5) and the rigid plate (1);
forming one and forming two: a second forming step of routing a static bending area (5) by using a milling cutter to control depth, wherein the static bending area (5) is a blind hole, the lower end surface of the milling cutter is parallel to a horizontal plane, two opposite side surfaces of the milling cutter are provided with a cutting edge, and an included angle between the cutting edge and a vertical surface is an acute angle; the two ends of the bottom surface of the static bending area (5) are both provided with a convex part, and the convex parts are part of the rigid plate (1);
and (5) post-flow processing.
2. The method for manufacturing the semi-flexible static flexible circuit board according to claim 1, wherein the method comprises the following steps: the former flow processing sequentially comprises cutting, inner layer pattern, inner layer AOI, pressing, cutting and grinding, drilling, plate electric, outer layer pattern and outer layer AOI.
3. The method for manufacturing the semi-flexible static flexible circuit board according to claim 1, wherein the method comprises the following steps: the post-process treatment sequentially comprises FQC, OQC and packaging.
4. The method for manufacturing the semi-flexible static flexible circuit board according to claim 1, wherein the method comprises the following steps: the residual thickness of the blind hole is controlled to be 0.24-0.26 mm.
5. The method for manufacturing the semi-flexible static flexible circuit board according to claim 1, wherein the method comprises the following steps: the midline of the position of the welding-proof windowing is overlapped with the midline of the static folding area (5).
6. The method for manufacturing the semi-flexible static flexible circuit board according to claim 1, wherein the method comprises the following steps: the included angle between the cutting edge and the vertical surface is 45 degrees.
7. The method for manufacturing the semi-flexible static flexible circuit board according to claim 1, wherein the method comprises the following steps: the anti-welding windowing is 10-20 mil larger than the single edge of the joint of the bottom surface of the static flexible folding area (5) and the rigid plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110252617.2A CN113115524A (en) | 2021-03-09 | 2021-03-09 | Manufacturing method of semi-flexible static flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110252617.2A CN113115524A (en) | 2021-03-09 | 2021-03-09 | Manufacturing method of semi-flexible static flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN113115524A true CN113115524A (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110252617.2A Pending CN113115524A (en) | 2021-03-09 | 2021-03-09 | Manufacturing method of semi-flexible static flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501858A (en) * | 2022-01-04 | 2022-05-13 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of semi-flexible circuit board |
| CN115665976A (en) * | 2022-10-25 | 2023-01-31 | 清远市富盈电子有限公司 | Semi-flexible Printed Circuit Board (PCB) structure and manufacturing method thereof |
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| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| CN103281864A (en) * | 2013-05-02 | 2013-09-04 | 深圳崇达多层线路板有限公司 | Method for producing static flexible and foldable step circuit board |
| CN104968147A (en) * | 2015-05-29 | 2015-10-07 | 广州杰赛科技股份有限公司 | Bendable printed circuit board and manufacturing method thereof |
| CN108882570A (en) * | 2018-09-28 | 2018-11-23 | 广州兴森快捷电路科技有限公司 | Rigid-flex circuit board and preparation method thereof |
| US10863620B1 (en) * | 2020-05-11 | 2020-12-08 | Avary Holding (Shenzhen) Co., Limited. | Bendable circuit board and method for manufacturing the same |
-
2021
- 2021-03-09 CN CN202110252617.2A patent/CN113115524A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| CN103281864A (en) * | 2013-05-02 | 2013-09-04 | 深圳崇达多层线路板有限公司 | Method for producing static flexible and foldable step circuit board |
| CN104968147A (en) * | 2015-05-29 | 2015-10-07 | 广州杰赛科技股份有限公司 | Bendable printed circuit board and manufacturing method thereof |
| CN108882570A (en) * | 2018-09-28 | 2018-11-23 | 广州兴森快捷电路科技有限公司 | Rigid-flex circuit board and preparation method thereof |
| US10863620B1 (en) * | 2020-05-11 | 2020-12-08 | Avary Holding (Shenzhen) Co., Limited. | Bendable circuit board and method for manufacturing the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501858A (en) * | 2022-01-04 | 2022-05-13 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of semi-flexible circuit board |
| CN115665976A (en) * | 2022-10-25 | 2023-01-31 | 清远市富盈电子有限公司 | Semi-flexible Printed Circuit Board (PCB) structure and manufacturing method thereof |
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Application publication date: 20210713 |
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