CN105430877A - Flexible circuit board, terminal and preparation method of flexible circuit board - Google Patents
Flexible circuit board, terminal and preparation method of flexible circuit board Download PDFInfo
- Publication number
- CN105430877A CN105430877A CN201511025174.4A CN201511025174A CN105430877A CN 105430877 A CN105430877 A CN 105430877A CN 201511025174 A CN201511025174 A CN 201511025174A CN 105430877 A CN105430877 A CN 105430877A
- Authority
- CN
- China
- Prior art keywords
- telltale mark
- solder mask
- flexible pcb
- auxiliary material
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
Abstract
The invention discloses a flexible circuit board. The flexible circuit board comprises a flexible board main body and a solder mask layer arranged on the flexible board main body; the flexible circuit board further comprises positioning marks and an accessory bonding area; the accessory bonding area and the positioning mark area arranged at one side of the flexible board main body; the positioning marks are arranged at the circumferential side of the accessory bonding area; the positioning marks and the solder mask layer are located at the same lamination; and the positioning marks and the solder mask layer are made of the same material. According to the flexible circuit board, the precision of the accessory bonding area can be improved, and a manufacturing process is simple, and the production cost of products can be reduced. The invention also discloses a terminal comprising the flexible circuit board and a preparation method of the flexible circuit board.
Description
Technical field
The present invention relates to printed circuit board field, the terminal particularly relate to a kind of flexible PCB for fitting with auxiliary material, comprising flexible PCB, and the preparation method of flexible PCB.
Background technology
Flexible PCB (FlexiblePrintedCircuit, FPC) be take flexible material as base material and obtained printed circuit board, have that wiring density is high, quality is light, thickness is thin and the advantage such as made of soft, it is flexible, winding and folding, therefore, be widely used in the conducting system of modern various electronic product.Flexible PCB generally includes base material, cabling and insulating barrier, and insulating barrier is generally coverlay and/or solder mask.Flexible PCB is applied in the process of various electronic product, is inevitably fitted with it by various auxiliary material, such as, often the auxiliary materials such as high tempreture tape, conducting resinl, foam and flexible PCB will be fitted by contraposition.In the prior art, carry out contraposition by the mark of printing white printing on flexible PCB mostly, that is: flexible PCB is positioned over upper and lower two can between the printed panel of folding, the position that printed panel above needs printing white printing to mark on flexible PCB is offered corresponding perforate, when two printed panels are covered and superincumbent printed panel apply white oil, white oil is from the flexible PCB (being namely clipped in the flexible PCB between upper and lower two printed panels) below described perforate drains to, thus white marking is stamped on the relevant position of described flexible PCB, to be used for contraposition when fitting auxiliary material.
But the precision of such printing process itself is very low, and its alignment tolerance is generally ± 0.2mm, therefore, when fitting auxiliary material, adopt described white oil to mark contraposition, aligning accuracy is lower, easily makes auxiliary material paste partially, thus causes yield to decline.In addition, on flexible PCB, printing white printing mark, the basis of preparing flexible PCB has had more a procedure, too loaded down with trivial details, is unfavorable for the reduction of cost.
Summary of the invention
Technical problem to be solved by this invention is, provides a kind of flexible PCB, and described flexible PCB can improve the precision of auxiliary material laminating, and manufacture craft is simple, can reduce the production cost of product.
The present invention also provides a kind of preparation method of flexible PCB.
In order to solve the problems of the technologies described above, the present invention by the following technical solutions:
On the one hand, The embodiment provides flexible PCB, described flexible PCB comprises flexible board main body and is arranged at the solder mask in described flexible board main body, described flexible PCB also comprises telltale mark and auxiliary material conformable region, described auxiliary material conformable region and described telltale mark are arranged at the side that described flexible board main body has described solder mask, described telltale mark is arranged at all sides of described auxiliary material conformable region, described telltale mark and described solder mask are in same lamination, and described specifically labelled material is identical with the material of described solder mask.
Wherein, the boundary alignment of described specifically labelled inward flange and described auxiliary material conformable region, described telltale mark and described solder mask are made by photosensitive-ink, and this telltale mark and described solder mask are made in same procedure.
Wherein, described telltale mark is continuous print narrow line shape.
Wherein, described telltale mark is discontinuous narrow line shape.
Wherein, described specifically labelled live width is for being more than or equal to 0.1mm and being less than or equal to 0.12mm.
Wherein, described flexible board main body comprises base material and is arranged at the routing layer on described base material, and described solder mask and described telltale mark are arranged on described routing layer.
Wherein, described flexible board main body comprises base material, routing layer and coverlay, and described routing layer and described coverlay are cascadingly set on described base material, and described solder mask and described telltale mark are arranged on described coverlay.
On the other hand, the present invention also provides a kind of terminal, comprises the flexible PCB described in above any one.
Again on the one hand, the present invention also provides a kind of preparation method of flexible PCB, comprises the steps:
There is provided one with the flexible board main body of auxiliary material conformable region;
Described flexible board main body applies a photosensitive printing ink layer; And
Described photosensitive printing ink layer exposed and develops, to form solder mask and telltale mark, described specifically labelled inward flange being alignd with the outward flange of described auxiliary material conformable region.
Wherein, described telltale mark is narrow line shape.
Wherein, described specifically labelled live width is for being more than or equal to 0.1mm and being less than or equal to 0.12mm.
Compared with prior art, technical scheme of the present invention has following beneficial effect: flexible PCB of the present invention is provided with telltale mark in auxiliary material conformable region, and the material of specifically labelled material and solder mask is all photosensitive-ink, telltale mark can be made in the operation making solder mask simultaneously, thus without the need to increasing other operation, thus the preparation technology of described flexible PCB is simplified; Meanwhile, can adopt because telltale mark is the same with solder mask expose, the technique such as development makes, it is meticulousr than the white oil mark printed in prior art to make telltale mark, and contraposition is more accurate, thus improves the precision of auxiliary material laminating.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic top plan view of the flexible PCB of first embodiment of the invention;
Fig. 2 is the schematic cross-section of the flexible PCB shown in Fig. 1 along cutting line A-A;
Fig. 3 is the schematic top plan view of the flexible PCB of second embodiment of the invention;
Fig. 4 is the schematic cross-section of the flexible PCB of third embodiment of the invention;
Fig. 5 is the flow chart of the preparation method of flexible PCB of the present invention; And
Fig. 6 to Fig. 8 is the process schematic of the preparation method of flexible PCB of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
If employ some vocabulary to censure specific components in the middle of specification and claim.Those skilled in the art should understand, and hardware manufacturer may call same assembly by different noun.This specification and claims are not used as with the difference of title the mode distinguishing assembly, but are used as the criterion of differentiation with assembly difference functionally.If " comprising " mentioned in the middle of specification and claim is in the whole text an open language, therefore should be interpreted as " comprise but do not limit "." roughly " refer to that in acceptable error range, those skilled in the art can solve the technical problem within the scope of certain error, reach described technique effect substantially.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature is as illustrated in the drawing described.Be appreciated that, when an element or layer be called as another element or layer " on ", " being connected to " or " being couple to " another element or layer time, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or intervening elements or layer can be there is.In addition, " couple " word and comprise directly any and indirectly electric property coupling means at this.Therefore, if describe a first device in literary composition to be coupled to one second device, then represent described first device and directly can be electrically coupled to described second device, or be indirectly electrically coupled to described second device by other devices or the means that couple.
Being appreciated that terminology used here is only to describe specific embodiment, not really wanting to limit the present invention.When here using, clearly state unless context separately has, otherwise singulative " " and " being somebody's turn to do " are also intended to comprise plural form.Further, when using in this manual, term " comprises " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but does not get rid of other features one or more, entirety, step, element, assembly and/or its existence of combining or increase.Specification subsequent descriptions is for implementing better embodiment of the present invention, and right described description is to illustrate for the purpose of rule of the present invention, and is not used to limit scope of the present invention.Protection scope of the present invention is when being as the criterion depending on the claims person of defining.
Refer to Fig. 1 and Fig. 2, Fig. 1 is the schematic top plan view of the flexible PCB of first embodiment of the invention; Fig. 2 is the schematic cross-section of the flexible PCB shown in Fig. 1 along cutting line A-A.In the present embodiment, flexible PCB comprises flexible board main body 10 and the solder mask 20 be arranged in this flexible board main body 10.Described flexible board main body 10 comprises base material 11 and routing layer 12, and described routing layer 12 is arranged on described base material 11, and this routing layer 12 can be etched by Copper Foil and form, and specifically can comprise wire and large copper face (not shown).Described solder mask 20 is arranged on the routing layer 12 of described flexible board main body 10, plays welding resistance, insulation and protection to this routing layer 12.
Described flexible board main body 10 is provided with auxiliary material conformable region 30, this auxiliary material conformable region 30 corresponds to a part of routing layer 12, namely auxiliary material conformable region 30 is the subregions on described routing layer 12 surface, be specially, on the wire that this auxiliary material conformable region 30 can be arranged at described routing layer 12 and/or described large copper face.The shape of described auxiliary material conformable region 30 is consistent with the shape of the auxiliary material (not shown) that will fit, can be but be not limited to circle, rectangle, polygon or irregular figure etc., the present embodiment be that rectangle is illustrated for auxiliary material conformable region 30.
In an embodiment of the present invention, the border of described auxiliary material conformable region 30 is provided with telltale mark 40, namely described auxiliary material conformable region 30 is surrounded by this telltale mark 40 in the region of routing layer 12, described telltale mark 40 is in same lamination with described solder mask 20, namely this telltale mark 40 is made in same procedure with described solder mask 20, described telltale mark 40 is all positioned on described routing layer 12 with described solder mask 20, and the material of this telltale mark 40 is identical with the material of solder mask 20.Preferably, the material of described telltale mark 40 and described solder mask 20 is all photosensitive-ink.
In an embodiment of the present invention, described telltale mark 40 can be continuous print fine rule, and the border along described auxiliary material conformable region 30 is arranged, and within 30 1 weeks, forms a such as rectangular area around this auxiliary material conformable region.Such as, vertical view as shown in Figure 1, the shape of described auxiliary material conformable region 30 is rectangle, then described telltale mark 40 is the rectangle frames surrounded by continuous print fine rule.When carrying out laminating auxiliary material, the periphery of auxiliary material is alignd with described fine rule (i.e. telltale mark 40), with the periphery exposed portion of auxiliary material or whole described fine rule for meeting the requirements.Because the material of telltale mark 40 is identical with the material of described solder mask 20, namely the material of the two is photosensitive-ink, therefore, when making the solder mask 20 of described flexible PCB, described telltale mark 40 can be made simultaneously, and without the need to increasing extra operation, thus simplify preparation technology relative to prior art.In addition, because the material of this telltale mark 40 and described solder mask 20 is all photosensitive-ink, therefore can be made by techniques such as exposure, developments, this technique can obtain meticulous fine rule, and the live width of described telltale mark 40 specifically can be made for being more than or equal to 0.1mm and being less than or equal to 0.12mm.Therefore, little at laminating auxiliary material time error, and aligning accuracy is high.
In the present embodiment, can be set to consistent with the size of the auxiliary material that will fit by the size of described auxiliary material conformable region 30, the inward flange of described telltale mark 40 aligns with the periphery of this auxiliary material conformable region 30.Therefore, when fitting auxiliary material, the inward flange of the outward flange of auxiliary material with telltale mark 40 being alignd, so not only can improve the precision of auxiliary material laminating, and manufacture craft is simple.
Refer to Fig. 3, Fig. 3 is the schematic top plan view of the flexible PCB of second embodiment of the invention.The structure of the flexible PCB in the present embodiment is substantially identical with the structure of the flexible PCB in described first embodiment and respective figure thereof, and difference is: telltale mark 40 is formed by discontinuous fine rule.
Be specially, in embodiments of the present invention, described telltale mark 40 is set to discontinuous fine rule, vertical view as shown in Figure 3, and the shape of described auxiliary material conformable region 30 can be rectangle, then described telltale mark 40 is the rectangle frames surrounded by discontinuous fine rule.Described telltale mark 40 includes multiple breaking part 41 and multiple continuous part 42, and the plurality of breaking part 41 is the part without photosensitive-ink, and the plurality of continuous part 42 has been photosensitive-ink part.When the wire 31 of described routing layer 12 is positioned at described auxiliary material conformable region 30, this wire 31 passes corresponding breaking part 41 in the plane of described base material 11, in a preferred embodiment as shown in Figure 3, many wires 31 in the horizontal direction through corresponding breaking part 41, thus are spaced in this telltale mark 40.Be appreciated that according to concrete cabling requirement, many wires 31 can in described telltale mark 40 vertically or to be obliquely spaced.In addition, height due to telltale mark 40 equals the height of described wire 31, and wire 31 is arranged in corresponding breaking part 41, namely, this wire 31 flushes with continuous part 42 entirety of breaking part 41 both sides, thus make the edge of the auxiliary material conformable region 30 being provided with telltale mark 40 smooth, be conducive to improving aligning accuracy when pasting auxiliary material, and strengthen the adhesive force after auxiliary material laminating.
Refer to Fig. 4, Fig. 4 is the schematic cross-section of the flexible PCB of third embodiment of the invention.The structure of the flexible PCB in the present embodiment is substantially identical with the structure of the flexible PCB in above-mentioned first embodiment and respective figure thereof, difference is: flexible board main body 10 comprises base material 11, routing layer 12 and coverlay 13, described routing layer 12 and described coverlay 13 are cascadingly set on described base material 11, described solder mask 20 and described telltale mark 40 are arranged on described coverlay 13, exposed portion, auxiliary material conformable region 30 coverlay 13.
When flexible PCB not only comprises coverlay but also comprises solder mask, existing technology normally carrys out contraposition by printing white printing or at coverlay uplifting window, but both errors are all larger.The present embodiment is provided with alignment mark on the border of auxiliary material conformable region of exposing coverlay, and the material of the material of alignment mark and solder mask is all photosensitive-ink, make can make described telltale mark when manufacturing the operation of this solder mask simultaneously, thus without the need to increasing other manufacturing process, and then the preparation technology of described flexible PCB is simplified.In addition, can adopt because alignment mark is the same with solder mask expose, the technique such as development makes, it is meticulousr than the white oil mark printed in prior art to make described alignment mark, and contraposition is more accurate, thus improves the precision of auxiliary material laminating.
Embodiments of the invention also provide a kind of terminal, and described terminal comprises flexible PCB described in above any embodiment.Described terminal refers to but is not limited to the products such as mobile phone, laptop computer, panel computer, POS and vehicle-mounted computer.
Refer to Fig. 5, Fig. 5 is the flow chart of the preparation method of flexible PCB of the present invention, and embodiments of the invention additionally provide a kind of preparation method preparing above-mentioned flexible PCB, and described preparation method at least comprises step S1, S2 and S3.See also Fig. 6 to Fig. 8, Fig. 6 to Fig. 8 is the process schematic of the preparation method of flexible PCB of the present invention.
S1: provide one with the flexible board main body of auxiliary material conformable region.
Be specially, as shown in Figure 6, flexible board main body 10 can comprise base material and routing layer, in manufacturing process, single sided board with Copper Foil is first provided, described single sided board comprises described base material and Copper Foil, by the described Copper Foil of described single sided board after the operations such as overexposure, development, etching, obtains described routing layer on the substrate; In the actual process manufactured, according to the position of concrete auxiliary material laminating, described routing layer marks off auxiliary material conformable region.
Described flexible board main body 10 can also comprise coverlay, and described coverlay is fitted on described routing layer, shields to described routing layer, and now, described auxiliary material conformable region can be delimited on described coverlay.
S2: apply a photosensitive printing ink layer in described flexible board main body.
Be specially, as shown in Figure 7, the method coating photosensitive-ink by printing or be coated with in flexible board main body 10, and solidified, thus form a photosensitive printing ink layer 20 '.
S3: described photosensitive printing ink layer is exposed and development treatment to form solder mask and telltale mark, and described specifically labelled inward flange is alignd with the outward flange of described auxiliary material conformable region.
Be specially, as shown in Figure 8, when exposing described photosensitive printing ink layer 20 ', a light shield is placed between described photosensitive printing ink layer 20 ' and a uviol lamp, the ultraviolet lighting that described light shield makes uviol lamp send is mapped to the position that will form solder mask 20 and telltale mark 40 in photosensitive printing ink layer 20 ', all the other positions then not by UV-irradiation, thus make the photosensitive printing ink layer 20 ' that will be formed on the position of solder mask 20 and telltale mark 40 that cross-linking reaction occur by the mode of covering; During development, the photosensitive-ink that cross-linking reaction does not occur is washed off (photosensitive-ink on the position be not namely then mapped to by ultraviolet lighting by the mode of covering is washed off), thus the solder mask 20 formed as shown in Figure 8 and telltale mark 40.Wherein, described telltale mark 40 is in continuous or discrete narrow line shape, and preferably, the width of described fine rule is for being more than or equal to 0.10mm and being less than or equal to 0.12mm.
In sum, in the preparation method of the flexible PCB of the embodiment of the present invention, described flexible PCB is provided with telltale mark in auxiliary material conformable region, and the material of the material of alignment mark and solder mask is all photosensitive-ink, make can make described telltale mark when manufacturing the operation of this solder mask simultaneously, thus without the need to increasing other manufacturing process, and then the preparation technology of described flexible PCB is simplified.In addition, can adopt because contraposition part is the same with solder mask expose, the technique such as development makes, it is meticulousr than the white oil mark printed in prior art to make described telltale mark, and contraposition is more accurate, thus improves the precision of auxiliary material laminating.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a flexible PCB, comprise flexible board main body and be arranged at the solder mask in described flexible board main body, it is characterized in that, described flexible PCB also comprises telltale mark and auxiliary material conformable region, described auxiliary material conformable region and described telltale mark are arranged at the side that described flexible board main body has described solder mask, described telltale mark is arranged at all sides of described auxiliary material conformable region, described telltale mark and described solder mask are in same lamination, and described specifically labelled material is identical with the material of described solder mask.
2. flexible PCB as claimed in claim 1, it is characterized in that, the boundary alignment of described specifically labelled inward flange and described auxiliary material conformable region, described telltale mark and described solder mask are made by photosensitive-ink, and this telltale mark and described solder mask are made in same procedure.
3. flexible PCB as claimed in claim 2, it is characterized in that, described telltale mark is continuous or discrete narrow line shape.
4. flexible PCB as claimed in claim 3, it is characterized in that, described specifically labelled live width is for being more than or equal to 0.1mm and being less than or equal to 0.12mm.
5. the flexible PCB as described in any one of Claims 1-4, is characterized in that, described flexible board main body comprises base material and is arranged at the routing layer on described base material, and described solder mask and described telltale mark are arranged on described routing layer.
6. the flexible PCB as described in any one of Claims 1-4, it is characterized in that, described flexible board main body comprises base material, routing layer and coverlay, described routing layer and described coverlay are cascadingly set on described base material, and described solder mask and described telltale mark are arranged on described coverlay.
7. a terminal, is characterized in that, comprises the flexible PCB described in any one of claim 1 to 6.
8. a preparation method for flexible PCB, is characterized in that, comprises the steps:
There is provided one with the flexible board main body of auxiliary material conformable region;
Described flexible board main body applies a photosensitive printing ink layer; And
Described photosensitive printing ink layer exposed and develops, to form solder mask and telltale mark, described specifically labelled inward flange being alignd with the outward flange of described auxiliary material conformable region.
9. preparation method as claimed in claim 8, it is characterized in that, described telltale mark is narrow line shape.
10. preparation method as claimed in claim 9, it is characterized in that, described specifically labelled live width is for being more than or equal to 0.1mm and being less than or equal to 0.12mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025174.4A CN105430877B (en) | 2015-12-29 | 2015-12-29 | The preparation method of flexible PCB, terminal and flexible PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025174.4A CN105430877B (en) | 2015-12-29 | 2015-12-29 | The preparation method of flexible PCB, terminal and flexible PCB |
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| CN105430877A true CN105430877A (en) | 2016-03-23 |
| CN105430877B CN105430877B (en) | 2018-06-29 |
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| CN106304618A (en) * | 2016-08-30 | 2017-01-04 | 张家港康得新光电材料有限公司 | Circuit board fit area and the alignment method of conductive adhesive layer |
| CN106358363A (en) * | 2016-11-18 | 2017-01-25 | 广东小天才科技有限公司 | Printed circuit board designing method, printed circuit board and terminal equipment |
| CN107623988A (en) * | 2017-10-24 | 2018-01-23 | 广东欧珀移动通信有限公司 | Preparation method, flexible PCB and the mobile terminal of flexible PCB |
| CN107846779A (en) * | 2017-10-24 | 2018-03-27 | 广东欧珀移动通信有限公司 | Preparation method, flexible PCB and the mobile terminal of flexible PCB |
| CN108322999A (en) * | 2018-03-30 | 2018-07-24 | 成都奕斯伟芯片设计有限公司 | Circuit board, the forming method of circuit board resistance welding layer and chip |
| CN108565359A (en) * | 2018-02-07 | 2018-09-21 | 上海瀚莅电子科技有限公司 | The alignment device and manufacturing system of silicon substrate OLED micro-displays |
| CN111652248A (en) * | 2020-06-02 | 2020-09-11 | 上海岭先机器人科技股份有限公司 | Positioning method and device for flexible cloth |
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| CN106304618A (en) * | 2016-08-30 | 2017-01-04 | 张家港康得新光电材料有限公司 | Circuit board fit area and the alignment method of conductive adhesive layer |
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| CN111652248A (en) * | 2020-06-02 | 2020-09-11 | 上海岭先机器人科技股份有限公司 | Positioning method and device for flexible cloth |
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| CN105430877B (en) | 2018-06-29 |
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