CN209151418U - Board structure of circuit with laser windowing area - Google Patents
Board structure of circuit with laser windowing area Download PDFInfo
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- CN209151418U CN209151418U CN201821513206.4U CN201821513206U CN209151418U CN 209151418 U CN209151418 U CN 209151418U CN 201821513206 U CN201821513206 U CN 201821513206U CN 209151418 U CN209151418 U CN 209151418U
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- circuit
- layer
- board structure
- soldermask
- soldermask layer
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Abstract
The utility model provides a kind of board structure of circuit, including support plate, circuit layer and soldermask layer, and circuit layer is set on support plate；Soldermask layer is set on circuit layer and support plate, and soldermask layer has at least laser windowing area to expose at least part circuit layer.
Description
Technical field
The utility model is about a kind of board structure of circuit, espespecially a kind of board structure of circuit with laser windowing area.
Background technique
Traditional board structure of circuit would generally form a soldermask layer on metal circuitry, will be not required to the circuit and gold of welding
Metal surface all covers, and using prevents from causing short circuit when welding and save the dosage of scolding tin；On the other hand, soldermask layer can prevent water
Gas and electrolyte enter in circuit board, endanger electrical properties to avoid circuit layer oxidation, can also prevent instrument from damaging circuit layer；
In another aspect, soldermask layer also provides exhausted between adjacent circuit since the line width of the circuit layer on circuit board is more and more narrow
Edge effect.
Then, using development etch process, the soldermask layer on the specified pad of circuit layer is removed, the pad is made
Circuit layer is exposed, in order to carry out subsequent welding processing procedure.Development etch process is the UV light using irradiation specific band
Or visible light is on the soldermask layer, so that the soldermask layer solidifies；Followed by special chemical solvent by uncured soldermask layer material
Material removes, so that the circuit layer of the pad is exposed.However, when the solidification of soldermask layer irradiation, because soldermask layer itself is anti-
The penetration for penetrating rate and thickness effect UV light or visible light causes the anti-welding material positioned at soldermask layer bottom not to be fully cured, and
It is removed by special chemical solvent.In this way, should can be exposed by the circuit layer that soldermask layer is protected, made when carrying out subsequent welding
Journey, it is likely that it will cause short circuit, even damage circuit board.
Therefore how providing a kind of can be the technical task of urgent need to resolve accurately in the board structure of circuit of pad windowing.
Utility model content
In view of this, soldermask layer has laser the main purpose of the utility model is to provide a kind of board structure of circuit
Open a window area, can accurately expose the circuit layer of predetermined exposure.
In order to reach above-mentioned purpose, the utility model provides a kind of board structure of circuit, including support plate, circuit layer and anti-welding
Layer.Circuit layer is set on support plate；Soldermask layer is set on circuit layer and support plate, and soldermask layer opens a window with an at least laser
Area, at least part circuit layer are in exposed at least laser windowing area.
In the utility model embodiment, soldermask layer with a thickness of 10-200 μm.
In the utility model embodiment, soldermask layer with a thickness of 10-50 μm.
In the utility model embodiment, light reflectivity of the soldermask layer to wavelength at least a part of in visible wavelength range
Greater than 80%.
In the utility model embodiment, soldermask layer at least a part of wavelength in 625-740nm range to wavelength
The light reflectivity of visible light is greater than 80%.
In the utility model embodiment, soldermask layer at least a part of wavelength in 500-565nm range to wavelength
The light reflectivity of visible light is greater than 80%.
In the utility model embodiment, soldermask layer at least a part of wavelength in 485-500nm range to wavelength
The light reflectivity of visible light is greater than 80%.
Based on above-mentioned design, the board structure of circuit of the utility model is because having laser windowing area that can accurately remove specified welding
Soldermask layer on point, and the anti-welding layer material other than laser windowing area will not be removed, subsequent welding processing procedure is prevented to reach
The problem of short circuit occurs.
The detailed content of other effects and embodiment in relation to the utility model, cooperation schema are described as follows.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in application, for those of ordinary skill in the art, without creative efforts,
It can also be obtained according to these attached drawings other attached drawings.
Figure 1A is the top view of the board structure of circuit of the utility model first embodiment；
Figure 1B is the sectional view of Figure 1A；
Fig. 2A is the top view of the board structure of circuit of the utility model second embodiment；
Fig. 2 B is the sectional view of Fig. 2A；
Fig. 3 A, Fig. 3 B and Fig. 3 C are the fabrication steps sectional view of the board structure of circuit of the utility model first embodiment.
Symbol description
10,20 board structure of circuit 12,22 support plates
14,24 circuit layers 16,26 soldermask layers
162,262 lasers windowing area 164 specifies windowed regions
30 lasers windowing equipment L laser beam
Specific embodiment
Positional relationship described in embodiment below, comprising: on, under, left and right, if being all without specializing
On the basis of the direction that component in schema is painted.
It please join shown in Figure 1A and Figure 1B, the board structure of circuit 10 of the utility model embodiment includes support plate 12, circuit layer 14
And soldermask layer 16.In the present embodiment, support plate 12 can be lamina structure or multilayer composite sheet structure, and support plate 12 can be soft
The support plate of circuit board (Flexible Printed Circuit, FPC) or rigid circuit board (Printed Circuit Board,
PCB support plate)；Support plate 12 can be polyethylene terephthalate (PET) or other polyester films, Kapton, polyamides
Amine imide membrane, polypropylene film, polystyrene film etc..
As shown in Figure 1B and Fig. 3 A, circuit layer 14 is set on support plate 12.In the present embodiment, circuit layer 14 is laminated
In on support plate 12, being formed with thin copper foil (figure is not painted) copper facing again, in formation copper conductive layer on support plate 12 (figure is not painted).
Then, with route image transfer technology by copper conductive layer image conversion, in formation circuit layer 14 (as shown in Figure 1B) on support plate 12.
In the present embodiment, the material of circuit layer 14 includes copper.
Then, as shown in Figure 3B, soldermask layer 16 is set on circuit layer 14 and support plate 12.In the present embodiment, anti-welding
16 material of layer may be, for example, the double-formulation anti-solder ink (double of thermmohardening anti-solder ink or photo-hardening anti-solder ink type
Liquid type solder mask ink), ingredient is for example including anti-welding host agent, colorant, diluent and curing agent
(Hardener)。
The anti-welding host agent of the present embodiment mainly includes that light can be imaged anti-welding resin, and light anti-welding resin can be imaged can are as follows: contain
Carboxyl light can be imaged resin and resin can be imaged with the light containing carboxyl of epoxy resin or and with thermosetting resin, photo-hardening
Resin can be imaged in the light containing carboxyl of resin.On the other hand, anti-welding host agent may also contain it other than anti-welding resin can be imaged in light
Other additives of the prior art in its field of electronic materials, such as: organic solvent, antioxidant, filler, dispersing agent, can
Mould agent, antistatic agent, age resister, ultraviolet absorbing agent, defoaming agent, thermal polymerization preventing agent, couplant, incombustible agent, mould inhibitor,
Flat dose, tackifier, remover, surface modifier, stabilization agent.In practice, the material of anti-welding host agent also may include asphalt mixtures modified by epoxy resin
Rouge, silicone resin, polyimide resin, phenolic resin, fluororesin, silica or aluminium oxide.
The colorant of the present embodiment is, for example, white color agents, so that soldermask layer 16 is after solidification, to visible wavelength model
The light reflectivity of at least a part of wavelength is greater than 80% in enclosing, wherein the visible wavelength between 485nm between 740nm,
Between 625nm between 740nm, between 500nm between 565nm or between 485nm between 500nm.The present embodiment it is dilute
Releasing agent is the viscosity to adjust 16 material of soldermask layer, so that soldermask layer 16 can uniformly be formed in support plate 12 and circuit layer 14
On.The curing agent of the present embodiment may include at least one of photopolymerization initiator, stiffening aids, hardening catalyst.It is practical at this
In new embodiment, soldermask layer with a thickness of 10-200 μm, preferably 10-50 μm.
Then, as shown in Figure 3B, using laser windowing technology, thunder is formed in the soldermask layer 16 for corresponding to 14 position of circuit layer
Windowing area 162 is penetrated with expose portion circuit layer 14.The laser windowing technology of the present embodiment is provided using laser windowing equipment 30
The laser beam L of particular energy will specify the anti-welding ashing of material in windowed regions 164 to remove, to be made a reservation on soldermask layer 16
The windowing of soldermask layer 16 area 162 of size, as illustrated in figures 1A and ib.By laser windowing technology, it is hardened to accurately control circuit
162 size of windowing area of soldermask layer 16 on structure 10, and the risk for excessively removing 16 material of soldermask layer can be reduced, to reduce
Influence the electrical properties of board structure of circuit 10.
It please join Fig. 2A and Fig. 2 B, the board structure of circuit 20 of another embodiment of the utility model is provided.Board structure of circuit 20
Including support plate 22, circuit layer 24 and soldermask layer 26.It is worth noting that, each composition material of board structure of circuit 20 substantially with circuit
Each composition material of hardened structure 10 is similar, and so the difference of both this is that the size in the laser windowing area of soldermask layer is different.In electricity
In the hardened structure 10 in road, because laser windowing area 162 is smaller, therefore soldermask layer 16 is still covered on partial circuit layer 16, as shown in Figure 1B；
And in board structure of circuit 20, because laser windowing area 262 is larger, so that soldermask layer 26 is not covered in laser windowing area 262
On circuit layer 26, and the support plate 22 of exposure a part.
Based on above-mentioned design, the board structure of circuit of the utility model is because having laser windowing area that can accurately remove specified welding
Soldermask layer on point, and the anti-welding layer material other than laser windowing area will not be removed, subsequent welding processing procedure is prevented to reach
The problem of short circuit occurs.
Embodiment described above and/or embodiment are only the preferable realities to illustrate to realize the utility model technology
Example and/or embodiment are applied, not the embodiment of the utility model technology is made any form of restriction, any this field
Technical staff, in the range for not departing from technological means disclosed in the content of the present invention, when can make a little change or modification
For other equivalent embodiments, but still it should be regarded as technology identical with the utility model in essence or embodiment.
Claims (7)
1. a kind of board structure of circuit with laser windowing area characterized by comprising
One support plate；
One circuit layer is set on the support plate；And
One soldermask layer is set on the circuit layer and the support plate, and the soldermask layer have an at least laser open a window area, at least one
Dividing the circuit layer is in exposed at least laser windowing area.
2. as described in claim 1 with laser windowing area board structure of circuit, which is characterized in that the soldermask layer with a thickness of
10-200μm。
3. as described in claim 1 with laser windowing area board structure of circuit, which is characterized in that the soldermask layer with a thickness of
10-50μm。
4. the board structure of circuit as described in claim 1 with laser windowing area, which is characterized in that the soldermask layer is to visible light
The light reflectivity of at least a part of wavelength is greater than 80% in wave-length coverage.
5. the board structure of circuit as described in claim 1 with laser windowing area, which is characterized in that the soldermask layer is situated between to wavelength
The light reflectivity of the visible light of at least a part of wavelength is greater than 80% in 625-740nm range.
6. the board structure of circuit as described in claim 1 with laser windowing area, which is characterized in that the soldermask layer is situated between to wavelength
The light reflectivity of the visible light of at least a part of wavelength is greater than 80% in 500-565nm range.
7. the board structure of circuit as described in claim 1 with laser windowing area, which is characterized in that the soldermask layer is situated between to wavelength
The light reflectivity of the visible light of at least a part of wavelength is greater than 80% in 485-500nm range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821513206.4U CN209151418U (en) | 2018-09-17 | 2018-09-17 | Board structure of circuit with laser windowing area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821513206.4U CN209151418U (en) | 2018-09-17 | 2018-09-17 | Board structure of circuit with laser windowing area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209151418U true CN209151418U (en) | 2019-07-23 |
Family
ID=67265477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821513206.4U Active CN209151418U (en) | 2018-09-17 | 2018-09-17 | Board structure of circuit with laser windowing area |
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| Country | Link |
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| CN (1) | CN209151418U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566352A (en) * | 2019-09-25 | 2021-03-26 | 李家铭 | Circuit structure with anti-laser seam filling layer and manufacturing method thereof |
| CN112566371A (en) * | 2019-09-25 | 2021-03-26 | 李家铭 | Circuit structure with gap filling layer and manufacturing method thereof |
-
2018
- 2018-09-17 CN CN201821513206.4U patent/CN209151418U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566352A (en) * | 2019-09-25 | 2021-03-26 | 李家铭 | Circuit structure with anti-laser seam filling layer and manufacturing method thereof |
| CN112566371A (en) * | 2019-09-25 | 2021-03-26 | 李家铭 | Circuit structure with gap filling layer and manufacturing method thereof |
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