CN110933876A - Manufacturing method of stepped groove - Google Patents
Manufacturing method of stepped groove Download PDFInfo
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- CN110933876A CN110933876A CN201911212965.6A CN201911212965A CN110933876A CN 110933876 A CN110933876 A CN 110933876A CN 201911212965 A CN201911212965 A CN 201911212965A CN 110933876 A CN110933876 A CN 110933876A
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- stepped groove
- manufacturing
- laminate
- protective layer
- depth control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A manufacturing method of a stepped groove comprises the following steps: s1: cutting the n layers of substrates L1-Ln into preset sizes, wherein n is larger than or equal to 2; s2: presetting the position and the depth of a stepped groove, wherein the bottom surface of the stepped groove is an Lm laminate, m is more than 1 and less than or equal to n, a protective layer is arranged between the Lm laminate and the Lm-1 laminate, and the protective layer is formed by sequentially laminating a first no-flow adhesive PP, a light plate and a second no-flow adhesive PP; s3: windowing the position, corresponding to the preset step groove, on the protective layer; s4: and the n layers of substrates and the protective layer are laminated to form the whole PCB, and a stepped groove is milled in the depth control mode, wherein the depth control depth is equal to the thickness of the L1-Lm-1 layer plus the depth control machine precision. The invention solves the problems that the size of the stepped groove is not accurate and the stepped groove is easy to mill or residual glue is left in the groove in the traditional manufacturing process, improves the quality and the product percent of pass of the stepped groove, reduces the production cost and the difficulty of depth control routing, improves the performance of a PCB (printed circuit board), and forms the stepped groove with a smooth surface.
Description
Technical Field
The invention relates to the field of PCBs, in particular to a manufacturing method of a stepped groove.
Background
With the development of the communication industry to the 5G era, communication signals are enhanced, the communication speed is increased, and the corresponding server PCB must meet the requirements of high frequency and high speed. In order to reduce interference of a deposited capacitor, an antenna needs to be arranged in a stepped groove, a traditional method is to adopt a depth control routing process for manufacturing, but the depth control routing process cannot be manufactured when the antenna in the stepped groove is exposed and the groove wall is metallized.
The conventional grooving method is depth control milling, but the depth control precision can only be +/-3mil, so when the thickness of a plate medium is below 3mil or a copper foil is thin (such as 1 OZ), the method is difficult to manufacture a qualified stepped groove, and quality problems such as milling through or residual glue are easy to occur.
Disclosure of Invention
The invention provides a manufacturing method of a stepped groove, aiming at solving the problems that the existing stepped groove is easy to be milled and penetrated, has residual glue and the like.
A manufacturing method of a stepped groove comprises the following steps:
s1: cutting the n layers of substrates L1-Ln into preset sizes, wherein n is larger than or equal to 2;
s2: presetting the position and the depth of a stepped groove, wherein the bottom surface of the stepped groove is an Lm laminate, m is more than 1 and less than or equal to n, a protective layer is arranged between the Lm laminate and the Lm-1 laminate, and the protective layer is formed by sequentially laminating a first no-flow adhesive PP, a light plate and a second no-flow adhesive PP;
s3: windowing the position, corresponding to the preset step groove, on the protective layer;
s4: and the n layers of substrates and the protective layer are laminated to form the whole PCB, and a stepped groove is milled in the depth control mode, wherein the depth control depth is equal to the thickness of the L1-Lm-1 layer plus the depth control machine precision.
Preferably, after the n layers of substrates are pressed, drilling, routing a PTH hole, board electricity, an outer layer pattern, pattern electricity, secondary drilling, outer layer etching and outer layer AOI are further carried out, and finally, the stepped groove is milled in a depth control manner.
Preferably, after the stepped groove is milled in the depth control mode, the whole PCB is subjected to gold melting, and local gold melting is carried out at the position of the stepped groove.
Preferably, the windowing the protective layer in the step S3 includes:
slotting the optical plate, using the exposure coefficient of an Lm or Ln laminate, carrying out rough routing and then fine routing, wherein the slotting size of the optical plate is consistent with the size of a preset step groove;
and (3) slotting the first no-flow glue PP and the second no-flow glue PP, using the exposure coefficient of an Lm or Ln laminate, wherein the slotting sizes of the first no-flow glue PP and the second no-flow glue PP are the same, and the slotting size is larger than each side of the light plate slotting by more than 2 mils.
Preferably, the light panel is fabricated by cutting, etching, drilling and grooving.
Preferably, the first no-flow adhesive PP and the second no-flow adhesive PP are manufactured by cutting, drilling and grooving.
Preferably, the L1 and Ln layers are subjected to cutting, drilling, outer layer circuit manufacturing and external inspection in sequence before lamination.
Preferably, the L2 and Ln-1 layers are subjected to cutting, drilling, electroplating, outer layer circuit manufacturing and external inspection in sequence before lamination.
Preferably, a PP sheet is arranged between the adjacent substrates, and a light plate is arranged at intervals of four PP sheets.
Preferably, before gold is dissolved, the whole PCB is subjected to ultrasonic water washing, then is subjected to sand blasting, and finally is determined that no adhesive residue exists at the position of the stepped groove.
The invention provides a manufacturing method of a stepped groove, which solves the problems that the stepped groove is inaccurate in size and easy to mill through or residual glue exists in the groove in the traditional manufacturing method of the stepped groove; the protective layer is arranged above the bottom plate of the preset stepped groove, the position, corresponding to the stepped groove, on the protective layer is windowed, the stepped groove is milled through the depth control gong which is easy to control after the multilayer board and the protective layer are pressed, the formed stepped groove is smooth in surface, no adhesive residue exists, and the exposed stepped groove can be subjected to chemical gold or other processing procedures.
Drawings
FIG. 1 is a schematic view of one of the PCBs manufactured by the method.
Detailed Description
The technical solution protected by the present invention is further explained in detail below.
A manufacturing method of a stepped groove comprises the following steps:
s1: cutting the n layers of substrates L1-Ln into preset sizes, wherein n is larger than or equal to 2; wherein the L1 and Ln laminates are subjected to cutting, drilling, outer layer circuit manufacturing and external inspection in sequence before subsequent lamination; the L2 and Ln-1 laminate are subjected to cutting, drilling, electroplating, outer layer circuit manufacturing and external inspection in sequence before subsequent lamination.
S2: presetting the position and the depth of a stepped groove, setting the bottom surface of the stepped groove as an Lm laminate, wherein m is more than 1 and less than or equal to n, arranging a protective layer between the Lm laminate and the Lm-1 laminate, and laminating the protective layer by sequentially a first no-flow adhesive PP, a light plate and a second no-flow adhesive PP;
s3: windowing is performed on the protective layer at a position corresponding to the preset step groove, and the windowing of the protective layer in the step S3 includes the following steps:
slotting a light plate, using an exposure coefficient of an Lm or Ln laminate, carrying out rough routing and then fine routing, wherein the slotting size of the light plate is consistent with the size of a preset step slot, and the light plate is manufactured by cutting, etching, drilling and slotting;
slotting the first no-flow glue PP and the second no-flow glue PP, using the exposure coefficient of an Lm or Ln laminate, wherein the slotting sizes of the first no-flow glue PP and the second no-flow glue PP are the same, the slotting size is larger than each side of the light plate slotting by more than 2 mils, and the first no-flow glue PP and the second no-flow glue PP are manufactured by cutting, drilling and slotting.
S4: the method comprises the following steps that PP sheets are arranged between adjacent substrates, a light plate is arranged at intervals of four PP sheets to prevent glue residues generated by the edge of a groove due to high temperature, an n-layer board, the PP sheets and a protective layer are pressed to form a whole PCB, drilling, routing of PTH holes, a board electric, an outer layer graph, a graph electric, secondary drilling, outer layer etching and outer layer AOI are sequentially carried out after the n-layer board is pressed, finally, a step groove is milled in a depth control mode, the depth control depth is equal to the thickness of a layer from L1 to Lm-1, the precision of a depth control machine is added, such as Lm = L3, the thicknesses of the L1 layer board and the L2 layer board are equal to 0.5mm, the precision of the depth control machine is 0.1mm, the depth control depth is equal to 0.6mm, the protective layer can prevent copper foils on the surface of the Lm-layer board from being milled in the depth control mode of milling the step groove, and windows are formed in the corresponding positions of;
s5: after the stepped groove is milled by depth control, gold melting is carried out on the whole PCB, local gold melting is carried out at the position of the stepped groove, the whole PCB is subjected to ultrasonic water washing before the gold melting, then is subjected to sand blasting, and finally, the position of the stepped groove is determined to have no adhesive residue, so that the quality of the gold melting is ensured.
Fig. 1 is a diagram of one of the PCBs manufactured by the method of the present invention, the PCB is provided with a PTH hole 1, a first stepped groove 2 and a second stepped groove 3, the first stepped groove 2 is semicircular, the upper surface of the first stepped groove 2 is provided with a localized gold region 21, the second stepped groove 3 is rectangular, the second stepped groove 3 is provided with a through hole 31, and the PCB is completely plated with gold except the first stepped groove 2, including board edge gold. The exposed surfaces of the first stepped groove and the second stepped groove are smooth and have no adhesive residue.
The invention provides a manufacturing method of a stepped groove, which solves the problems that the stepped groove is inaccurate in size and easy to mill through or residual glue exists in the groove in the traditional manufacturing method of the stepped groove; the protective layer is arranged above the bottom plate of the preset stepped groove, the position, corresponding to the stepped groove, on the protective layer is windowed, the stepped groove is milled through the depth control gong which is easy to control after the multilayer board and the protective layer are pressed, the formed stepped groove is smooth in surface, no adhesive residue exists, and the exposed stepped groove can be subjected to chemical gold or other processing procedures.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (10)
1. A manufacturing method of a stepped groove is characterized by comprising the following steps: the method comprises the following steps:
s1: cutting the n layers of substrates L1-Ln into preset sizes, wherein n is larger than or equal to 2;
s2: presetting the position and the depth of a stepped groove, wherein the bottom surface of the stepped groove is an Lm laminate, m is more than 1 and less than or equal to n, a protective layer is arranged between the Lm laminate and the Lm-1 laminate, and the protective layer is formed by sequentially laminating a first no-flow adhesive PP, a light plate and a second no-flow adhesive PP;
s3: windowing the position, corresponding to the preset step groove, on the protective layer;
s4: and the n layers of substrates and the protective layer are laminated to form the whole PCB, and a stepped groove is milled in the depth control mode, wherein the depth control depth is equal to the thickness of the L1-Lm-1 layer plus the depth control machine precision.
2. The manufacturing method of the stepped groove according to claim 1, wherein: and after the n layers of substrates are pressed, drilling, routing PTH holes, board electricity, outer layer patterns, pattern electricity, secondary drilling, outer layer etching and outer layer AOI are carried out, and finally depth control is carried out to mill a stepped groove.
3. A method of manufacturing a stepped recess according to claim 1 or 2, wherein: and after the stepped groove is milled in the depth control mode, carrying out gold melting on the whole PCB, and carrying out local gold melting at the position of the stepped groove.
4. The manufacturing method of the stepped groove according to claim 1, wherein: the step S3 of windowing the protection layer includes the following steps:
slotting the optical plate, using the exposure coefficient of an Lm or Ln laminate, carrying out rough routing and then fine routing, wherein the slotting size of the optical plate is consistent with the size of a preset step groove;
and (3) slotting the first no-flow glue PP and the second no-flow glue PP, using the exposure coefficient of an Lm or Ln laminate, wherein the slotting sizes of the first no-flow glue PP and the second no-flow glue PP are the same, and the slotting size is larger than each side of the light plate slotting by more than 2 mils.
5. The manufacturing method of the stepped groove according to claim 1, wherein: the light plate is manufactured by cutting, etching, drilling and slotting.
6. The manufacturing method of the stepped groove according to claim 1, wherein: the first no-flow glue PP and the second no-flow glue PP are manufactured by cutting, drilling and grooving.
7. The manufacturing method of the stepped groove according to claim 1, wherein: the L1 and Ln layers are subjected to cutting, drilling, outer layer circuit manufacturing and external inspection in sequence before lamination.
8. The manufacturing method of the stepped groove according to claim 1, wherein: the L2 and Ln-1 layers are subjected to cutting, drilling, electroplating, outer layer circuit manufacturing and external inspection in sequence before lamination.
9. The method for manufacturing the stepped groove according to any one of claims 1 to 8, wherein: PP sheets are arranged between the adjacent substrates, and a light plate is arranged at every four PP sheets.
10. The manufacturing method of the stepped groove according to claim 3, wherein: before gold melting, the whole PCB is subjected to ultrasonic water washing, then is subjected to sand blasting, and finally the step groove position is determined to have no residual glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911212965.6A CN110933876A (en) | 2019-12-02 | 2019-12-02 | Manufacturing method of stepped groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911212965.6A CN110933876A (en) | 2019-12-02 | 2019-12-02 | Manufacturing method of stepped groove |
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| CN110933876A true CN110933876A (en) | 2020-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911212965.6A Pending CN110933876A (en) | 2019-12-02 | 2019-12-02 | Manufacturing method of stepped groove |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836485A (en) * | 2020-08-24 | 2020-10-27 | 大连崇达电子有限公司 | Manufacturing process of twice stepped plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594742A (en) * | 2008-05-29 | 2009-12-02 | 华为技术有限公司 | The equipment of the manufacture method of circuit board step trough and circuit board manufacturing step trough |
| CN101699937A (en) * | 2009-11-04 | 2010-04-28 | 上海美维电子有限公司 | Method for producing stepped PCB board |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN107592735A (en) * | 2017-08-22 | 2018-01-16 | 深圳崇达多层线路板有限公司 | Thick desired ladder board manufacturing method more than a kind of high accuracy |
-
2019
- 2019-12-02 CN CN201911212965.6A patent/CN110933876A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594742A (en) * | 2008-05-29 | 2009-12-02 | 华为技术有限公司 | The equipment of the manufacture method of circuit board step trough and circuit board manufacturing step trough |
| CN101699937A (en) * | 2009-11-04 | 2010-04-28 | 上海美维电子有限公司 | Method for producing stepped PCB board |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN107592735A (en) * | 2017-08-22 | 2018-01-16 | 深圳崇达多层线路板有限公司 | Thick desired ladder board manufacturing method more than a kind of high accuracy |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836485A (en) * | 2020-08-24 | 2020-10-27 | 大连崇达电子有限公司 | Manufacturing process of twice stepped plate |
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Application publication date: 20200327 |