CN105611751B - A kind of processing method of multi-layer flexible circuit board - Google Patents
A kind of processing method of multi-layer flexible circuit board Download PDFInfo
- Publication number
- CN105611751B CN105611751B CN201510559712.1A CN201510559712A CN105611751B CN 105611751 B CN105611751 B CN 105611751B CN 201510559712 A CN201510559712 A CN 201510559712A CN 105611751 B CN105611751 B CN 105611751B
- Authority
- CN
- China
- Prior art keywords
- substrate
- layer
- outermost layer
- circuit board
- golden finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to flexible circuit board manufacture field, in particular to a kind of multi-layer flexible circuit board processing method of exposed internal layer golden finger.Outermost layer substrate does not open a window the present invention and bonding sheet uplifting window before pressing in outer layer; the region is set to form the space protected by outermost layer substrate an of sealing state after pressing; the outermost layer substrate of guard space is removed by laser control windowing deeply or using the windowing of plane blade cutting equipment again after outer-layer circuit completes, exposes internal layer golden finger.The present invention effectively avoids printing blue glue or pastes the technological deficiency of anti-plate adhesive tape, and processing quality is high, and processing efficiency is fast, and processing cost is low, will not pollute to product itself and production equipment, is suitble to produce in enormous quantities.
Description
Technical field
The invention belongs to flexible circuit board manufacture fields, more particularly to a kind of layer flexible line of exposed internal layer golden finger
Road plate processing method.
Background technique
Flexible circuit board (Flexible Printed Circuit Board) referred to as " soft board ", is commonly called as FPC in industry, is
The printed circuit board made of insulating substrate flexible (mainly polyimides or polyester film) has many hardness printing electricity
The advantages of road plate does not have is fitted if it can be substantially reduced the volume of electronic product with FPC with free bend, winding, folding
The needs developed with electronic product to high density, miniaturization, highly reliable direction.
Flexible circuit board is divided into single side, two-sided and multi-layer board, and for multi-layer flexible circuit board, some golden finger positions are in interior
On laminar substrate, this just needs to open a window in outer layer corresponding position, so that the golden finger of internal substrate exposes, and general system
Making method all is opened a window in advance in outer layer corresponding position, then in windowing position patch anti-plate adhesive tape or printing blue glue to protect
Internal layer golden finger is protected, is torn after outer-layer circuit completes, then anti-plate adhesive tape or blue glue.
But the method for either pasting anti-plate adhesive tape or printing blue glue may occur that overlay area is poorly sealed close to lead
The risk for causing internal layer circuit and golden finger to be attacked by liquid medicine, while adhesive tape and blue glue may also pollute heavy copper facing liquid medicine, and it
The clast etc. that generates also will affect outer-layer circuit production, poor short circuit is opened in increase.
Summary of the invention
It can be to avoid internal layer circuit and golden finger by medicine it is an object of the invention to provide one kind in order to solve the above problem
Water attack, processing quality is high, and processing efficiency is fast, and processing cost is low, and product itself and production equipment will not be polluted
The processing method of multi-layer flexible circuit board.
For this purpose, the invention discloses a kind of processing methods of multi-layer flexible circuit board: including the following steps:
A1: route and golden finger are produced on the two sides of internal substrate, in the golden hand of internal substrate on outer layer bonding sheet
Refer to the default windowing of corresponding exposed zone position；
A2: by internal substrate, outer bound piece and outermost layer substrate are pressed into multi-layer board；
A3: via hole is opened up on multilayer boards, and hole metallization will be connected；
A4: route is produced on outermost layer substrate, and the metal-plated for the exposed area for corresponding to golden finger on outermost layer substrate
Layer etches away；
A5: the part in the exposed area of outermost layer substrate is removed, the golden finger of internal substrate is exposed.
Further, further include step A6: carrying out outer layer welding resistance.
Further, the via hole is metallized using heavy copper-plating technique.
Further, it in the step A5, is profoundly prescinded in the exposed area except the outermost layer substrate using laser control
Part.
Further, the step A5 specifically: by laser controlling depth mode along the exposed area of outermost layer substrate
It is cut on profile in domain, leaves on one side as tear line, then tear the part in the exposed area along tear line again.
Further, it in the step A5, is cut using plane blade in the exposed area for removing the outermost layer substrate
Part.
Further, the step A5 specifically: by plane blade cutting mode along the exposed area of outermost layer substrate
It is cut on profile in domain, leaves on one side as tear line, then tear the part in the exposed area along tear line again.
Further, in the step A5, a small notch is opened up respectively at the both ends of tear line, in order to tear by hand.
Advantageous effects of the invention:
The present invention, which takes, not to open a window in advance in outermost layer substrate and only opens a window in outer layer bonding sheet, is formed after pressing multi-layer board
By a hanging region of outermost layer substrate seal protection internal layer circuit, opened a window deeply when outer-layer circuit completes using laser control
Or the windowing of plane blade cutting equipment, the outermost layer substrate of protection zone is removed, exposes internal layer golden finger, to avoid internal layer circuit
With golden finger by the attack of liquid medicine in subsequent handling, it not will increase other filling coverings (such as blue glue, anti-plate adhesive tape), it will not
Heavy copper facing effect is polluted, extra clast attachment will not be generated and then influences the process rate of subsequent outer-layer circuit,
Operating process is simple and convenient, and processing efficiency is fast, and processing quality is high, and processing cost is low, is suitble to produce in enormous quantities.
Detailed description of the invention
Fig. 1 is the outer bound piece windowing schematic diagram of the embodiment of the present invention；
Fig. 2 is the Multi-layer force fit schematic diagram of the embodiment of the present invention；
Fig. 3 opens up through-hole and the schematic diagram that metallizes for the embodiment of the present invention；
Fig. 4 is the coat of metal windowing schematic diagram of the embodiment of the present invention；
Fig. 5 is the outermost layer substrate windowing schematic diagram of the embodiment of the present invention；
Fig. 6 is another schematic diagram of outermost layer substrate windowing of the embodiment of the present invention；
Fig. 7 is the finished product schematic of the embodiment of the present invention.
Specific embodiment
Now in conjunction with the drawings and specific embodiments, the present invention is further described.
Embodiment one:
As shown in figs. 1-7, a kind of processing method of multi-layer flexible circuit board: include the following steps:
A1: including PI substrate and copper foil in internal substrate 4() two sides produce route 6 and golden finger 3, the system of route 6
Making process includes the processes such as the design film, exposure, development and etching, these processes be all it is more mature, be referred to existing
Technology, this is no longer described in detail.The default windowing 5 of the corresponding exposed zone position of golden finger 3 on outer layer bonding sheet 2 in internal substrate 4.
A2: by internal substrate 4, outer bound piece 2 and outermost layer substrate 1 are pressed into multi-layer board, and multi-layer board pressing is referred to
The prior art, this is no longer described in detail.After pressing, outermost layer substrate 1 seals window 5 to form a cavity space 7, in protecting
Sandwich circuit 6 and golden finger 3 be not by subsequent handling (as the heavy plating copper process of via hole and outermost layer substrate make route process) liquid medicine
Attack.
A3: opening up via hole 8 on multilayer boards, can process via hole 8 using the methods of NC brill, mechanical punching, laser drilling,
These methods have been widely used, and specifically can refer to the prior art, this is no longer described in detail, and via hole 8 is metallized, so that up and down
Two layers of conductor conducting.In this specific implementation, via hole 8 is metallized using heavy copper-plating technique, in outermost layer substrate 1 after metallization
Surface and the hole wall of via hole 8 form one layer of coat of metal 9, heavy copper-plating technique is referred to the prior art, this is no longer thin
It says.
A4: processing procedure goes out route on outermost layer substrate 1, and production process includes the works such as the design film, exposure, development and etching
Sequence, these processes be all it is more mature, be referred to the prior art, this is no longer described in detail.And it is golden corresponding on outermost layer substrate 1
The coat of metal 9 of the exposed area (i.e. cavity space 7 is corresponding) of finger 3 etches away, and the etching about the coat of metal is referred to existing
There is technology, this is no longer described in detail, forms window 10, exposes outermost layer substrate 1.
A5: the part (i.e. the corresponding outermost layer substrate in 10 region of window) in the exposed area of outermost layer substrate 1 is removed, dew
The golden finger 3 of internal substrate 4 out.
Specifically, being cut along the profile in the exposed area of outermost layer substrate 1 by way of laser controlling depth, stay
Lower to be used as tear line on one side, then it is outer to tear this as close as possible to the useful area of flexible circuit board by hand along tear line again for tear line
Reveal the part in region, form window 16, exposes the golden finger 3 on internal substrate 4.Being somebody's turn to do for outermost layer substrate 1 is torn using manual
Part in exposed area rather than cut away by the way of laser controlling depth, be because by the way of laser controlling depth
The control difficulty cut away is big, is easy to cause to damage or influence appearance to the useful region of product.Certainly, for as round or non-rule
The then windowing of the golden finger of shape then can not need all to cut away using laser using tearing.
Existing golden finger shape be all largely it is rectangular, in this specific embodiment, will be by taking rectangular golden finger as an example for
The detailed process that the mode of bright laser controlling depth is cut on the profile in the exposed area of outermost layer substrate 1: outside
In the exposed area of laminar substrate 1 corresponding to the exposed area of golden finger 3 preceding 11, a left side 14, right 13 3 directions contour line into
Row cutting leaves the rear direction contour line 12 positioned at the useful area of wiring board as tear line, then tears by hand along tear line 12
Outermost layer substrate 1 in 10 region of window, as shown in Figure 6.
Further, a small notch 15 is opened up respectively at the both ends of tear line 12, in order to tear by hand.
Further, it after the completion of step A5, also progress step A6: carries out outer layer welding resistance and specifically may be used with protecting outer circuit
With referring to the prior art, this is no longer described in detail.
Embodiment two:
The difference from embodiment 1 is that step A5, the present embodiment step A5 to be set using plane blade cutting for the present embodiment
The standby mode for building work replaces the mode of the laser controlling depth of embodiment one.
It is more at low cost than by the way of laser controlling depth by the way of the processing of plane blade cutting equipment.
It does not open a window in outermost layer substrate and only opens a window in outer layer bonding sheet in advance in conclusion the present invention takes, press more
A hanging region by outermost layer substrate seal protection internal layer circuit and golden finger is formed after laminate, is completed in outer-layer circuit
Shi Caiyong laser control windowing deeply or the windowing of plane blade cutting equipment, remove the substrate of protection zone, expose internal layer golden finger, and one
Aspect protects the attack of internal layer circuit and golden finger not by subsequent handling liquid medicine, on the other hand not will increase other filling coverings
Object (such as blue glue, anti-plate adhesive tape), will not pollute heavy copper facing effect, will not generate extra clast attachment and then shadow
The process rate of subsequent outer-layer circuit is rung, operating process is simple and convenient, and processing efficiency is fast, and processing quality is high, and processing cost is low.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
It is white, it is not departing from the spirit and scope of the present invention defined by the appended claims, it in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (4)
1. a kind of processing method of multi-layer flexible circuit board, which comprises the steps of:
A1: route and golden finger are produced on the two sides of internal substrate, in the golden finger pair of internal substrate on outer layer bonding sheet
The default windowing of the exposed zone position answered；
A2: by internal substrate, outer bound piece and outermost layer substrate are pressed into multi-layer board；
A3: via hole is opened up on multilayer boards, and hole metallization will be connected；
A4: route is produced on outermost layer substrate, and the coat of metal for the exposed area for corresponding to golden finger on outermost layer substrate is lost
Quarter is fallen；
A5: the part in the exposed area of outermost layer substrate being removed, the golden finger of internal substrate is exposed, specifically, by swashing
Photocontrol depth mode is cut along the profile in the exposed area of outermost layer substrate, is left on one side as tear line, then again
The part in the exposed area is torn along tear line, or through plane blade cutting mode along the exposed area of outermost layer substrate
Profile on cut, leave on one side as tear line, then tear the part in the exposed area along tear line again.
2. the processing method of multi-layer flexible circuit board according to claim 1, it is characterised in that: further include step A6: into
Row outer layer welding resistance.
3. the processing method of multi-layer flexible circuit board according to claim 1, it is characterised in that: the via hole is using heavy
Copper-plating technique metallizes.
4. the processing method of multi-layer flexible circuit board according to claim 1, it is characterised in that: in the step A5,
The both ends of tear line open up a small notch respectively, in order to tear by hand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510559712.1A CN105611751B (en) | 2015-09-07 | 2015-09-07 | A kind of processing method of multi-layer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510559712.1A CN105611751B (en) | 2015-09-07 | 2015-09-07 | A kind of processing method of multi-layer flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105611751A CN105611751A (en) | 2016-05-25 |
| CN105611751B true CN105611751B (en) | 2019-02-19 |
Family
ID=55991197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510559712.1A Active CN105611751B (en) | 2015-09-07 | 2015-09-07 | A kind of processing method of multi-layer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105611751B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323039A (en) * | 2018-01-26 | 2018-07-24 | 景旺电子科技(龙川)有限公司 | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed |
| CN110022651B (en) * | 2019-05-21 | 2020-09-01 | 安捷利（番禺）电子实业有限公司 | Processing method and equipment for inner layer golden finger of multilayer board |
| CN110557894A (en) * | 2019-10-15 | 2019-12-10 | 深圳市华旭达精密电路科技有限公司 | Cover opening process for multi-layer hollowed-out flexible board |
| CN111542179A (en) * | 2020-05-15 | 2020-08-14 | 深圳市实锐泰科技有限公司 | Flexible plate uncovering method |
| CN112738979A (en) * | 2020-12-10 | 2021-04-30 | 西安易朴通讯技术有限公司 | PCB, chip and electronic equipment |
| CN113068308A (en) * | 2021-03-29 | 2021-07-02 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN113597146A (en) * | 2021-08-25 | 2021-11-02 | 盐城维信电子有限公司 | Roll-to-roll preparation process of multilayer flexible circuit board |
| CN114173494A (en) * | 2021-12-06 | 2022-03-11 | 博罗县精汇电子科技有限公司 | Method for manufacturing multilayer flexible circuit board with inner layer needing to be pasted |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101986773A (en) * | 2010-11-03 | 2011-03-16 | 东莞红板多层线路板有限公司 | Method for manufacturing combined rigid/flexible circuit board |
| CN102281725A (en) * | 2010-06-10 | 2011-12-14 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN103249264A (en) * | 2013-04-01 | 2013-08-14 | 深圳崇达多层线路板有限公司 | Method for manufacturing multi-layer circuit board with internal connecting finger |
| KR20140093442A (en) * | 2013-01-18 | 2014-07-28 | 주식회사 디엠케이 | Multi-layered flexible printed circuit board and the manufacturing method thereof |
| CN104284532A (en) * | 2014-09-30 | 2015-01-14 | 台山市精诚达电路有限公司 | Processing method for multilayer flexible printed circuit board |
-
2015
- 2015-09-07 CN CN201510559712.1A patent/CN105611751B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281725A (en) * | 2010-06-10 | 2011-12-14 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN101986773A (en) * | 2010-11-03 | 2011-03-16 | 东莞红板多层线路板有限公司 | Method for manufacturing combined rigid/flexible circuit board |
| KR20140093442A (en) * | 2013-01-18 | 2014-07-28 | 주식회사 디엠케이 | Multi-layered flexible printed circuit board and the manufacturing method thereof |
| CN103249264A (en) * | 2013-04-01 | 2013-08-14 | 深圳崇达多层线路板有限公司 | Method for manufacturing multi-layer circuit board with internal connecting finger |
| CN104284532A (en) * | 2014-09-30 | 2015-01-14 | 台山市精诚达电路有限公司 | Processing method for multilayer flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105611751A (en) | 2016-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105611751B (en) | A kind of processing method of multi-layer flexible circuit board | |
| CN1095173C (en) | Rigid/flex printed circuit board and manufacturing method therefor | |
| CN202310279U (en) | Graphical printed board at bottom of dual-step ladder groove | |
| CN103249264B (en) | A kind of manufacturing method of multi-layer circuit board of built-in golden finger | |
| CN110351965B (en) | Circuit board blind slot manufacturing method | |
| CN106409688A (en) | Processing method of ultrathin coreless package substrate and structure | |
| CN106102351B (en) | A kind of production method of cover film protection electromagnetic shielding film rigid-flex combined board | |
| CN107072080B (en) | Manufacturing method of bent copper-based PCB | |
| CN102238809B (en) | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof | |
| CN109843001A (en) | A kind of production method of Rigid Flex | |
| CN105704948A (en) | Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN102209438B (en) | High-density flexible circuit board and manufacturing method thereof | |
| CN114126259B (en) | Manufacturing method of stepped hole with non-metallized upper side wall and metallized lower side wall | |
| CN104981097B (en) | The processing method and golden finger circuit board of golden finger | |
| CN106879171A (en) | A kind of step conductive flexible circuit board and its processing method | |
| CN105682363B (en) | A kind of production method of the PCB of edges of boards metallization | |
| CN104981113B (en) | The processing method and golden finger circuit board of circuit edge connector | |
| CN103052267B (en) | The processing method of blind buried via hole wiring board | |
| WO2023123907A1 (en) | Manufacturing method for rigid-flex board, and circuit board | |
| CN103607845B (en) | Manufacturing method of flexible printed circuit board | |
| CN105228357A (en) | A kind of manufacture method of ladder wiring board | |
| CN101547573B (en) | Method for manufacturing circuit board with offset structure | |
| CN104981115B (en) | The processing method and golden finger circuit board of circuit edge connector | |
| CN109379840A (en) | A kind of processing method and circuit board of hanging golden finger | |
| CN109104824A (en) | A kind of production method of rigid-flexible combined circuit plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A processing method of multilayer flexible circuit board Effective date of registration: 20220207 Granted publication date: 20190219 Pledgee: Industrial Bank Limited by Share Ltd. Xiamen branch Pledgor: SUIWA HIGH TECHNOLOGY ELECTRONIC INDUSTRIES (XIAMEN) Co.,Ltd. Registration number: Y2022980001402 |