CN111542179A - Flexible plate uncovering method - Google Patents
Flexible plate uncovering method Download PDFInfo
- Publication number
- CN111542179A CN111542179A CN202010414537.8A CN202010414537A CN111542179A CN 111542179 A CN111542179 A CN 111542179A CN 202010414537 A CN202010414537 A CN 202010414537A CN 111542179 A CN111542179 A CN 111542179A
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- layer
- inner layer
- flexible board
- manufacturing
- outer layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention discloses a flexible board uncovering method aiming at a flexible board with a golden finger on an inner layer, which comprises the following steps: the inner layer circuit pattern is manufactured on an inner layer plate of the flexible board, the inner layer circuit pattern comprises an inner layer golden finger pattern, the dielectric layer is subjected to windowing manufacturing, the dielectric layer is subjected to inner layer laminating on the dielectric layer and the inner layer plate, the flexible board and an outer layer after the inner layer laminating are subjected to outer layer circuit layer typesetting and pressing, double-sided wet film coating and outer layer circuit pattern manufacturing are carried out, a punching line is made on the flexible board after the outer layer circuit is manufactured, punching and cover opening grooves are manufactured, then cover opening manufacturing is carried out, and finally cover film pasting and forming manufacturing are completed. According to the invention, the medium layer is windowed, and the outer layer is not windowed, so that the problem of fault pits caused by direct windowing is avoided, and the cover opening is accurate and convenient by manufacturing the etching line and the cover opening groove and opening the cover by adopting the viscose roller, so that the product reliability is effectively improved.
Description
Technical Field
The invention relates to the technical field of electronic manufacturing, in particular to a flexible board uncovering method.
Background
Flexible Printed Circuit boards (FPCs) have found wide applications in the high-end consumer electronics, medical devices, automobiles, and avionics fields based on their flexibility and high reliability.
For the multilayer flexible board with the inner layer provided with the golden finger plug circuit pattern, the inner layer golden finger position corresponding to the outer layer circuit needs to be uncovered, so that the inner layer golden finger pattern is exposed. The uncapping method of direct graph making is generally adopted, and the making process generally comprises the following steps: inner layer board → inner layer circuit pattern making → inner layer golden finger position window opening corresponding to the outer layer → inner layer pressing → outer layer board and inner layer board pressing → double-sided wet film coating → outer layer circuit pattern making, exposure, development, etching, film removing → laminating cover film → molding.
There are generally three problems associated with this approach:
(1) when the inner layer golden finger position corresponding to the outer layer is windowed, expansion and shrinkage of materials during pressing are required to be accurately estimated, and the inner layer golden finger position is windowed accurately, but due to the influence of uncertain factors such as hot pressing, wet flow manufacturing and the like during actual manufacturing, the problems of glue overflow, cavities and the like are easily generated at the step position of the cover during pressing;
(2) when the outer layer is coated with the wet film, because the position of the golden finger corresponding to the outer layer is windowed, the position is in a non-covered direct fault pit state after lamination, when the outer layer is coated with the wet film, because the coating roller is not easy to press into the pit, the problems of no wet film coating or wet film overflow in the direct fault pit are easily caused, and the problems of incomplete development, open circuit of a circuit, short circuit and the like are caused due to uneven wet film coating;
(3) when the outer layer pattern is manufactured, due to the reason of the problem (2), wet processes such as development, etching, film stripping and the like of the outer layer pattern manufacturing are manufactured, and liquid medicine easily permeates into the step position of the cover opening, so that the problems of open circuit, short circuit scrap and excessive side corrosion of the golden finger circuit pattern are caused.
Disclosure of Invention
The invention provides a flexible printed board forming method which can solve the problems of glue overflow and cavities generated at the step position of an uncapped cover during pressing and uneven wet film coating, and the problems of open circuit, short circuit scrap and excessive side corrosion of a gold finger circuit pattern caused by uneven wet film coating.
The invention provides a flexible plate uncovering method, which comprises the following steps:
manufacturing an inner layer circuit pattern on an inner layer plate of the flexible plate, wherein the inner layer circuit pattern comprises an inner layer golden finger pattern;
performing dielectric layer windowing manufacture on the inner layer golden finger pattern position area on the dielectric layer used for laminating the flexible board;
performing inner layer lamination on the inner layer plate after the inner layer circuit pattern is manufactured and the dielectric layer after the dielectric layer window is manufactured;
performing outer layer circuit layer typesetting and laminating on the flexible board with the inner layer laminated;
carrying out double-sided wet film coating on the flexible board after the outer layer circuit layer is typeset and pressed;
manufacturing an outer layer circuit pattern on the flexible board coated with the double-sided wet film;
making a punching line for the flexible board after the outer layer circuit pattern is manufactured, and punching and uncovering a groove for manufacturing;
opening the cover of the flexible plate after punching the cover opening groove;
carrying out covering film pasting manufacture on the flexible board after the cover opening manufacture;
and forming and manufacturing the flexible board after the covering film is adhered.
According to the invention, the outer layer circuit layer is designed into a structure for independently manufacturing the dielectric layer and the outer layer circuit layer, and the inner layer golden finger pattern position area corresponding to the dielectric layer is windowed, so that the phenomenon of overlarge drop of the golden finger pattern position area after lamination caused by the fact that the outer layer circuit layer is too thick is effectively reduced; the characteristic that the outer layer circuit layer is not windowed and directly covers the whole board is utilized, so that the outer layer has no direct fault pits, and the basis of board surface smoothness is made for the subsequent manufacturing procedures of wet film coating and outer layer circuit pattern manufacturing; moreover, because the dielectric layer is subjected to windowing manufacture, the inner layer golden finger pattern position area corresponding to the outer layer circuit layer is in a half-pressing state, and a low-adhesion interlayer binding force basis is provided for subsequent uncapping; the cover opening slot is punched to manufacture a cover opening for subsequent cover opening, and the effect of adhering and pulling the cover from one corner of the cover opening slot is achieved; the combination of the overall process effectively improves the yield of uncapping.
Optionally, the dielectric layer windowing includes: and carrying out milling-empty windowing according to the inner-layer golden finger pattern position area corresponding to the dielectric layer, wherein the windowing precision is controlled within-0.05 mm.
Optionally, the inner layer is attached to the outer layer, including: and matching and fitting corresponding patterns according to the inner layer circuit pattern and the dielectric layer windowing.
Optionally, the typesetting and laminating of the outer layer circuit layer includes typesetting and laminating the whole board with the glue layer side of the outer layer circuit layer facing the dielectric layer, and the laminating parameters are as follows: pressure 100kg/cm2～120kg/cm2The time is 150-200 seconds, and the temperature is 180 +/-5 ℃.
Optionally, the manufacturing of the outer layer circuit pattern includes making an etching line with a thickness of 0.1mm to 1.0 mm by extending inward the edge of the inner layer golden finger pattern position area corresponding to the outer layer circuit layer.
Optionally, the manufacturing of the outer layer circuit pattern further comprises the manufacturing of exposing, developing, etching and stripping the outer layer circuit layer, and the circuit precision of the manufacturing of the outer layer circuit pattern is controlled within-0.01 mm.
Optionally, the cover opening groove is formed by punching according to a punching line, the punching line is a 'U' -shaped punching indicating line which extends into the inner end along the edges of the two sides of the inner layer golden finger pattern position area by 1 mm-5 mm according to the edge line of the golden finger pointing end of the inner layer golden finger pattern position area.
Optionally, in the step of opening the cover, an adhesive roller is adopted, the cover is adhered to the end of the golden finger to open the cover on the whole plate from the position of the cover opening groove to the end direction of the golden finger, and the adhesion strength of the adhesive roller is 40N/100 mm-60N/100 mm.
Optionally, the attaching of the cover film includes: and manufacturing a cover film pattern on the cover film, laminating the cover film, and laminating the flexible board laminated with the cover film, wherein the manufacturing precision of the laminated cover film is controlled within-0.02 mm.
According to the cover opening method for the flexible board, the method that the dielectric layer is firstly attached to open the window and the dielectric layer is attached to reserve a certain pressing fall space for the position area of the golden finger pattern on the inner layer, the outer surface is integrally formed through whole board pressing of the circuit layer on the outer layer, the occurrence of a direct fault pit is avoided, the board surface is smoother, the uniformity of a coated wet film is effectively improved, the problems of incomplete development, open circuit, short circuit and the like are prevented, the outer surface is not directly opened the window, and the problems that liquid medicine permeates into the inner layer through the position where the window is directly opened or the inner layer leaks liquid medicine, open circuit, short circuit and the like due to the fact that the wet film is too thin are effectively avoided; the dielectric layer is separated from the outer layer, so that the thickness of the dielectric layer is reduced, the problem of glue overflow during pressing is effectively prevented, windowing is performed on the dielectric layer, and the position area of the golden finger pattern on the inner layer is in a half-pressing state after pressing, so that the uncovering area can be conveniently stripped; the manufacturing method comprises the steps of designing and manufacturing an etching line at the uncapping outline position during manufacturing of an outer layer circuit, etching a copper layer, enabling only a glue layer of an outer layer circuit layer to be reserved between the uncapping outline position and an inner layer, effectively reducing interlayer adhesion during uncapping manufacturing, manufacturing a U-shaped uncapping groove, using an adhesive roller to roll from the uncapping groove position to a plate body position to adhere and uncap, enabling the U-shaped uncapping groove to serve as an uncapping and cover lifting point, and enabling the adhesive roller to adhere to the uncapping manufacturing mode in batches, so that the problems that the plate surface is torn due to uncapping and; the overall technical process and the method can effectively improve the uncovering quality of the flexible board with the inner-layer golden finger patterns and improve the reliability of products.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a flow chart of a flexible board uncapping method according to an embodiment of the invention;
fig. 2 is a schematic diagram of a flexible board uncovering method according to an embodiment of the invention.
In the figure: 10. the inner layer board, 11, an inner layer circuit pattern, 12, an inner layer golden finger pattern position area, 20, medium layer laminating, 22, a medium layer, 21, a medium layer windowing, 30, an outer layer circuit layer composing and laminating, 31, an outer layer circuit layer, 311, a copper layer, 312, a glue layer, 40, double-sided wet film coating, 401, a wet film, 50, an outer layer circuit pattern, 51, exposure, development, 52, etching, film stripping, 521, an etching line, 60, cover opening groove manufacturing, 601, a punching line, 602, a cover opening groove, 70, a cover opening, 80, a cover pasting film, 801, a cover film, 90 and forming.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".
Referring to fig. 1-2, a flow chart and a schematic diagram of a method for opening a cover of a flexible board according to an embodiment of the present invention are shown.
The invention provides a flexible board uncovering method, which comprises the following steps:
step S10, manufacturing an inner layer circuit pattern 11 for the inner layer plate 10 of the flexible board, including manufacturing an inner layer golden finger pattern;
step S11, making a dielectric layer windowing 21 in the inner layer golden finger pattern position area 12 on the dielectric layer 22 for laminating the flexible board;
step S12, performing inner layer lamination 20 on the inner layer plate after the inner layer circuit pattern 11 is manufactured and the dielectric layer after the dielectric layer windowing 21 is manufactured;
step S13, performing outer layer circuit layer typesetting and stitching 30 on the flexible board with the inner layer laminated by 20;
step S14, performing double-sided wet film coating 40 on the flexible board after the outer layer circuit layer is typeset and pressed 30;
step S15, manufacturing an outer layer circuit pattern 50 on the flexible board coated with the double-sided wet film 40;
step S16, preparing a punching line 601 for the flexible board after the outer layer circuit pattern 50 is manufactured, and punching the cover opening groove 60;
step S17, performing cover 70 manufacturing on the flexible board after punching the cover opening groove 60;
step S18, manufacturing a cover film 80 on the flexible board after the cover 70 is manufactured;
step S19, the flexible board after the cover film 80 is formed is molded 90.
Specifically, as the outer-layer circuit windowing is directly manufactured at one time, the problems of glue overflow and cavities can be generated at the fault position after lamination, and therefore, the outer-layer circuit layer is designed into a single manufacturing structure of the dielectric layer and the outer-layer circuit layer, the breaking difference height of windowing is reduced, and a direct fault pit generated by direct windowing is prevented; because direct windowing can generate direct fault pits to influence the uniformity of wet film coating, and thus the manufacturing of the circuit is influenced, the manufacturing method that the dielectric layer is windowed and the outer layer circuit layer is not windowed is adopted, and good flat plate surface conditions are provided for the manufacturing of the outer layer circuit and the wet film coating; because the direct fault pit of the direct windowing causes that the circuit pattern of the outer layer is easy to seep liquid medicine, the design that the outer layer is not windowed is adopted; because the outer layer is not windowed, the outer layer can be pulled and adhered during uncapping, so that an etching line at the uncapping position is manufactured while the outer layer graph is manufactured, the copper layer is etched away, and a strippable guide line basis is provided for subsequent uncapping; because the outer window of not opening, directly uncap and be difficult to find and play the lid point, consequently adopt the mode in die-cut groove of uncapping, for uncapping the region provide one can the adhesion play lid mouth of lid, the operation of uncapping of being convenient for realizes uncapping the industrial production.
Referring to fig. 2, a schematic diagram of a method for opening a flexible board according to an embodiment of the present invention is shown.
As an alternative, the dielectric layer is windowed, comprising: performing milling-empty windowing according to the inner-layer golden finger pattern position area 12 corresponding to the dielectric layer 21;
furthermore, the windowing precision is controlled within-0.05 mm.
As an alternative, the inner layer laminate 20 includes: and matching and attaching corresponding patterns according to the inner layer circuit pattern 11 and the dielectric layer windowing 22.
Optionally, the outer circuit layer typesetting and laminating 30 includes: typesetting and pressing the whole board of the glue layer 312 of the outer circuit layer 31 towards the medium layer 21;
further, the pressing parameters are as follows: pressure 100kg/cm2～120kg/cm2The time is 150-200 seconds, and the temperature is 180 +/-5 ℃.
As an alternative, the outer layer circuit pattern 50 is formed by etching lines 521 extending inward by 0.1mm to 1.0 mm from the edge of the inner layer golden finger pattern position area 12 corresponding to the outer layer circuit layer 31.
As an alternative, the manufacturing of the outer layer circuit pattern 50 further includes the manufacturing of exposing, developing 51, etching and stripping 52 the outer layer circuit layer 31;
furthermore, the circuit precision of the outer layer circuit pattern 50 is controlled within-0.01 mm.
As an alternative, the uncovering groove making 60 is to form the uncovering groove 602 by punching according to a punching line 601, where the punching line 601 is a pointed end edge line of a golden finger according to the inner layer golden finger pattern position area 12, and a "U" -shaped punching indication line extending into the inner end along two side edges of the inner layer golden finger pattern position area 12 by 1mm to 5 mm.
As an alternative, the cover opening is made by adopting an adhesive roller, and the cover opening is performed by adhering the whole plate from the position of the cover opening groove 602 to the direction of the tail end of the golden finger;
furthermore, the adhesive force of the adhesive roller is 40N/100 mm-60N/100 mm.
As an alternative, the application of the cover film 80 is made by: manufacturing a cover film pattern on a cover film 801, attaching the cover film 801, and laminating the flexible board attached with the cover film 801; (ii) a
Furthermore, the manufacturing precision of the pasting covering film 80 is controlled within-0.02 mm.
According to the embodiment of the invention, through the windowing design of the dielectric layer, the integral pressing of the outer layer circuit layer, the manufacturing of the etching line, the punching of the uncapping groove and the manufacturing of adhering the uncapping by the adhesive roller, the problems of glue overflow and cavities of the pressing generated by the direct windowing of the outer layer circuit, uneven coating of a wet film, open circuit and short circuit of circuit patterns are effectively solved, and the problems that the uncapping has no cover lifting point and is not easy to peel off when the outer layer circuit is not windowed are solved, so that the uncapping yield of the flexible plate with the inner layer golden fingers and the reliability of the flexible plate are effectively improved by the overall process.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A flexible board uncovering method is characterized by comprising the following steps:
manufacturing an inner layer circuit pattern on an inner layer plate of the flexible plate, wherein the inner layer circuit pattern comprises an inner layer golden finger pattern;
performing dielectric layer windowing manufacture on the inner layer golden finger pattern position area on the dielectric layer used for laminating the flexible board;
performing inner layer lamination on the inner layer plate after the inner layer circuit pattern is manufactured and the dielectric layer after the dielectric layer window is manufactured;
performing outer layer circuit layer typesetting and laminating on the flexible board with the inner layer laminated;
carrying out double-sided wet film coating on the flexible board after the outer layer circuit layer is typeset and pressed;
manufacturing an outer layer circuit pattern on the flexible board coated with the double-sided wet film;
making a punching line for the flexible board after the outer layer circuit pattern is manufactured, and punching and uncovering a groove for manufacturing;
opening the cover of the flexible plate after punching the cover opening groove;
carrying out covering film pasting manufacture on the flexible board after the cover opening manufacture;
and forming and manufacturing the flexible board after the covering film is adhered.
2. A method of uncovering a flexible panel according to claim 1, wherein said dielectric layer is windowed, comprising: and carrying out milling-empty windowing according to the inner-layer golden finger pattern position area corresponding to the dielectric layer, wherein the windowing precision is controlled within-0.05 mm.
3. A method of uncapping a flexible sheet as claimed in claim 1, wherein said applying of said inner layer comprises: and matching and fitting corresponding patterns according to the inner layer circuit pattern and the dielectric layer windowing.
4. A cover opening method for a flexible board according to claim 1, wherein the typesetting and laminating of the outer layer circuit layer comprises typesetting and laminating the whole board by facing one side of the glue layer of the outer layer circuit layer to the medium layer, and the laminating parameters are as follows: pressure 100kg/cm2～120kg/cm2The time is 150-200 seconds, and the temperature is 180 +/-5 ℃.
5. A method for uncovering a flexible board according to claim 1, wherein the manufacturing of the outer layer circuit pattern comprises etching lines with the thickness of 0.1 mm-1.0 mm for inwards extending the edges of the inner layer golden finger pattern position areas corresponding to the outer layer circuit layer.
6. A cover opening method for a flexible board according to claim 1 or 5, characterized in that the manufacture of the outer layer circuit pattern further comprises the manufacture of exposing, developing, etching and film stripping the outer layer circuit layer, and the circuit precision of the manufacture of the outer layer circuit pattern is controlled within-0.01 mm.
7. A method for uncovering a flexible plate according to claim 1, wherein the uncovering groove is manufactured by punching and forming the uncovering groove according to punching and cutting lines, wherein the punching and cutting lines are edge lines of a golden finger pointing end according to the position area of the golden finger pattern on the inner layer, and U-shaped punching and cutting indication lines which extend into the inner end from 1mm to 5mm along two side edges of the position area of the golden finger pattern on the inner layer.
8. A method for opening a cover on a flexible board according to claim 1, wherein the opening is performed by adhering the whole board from the position of the opening groove to the end direction of the golden finger by using an adhesive roller.
9. A method for opening a cover on a flexible board according to claim 8 wherein the adhesive roller has an adhesion force of 40N/100mm to 60N/100 mm.
10. A method of uncovering a flexible panel according to claim 1, characterised in that said application of a cover film preparation comprises: and manufacturing a cover film pattern on the cover film, laminating the cover film, and laminating the flexible board laminated with the cover film, wherein the manufacturing precision of the laminated cover film is controlled within-0.02 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010414537.8A CN111542179A (en) | 2020-05-15 | 2020-05-15 | Flexible plate uncovering method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010414537.8A CN111542179A (en) | 2020-05-15 | 2020-05-15 | Flexible plate uncovering method |
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| CN111542179A true CN111542179A (en) | 2020-08-14 |
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| CN202010414537.8A Pending CN111542179A (en) | 2020-05-15 | 2020-05-15 | Flexible plate uncovering method |
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| CN111918490A (en) * | 2020-08-30 | 2020-11-10 | 深圳市实锐泰科技有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
| CN112888200A (en) * | 2021-01-21 | 2021-06-01 | 盐城维信电子有限公司 | Flexible circuit board processing method |
| CN113507791A (en) * | 2021-06-02 | 2021-10-15 | 深圳市强达电路股份有限公司 | Manufacturing method of gold finger with stepped structure |
| CN114340218A (en) * | 2021-12-29 | 2022-04-12 | 江苏苏杭电子有限公司 | Manufacturing method of second-order HDI multilayer circuit board containing loop type dense circuit |
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| CN114340218A (en) * | 2021-12-29 | 2022-04-12 | 江苏苏杭电子有限公司 | Manufacturing method of second-order HDI multilayer circuit board containing loop type dense circuit |
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