CN111918490B - Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board - Google Patents
Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board Download PDFInfo
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- CN111918490B CN111918490B CN202010891440.6A CN202010891440A CN111918490B CN 111918490 B CN111918490 B CN 111918490B CN 202010891440 A CN202010891440 A CN 202010891440A CN 111918490 B CN111918490 B CN 111918490B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 81
- 229910000679 solder Inorganic materials 0.000 claims abstract description 78
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000010030 laminating Methods 0.000 claims abstract description 18
- 238000011161 development Methods 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 claims description 159
- 239000013039 cover film Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000004080 punching Methods 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 151
- 238000010586 diagram Methods 0.000 description 11
- 238000001723 curing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of a rigid-flex board, which comprises the steps of manufacturing a solder mask layer in a region of a flexible board, which is required to be manufactured and subjected to high-temperature baking, pasting a dry film on the solder mask layer, carrying out exposure development to form a dry film layer, coating a wet film on the dry film layer, carrying out exposure development to reserve a wet film pattern corresponding to the dry film layer, forming a first wet film layer, coating a wet film on a position of a rigid board corresponding to the first wet film layer, carrying out exposure development to reserve a wet film pattern corresponding to the first wet film layer, forming a second wet film layer, typesetting and laminating the flexible board and the rigid board, carrying out uncovering treatment on the rigid board after lamination to form an uncovering region, exposing the dry film layer or the first wet film layer outside the uncovering region, removing an auxiliary region, and removing the dry film layer or the dry film layer and the first wet film layer by adopting a film removing solution to obtain the rigid-flex board. The manufacturing method of the rigid-flex printed circuit board provided by the invention can effectively improve the quality of the rigid-flex printed circuit board and reduce the problems of scrapping of the rigid-flex printed circuit board in the process of uncovering and the like.
Description
Technical Field
The invention relates to the field of rigid-flex board manufacturing, in particular to a manufacturing method of a rigid-flex board and the rigid-flex board.
Background
The rigid-Flex PCB (Rigid-Flex PCB) is a printed circuit board in which a flexible board and a rigid board are combined with each other through interlayer distribution. The rigid-flex printed circuit board changes the traditional planar design concept, expands to a three-dimensional space concept, brings great convenience to product design and application, and increases the manufacturing difficulty.
The flexible board is provided with a local solder mask rigid-flex printed circuit board, the rigid board and the flexible board are pressed together, and then when the cover is opened in a flexible board area, the rigid board and the board surface of the flexible board are firmly combined due to the pressing, so that the solder mask is easily torn during the cover opening, the problem that the solder mask falls off and the like is caused, and if the screen printing of the solder mask is carried out after the rigid-flex printed circuit board is manufactured, the problems of oil leakage and deviation of the solder mask, even the screen printing cannot be caused because the board surface rigid-flex printed circuit board is not on the same plane are solved.
Therefore, a novel cover opening manufacturing method is designed and developed for the rigid-flex printed circuit board with the local solder mask layer on the flexible board layer, so that the problem of tearing of the solder mask layer on the flexible board during cover opening is avoided.
Disclosure of Invention
The invention aims to solve the technical problem of providing a manufacturing method of a rigid-flex printed circuit board and the rigid-flex printed circuit board, wherein a mode of pasting a dry film and a wet film on a solder mask and coating the wet film on a hard board position corresponding to the solder mask is adopted to realize that the solder mask cannot fall off when a cover is opened, the whole manufacturing method is simple, the manufacturing cost is low, and the reliability of the rigid-flex printed circuit board is effectively improved.
In a first aspect, the present invention provides a method for manufacturing a rigid-flex printed circuit board, wherein at least one flexible printed circuit board and at least two rigid printed circuit boards are laminated, and the method includes:
Laminating a cover film, windowing the cover film, laminating a first cover film on a first copper layer of the flexible board, and laminating a second cover film on a second copper layer of the flexible board;
manufacturing a solder mask layer, manufacturing the solder mask layer in a region of the flexible board, which is required to be manufactured with the solder mask, and performing high-temperature baking and curing;
manufacturing a dry film layer, attaching a dry film on the solder mask layer, and performing exposure development to form the dry film layer, wherein the dry film layer does not completely cover the solder mask layer;
manufacturing a first wet film layer, coating a wet film on the dry film layer, performing exposure development, and reserving a wet film pattern corresponding to the dry film layer to form the first wet film layer;
Manufacturing a second wet film layer, coating a wet film on the position of the rigid plate corresponding to the first wet film layer, exposing and developing, and reserving a wet film pattern corresponding to the first wet film layer to form the second wet film layer;
The method comprises the steps of uncovering, manufacturing, typesetting and laminating the flexible board and the rigid board, and after lamination, uncovering the rigid board to form an uncovering area, wherein the uncovering area enables the dry film layer and the first wet film layer to be exposed;
Forming and manufacturing the appearance by punching;
and removing the film, namely removing the dry film layer or the dry film layer and the first wet film layer by adopting film removing liquid to obtain the just-wound combination plate.
Furthermore, the first attaching film does not cover the area, which is needed to be subjected to solder resist manufacture, on the first copper layer, and the second attaching film does not cover the area, which is needed to be subjected to solder resist manufacture, on the second copper layer.
Further, the dry film layer covers the solder mask layer of the active area of the flex board, and does not cover the solder mask layer of the auxiliary area of the flex board.
Further, the manufacturing method further comprises the step of forming a notch on the rigid plate after the second wet film layer is manufactured, and performing the cover opening manufacturing at the position of the notch to form the cover opening area.
Further, the manufacturing method further comprises the step of attaching a reinforcing sheet to a corresponding area of one surface of the flexible board opposite to the solder mask after film removal, and further providing supporting force for the solder mask.
Further, the high-temperature baking temperature of the solder mask layer is 145-155 ℃.
Further, the high-temperature baking time of the solder mask layer is 20-30 min.
Furthermore, the cover opening manufacture can adopt a mode of depth control numerical control milling, a cover opening groove is milled, cover opening is performed, and the cover body is removed.
In a second aspect, the invention further provides a rigid-flex printed circuit board, which is manufactured by adopting the manufacturing method of the rigid-flex printed circuit board.
By adopting the technical scheme, the dry film layer and the first wet film layer are manufactured at the position of the solder mask layer of the flexible plate, the solder mask layer can be effectively protected from being damaged in the subsequent manufacturing process, and the second wet film layer is manufactured at the position of the solder mask layer of the rigid plate corresponding to the flexible plate, the second wet film layer on the rigid plate corresponds to the first wet film layer of the flexible plate, the characteristic that the bonding force between the wet film layer and the wet film layer is weaker is utilized, even the bonding force between the wet film layer and the wet film layer is not good, so that a good separable basis is provided for the subsequent uncovering manufacturing, and the solder mask layer subjected to high-temperature heat curing has high hardness and strong inertia.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a flowchart of a method for manufacturing a rigid-flex printed circuit board according to an embodiment of the present invention;
FIG. 2 is a flowchart of a method for manufacturing a rigid-flex printed circuit board according to another embodiment of the present invention;
FIG. 3 is a schematic view of a flexible board according to an embodiment of the present invention after attaching a cover film;
FIG. 4 is a schematic view of a first wet film layer of a flexible board according to an embodiment of the invention;
FIG. 5 is a schematic diagram of a laminated layout structure of a rigid board and a flexible board according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a laminated rigid board and flexible board according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of the embodiment of the present invention after the cover is opened;
FIG. 8 is a schematic diagram of a structure after removing auxiliary areas according to an embodiment of the present invention;
fig. 9 is a schematic structural view of a just-wound bonding board according to an embodiment of the present invention.
The reference numerals are explained as follows:
1-flexible board, 11-first copper layer, 12-second copper layer, 13-solder mask layer, 14-dry film layer, 15-first wet film layer, 111-first cover film, 112-second cover film;
2-a rigid plate, 21-a second wet film layer, 22-a notch, 23-a first uncapping area and 24-a second uncapping area;
3-auxiliary area;
4-reinforcing sheet.
Detailed Description
The following describes the embodiments of the present invention further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present invention, but is not intended to limit the present invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
The invention provides a manufacturing method of a rigid-flex printed circuit board, which is implemented by laminating at least one flexible board and at least two rigid boards, referring to fig. 1, fig. 1 is a flow chart of the manufacturing method of the rigid-flex printed circuit board according to the embodiment of the invention, and the manufacturing method comprises the following steps:
Step 101: laminating a cover film, windowing the cover film, laminating a first cover film on a first copper layer of the flexible board, and laminating a second cover film on a second copper layer of the flexible board. .
Step 102: and manufacturing a solder mask layer, manufacturing the solder mask layer in a region of the flexible board, which is required to be manufactured with the solder mask, and performing high-temperature baking and curing.
Further, the high-temperature baking temperature of the solder mask layer is 145-155 ℃.
Further, the high-temperature baking time of the solder mask layer is 20-30 min.
Step 103: and manufacturing a dry film layer, attaching a dry film on the solder mask layer, and performing exposure development to form the dry film layer, wherein the dry film layer does not completely cover the solder mask layer.
Step 104: and manufacturing a first wet film layer, coating a wet film on the dry film layer, performing exposure development, and retaining a wet film pattern corresponding to the dry film layer to form the first wet film layer.
Step 105: and manufacturing a second wet film layer, coating a wet film on the position of the rigid plate corresponding to the first wet film layer, exposing and developing, and reserving a wet film pattern corresponding to the first wet film layer to form the second wet film layer.
Step 106: and (3) uncovering, namely typesetting and laminating the flexible board and the rigid board, and after lamination, uncovering the rigid board to form an uncovering area, wherein the uncovering area enables the dry film layer or the first wet film layer to be exposed.
Step 107: and (5) carrying out shape punching, forming and manufacturing.
Step 108: and removing the film, namely removing the dry film layer or the dry film layer and the first wet film layer by adopting film removing liquid to obtain the just-wound combination plate.
According to the manufacturing method of the rigid-flex printed circuit board, the second wet film layer is also manufactured on the position of the solder mask layer of the flexible board corresponding to the rigid board, the second wet film layer on the rigid board corresponds to the first wet film layer of the flexible board, the bonding force between the wet film layer and the wet film layer is weak, and the bonding force between the wet film layer and the wet film layer is not good even in the pressing process, so that a good separable foundation is provided for the subsequent uncovering manufacturing, the solder mask layer subjected to high-temperature heat curing is high in hardness and high in inertia, when the film removing mode is adopted to remove the first wet film layer and the dry film layer on the flexible board, the solder mask layer is not damaged, and therefore, the effect of separating the dry film layer, the wet film layer and the solder mask layer is achieved, the solder mask manufacturing precision of the flexible board can be well met, the manufacturing cost is low, the quality of the rigid-flex printed circuit board can be effectively improved, and the scrapping problem of the rigid-flex printed circuit board in the uncovering process is reduced.
Referring to fig. 2, fig. 2 is a flowchart of a method for manufacturing a rigid-flex printed circuit board according to another embodiment of the present invention, the method includes the following steps:
step 201: laminating a cover film, windowing the cover film, laminating a first cover film on a first copper layer of the flexible board, and laminating a second cover film on a second copper layer of the flexible board.
Step 202: and manufacturing a solder mask layer, manufacturing the solder mask layer in a region of the flexible board, which is required to be manufactured with the solder mask, and performing high-temperature baking and curing.
Step 203: and manufacturing a dry film layer, attaching a dry film on the solder mask layer, and performing exposure development to form the dry film layer, wherein the dry film layer does not completely cover the solder mask layer.
When the dry film is pasted, the dry film layer covers the solder mask layer of the effective area of the flexible board, and does not cover the solder mask layer of the auxiliary area of the flexible board.
Step 204: and manufacturing a first wet film layer, coating a wet film on the dry film layer, performing exposure development, and retaining a wet film pattern corresponding to the dry film layer to form the first wet film layer.
Step 205: and manufacturing a second wet film layer, coating a wet film on the position of the rigid plate corresponding to the first wet film layer, exposing and developing, and reserving a wet film pattern corresponding to the first wet film layer to form the second wet film layer.
Step 206: and a notch is formed in the rigid plate.
And after the second wet film layer is manufactured, forming a notch on the rigid plate. In this embodiment, a laser ablation mode may be adopted, and a notch is formed on the rigid plate, so as to facilitate subsequent cover opening manufacture.
Step 207: and (3) uncovering, namely typesetting and laminating the flexible board and the rigid board, and after lamination, uncovering the rigid board to form an uncovering area, wherein the uncovering area enables the dry film layer and the first wet film layer to be exposed.
Step 208: and (5) carrying out shape punching, forming and manufacturing.
Step 209: and (3) removing the film, namely removing the dry film layer and the first wet film layer by adopting film removing liquid to obtain the just-wound combined plate.
Step 210: and after the reinforcing sheet is adhered and removed, the reinforcing sheet is adhered to the corresponding area of one surface of the flexible board opposite to the solder mask layer, and the supporting force of the solder mask layer is further given.
The manufacturing method is simple, the manufacturing cost is low, and the reliability of the rigid-flex printed circuit board is effectively improved.
The present invention will be described in detail with reference to the accompanying drawings.
In this embodiment, the case of having only one solder mask is exemplarily described, and it should be understood that in other embodiments, the manufacturing method is also suitable for the case of having a plurality of solder masks, where only the same manufacturing manner as in this embodiment needs to be performed on the solder mask.
As shown in fig. 3, fig. 3 is a schematic structural diagram of a flexible board 1 after a cover film is attached to the flexible board according to an embodiment of the present invention, the flexible board 1 has a first copper layer 11 and a second copper layer 12, a first cover film 111 that is subjected to a windowing process is attached to the first copper layer 11 of the flexible board 1, a second cover film 112 that is subjected to a windowing process is attached to the second copper layer 12 of the flexible board 1, and the second cover film 112 does not cover a region on the second copper layer 12 where a solder resist needs to be manufactured.
Referring to fig. 4, fig. 4 is a schematic structural diagram of the flexible board after the first wet film layer is completed according to the embodiment of the invention. And manufacturing a solder mask layer 13 in a region of the flexible board 1 where solder mask is required, and baking at a high temperature, wherein the solder mask layer 13 is partially positioned on the second covering film 112. The solder mask layer 13 after high-temperature baking has high hardness and high inertia.
And (3) manufacturing a dry film layer, attaching a dry film to the solder mask layer 13, and performing exposure and development to form a dry film layer 14, wherein the dry film layer 14 does not completely cover the solder mask layer 13, and specifically, one end of the dry film layer 14 is flush with one end of the solder mask layer 13 positioned on the second cover film 112.
And manufacturing a first wet film layer 15, coating a wet film on the dry film layer 14, performing exposure and development, and reserving a wet film pattern corresponding to the dry film layer 14 to form the first wet film layer 15.
Referring to fig. 5 and fig. 6, fig. 5 is a schematic diagram of a laminated typesetting structure of a rigid board and a flexible board according to an embodiment of the present invention; FIG. 6 is a schematic diagram of a laminated rigid board and flexible board according to an embodiment of the present invention; and coating a wet film on the position of the rigid plate 2 corresponding to the first wet film layer 15, performing exposure development, and retaining a wet film pattern corresponding to the first wet film layer 15 to form a second wet film layer 21.
In this embodiment, after the second wet film layer 21 is manufactured, the rigid plate 2 is provided with the notch 22, specifically, the notch 22 may be formed on the rigid plate 2 by laser ablation, so as to facilitate the subsequent manufacture of the cover.
As shown in fig. 7, fig. 7 is a schematic structural diagram of the embodiment of the present invention after the cover is manufactured, and the cover is manufactured, where the flexible board 1 and the rigid board 2 are typeset and pressed, and after the pressing, the rigid board 2 is subjected to cover opening treatment to form a first cover opening area 23 and a second cover opening area 24, where the second cover opening area 24 exposes the dry film layer 14 and the first wet film layer 15, and the first cover opening area 23 and the second cover opening area 24 are opposite to each other, and have the same size.
The cover opening manufacture can adopt a mode of numerical control milling with depth control, a cover opening groove is milled, cover opening is carried out, and a cover body is removed, so that the first cover opening area 23 and the second cover opening area 24 are formed.
As shown in fig. 8, fig. 8 is a schematic structural diagram of the embodiment of the present invention after removing the auxiliary area, and after the cover is opened, the auxiliary area 3 is removed by punching.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a just-wound bonding board according to an embodiment of the present invention, and the dry film layer 14 and the first wet film layer 15 are removed by using a film removing solution to obtain the just-wound bonding board.
In this embodiment, after film removal, the reinforcing sheet 4 is attached to a corresponding area of the surface of the flexible board 1 opposite to the solder mask layer 13, so as to further give a supporting force to the solder mask layer 13.
The invention also provides a rigid-flex printed circuit board, which is manufactured by adopting the manufacturing method of the rigid-flex printed circuit board in any embodiment.
The manufacturing method of the rigid-flex printed circuit board skillfully utilizes the characteristic that the binding force between the wet film layer and the wet film layer is weak, provides a good separable basis for the subsequent uncovering manufacture, has high pattern manufacturing precision of the dry film and the wet film through exposure and development, can well meet the solder mask manufacturing precision of the flexible board, has relatively low manufacturing cost, can effectively improve the quality of the rigid-flex printed circuit board, reduces the scrapping problem of the rigid-flex printed circuit board in the uncovering process, and can provide a wider design idea for customers.
The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, and yet fall within the scope of the invention.
In the description of the present patent, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", "row", "column", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present patent and simplifying the description, and do not indicate or imply that the apparatus or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the patent.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present patent, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In the patent of the invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," "fixedly connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present patent will be understood by those skilled in the art according to the specific circumstances.
In the present patent, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Claims (9)
1. A manufacturing method of a rigid-flex printed circuit board is characterized by taking at least one flexible board and at least two rigid boards for pressing and manufacturing, and comprising the following steps:
Laminating a cover film, windowing the cover film, laminating a first cover film on a first copper layer of the flexible board, and laminating a second cover film on a second copper layer of the flexible board;
manufacturing a solder mask layer, manufacturing the solder mask layer in a region of the flexible board, which is required to be manufactured with the solder mask, and performing high-temperature baking and curing;
manufacturing a dry film layer, attaching a dry film on the solder mask layer, and performing exposure development to form the dry film layer, wherein the dry film layer does not completely cover the solder mask layer;
manufacturing a first wet film layer, coating a wet film on the dry film layer, performing exposure development, and reserving a wet film pattern corresponding to the dry film layer to form the first wet film layer;
Manufacturing a second wet film layer, coating a wet film on the position of the rigid plate corresponding to the first wet film layer, exposing and developing, and reserving a wet film pattern corresponding to the first wet film layer to form the second wet film layer;
The method comprises the steps of uncovering, manufacturing, typesetting and laminating the flexible board and the rigid board, and after lamination, uncovering the rigid board to form an uncovering area, wherein the uncovering area enables the dry film layer or the first wet film layer to be exposed;
Forming and manufacturing the appearance by punching;
and removing the film, namely removing the dry film layer or the dry film layer and the first wet film layer by adopting film removing liquid to obtain the rigid-flex printed circuit board.
2. The method of claim 1, wherein the first adhesive film does not cover the area of the first copper layer where solder resist is required, and the second adhesive film does not cover the area of the second copper layer where solder resist is required.
3. The method of claim 1, wherein the dry film layer covers the solder mask layer in the active area of the flex board and does not cover the solder mask layer in the auxiliary area of the flex board.
4. The method of claim 1, further comprising forming a notch in the rigid board after the second wet film layer is formed, and forming the cover opening area by performing the cover opening at the position of the notch.
5. The method according to claim 1 or 2, further comprising attaching a reinforcing sheet to a corresponding area of a side of the flexible board opposite to the solder mask after removing the film, and further providing a supporting force to the solder mask.
6. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein the temperature for baking the solder mask layer at a high temperature is 145-155 ℃.
7. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein the time for baking the solder mask layer at a high temperature is 20-30 min.
8. The method for manufacturing the rigid-flex printed circuit board according to claim 1, wherein the cover opening manufacturing can adopt a depth-control numerical control milling mode to mill a cover opening groove, then cover opening is carried out, and the cover body is removed.
9. A rigid-flex board, characterized in that the rigid-flex board is manufactured by adopting the manufacturing method of the rigid-flex board according to any one of claims 1 to 6.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010891440.6A CN111918490B (en) | 2020-08-30 | 2020-08-30 | Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010891440.6A CN111918490B (en) | 2020-08-30 | 2020-08-30 | Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board |
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| Publication Number | Publication Date |
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| CN111918490A CN111918490A (en) | 2020-11-10 |
| CN111918490B true CN111918490B (en) | 2024-05-07 |
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|---|---|---|---|---|
| CN112770535B (en) * | 2021-01-31 | 2024-01-26 | 惠州中京电子科技有限公司 | Processing method of soft and hard combined plate with main plate structure and auxiliary plate structure |
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