CN112135423A - Processing technology for improving EMI film tearing convenience - Google Patents
Processing technology for improving EMI film tearing convenience Download PDFInfo
- Publication number
- CN112135423A CN112135423A CN202010915899.5A CN202010915899A CN112135423A CN 112135423 A CN112135423 A CN 112135423A CN 202010915899 A CN202010915899 A CN 202010915899A CN 112135423 A CN112135423 A CN 112135423A
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- China
- Prior art keywords
- emi
- fpc
- adhesive tape
- film
- tearing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Abstract
The invention discloses a processing technology for improving the convenience of an EMI (electro-magnetic interference) tear film, which comprises the steps of S1, manufacturing a pull tab; s2, preparing a jig; s3, attaching bottom EMI; s4, attaching an FPC; s5, attaching upper EMI; s6, prepressing the FPC; s7, tearing the EMI surface PET; s8, pressing FPC quickly; s9, placing EMI, tearing the film, enabling the EMI adhesive surface to face downwards, enabling the PI adhesive tape to face upwards in a reverse adhesive mode, placing the PI adhesive tape on an equipment workbench, starting equipment, driving an adhesive tape wheel to roll back and forth on the EMI upper surface from left to right, enabling the adhesive tape to be in contact with a pull lug, directly tearing off the EMI transfer film, enabling the pull lug in the step S1 to be a yellow PI adhesive tape, enabling the thickness of the PI adhesive tape to be 30 mu m, resisting high temperature to be more than 170 degrees, in order to solve the problem that the EMI transfer film needs to be manually lifted by a knife to tear off an opening, increasing a separation surface at the position of the tear off opening during material processing, namely pulling the pull lug to be the PI adhesive tape, ensuring that the tear off opening is not in combination with an attached plate surface and pressing together, and tearing off the EMI transfer film.
Description
Technical Field
The invention belongs to the technical field of FPC (flexible printed circuit), and particularly relates to a processing technology for improving the convenience of EMI (electro-magnetic interference) film tearing.
Background
The size of the flexible circuit board can be made into a small unit according to the requirement, the plate production and the installation of subsequent components are convenient during production, and the flexible circuit board can be produced by makeup usually. EMI (electromagnetic shielding films) are attached to the front side and the back side of the flexible circuit board, and when the flexible circuit board is manufactured, the EMI transfer film needs to be torn off to carry out the next process. An electromagnetic shielding film (EMI) is an FPC that functions as a transmission signal in an electronic device. When the signal layer is distributed on the outermost layer of the FPC, in order to avoid signal distortion caused by electromagnetic interference in the signal transmission process, the FPC can press a conductive layer (an electromagnetic shielding film) after pressing the covering film, and the effect of blocking the electromagnetic interference is achieved.
Because EMI materials are extremely fragile, a transfer film can be attached to the raw materials in the processing and using processes as protection, the transfer film is torn off after the products are pressed, EMI can be attached to the board in the whole face after pressing, the transfer film is torn off by manually picking up the transfer film with a knife, if a knife edge directly points to a product demand area, scratching and damage can be caused, a waste material area is reserved in an FPC waste material area as a tearing-off lower knife edge in the prior art, and the lower knife position still can be pressed and attached to the board, so that the board still needs to be scratched through operation of the knife, and the product rejection rate is high.
Therefore, we propose a process that improves the ease of EMI tear-off.
Disclosure of Invention
The invention aims to provide a processing technology for improving the convenience of an EMI (electro-magnetic interference) tear film, and aims to solve the problems that in the prior art, after lamination, EMI can be attached to a board surface in a whole surface, a transfer film is manually picked up by a knife to tear off, if a knife edge directly points to a product demand area, scratching and damage can be caused, a waste material area is reserved in an FPC waste material area as a tear-off lower knife edge in the prior art, and the lower knife position still can be laminated and attached to the board surface, so that the board surface still needs to be scratched by a knife operation, and the product rejection rate is high.
In order to achieve the purpose, the invention adopts the following technical scheme:
a processing technology for improving the convenience of an EMI tear film comprises the following steps:
s1, manufacturing a pull lug, namely manufacturing the pull lug on one side of the upper surface of the EMI;
s2, preparing a jig, and preparing a jig matched with the FPC for later use;
s3, attaching bottom EMI, and attaching the EMI to one surface of the prepared jig;
s4, attaching the FPC, and taking out the FPC to be processed to attach the FPC to the EMI attached to one surface of the jig;
s5, attaching upper EMI, and attaching a layer of EMI on the upper surface of the FPC obtained in the step (A);
s6, prepressing the FPCs, namely prepressing the FPCs with the upper surfaces and the lower surfaces both attached with the EMI;
s7, tearing the PET film on the EMI surface after FPC prepressing;
s8, carrying out FPC fast pressing, and carrying out fast pressing on the FPC by using a press;
s9, placing EMI, tearing the film, enabling the EMI adhesive surface to face downwards, enabling the PI adhesive tape to face upwards in a reverse adhesive film sticking mode, placing the PI adhesive tape on an equipment workbench, starting the equipment, driving an adhesive tape wheel to roll back and forth on the EMI upper surface from left to right, and directly tearing off the EMI transfer film after the PI adhesive tape is contacted with a pull lug.
Preferably, the larval color in step S1 is yellow PI tape, the thickness is 30 μm, and the larval color resists high temperature of 170 ° or more.
Preferably, after the EMI with the pull tab is manufactured, clockwise rolling manufacturing is carried out, a white isolation film is arranged on the upper surface of the EMI, a yellow PI adhesive tape with the thickness of 30 mu m is arranged on one side of the EMI, a machine-pasted bearing PET film layer is arranged at the bottom of the yellow PI adhesive tape, the EMI forming tolerance is +/-0.1mm, and the tolerance of the product in the position of a roll material is +/-0.5 mm.
Preferably, the FPC in step S2 includes a transfer film having a thickness of 57 μm, a protective layer having a thickness of 5 μm, a metal thin film layer having a thickness of 0.1 μm, and a heteroaromatic conductive auxiliary layer having a thickness of 3 μm and 5 μm before actual coupling.
Preferably, the EMI layer includes a conductive adhesive layer, a metal alloy layer, an insulating layer, and a carrier film.
Preferably, the tool used for pre-pressing the FPC in step S6 is an automatic reinforcing machine.
The invention has the technical effects and advantages that: compared with the prior art, the processing technology for improving the convenience of the EMI tearing film provided by the invention has the following advantages:
in order to solve the problem that the EMI film tearing needs to be manually lifted by a knife to tear the opening, the position of the tearing opening is increased by a pull lug which is a PI adhesive tape when materials are processed, the tearing opening is guaranteed not to be attached to the surface of the board and pressed together, and then the EMI transfer film is torn by the adhesive tape.
Drawings
FIG. 1 is a schematic diagram of the EMI and tab structure of the present invention.
In the figure: 100. pulling the lug; 200. EMI; 300. the machine pastes and bears the weight of the PET rete.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A processing technology for improving the convenience of an EMI tear film comprises the following steps:
s1, manufacturing a pull lug, namely manufacturing the pull lug 100 on one side of the upper surface of the EMI 200;
s2, preparing a jig, and preparing a jig matched with the FPC for later use;
s3, attaching the bottom EMI200, and attaching the EMI200 to one surface of the prepared jig;
s4, attaching the FPC, taking out the FPC to be processed, and attaching the FPC to the EMI200 attached to one surface of the jig;
s5, attaching an upper EMI (electro-magnetic interference) layer 200, and attaching a layer of EMI200 on the upper surface of the FPC which is finished in the step (A);
s6, prepressing the FPCs, namely prepressing the FPCs with the upper surfaces and the lower surfaces both attached with the EMI 200;
s7, tearing PET on the surface of the EMI200, and tearing off the PET film on the surface of the EMI200 after FPC prepressing;
s8, carrying out FPC fast pressing, and carrying out fast pressing on the FPC by using a press;
s9, placing the EMI200, then tearing the film, wherein the EMI200 is downward in adhesive surface, the PI adhesive tape is upward in reverse adhesive surface, placing the PI adhesive tape on an equipment workbench, starting the equipment, driving the adhesive tape wheel to roll back and forth on the upper surface of the EMI200 from left to right, and directly tearing off the EMI200 transcription film after the adhesive tape is contacted with the pull lug.
Specifically, the larch in the step S1 is a yellow PI adhesive tape, the thickness of the larch is 30 μm, and the larch is resistant to high temperature of more than 170 degrees.
Specifically, after the EMI200 with the pull tab 100 is manufactured, clockwise rolling manufacturing is performed, a white isolation film is arranged on the upper surface of the EMI200, a yellow PI adhesive tape with the thickness of 30 microns is arranged on one side of the EMI200, a machine-pasted bearing PET film layer 300 is arranged at the bottom of the yellow PI adhesive tape, the forming tolerance of the EMI200 is +/-0.1mm, and the tolerance of the position of a product in a roll material is +/-0.5 mm.
Specifically, the FPC in step S2 includes a transfer film, a protective layer, a metal thin film layer, and a heteroaromatic conductive auxiliary agent layer, where the transfer film has a thickness of 57 μm, the protective layer has a thickness of 5 μm, the metal thin film layer has a thickness of 0.1 μm, the heteroaromatic conductive auxiliary agent layer has a thickness of 3 μm, and the thickness is 5 μm before actual coupling.
Specifically, the EMI200 layer includes a conductive adhesive layer, a metal alloy layer, an insulating layer, and a carrier film.
Specifically, the tool used for pre-pressing the FPC in step S6 is an automatic reinforcing machine.
Through the comparison, in order to solve the problem that the EMI film tearing needs to be manually lifted by a knife to tear the separation opening, the separation surface is added at the position of the separation opening during material processing, namely the pull lug is a PI adhesive tape, so that the separation opening is not attached to and pressed with the board surface, and then the EMI transfer film is torn by the adhesive tape.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. A processing technology for improving the convenience of an EMI tear film is characterized by comprising the following steps:
s1, manufacturing a pull lug, namely manufacturing the pull lug (100) on one side of the upper surface of the EMI (200);
s2, preparing a jig, and preparing a jig matched with the FPC for later use;
s3, attaching bottom EMI (200), and attaching the EMI (200) to one surface of the prepared jig;
s4, attaching the FPC, taking out the FPC to be processed, and attaching the FPC to the EMI (200) attached to one surface of the jig;
s5, attaching an upper EMI (200), and attaching a layer of EMI (200) on the upper surface of the FPC which is finished in the step (A);
s6, prepressing the FPCs, namely prepressing the FPCs with the upper surfaces and the lower surfaces both attached with the EMI (200);
s7, tearing PET on the surface of EMI (200), and tearing off the PET film on the surface of the EMI (200) after FPC prepressing;
s8, carrying out FPC fast pressing, and carrying out fast pressing on the FPC by using a press;
s9, placing the EMI (200) and tearing the film, wherein the EMI (200) adhesive surface faces downwards, the PI adhesive tape is placed on the equipment workbench with the reverse adhesive film adhesive surface facing upwards, starting the equipment to drive the adhesive tape wheel to roll back and forth on the upper surface of the EMI (200) from left to right, and directly tearing off the EMI (200) transfer film after the adhesive tape is contacted with the pull lug (100).
2. The process of claim 1 for improving the ease of EMI peeling, wherein: the handle (100) in the step S1 is yellow PI adhesive tape, the thickness is 30 μm, and the handle can resist high temperature of more than 170 degrees.
3. The process of claim 1 for improving the ease of EMI peeling, wherein: after the EMI (200) with the pull lug (100) is manufactured, clockwise rolling is performed, a white isolating film is arranged on the upper surface of the EMI (200), a yellow PI adhesive tape with the thickness of 30 mu m is arranged on one side of the EMI (200), a machine-pasted bearing PET film layer (300) is arranged at the bottom of the yellow PI adhesive tape, the EMI (200) forming tolerance is +/-0.1mm, and the product position tolerance is +/-0.5mm in a roll material.
4. The process of claim 1 for improving the ease of EMI peeling, wherein: the FPC in step S2 includes a transfer film having a thickness of 57 μm, a protective layer having a thickness of 5 μm, a metal thin film layer having a thickness of 0.1 μm, and an isoaromatic conductive auxiliary layer having a thickness of 3 μm before actual coupling of 5 μm.
5. The process of claim 1 for improving the ease of EMI peeling, wherein: the EMI (200) layer includes a conductive adhesive layer, a metal alloy layer, an insulating layer, and a carrier film.
6. The process of claim 1 for improving the ease of EMI peeling, wherein: and the tool adopted for prepressing the FPC in the step S6 is an automatic reinforcing machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010915899.5A CN112135423A (en) | 2020-09-03 | 2020-09-03 | Processing technology for improving EMI film tearing convenience |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010915899.5A CN112135423A (en) | 2020-09-03 | 2020-09-03 | Processing technology for improving EMI film tearing convenience |
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| Publication Number | Publication Date |
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| CN112135423A true CN112135423A (en) | 2020-12-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010915899.5A Pending CN112135423A (en) | 2020-09-03 | 2020-09-03 | Processing technology for improving EMI film tearing convenience |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114698249A (en) * | 2022-04-02 | 2022-07-01 | 博敏电子股份有限公司 | Method for improving processing efficiency of mounting and pasting electromagnetic shielding film on flexible printed board |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120131709A (en) * | 2011-05-26 | 2012-12-05 | (주)우리엔지니어링 | EMI shield apparatus and method for removing the transfer film |
| CN202713773U (en) * | 2012-06-27 | 2013-01-30 | 比亚迪股份有限公司 | Flexible printed circuit board |
| CN206201653U (en) * | 2016-09-14 | 2017-05-31 | 硕诺科技（深圳）有限公司 | A kind of PET protection film tears hand structure |
| CN208509399U (en) * | 2018-08-10 | 2019-02-15 | 深圳鹏鑫智造科技有限公司 | It is a kind of to tear adhesive dispenser automatically |
| CN209336244U (en) * | 2018-11-20 | 2019-09-03 | 深圳市新宇腾跃电子有限公司 | A kind of coat peeling unit |
| CN110602886A (en) * | 2019-09-12 | 2019-12-20 | 景旺电子科技(龙川)有限公司 | Novel method for tearing EMI (electro-magnetic interference) protective film by single PCS (Process control System) |
| CN111479388A (en) * | 2020-04-07 | 2020-07-31 | 珠海景旺柔性电路有限公司 | Method for wrapping shielding film on side edge of 5G flexible circuit board |
| CN211352611U (en) * | 2020-03-18 | 2020-08-25 | 梅州市兴成线路板有限公司 | High-temperature-resistant and bending-resistant double-sided circuit board |
-
2020
- 2020-09-03 CN CN202010915899.5A patent/CN112135423A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120131709A (en) * | 2011-05-26 | 2012-12-05 | (주)우리엔지니어링 | EMI shield apparatus and method for removing the transfer film |
| CN202713773U (en) * | 2012-06-27 | 2013-01-30 | 比亚迪股份有限公司 | Flexible printed circuit board |
| CN206201653U (en) * | 2016-09-14 | 2017-05-31 | 硕诺科技（深圳）有限公司 | A kind of PET protection film tears hand structure |
| CN208509399U (en) * | 2018-08-10 | 2019-02-15 | 深圳鹏鑫智造科技有限公司 | It is a kind of to tear adhesive dispenser automatically |
| CN209336244U (en) * | 2018-11-20 | 2019-09-03 | 深圳市新宇腾跃电子有限公司 | A kind of coat peeling unit |
| CN110602886A (en) * | 2019-09-12 | 2019-12-20 | 景旺电子科技(龙川)有限公司 | Novel method for tearing EMI (electro-magnetic interference) protective film by single PCS (Process control System) |
| CN211352611U (en) * | 2020-03-18 | 2020-08-25 | 梅州市兴成线路板有限公司 | High-temperature-resistant and bending-resistant double-sided circuit board |
| CN111479388A (en) * | 2020-04-07 | 2020-07-31 | 珠海景旺柔性电路有限公司 | Method for wrapping shielding film on side edge of 5G flexible circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114698249A (en) * | 2022-04-02 | 2022-07-01 | 博敏电子股份有限公司 | Method for improving processing efficiency of mounting and pasting electromagnetic shielding film on flexible printed board |
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Application publication date: 20201225 |