CN107263956B - Electromagnetic interference EMI composite material and preparation method thereof - Google Patents
Electromagnetic interference EMI composite material and preparation method thereof Download PDFInfo
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- CN107263956B CN107263956B CN201610215049.8A CN201610215049A CN107263956B CN 107263956 B CN107263956 B CN 107263956B CN 201610215049 A CN201610215049 A CN 201610215049A CN 107263956 B CN107263956 B CN 107263956B
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- 239000002131 composite material Substances 0.000 title claims abstract description 70
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 230000001681 protective effect Effects 0.000 claims abstract description 132
- 239000000463 material Substances 0.000 claims abstract description 79
- 239000002390 adhesive tape Substances 0.000 claims abstract description 25
- 239000002699 waste material Substances 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 94
- 238000000034 method Methods 0.000 claims description 33
- 238000005520 cutting process Methods 0.000 claims description 29
- 238000004080 punching Methods 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000003475 lamination Methods 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000010408 film Substances 0.000 claims 16
- 239000010409 thin film Substances 0.000 claims 1
- 230000002829 reductive effect Effects 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides an electromagnetic interference EMI composite material and a preparation method thereof, wherein the composite material comprises an EMI base material and a single-sided adhesive tape, the EMI base material comprises an effective part and a protective film layer, the effective part is adhered to the protective film layer, the effective part comprises a retaining part and a part to be separated, and one side of the part to be separated opposite to the protective film layer is adhered to one sticky side of the single-sided adhesive tape. According to the invention, the single-sided adhesive tape is added on one side of the EMI base material in the stripping direction, so that the stripping rate of the EMI material protective film layer is improved, and the problem of EMI material waste is reduced.
Description
Technical Field
The invention belongs to the field of electromagnetic interference (EMI) materials, and relates to an electromagnetic interference (EMI) composite material and a preparation method thereof.
Background
In recent years, with the rapid development of the electronic industry, electromagnetic interference materials EMI (Electromagnetic Interference) capable of generating electromagnetic interference have been widely used. Common electromagnetic interference EMI materials are conductive gold foil, conductive silver foil, conductive copper foil, conductive aluminum foil, and the like.
Generally, the EMI material is composed of a protective film layer, a functional treatment layer, a metal film layer, and a conductive adhesive layer, and its structure is shown in fig. 1, which is mainly prepared by die cutting.
The die cutting process refers to forming a material into a specific part by precision machining and cutting according to a predetermined shape. In recent years, die-cut adhesive products are widely applied to industries such as photoelectricity, communication, computers, automobiles and the like, and are matched with different parts, so that the die-cut adhesive products have the functions of vibration prevention, insulation, conduction, adhesion and the like.
In the using process of the EMI material, the conductive adhesive layer in the EMI material is melted through high-temperature pressing, the melted conductive adhesive layer is used for adhering and fixing the EMI material on the surface of an object to be pasted (such as an FPC flexible circuit board and the like), and then the protective film layer is peeled off, so that the performance of the EMI material is exerted. However, the adhesion between the protective film layer and the functional treatment layer is strong due to the characteristic requirement of the EMI material, which makes peeling difficult.
To facilitate full-scale application of EMI materials and release of protective film layers, EMI die cut articles are often designed as shown in fig. 2, i.e., comprising a rectangular body of EMI material and high temperature and high adhesion protective films and pre-release films adhered to both sides of the EMI material substrate, respectively. The high-temperature-resistant high-viscosity protective film is adhered to one side of the protective film layer of the EMI material, so that the high-viscosity characteristic of the high-temperature-resistant high-viscosity protective film is brought into play while the high-temperature-resistant high-viscosity protective film is stripped after high-temperature lamination, and the protective film layer of the EMI material body is synchronously taken away. However, because the area of the EMI material body in the EMI die-cut product is relatively small and the EMI materials are independently distributed, the problem that the sticking rate of the high-temperature-resistant high-viscosity protective film from the self-protective film layer of the EMI material body is low cannot be effectively improved even if the viscosity of the high-temperature-resistant high-viscosity protective film is increased.
In order to solve the problem of lower sticking-off rate of the self-protective film layer of the EMI material body, the following improvement process is mainly adopted in the prior art:
(1) The area of the EMI material is increased under the condition of not interfering with the attached object, and the effective contact area between the EMI protective film layer and the high-temperature-resistant high-viscosity protective film is increased;
(2) All independent EMI body materials are connected in series (as shown in figure 3) so as to realize the integral stripping of the protective film layers in the EMI body materials, and the condition that the individual protective film layers are not stripped due to the fact that the number of the independent EMI body materials is large is avoided.
However, although the area of the EMI material is greatly increased in the above method, the effective use area of the EMI material is not increased, so that the utilization rate of the EMI material in the existing process is low; in addition, a large amount of EMI waste is required to be removed in the traditional die cutting overshoot for preparing the EMI die-cut product, so that serious waste is caused, the process cost is too high, and the processing cost of the EMI die-cut product is increased.
Disclosure of Invention
Aiming at the problems of lower stripping rate of a protective film layer in an EMI material, overlarge EMI waste material discharge caused by greatly increasing the area of the EMI material in the production process, overlarge production cost and the like in the prior art, the invention provides an electromagnetic interference EMI composite material and a preparation method thereof.
To achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides an electromagnetic interference EMI composite material, the composite material comprising an EMI matrix material and a single-sided tape, wherein the EMI matrix material comprises an effective portion and a protective film layer, the effective portion is adhered to the protective film layer, the effective portion comprises a retaining portion and a portion to be separated, and a side of the portion to be separated opposite to the protective film layer is adhered to a side of the single-sided tape having adhesion.
The structure of the electromagnetic interference EMI composite is shown in fig. 4.
In the invention, the single-sided adhesive tape has the characteristic of high temperature resistance, and the high temperature resistance is matched with the EMI material, so that the single-sided adhesive tape is not damaged in the high temperature lamination process; one sticky surface of the single-sided adhesive tape is adhered to one side of the part to be separated opposite to the protective film layer, so that the part to be separated is prevented from being adhered to the surface of an object to be adhered after hot pressing.
In the invention, the protective film layer in the electromagnetic interference EMI composite material is an integral body, the protective film layer of the composite material is adhered with the protective film with high temperature resistance and high viscosity, after high temperature lamination, the conductive adhesive layer of the reserved part in the EMI composite material is melted and adhered and fixed on the object to be adhered, and the part to be separated forms a height difference between the single-sided adhesive tape and the reserved part, so that the protective film layer is separated from the reserved part in advance, and the protective film layer and the part to be separated in the EMI composite material are effectively stripped at the same time when the protective film with high temperature resistance and high viscosity is stripped, thereby improving the stripping rate.
The following technical scheme is a preferred technical scheme of the invention, but is not a limitation of the technical scheme provided by the invention, and the technical purpose and beneficial effects of the invention can be better achieved and realized through the following technical scheme.
As a preferable technical scheme of the invention, the effective part is sequentially provided with a functional treatment layer, a metal film layer and a conductive adhesive layer from inside to outside from one side adhered to the protective film layer.
As a preferred embodiment of the present invention, the planar dimension of the protective film layer is equal to the sum of the planar dimensions of the remaining portion and the portion to be separated.
In the present invention, the shapes of the retaining portion and the portion to be separated are not limited to the rectangular dimensions in the drawings, and can be adjusted according to actual production requirements.
The retaining part and the part to be separated are firstly used as a whole, a protective film layer is adhered on the whole, and the retaining part and the part to be separated are obtained through half-cutting, so that the plane size of the protective film layer is equal to the sum of the plane sizes of the retaining part and the part to be separated.
As a preferable technical scheme of the invention, the plane size of the single-sided adhesive tape is the same as that of the part to be separated; the thickness of the single-sided tape is h, h=0.001 to 1mm, for example, 0.001mm, 0.005mm, 0.01mm, 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, or 1mm, etc., but not limited to the listed values, and other values within the listed range are possible.
As a preferable technical scheme of the invention, one side of the protective film in the electromagnetic interference EMI material is adhered with the effective part, the other side of the protective film layer opposite to the effective part is adhered with the protective film, namely, one side of the protective film layer is adhered with the effective part, and the opposite side is adhered with the protective film.
The protective film has the characteristics of high temperature resistance and high viscosity, the high temperature resistance of the protective film is matched with the temperature resistance of an electromagnetic interference EMI material, so that the protective film cannot be damaged in the high temperature lamination process, and the viscosity of the protective film is as follows: the protective film layer is peeled off together with the protective film.
Preferably, the thickness of the protective film is 0.01 to 0.2mm, for example, 0.01mm, 0.05mm, 0.1mm, 0.15mm, or 0.2mm, etc., but is not limited to the recited values, and other values within the listed range are possible.
Preferably, the side of the electromagnetic interference EMI material to which the single-sided tape is attached is covered with a pre-release film, and the pre-release film mainly has a protective effect.
In the present invention, the electromagnetic interference EMI composite material to which the protective film and the release film are adhered has a structure as shown in fig. 5.
In a second aspect, the present invention provides a method for preparing the electromagnetic interference EMI composite material, the method comprising the steps of:
(1) Half-cutting is carried out after a single-sided adhesive tape is adhered to one side of the electromagnetic interference EMI material, so that single-sided adhesive tape waste is removed;
(2) And (3) putting the electromagnetic interference EMI material after the half-cutting and the waste material removal into punching equipment for punching to obtain the electromagnetic interference EMI composite material adhered with the single-sided adhesive tape.
The step (1) of half-cutting the electromagnetic interference EMI material is to cut the electromagnetic interference EMI material perpendicularly from the top of the plane of the single-sided adhesive tape, and the conductive adhesive layer, the metal film layer and the functional treatment layer cut to the electromagnetic interference EMI material are separated to form a reserved portion and a portion to be separated, and the protective film layer is not cut, so that the protective film layer is kept as a whole, as shown in fig. 6.
As a preferable technical scheme of the invention, in the step (1), the single-sided adhesive tape is adhered on the top plane of the conductive adhesive layer of the electromagnetic interference EMI material.
Preferably, the protective film layer in the electromagnetic interference EMI material is half cut in the step (1), so that the functional treatment layer, the metal film layer and the conductive adhesive layer are divided into two parts, so that a reserved part and a part to be separated are formed in the subsequent operation, and the protective film layer is kept intact.
As a preferable technical scheme of the invention, the electromagnetic interference EMI material after being half-cut and waste materials are discharged is filled into punching equipment in the step (2), and the positions of the mold and the electromagnetic interference EMI material are fixed by using a limiting clamping strip or a sleeve position hole.
Preferably, the forming blade or punch of the die used in step (2) is rectangular, including the added area and the original area, as shown in fig. 7.
In the die cutting process, the added area of the forming blade or punch is positioned over the single-sided tape and the original area is positioned over the retained portion so that the die cut electromagnetic interference EMI composite meets the desired dimensions and configuration.
Preferably, the length of the increased area is the same as the length of the portion to be separated in the electromagnetic interference EMI composite material, and the width of the increased area is the same as the width of the portion to be separated in the electromagnetic interference EMI composite material.
Preferably, the length of the original region is the same as the length of the remaining portion of the electromagnetic interference EMI composite, and the width of the original region is the same as the width of the remaining portion of the electromagnetic interference EMI composite.
Preferably, the increased area of the die during die cutting corresponds to the side of the electromagnetic interference EMI material to which the single sided tape is adhered, as shown in fig. 8.
As a preferable technical scheme of the invention, the punching equipment is an automatic punching laminating machine.
As a preferable technical scheme of the invention, an effective part is adhered on one side of a protective film layer in the electromagnetic interference EMI composite material adhered with the single-sided adhesive tape obtained in the step (2), and a protective film is adhered on the other side of the protective film layer opposite to the effective part. When the automatic laminating machine is adopted in the punching process, the formed protective film can be fixed on a carrying platform below a punching die of the automatic laminating machine, and the electromagnetic interference EMI composite material obtained by punching is directly laminated on the protective film; when a common die cutting machine is adopted for the die cutting process, the electromagnetic interference EMI composite material obtained by die cutting can be attached to the protective film in a manual assembly mode.
Preferably, the side to which the single-sided tape is adhered in the electromagnetic interference EMI composite material to which the single-sided tape is adhered obtained in the step (2) is coated with the release-first film.
The two sides of the electromagnetic interference EMI composite material are respectively adhered with the protective film and the first stripping film, in the use process, the first stripping film is stripped, the conductive adhesive layer of the reserved part of the electromagnetic interference EMI composite material is melted and adhered and fixed on a to-be-adhered object through high-temperature pressing, the height difference is formed between the reserved part and the part to be separated, the protective film is stripped, and the protective film layer of the electromagnetic interference EMI composite material is stripped along with the protective film at the same time when the protective film is stripped, and the stripping process is shown in figure 9.
The peeling direction of the protective film is required to be peeled from one side to the other side of the single-sided adhesive tape.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the high-temperature resistant single-sided adhesive tape is added on one side of the EMI base material in the stripping direction, in the high-temperature lamination process, the conductive adhesive layer of the reserved part of the EMI composite material is melted and adhered and fixed on an object to be adhered, the to-be-separated part is adhered with the single-sided adhesive tape to form a height difference with the reserved part, and the formed height difference is utilized to press the protective film layer to be separated from the reserved part in advance, so that the protective film with high-temperature resistance and high-viscosity is stripped, and simultaneously, the protective film layer and the to-be-separated part in the EMI composite material are effectively stripped along with the high-temperature resistant high-viscosity protective film, thereby improving the stripping rate of the protective film layer of the EMI material, improving the stripping rate from 10-20% to 80-90%, reducing the problem of EMI material waste, and reducing the production cost by at least 60% compared with the prior art.
Drawings
FIG. 1 is a schematic diagram of a prior art EMI material;
fig. 2 is a schematic structural view of a prior art EMI material die cut article, wherein fig. 2 (a) is a top view of the die cut article and fig. 2 (b) is a side view of the die cut article;
FIG. 3 is a schematic structural view of a prior art improved die cut article of EMI material;
FIG. 4 is a schematic structural view of an electromagnetic interference EMI composite material according to the present invention, wherein FIG. 4 (a) is a top view of the electromagnetic interference EMI composite material; FIG. 4 (b) is a side view of an electromagnetic interference EMI composite;
FIG. 5 is a structural side view of an electromagnetic interference EMI composite material with a protective film and a peel-off film attached according to the present invention;
FIG. 6 is a schematic diagram of a semi-cut of an electromagnetic interference EMI material in accordance with the present invention;
FIG. 7 is a schematic view of the structure of a die used in the die-cutting process of the present invention;
FIG. 8 is a die-cutting schematic of the die-cutting process of the present invention;
FIG. 9 is a schematic illustration of the stripping of an electromagnetic interference EMI composite material with a protective film adhered thereto according to the present invention;
wherein, 100-EMI base material, 101-functional treatment layer, 102-metal film layer, 103-conductive adhesive layer, 110-reserved portion, 120-portion to be separated, 130-protective film layer, 200-single-sided tape, 201-half cutting mark, 202-single-sided tape waste, 300-protective film, 400-peeling-off film, 500-punching die, 501-added area, 502-original area, 600-electromagnetic interference EMI composite material, 700-punching mark.
Detailed Description
For better illustrating the present invention, the technical scheme of the present invention is convenient to understand, and the present invention is further described in detail below. The following examples are merely illustrative of the present invention and are not intended to represent or limit the scope of the invention as defined in the claims.
As shown in fig. 4, the embodiment of the present invention provides an electromagnetic interference EMI composite material, which includes an EMI base material 100 and a single-sided tape 200, wherein the EMI base material 100 includes an effective portion and a protective film layer 130, the effective portion is adhered to the protective film layer 130, the effective portion includes a retaining portion 110 and a portion to be separated 120, and a side of the portion to be separated 120 opposite to the protective film layer 130 is adhered to a side of the single-sided tape 200 having adhesion.
The effective part is sequentially provided with a functional treatment layer 101, a metal film layer 102 and a conductive adhesive layer 103 from the side adhered to the protective film layer 130 from inside to outside.
The planar size of the protective film layer 130 is equal to the sum of the planar sizes of the remaining portion 110 and the portion to be separated 120.
The single-sided tape 200 has the same planar dimensions as the plane of the portion 120 to be separated; the thickness of the single-sided tape 200 is h, h=0.001 to 1mm.
Example 1:
an electromagnetic interference EMI composite material comprising an EMI base material 100 and a single-sided tape 200, wherein the EMI base material 100 comprises an effective portion and a protective film layer 130, the effective portion is adhered to the protective film layer 130, the effective portion comprises a retaining portion 110 and a portion to be separated 120, and a side of the portion to be separated 120 opposite to the protective film layer 130 is adhered to a side of the single-sided tape 200 having adhesion.
The effective part is sequentially provided with a functional treatment layer 101, a metal film layer 102 and a conductive adhesive layer 103 from the side adhered to the protective film layer 130 from inside to outside.
Taking a rectangle as an example, the length of the protective film 130 is the sum of the length a of the retaining portion 110 and the width c of the portion 120 to be separated, and the width of the protective film 130 is the same as the width b of the retaining portion 110. That is, the planar size of the protective film layer 130 is equal to the sum of the planar sizes of the remaining portion 110 and the portion to be separated 120.
The length b' of the single-sided tape 200 is the same as the width b of the remaining portion 110; the width c' of the single-sided tape 200 is the same as the width c of the portion 120 to be separated; i.e., the planar size of the single-sided tape 200 is the same as the planar size of the portion 120 to be separated; the thickness h of the single-sided tape 200 was 0.05mm.
Example 2:
this embodiment 2 provides an electromagnetic interference EMI composite material, and the other structures are the same as those of the electromagnetic interference EMI composite material of embodiment 1 except that the thickness h of the single-sided adhesive tape 200 is 0.001 mm.
Example 3:
this embodiment 2 provides an electromagnetic interference EMI composite material, and the other structures are the same as those of the electromagnetic interference EMI composite material of embodiment 1 except that the thickness h of the single-sided adhesive tape 200 is 1mm.
Example 4:
this example provides a method of preparing the electromagnetic interference EMI composite described in examples 1-3 above, as follows:
(1) After the single-sided tape 200 is adhered to the electromagnetic interference EMI material, half-cutting is performed to the protective film layer 130 in the electromagnetic interference EMI material, so that the functional treatment layer 101, the metal film layer 102 and the conductive adhesive layer 103 are divided into two parts, the half-cutting tool mark 201 is punched, as shown in FIG. 6, the protective film layer 130 is kept complete, and then single-sided tape waste 202 is removed;
(2) The electromagnetic interference EMI composite material after the half-cut and the scrap material removal is fed into an automatic punching and laminating machine to perform punching, wherein the punching process is shown in fig. 8, and the electromagnetic interference EMI composite material 600 with the single-sided adhesive tape 200 adhered thereto is obtained, and the punching mold 500 is shown in fig. 7 in the punching process.
Example 5:
this example provides a method of preparing the electromagnetic interference EMI composite described in examples 1-3, comprising:
(1) After the single-sided tape 200 is adhered to the electromagnetic interference EMI material, half-cutting is performed to the protective film layer 130 in the electromagnetic interference EMI material, so that the functional treatment layer 101, the metal film layer 102 and the conductive adhesive layer 103 are divided into two parts, as shown in FIG. 6, the protective film layer 130 is kept complete, and then single-sided tape waste 202 is removed;
(2) The electromagnetic interference EMI material after the half-cut and the scrap material removal is fed into a conventional die-cutting machine for die-cutting, the die-cutting process is shown in fig. 8, and the electromagnetic interference EMI composite 600 to which the single-sided adhesive tape 200 is adhered is obtained, and the die-cutting mold 500 is shown in fig. 7.
Example 6:
application of the electromagnetic interference EMI composites described in examples 1-3:
an effective portion is adhered to one side of the protective film layer 130 in the electromagnetic interference EMI composite, and a protective film 300 is adhered to the other side of the protective film layer 130 opposite to the effective portion, the protective film 300 having a thickness of 0.05mm, and the protective film 300 is adhered as follows:
the molded protective film 300 was fixed on a stage under the die-cutting die 500 of the automatic pressure laminator during the die-cutting process of example 4, and the electromagnetic interference EMI composite 600 obtained by die-cutting was directly laminated on the protective film 300.
On the electromagnetic interference EMI composite to which the protective film 300 is adhered, a release-first film 400 is adhered to the side opposite to the protective film 300.
In the use process, firstly, the stripping film 400 is stripped, the conductive adhesive layer 103 of the electromagnetic interference EMI composite material retaining part 110 is melted and adhered and fixed on an object to be stuck through high-temperature pressing, a height difference is formed between the retaining part 110 and the part 120 to be separated, then the protective film 300 is stripped, the protective film layer 130 of the electromagnetic interference EMI composite material 600 is stripped along with the protective film 300 when the protective film 300 is stripped, the stripping process is as shown in fig. 9, and the stripping rate of the protective film layer of the final EMI material is 87-90%, so that the production cost is reduced by 63-65% compared with the prior art.
Example 7:
application of the electromagnetic interference EMI composites described in examples 1-3:
an effective portion is adhered to one side of the protective film layer 130 in the electromagnetic interference EMI composite, and a protective film 300 is adhered to the other side of the protective film layer 130 opposite to the effective portion, the protective film 300 having a thickness of 0.01mm, and the protective film 300 is adhered as follows:
after the electromagnetic interference EMI composite material was prepared by the preparation method of example 5, the protective film 300 was attached by manual assembly.
On the electromagnetic interference EMI composite to which the protective film 300 is adhered, a release-first film 400 is adhered to the side opposite to the protective film 300.
The use process is the same as that in the embodiment 6, and the peeling rate of the final EMI material protective film layer is 85-87%, so that the production cost is reduced by 60-62% compared with the prior art.
Example 8:
the present embodiment provides a method for applying the electromagnetic interference EMI composite material, except that the thickness of the protective film 300 is 0.2mm, the adhesion manner of the protective film 300 and the pre-peeling film 400 is the same as that in embodiment 6, the use process is the same as that in embodiment 6, and the peeling rate of the protective film layer of the final EMI material is 83-85%, so that the production cost is reduced by 62-65% compared with the prior art.
As can be seen from the results of examples 1 to 8, the present invention increases the high temperature resistant single-sided tape on one side in the peeling direction of the EMI base material, and in the high temperature bonding process, the conductive adhesive layer of the remaining portion of the EMI composite material is melted and adhered to the adherend, and the portion to be separated forms a height difference between the single-sided tape and the remaining portion, so that the protective film layer and the portion to be separated are separated from the remaining portion in advance, so that the protective film layer and the portion to be separated in the EMI composite material are effectively peeled off at the same time when the protective film having high temperature resistance and high adhesiveness is peeled off, thereby improving the peeling rate of the protective film layer of the EMI material, improving the peeling rate from 10 to 20% to 80 to 90%, reducing the problem of waste of the EMI material, and reducing the production cost by at least 60% compared with the prior art.
The applicant states that the detailed method of the present invention is illustrated by the above examples, but the present invention is not limited to the detailed method described above, i.e. it does not mean that the present invention must be practiced in dependence upon the detailed method described above. It should be apparent to those skilled in the art that any modification of the present invention, equivalent substitution of raw materials for the product of the present invention, addition of auxiliary components, selection of specific modes, etc., falls within the scope of the present invention and the scope of disclosure.
Claims (10)
1. An electromagnetic interference EMI composite material, characterized in that the composite material comprises an EMI matrix material (100) and a single-sided tape (200), wherein the EMI matrix material (100) comprises an effective portion and a protective film layer (130), the effective portion is adhered to the protective film layer (130), the effective portion comprises a retaining portion (110) and a portion to be separated (120), and the side of the portion to be separated (120) opposite to the protective film layer (130) is adhered to the adhesive side of the single-sided tape (200); the thickness of the single-sided adhesive tape (200) is h, wherein h=0.001-1 mm;
an effective part is adhered to one surface of the protective film layer (130), and a protective film is adhered to the opposite surface; the protective film has the characteristics of high temperature resistance and high viscosity, the high temperature resistance of the protective film is matched with the temperature resistance of an electromagnetic interference EMI material, so that the protective film cannot be damaged in the high temperature lamination process, and the viscosity of the protective film is as follows: the protective film layer is peeled off together with the protective film.
2. The electromagnetic interference EMI composite of claim 1, wherein the active portion is a functional treatment layer (101), a metal thin film layer (102), and a conductive adhesive layer (103) in this order from the side adhered to the protective film layer (130).
3. The method of preparing an electromagnetic interference EMI composite material of claim 2, wherein the method comprises the steps of:
(1) Half-cutting is carried out after the single-sided adhesive tape is adhered on the electromagnetic interference EMI material, so that single-sided adhesive tape waste is removed;
(2) The electromagnetic interference EMI material after being half-cut and the waste materials are removed is put into punching equipment for punching, and the electromagnetic interference EMI composite material adhered with the single-sided adhesive tape is obtained;
in the step (1), the protective film layer (130) in the electromagnetic interference EMI material is half cut, so that the functional treatment layer (101), the metal film layer (102) and the conductive adhesive layer (103) are divided into two parts, and the protective film layer (130) is kept complete.
4. A method according to claim 3, wherein the step (2) is to load the electromagnetic interference EMI material after the scrap is half-cut and discharged into a punching apparatus, and fix the position of the mold (500) and the electromagnetic interference EMI material with a stopper bar or a socket.
5. A method of manufacture according to claim 3, wherein the forming blade or punch of the die (500) used for punching in step (2) is rectangular and comprises an added area (501) and an original area (502).
6. The method of claim 5, wherein the length of the added area (501) is the same as the length of the portion (120) to be separated in the electromagnetic interference EMI composite, and the width of the added area (501) is the same as the width of the portion (120) to be separated in the electromagnetic interference EMI composite.
7. The method of manufacturing according to claim 5, wherein the length of the original region (502) is the same as the length of the remaining portion (110) of the electromagnetic interference EMI composite, and the width of the original region (502) is the same as the width of the remaining portion (110) of the electromagnetic interference EMI composite.
8. The method of manufacturing according to claim 5, wherein the added area (501) of the die (500) corresponds to one side of the electromagnetic interference EMI material adhering single sided tape (200) during the punching process.
9. A method of manufacturing according to claim 3, wherein the die cutting apparatus is an automatic die press laminator.
10. A method of manufacturing according to claim 3, wherein the side of the electromagnetic interference EMI composite material to which the single-sided tape (200) is attached, which is obtained in the step (2), is coated with the pre-release film (400).
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| CN201610215049.8A CN107263956B (en) | 2016-04-08 | 2016-04-08 | Electromagnetic interference EMI composite material and preparation method thereof |
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| CN109623944B (en) * | 2018-10-29 | 2020-09-15 | 郑州领胜科技有限公司 | Universal flat plate die cutting material-saving process |
| CN111376346B (en) * | 2018-12-27 | 2023-10-27 | 昊佰电子科技（上海）有限公司 | Knife-free stamping and cutting method and device for double faced adhesive tape |
| CN110681325B (en) * | 2019-10-23 | 2020-10-27 | 杭州见闻录科技有限公司 | Method for manufacturing composite microspheres and core-shell type composite microspheres for EMI shielding |
| CN114709067B (en) * | 2022-04-29 | 2024-04-30 | 吴琳艳 | Preparation method of flexible magnetic stripe carrier, flexible magnetic stripe carrier and eyelash ornament |
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| EP1181930B1 (en) * | 1999-05-13 | 2003-11-05 | Hisamitsu Pharmaceutical Co., Inc. | Patch |
| JP2004202816A (en) * | 2002-12-25 | 2004-07-22 | Honda Motor Co Ltd | Coating substitute film and method for pasting the film |
| CN101037067B (en) * | 2004-12-27 | 2010-10-13 | 王子制纸株式会社 | Information recording body and its manufacturing method |
| JP3117147U (en) * | 2005-09-29 | 2006-01-05 | 日本ジッパーチュービング株式会社 | Separated release film for electromagnetic shielding material |
| JP2008282945A (en) * | 2007-05-10 | 2008-11-20 | Toyota Motor Corp | Method for releasing protective film of adhesive tape, and method for manufacturing semiconductor package |
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