CN113068308A - PCB manufacturing method and PCB - Google Patents
PCB manufacturing method and PCB Download PDFInfo
- Publication number
- CN113068308A CN113068308A CN202110334050.3A CN202110334050A CN113068308A CN 113068308 A CN113068308 A CN 113068308A CN 202110334050 A CN202110334050 A CN 202110334050A CN 113068308 A CN113068308 A CN 113068308A
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- protective layer
- designated area
- layer
- pcb
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 239000011241 protective layer Substances 0.000 claims abstract description 119
- 239000010410 layer Substances 0.000 claims abstract description 55
- 239000003292 glue Substances 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000000903 blocking effect Effects 0.000 claims abstract description 21
- 238000002161 passivation Methods 0.000 claims description 10
- 238000000608 laser ablation Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 8
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 1
- 239000002390 adhesive tape Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of PCBs, and discloses a PCB manufacturing method and a PCB. The PCB manufacturing method comprises the following steps: providing an inner core plate with laminated plates sequentially positioned at the bottom layer of the step groove, and manufacturing a graphic unit in a designated area; sticking a glue-blocking protective layer on the surface of the designated area; the glue blocking protective layer comprises a first protective layer and a second protective layer which are overlapped, the first protective layer and the second protective layer respectively cover the designated area and the graphic unit, and the second protective layer is positioned between the first protective layer and the graphic unit; the first protective layer comprises an adhesive surface and a non-adhesive surface which are opposite to each other, the second protective layer at least comprises a non-adhesive surface, the adhesive surface of the first protective layer faces the designated area, and the non-adhesive surface of the second protective layer faces the graphic unit; pressing to obtain a multilayer board; and removing the glue blocking protective layer after the cover of the multilayer board is opened. The invention can effectively prevent the glue from entering the bottom of the stepped groove in the pressing process, conveniently remove the glue blocking protective layer with high quality and high efficiency, avoid the occurrence of residual glue on the surface of the graphic unit and improve the quality of the PCB.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a PCB manufacturing method and a PCB.
Background
For a PCB with a step groove, the groove bottom of the step groove usually has a plurality of different structural designs, including graphic units such as gold fingers, bonding pads, metal lines, etc., which have higher appearance requirements due to the application of conductive functionality, and therefore, the following manufacturing methods are usually adopted:
the method comprises the steps of firstly manufacturing graphic units such as golden fingers, bonding pads and/or metal circuits on an inner core board positioned at the bottom layer of a step groove, then pasting an adhesive tape on the surface of the whole groove bottom area of the inner core board in the forward direction to protect the graphic units, then pressing a plurality of core boards positioned at the inner layer and the outer layer under the conditions of high temperature and high pressure, and finally opening a cover and removing the adhesive tape to expose the graphic units.
In the manufacturing process, the adhesive tape is attached to the bottom of the step groove in the positive direction, namely the adhesive surface of the adhesive tape contacts the surface of the graphic unit, so that the adhesive surface of the adhesive tape is easy to melt and is tightly adhered to the surface of the graphic unit under the high-temperature and high-pressure pressing condition for a plurality of times for a long time, the adhesive tape on the surface of the graphic unit is difficult to completely remove after the cover is opened, residual adhesive is formed, quality defects of a PCB (printed circuit board) are caused, and batch scanning and maintenance are needed.
Disclosure of Invention
The invention aims to provide a PCB manufacturing method and a PCB, and aims to solve the problem that a protective adhesive tape on the surface of a pattern at the bottom of a step groove is easy to remain.
In order to achieve the purpose, the invention adopts the following technical scheme:
a PCB manufacturing method comprises the following steps:
providing an inner core plate with a laminated plate sequentially positioned at the bottom layer of the step groove, and manufacturing a graphic unit in a designated area of the inner core plate, wherein the designated area is a vertical projection area of the step groove;
sticking a glue-blocking protective layer on the surface of the designated area of the inner core plate; the glue blocking protective layer comprises a first protective layer and a second protective layer which are overlapped, the first protective layer covers the designated area, the second protective layer covers the graphic unit, and the second protective layer is positioned between the first protective layer and the graphic unit;
the first protective layer comprises an adhesive surface and a non-adhesive surface which are opposite, the second protective layer at least comprises a non-adhesive surface, the adhesive surface of the first protective layer faces the designated area, and the non-adhesive surface of the second protective layer faces the graphic unit;
applying the inner core plate to press and prepare a multilayer plate;
and removing the glue blocking protective layer after the cover of the multilayer board is opened, so that the graphic unit is exposed.
Optionally, the step of attaching a glue blocking protection layer to the surface of the designated area of the inner core board includes:
attaching the first protection layer to the surface of the carrier, wherein the non-bonding surface of the first protection layer faces the carrier;
the second protective layer is attached to the bonding surface of the first protective layer;
and transferring the first protective layer and the second protective layer to the surface of the designated area of the inner core board through the carrier.
Optionally, the adhering a glue blocking protection layer on the surface of the designated area of the inner core board further includes: on the surface of the carrier, a first pair of bit lines and a second pair of bit lines are manufactured in advance according to the relative positions of the designated area and the graphic units;
in the step of attaching the first protective layer to the surface of the carrier, carrying out alignment operation on the first protective layer according to the first alignment line;
and in the step of attaching the second protective layer to the bonding surface of the first protective layer, carrying out alignment operation on the second protective layer according to the second alignment line.
Optionally, the shape of the first pair of bit lines matches the shape of the first protection layer, and the shape of the second pair of bit lines matches the shape of the second protection layer.
Optionally, the first pair of bit lines and the second pair of bit lines are fabricated by laser ablation.
Optionally, the adhering a glue blocking protection layer on the surface of the designated area of the inner core board further includes: manufacturing a contraposition target on the surface of the supporting body in advance;
and in the step of attaching the first protective layer to the surface of the supporting body and the step of attaching the second protective layer to the bonding surface of the first protective layer, carrying out alignment operation on the first protective layer and the second protective layer according to the alignment target.
Optionally, the number of the second protective layers is the same as that of the image units, and each second protective layer correspondingly covers one image unit.
Optionally, the second protective layer further includes a bonding surface opposite to the non-bonding surface thereof, and the bonding surface of the second protective layer is attached to the bonding surface of the first protective layer.
Optionally, the viscosity of the bonding surface of the second protective layer is greater than the viscosity of the bonding surface of the first protective layer.
A PCB manufactured according to the PCB manufacturing method of any one of the above.
Compared with the prior art, the invention has the beneficial effects that:
the embodiment of the invention adopts the glue-blocking protective layer consisting of two protective layers, the first protective layer covering the bottom area of the whole stepped groove adopts a forward pasting mode (namely, a bonding surface contacts with a designated area), and the second protective layer only covering the graphic unit adopts a reverse pasting mode (namely, a non-bonding surface contacts with the graphic unit), thereby effectively preventing glue flowing into the bottom of the stepped groove in the pressing process from entering the bottom of the stepped groove to protect the conductive performance of the graphic unit, conveniently removing the glue-blocking protective layer with high quality and high efficiency, preventing the surface of the graphic unit from generating residual glue, and improving the quality of the PCB.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a PCB manufacturing method according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a glue blocking protection layer according to an embodiment of the present invention.
Fig. 3 is a schematic diagram illustrating a pasting manner of the glue blocking protection layer and the graphic unit according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a carrier bearing a resist protection layer according to an embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a method for manufacturing a PCB, including:
The designated area refers to a vertical projection area of the step groove on the current inner-layer core board, and in a PCB finished product manufactured subsequently, the designated area is formed as the groove bottom of the step groove. In practice, a range of tolerances between the theoretical and actual size values of the region may be allowed.
The graphic unit 3 may be various graphics such as a pad, a gold finger, or a metal circuit, and is designed according to actual requirements, and is not limited specifically. The method for manufacturing the graphic unit 3 may adopt a conventional graphic transfer method, and the invention is not limited.
And 102, pasting a glue blocking protective layer on the surface of the designated area of the inner-layer core plate.
As shown in fig. 2 and fig. 3, the resist protection layer includes a first protection layer 1 and a second protection layer 2 stacked together, the first protection layer 1 covers the designated area, the second protection layer 2 covers the graphic unit 3, and the second protection layer 2 is located between the first protection layer 1 and the graphic unit 3.
The first protection layer 1 comprises an adhesive surface 11 and a non-adhesive surface 12 which are opposite, the second protection layer 2 at least comprises a non-adhesive surface 22, the adhesive surface 11 of the first protection layer 1 faces the designated area, and the non-adhesive surface 22 of the second protection layer 2 faces the graphic unit 3.
In this embodiment, the function of the glue blocking protective layer is to block the peripheral prepreg from melting and flowing to the surface of the graphic unit 3 in the subsequent pressing process, so as to ensure that the graphic unit 3 maintains good conductivity.
And 103, applying an inner core plate to press the inner core plate to manufacture the multilayer plate.
In this step, the treated core board of the inner layer and other core boards are subjected to a press-fitting treatment under a high-temperature and high-pressure press-fitting condition. In the pressing process, even if the prepreg with certain fluidity is melted and flowed due to high temperature, the flowing glue can not contact with the graphic unit 3 because the surface of the designated area where the graphic unit 3 is manufactured is covered with the glue blocking protective layer.
And 104, removing the glue blocking protective layer after the cover of the multilayer board is opened, so that the graphic unit 3 is exposed.
The glue blocking protective layer can be removed in a direct tearing mode. In the removing process, the non-bonding surface 22 of the second protective layer 2 is actually in contact with the surface of the graphic unit 3, that is, the graphic unit 3 and the glue blocking protective layer are not sticky, so that the glue blocking protective layer can be simply and rapidly removed, and the surface of the graphic unit 3 can be prevented from being residual glue.
Different from a conventional adhesive tape, the embodiment of the invention adopts a glue-blocking protective layer consisting of two protective layers, the first protective layer 1 covering the whole bottom area of the stepped groove adopts a forward pasting mode (namely, the bonding surface 11 contacts with a designated area), and the second protective layer 2 only covering the graphic unit 3 adopts a reverse pasting mode (namely, the non-bonding surface 22 contacts with the graphic unit 3), so that glue flowing in the pressing process can be effectively prevented from entering the bottom of the stepped groove to protect the conductivity of the graphic unit 3, the glue-blocking protective layer can be conveniently removed with high quality and high efficiency, the surface of the graphic unit 3 is prevented from generating residual glue, and the quality of a PCB is improved.
It should be noted that, in the actual PCB manufacturing process, other conventional processes are also involved, such as drilling after lamination, glue removal, electroplating, outer layer pattern manufacturing, solder mask, etc., which can be completed by various conventional methods, and the present invention is not limited thereto.
In the step 102, a specific method for pasting the glue blocking protection layer on the surface of the designated area of the core board is as follows: attaching the first protection layer 1 to the surface of the carrier 4, wherein the non-bonding surface 12 of the first protection layer 1 faces the carrier 4; attaching the second protective layer 2 to the bonding surface 11 of the first protective layer 1; the first protective layer 1 and the second protective layer 2 are transferred to the surface of the designated area of the inner core board through the carrier 4.
The supporting body 4 is used for supporting the glue-blocking protective layer, and units such as a PET film or a sucker can be selected.
In order to ensure that a better protective performance is obtained, the alignment accuracy of the glue-resistant protective layer needs to be improved when the glue-resistant protective layer is attached. Therefore, the embodiment of the present invention provides two alignment methods, as shown in fig. 4:
the first method comprises the following steps: respectively manufacturing a first pair of bit lines 5 and a second pair of bit lines 6 on the surface of the carrier 4 in advance according to the relative positions of the designated area and the graphic units 3; then, in the step of attaching the first protective layer 1 to the surface of the carrier 4, the first protective layer 1 is aligned according to the first alignment line 5; in the step of attaching the second passivation layer 2 to the adhesive surface 11 of the first passivation layer 1, the second passivation layer 2 is aligned according to the second pair of bit lines 6.
In practice, alignment lines may be ablated on the carrier 4 using a UV laser cutter. To facilitate fast alignment, the first pair of bit lines 5 may be further shaped to match the shape of the first passivation layer 1, and the second pair of bit lines 6 may be further shaped to match the shape of the second passivation layer 2, such as a rectangle, an ellipse, etc.
And the second method comprises the following steps: manufacturing a contraposition target 7 on the surface of the supporting body 4 in advance; in the step of attaching the first protective layer 1 to the surface of the carrier 4 and the second protective layer 2 to the bonding surface 11 of the first protective layer 1, the first protective layer 1 and the second protective layer 2 are aligned together according to the alignment target 7.
It can be understood that, in the embodiment of the present invention, the number of the image units may be multiple, and in this case, the second passivation layer 2 may be fabricated in one-to-one correspondence with the image units 3, so that the surface of each image unit 3 is distributed and covered by one second passivation layer 2.
The second protection layer 2 may further include an adhesive surface 21 opposite to the non-adhesive surface 22, and in this case, the adhesive surface 21 of the second protection layer 2 is attached to the adhesive surface 11 of the first protection layer 1. Preferably, the bonding surface 11 of the first protective layer 1 adopts a low-viscosity design, so that the movement of the glue-blocking protective layer can be finely adjusted after the supporting body 4 is removed; the adhesive surface 21 of the second protective layer 2 is designed to have medium or high viscosity, so that the second protective layer 2 is tightly attached to the first protective layer 1, and the second protective layer 2 is not easy to fall off when the first protective layer 1 is attached or moved.
In addition, after the glue-blocking protective layer is transferred to the surface of the inner core plate through the supporting body 4, the periphery of the inner core plate can be pre-fixed by using an electric soldering iron, and then the inner core plate is quickly pressed and fixed by using a vacuum quick press.
The embodiment of the invention also provides a PCB which is manufactured according to the PCB manufacturing method. Specifically, the PCB can be a soft board, a hard board or a rigid-flexible board, and the solution provided by the invention can be applied as long as the PCB has a step groove, and the bottom of the step groove is designed with a graphic unit 3 to be protected, so as to solve the problem of adhesive residue and impurities at the graphic position.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A PCB manufacturing method is characterized by comprising the following steps:
providing an inner core plate with a laminated plate sequentially positioned at the bottom layer of the step groove, and manufacturing a graphic unit in a designated area of the inner core plate, wherein the designated area is a vertical projection area of the step groove;
sticking a glue-blocking protective layer on the surface of the designated area of the inner core plate; the glue blocking protective layer comprises a first protective layer and a second protective layer which are overlapped, the first protective layer covers the designated area, the second protective layer covers the graphic unit, and the second protective layer is positioned between the first protective layer and the graphic unit;
the first protective layer comprises an adhesive surface and a non-adhesive surface which are opposite, the second protective layer at least comprises a non-adhesive surface, the adhesive surface of the first protective layer faces the designated area, and the non-adhesive surface of the second protective layer faces the graphic unit;
applying the inner core plate to press and prepare a multilayer plate;
and removing the glue blocking protective layer after the cover of the multilayer board is opened, so that the graphic unit is exposed.
2. The method for manufacturing a PCB of claim 1, wherein the step of attaching a glue blocking protection layer to the surface of the designated area of the inner core board comprises:
attaching the first protection layer to the surface of the carrier, wherein the non-bonding surface of the first protection layer faces the carrier;
the second protective layer is attached to the bonding surface of the first protective layer;
and transferring the first protective layer and the second protective layer to the surface of the designated area of the inner core board through the carrier.
3. The method of claim 2, wherein the step of applying a resist protective layer to the surface of the designated area of the inner core board further comprises: on the surface of the carrier, a first pair of bit lines and a second pair of bit lines are manufactured in advance according to the relative positions of the designated area and the graphic units;
in the step of attaching the first protective layer to the surface of the carrier, carrying out alignment operation on the first protective layer according to the first alignment line;
and in the step of attaching the second protective layer to the bonding surface of the first protective layer, carrying out alignment operation on the second protective layer according to the second alignment line.
4. The method for manufacturing a PCB according to claim 3, wherein the shape of the first pair of bit lines matches the shape of the first protection layer, and the shape of the second pair of bit lines matches the shape of the second protection layer.
5. The method of claim 3, wherein the first pair of bit lines and the second pair of bit lines are fabricated by laser ablation.
6. The method of claim 2, wherein the step of applying a resist protective layer to the surface of the designated area of the inner core board further comprises: manufacturing a contraposition target on the surface of the supporting body in advance;
and in the step of attaching the first protective layer to the surface of the supporting body and the step of attaching the second protective layer to the bonding surface of the first protective layer, carrying out alignment operation on the first protective layer and the second protective layer according to the alignment target.
7. The method for manufacturing a PCB of claim 1, wherein the number of the second protection layers is the same as that of the image units, and each second protection layer correspondingly covers one image unit.
8. The method of claim 1, wherein the second passivation layer further comprises a bonding surface opposite to the non-bonding surface thereof, and the bonding surface of the second passivation layer is attached to the bonding surface of the first passivation layer.
9. The method of claim 8, wherein the viscosity of the bonding surface of the second protective layer is greater than the viscosity of the bonding surface of the first protective layer.
10. A PCB manufactured according to the PCB manufacturing method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110334050.3A CN113068308A (en) | 2021-03-29 | 2021-03-29 | PCB manufacturing method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110334050.3A CN113068308A (en) | 2021-03-29 | 2021-03-29 | PCB manufacturing method and PCB |
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| Publication Number | Publication Date |
|---|---|
| CN113068308A true CN113068308A (en) | 2021-07-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110334050.3A Pending CN113068308A (en) | 2021-03-29 | 2021-03-29 | PCB manufacturing method and PCB |
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| Country | Link |
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| CN (1) | CN113068308A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115802621A (en) * | 2022-12-12 | 2023-03-14 | 福莱盈电子股份有限公司 | Processing method for improving wrinkle of rigid-flex board |
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| DE3741925A1 (en) * | 1986-12-11 | 1988-06-23 | Mitsubishi Electric Corp | IC CARDS AND METHOD FOR THEIR PRODUCTION |
| US20120003793A1 (en) * | 2010-07-01 | 2012-01-05 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing embedded substrate |
| CN105611751A (en) * | 2015-09-07 | 2016-05-25 | 瑞华高科技电子工业园(厦门)有限公司 | Processing method of multilayer flexible circuit board |
| CN107770963A (en) * | 2017-10-11 | 2018-03-06 | 广州兴森快捷电路科技有限公司 | The preparation method of rigid-flexible combined circuit board |
| CN107889377A (en) * | 2017-11-16 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of preparation method of ladder position golden finger |
| CN110139504A (en) * | 2019-05-24 | 2019-08-16 | 深圳市景旺电子股份有限公司 | Flexible and hard combined circuit board and preparation method thereof |
-
2021
- 2021-03-29 CN CN202110334050.3A patent/CN113068308A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3741925A1 (en) * | 1986-12-11 | 1988-06-23 | Mitsubishi Electric Corp | IC CARDS AND METHOD FOR THEIR PRODUCTION |
| US20120003793A1 (en) * | 2010-07-01 | 2012-01-05 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing embedded substrate |
| CN105611751A (en) * | 2015-09-07 | 2016-05-25 | 瑞华高科技电子工业园(厦门)有限公司 | Processing method of multilayer flexible circuit board |
| CN107770963A (en) * | 2017-10-11 | 2018-03-06 | 广州兴森快捷电路科技有限公司 | The preparation method of rigid-flexible combined circuit board |
| CN107889377A (en) * | 2017-11-16 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of preparation method of ladder position golden finger |
| CN110139504A (en) * | 2019-05-24 | 2019-08-16 | 深圳市景旺电子股份有限公司 | Flexible and hard combined circuit board and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115802621A (en) * | 2022-12-12 | 2023-03-14 | 福莱盈电子股份有限公司 | Processing method for improving wrinkle of rigid-flex board |
| CN115802621B (en) * | 2022-12-12 | 2024-03-08 | 福莱盈电子股份有限公司 | Processing method for improving folds of rigid-flex board |
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Application publication date: 20210702 |