CN106550532A

CN106550532A - For manufacturing the protection structure including lazy flow material of parts carrier

Info

Publication number: CN106550532A
Application number: CN201510594973.7A
Authority: CN
Inventors: A·泰; N·鲍尔-欧平阁; G·D·格雷戈里奥; P·戴
Original assignee: AT&S China Co Ltd
Current assignee: AT&S China Co Ltd
Priority date: 2015-09-17
Filing date: 2015-09-17
Publication date: 2017-03-29
Also published as: WO2017046762A1

Abstract

The present invention discloses the protection structure including lazy flow material for being used to manufacturing parts carrier, and a kind of semi-finished product (100), the semi-finished product (100) include：Protection structure (102), the protection structure (102) is including lazy flow material；And two parts carriers (104), both parts carrier (104) is releasedly formed on the opposed interarea of the protection structure (102).

Description

For manufacturing parts carrier Including the protection structure of lazy flow material

Technical field

The present invention relates to a kind of semi-finished product.Additionally, a kind of the present invention relates to method of manufacture parts carrier.

Background technology

With the development of electronics industry, electronic product is intended to miniaturization and high-performance, and therefore, it is Layout area of the increase by interlayer interconnection technique layout, and meet high density integrated circuit and drop simultaneously The thickness of low package substrate, develops multi-layer sheet.

Traditionally, parts carrier includes central layer and the packed structures being arranged on the both sides of the central layer.However, The thickness of the length and total of line is increased using central layer.Therefore, in order to overcome these defects, and And meet the development trend of high frequency and miniaturization, develop centreless parts carrier.

US 8,227,711 discloses a kind of centreless package substrate, and the centreless package substrate includes：Substrate master Body, the substrate body include the supplemental dielectric with the first opposed face and the second face；Interior wiring, should Interior wiring is formed on the second face；And packed structures, the packed structures are formed at supplemental dielectric and interior In wiring.Multiple conductive projections are set, and the conductive projection includes：Metal column, the metal column have opposed First end and the second end；And weld layer, the weld layer is formed in first end, wherein metal column Second end is arranged in supplemental dielectric, and is electrically connected with interior wiring, and has the metal column of weld layer First end protrude from the first face of supplemental dielectric, so as to realize ultra fine-pitch and very high connductivity projection.

US 2007/0124924 discloses a kind of method of manufacture wiring board, and the method comprising the steps of： Temporary substrates are obtained by semi-solid preparation material；And it is linear by the cloth being arranged on semi-solid preparation material with lower floor Into in area, and make what the outer part that the metal forming that its size is more than lower floor's size forms area with wiring was contacted Metal forming is arranged on semi-solid preparation material by mode by the lower floor being located between them, and and then is passed through Using heating and supercharging hardening semi-solid preparation material, formed on metal foil and pile up wiring layer, and by cutting Cut off layer, metal forming and pile up the part that wiring layer is formed at the structure on temporary substrates, piled up Wiring layer is formed at the wiring member in metal forming, outer part of the portion corresponding to lower floor, and therefore, lead to Crossing makes metal forming separate with temporary substrates, and metal forming is attached at least one face of temporary substrates simultaneously.

The problem that JP 2,006 332115 is related to is to provide a kind of technique for producing centreless wiring plate, in the nothing In core wiring plate, the rough surface of substrate can be easily made, and there is provided a kind of nothing of such production Core wiring plate, in the centreless wiring plate, improves underfilling (underfill material) Fluidity.In the corresponding technique of disclosed production centreless wiring plate, multilamellar lamellar body (has multilayer wiring Portion) it is formed on enhanced substrate, and and then, multilayer wiring portion is peeled from substrate is strengthened, therefore have Help production.Adhesion Copper Foil due to adopting the surface with the roughening by roughening, so tight with which The first medium layer that contact is arranged has sufficiently coarse interarea.

Although the existing method of manufacture centreless parts carrier is strong, in terms of manufacture process is simplified, Still having improves space.More specifically, the parts carrier for traditionally manufacturing is repaiied after may be required in lamination It is whole, to prevent from bubble occur in the edge of sheet material after lamination.Particularly, so distorted to nothing The further process of core components carrier, particularly possible electroplating process.

The content of the invention

The purpose of the present invention is can to manufacture reliable parts carrier with rational manufacture.

In order to realize the purpose being set forth above, there is provided a kind of to be used to manufacture part according to independent claims The semi-finished product and method of carrier.

Exemplary embodiment of the invention, there is provided a kind of semi-finished product, the semi-finished product include：Protection Structure (or temporary carrier), the protection structure include lazy flow material (particularly lazy flow center Structure)；And two parts carriers, both parts carrier is releasedly formed at the right of the protection structure Put on interarea.

A kind of another exemplary embodiment of the invention, there is provided method of manufacture parts carrier, The method includes：There is provided (particularly formed) including the protection structure of lazy flow material；And by two Individual parts carrier is releasedly formed on the opposed interarea of protection structure.

In the environment of the application, term " semi-finished product " can refer in particular to a kind of physical arrangement, and the physics is tied Structure is not yet manufactured, and in order to the initial product that functionally can act as individual components carrier will Ask and further process.In other words, semi-finished product can be will based on semi-finished product manufacture parts carrier it is pre- Form part.

In the environment of the application, term " protection structure " can refer in particular to temporary carrier or supplementary structure, The temporary carrier or supplementary structure do not form a part for the parts carrier for having manufactured, and only make at which During use so that two parts carriers are maintained on two opposed interareas of protection structure, so as to letter Mechanical robustness when changing and manipulate, and improving manufacture.Release after parts carrier from protection structure, should Protection structure can be used for manufacturing miscellaneous part carrier again, it is also possible to be eliminated, i.e. be sacrificed.

In the environment of the application, term " lazy flow material " (is also known as " illiquidity material sometimes Material ") can refer in particular to, when being processed in external pressure and at a temperature of raising, particularly in lamination, There is no or only the material of very limited amount of flow tendency.Particularly, under laminating temperature (for example, 150 DEG C), lazy flow material can have sufficiently high viscosity, for example, at least 5000 pools, preferably Moor on ground at least 10000.For example, when common semi-solid preparation material is heated under stress, its resin melting (liquefaction) and in such a case, flow freely in any space.In specific time period, common half The resin of curing materials remains able to the liquid for flowing freely.In contrast, particular arrangement is according to the present invention Exemplary embodiment realize lazy flow material, even with lamination when suppress eliminate mobility, make Obtain lazy flow material original position is essentially stayed in lamination.

In the environment of the application, term " parts carrier " can refer in particular to a kind of physical arrangement, and construction should Physical arrangement, fills and makes electrical contact with the electronic unit of at least one electronic chip for such as encapsulating with face.Cause This, after this face dress process, parts carrier carries one or more electronic unit.In addition or make Select for a kind of, electronic unit can also be embedded in the inside of corresponding component carrier.

Exemplary embodiment of the invention, can be by lazy flow material (particularly lazy flow half Curing materials) it is applied in the core region of protection structure and (wherein lazy flow material can be arranged in two Between individual Copper Foil, and can be with additional core material).In the feelings using this lazy flow protection structure It is under condition, unexpected as a result, it is possible to manufacture parts carrier, and without the need for be repaired after lamination. By taking the measure, it can be advantageous to prevent traditionally gas occur in the edge of sheet material after lamination Bubble, traditionally, this may cause chemistry to be subside in electroplating process.Therefore, when using lazy flow core Protection structure when, can significantly simplify the manufacture of centreless parts carrier, while ensureing manufactured part The high reliability of carrier.When using traditional semi-solid preparation material rather than (the such as low flowing of lazy flow material Property semi-solid preparation material) when, lamination when, it may occur however that traditional semi-solid preparation material from laminate flow out, So as to produce burr etc..In order to remove the traditional semi-solid preparation material for so laterally outflowing, traditionally, need Repaired or deburring before further laminate is processed.This may relate to workload, reliability Traditional semi-solid preparation material of sex chromosome mosaicism and outflow is simultaneous with the chemical material used in further manufacture process Capacitive problem.When, in protection structure, making especially proximate to the interface between protection structure and parts carrier During with lazy flow material, even these problems can be effectively suppressed elimination.

It is explained below the additional exemplary embodiment of semi-finished product and method.

In embodiment, lazy flow material includes lazy flow semi-solid preparation material or by lazy flow half Curing materials are constituted.Semi-solid preparation material is that the abbreviation of " pre-preg (pre-impregnated) " is represented. Semi-solid preparation material can be including the fiber in matrix (for example, resin, particularly epoxy resin) (such as Glass fibre).More specifically, semi-solid preparation material can include with polyimides, epoxy resin or its Glass fibre or other fiber reinforcements that his resin system is impregnated with, in coat operations, they occur Local vulcanized (or reacting).Lazy flow semi-solid preparation material is that outflow limits its mobility and special changes The semi-solid preparation material of property.In the environment of the application, term " lazy flow semi-solid preparation material " can be with spy There is after referring to transformation the semi-solid preparation material of controlled melt viscosity, carry in the part of lamination such as printed circuit board (PCB) During the structure of body, the semi-solid preparation material produces mobility in the extreme.With the low of high melt viscosity feature Mobility semi-solid preparation material is not flowed in space too much, but is stopped in the original location.Can be using using heat The modified epoxy systems production lazy flow semi-solid preparation material of plastic rubber, lazy flow semi-solid preparation material is also Can be made up of the compound of partial cross-linking.Constituted using the specified chemical of resin, it is also possible to obtain low stream Dynamic property characteristic, the specified chemical composition of the resin can include that high molecular mobility limits agent.For example, Can be fromCompany obtains lazy flow semi-solid preparation material, for example, as R1551LF or The lazy flow product of R1551WNL；Can be fromLazy flow semi-solid preparation material is obtained, for example, is made For 37N, 38N, 47N, 49N, 51N lazy flow product of Arlon；Can be fromCompany obtains Lazy flow semi-solid preparation material, for example as 104LF-75,106LF-67,106LF-72,1080LF-64, 106LF-72,1080LF-65,106LF-72,1080LF-65,106LF-65,106LF-68 or 1080LF-62 lazy flow products.(that is, apply pressure at elevated temperature) in lamination, low stream Dynamic property semi-solid preparation material can be presented Quick cross-linking, and or substantially not flow in adjacent area.

In embodiment, lazy flow material has between 30mil and 140mil, particularly 60mil Yield limit between 120mil, between more particularly 60mil and 90mil.1mil Corresponding to 0.001 inch or 25.4 μm.The relevant so-called IPC lazy flows of above-mentioned yield limit Test is using going out two 1 " sample in the hole of diameter, and the flow conduct for measuring under test conditions With the flow of the ostium of the reduction measurement in hole.Corresponding specification, example are represented with the mil that bore dia reduces Such as, 60mil to 90mil.

In embodiment, at 150 DEG C, the viscosity that lazy flow material has is in 5000 pools and 100000 Between pool, particularly between 5000 pools and 50000 pools.It is particularly preferred that the respective range of viscosity number Between 5000 pools and 35000 pools.1 pool is equal to 0.1Pas=0.1kgm^-ss^-1.Therefore, low flowing Property semi-solid preparation material viscosity number be noticeably greater than the viscosity number of traditional semi-solid preparation material, therefore, with tradition half Curing materials are compared, and lazy flow semi-solid preparation material has significantly lower mobility trend.For example, exist 140 DEG C with 160 DEG C at a temperature of between, the minimal viscosity that lazy flow material can have is 5000 Between pool and 100000 pools.

In embodiment, lazy flow material includes fiber and suppression base in resin matrix, the matrix High molecular additive in body.By optionally adding high molecular additive (for example, You Jitian Plus agent, polymer etc.), can be in controllable precise mode compared with lazy flow trend.

In embodiment, lazy flow material is local vulcanized, and is not vulcanizing in local.By adjusting Sulfuration and unvulcanized degree, can accurately limit the flow behavior of lazy flow material.

In embodiment, protection structure includes the division center with lazy flow material, and including position Above two opposed interareas of division center or top releasing layer (particularly peel ply), wherein Construct each releasing layer so that (corresponding component carrier being peeled off especially by from protection structure) can be from Protection structure discharges corresponding component carrier.This releasing layer can be by by thin fluorocarbon resin (PTFE) It is laminated on polyethylene terephthalate (PET) film and forms the layer with the surface for applying organosilicon etc. Press mold.Releasing layer can limit the interface between protection structure and parts carrier to be manufactured.Releasing layer with Adhesion between the adjacent materials of parts carrier can respectively significantly less than parts carrier or protection structure Each Rotating fields between adhesion.

In embodiment, division center includes pseudo- core, lazy flow material, particularly lazy flow half A piece in the piece separated in the two spaces of curing materials be covered in above two interareas of pseudo- core or Above person.Although without the need for carrying out repairing generally favourable to the edge of plate after lamination, as a result, Under the conditions of particular procedure and in the environment of being not intended to, have on two interareas between two parts carriers The simple lazy flow semi-solid preparation material for having reinforcement structure still may cause opposed with releasing layer in lamination Two Copper Foil corrugations and absciss layer.When two pieces being spaced vertically apart from that additional pseudo core is inserted in lazy flow material Between when, can effectively suppress two Copper Foils that the trend of corrugation and absciss layer occurs.The pseudo- core mentioned is by carrying Prevent Copper Foil from wrinkling and preventing Copper Foil from separating for additional support and stability.

In embodiment, pseudo- core includes：Central core, the particularly central core of semi-solid preparation material are (particularly It is the flowable semi-solid preparation material under pressurization and heating, rather than lazy flow semi-solid preparation material)；And Two conductive layers on central core, particularly two copper conductive layers.As a result, especially effectively preventing Two Copper Foil corrugations and absciss layer.

In embodiment, pseudo- core is copper-clad plate (CCL).The process of copper-clad plate is produced with by glass fibre system Start into glass cloth.With mainly by epoxy resin or resin liquid impregnated glass colth made by other resins, And and then, the corresponding Copper Foil of plating on both sides.

In an alternate embodiment, division center is only by lazy flow material, particularly lazy flow semi-solid preparation Material is constituted.Although the present embodiment involves a need to for the corrugation of two Copper Foils and absciss layer to be maintained at acceptable water Flat challenge, but for low cost application, it is a correct solution, because can utilize extremely simple The protection structure of construction is realized.

In embodiment, enhancement layer of the protection structure also including enhancement layer, particularly Copper Foil, each reinforcement Layer is all arranged between division center and the corresponding releasing layer in releasing layer.These enhancement layers can with compared with High thickness, such as between 10 μm with 30 μm, particularly at 15 μm and 25 μm Between, with lamination, during manipulating and discharging, there is provided high mechanical stability.

In embodiment, at least one of two parts carriers (particularly two parts carriers are all) structure Make as centreless parts carrier.Therefore, this parts carrier can be conductive coating structure and electric insulation layer structure Laminate, but can be no central layer.

In embodiment, protection structure is with the thickness between 10 μm with 300 μm. In embodiment, lazy flow material can be with the thickness between 40 μm with 260 μm.

In embodiment, two parts carriers are formed with symmetrical configurations.Therefore, conductive coating structure and electricity are exhausted Edge layer structure can be attached to the opposed interarea of parts carrier, and be processed on the opposed interarea, And the opposed interarea is connected to by lamination, to provide very symmetrical structure.Parts carrier and excellent The architecture that selection of land also has this symmetrical (the particularly specular) of protection structure prevents warpage And mechanical stress.

In embodiment, each parts carrier includes ultra-thin conductive at the respective interface with protection structure Layer, particularly thickness are less than 5 μm, more specifically less than 3 μm of layers of copper.For example, the copper mentioned The thickness of layer can be between 2 μm and 3 μm.Therefore, using described manufacture process, can make Significantly thin layers of copper is realized with than tradition.Due to after parts carrier is released from protection structure, Neng Goujin One step processes the layers of copper that (particularly graphical etc.) is mentioned, so as to form conductive trace etc., so little thickness Degree is especially advantageous (especially for being manufactured more according to very ultra thin conductor layers (be especially to provide graphical) The edge of this trace of straight shape).

In embodiment, each parts carrier includes at least one electric insulation layer structure and/or at least Individual conductive coating structure.This Rotating fields can be unbroken layer, patterned layer, have multiple in father-in-law's plane Island etc..

In embodiment, two electric insulation layer structures near protection structure arrangement are (that is, positioned at each An electric insulation layer structure on the corresponding interarea of parts carrier) it is pure electric insulation layer, there is no conduction in which Material.So advantageously prevent lamination when semi-finished product in there is stress because the layer with protection knot The homogeneous material characteristic of the homogenous properties matching of each layer of structure.Additionally, will arrange near protection structure Electric insulation layer structure is formed as pure electric insulation layer (particularly untreated semi-solid preparation layer), from accordingly releasing After putting the protection structure release corresponding component carrier of layer, can process (especially by being accordingly electrically insulated The conductive structure of such as path is formed in layer) these layers.The process as a result, for suppress warpage it is non- Chang Youxiao.

In embodiment, pure electric insulation layer is semi-solid preparation layer.They are normal semi-solid preparation layers, rather than low stream Dynamic property semi-solid preparation layer material, therefore so that in lamination, because melting and crosslinking, and contribute to part Connect between the configuration of carrier.

In embodiment, on the one hand near protection structure arrangement two electric insulation layer structures (each It is carrier related with the corresponding component in parts carrier) and another aspect lazy flow material by substantially having The material for having same coefficient of thermal expansion (CTE value) is made.Preferably, accordingly very thin three level stack Can be inserted on the one hand near the corresponding electric insulation layer structure in the electric insulation layer structure of protection structure arrangement And the protection structure of the lazy flow semi-solid preparation material of another aspect between.For example, releasing layer can be one There is on individual interarea first Copper Foil of the thickness between 2 μm and 3 μm (as the example of very ultra thin conductor layers) And with the second Copper Foil that thickness is 18 μm on opposed interarea (as the example of enhancement layer).It is this non- Often thin three level stack can be presented undesirable absciss layer or corrugated trend.Particularly very ultra thin conductor layers With enhancement layer particularly in edge usually absciss layer and the corrugation of the sheet material or layer stacking for forming semi-finished product, Integrity problem may so be caused.The knot that the CTE of the dielectric layer above and below thin three level stack is adjusted Fruit can be advantageously to suppress or eliminate absciss layer and corrugation.Due to being not intended to limited to particular theory, institute To be presently believed to, when basically or identical Coefficient of Thermal Expansion value (for example, CTE value is inclined Difference is less than 20%, especially less than 10%) middle to select to be located at the dielectric layer above and below thin three level stack Material when, acted on thin three level stack when being laminated under elevated pressure and elevated temperature Power reduce or be balanced.Accordingly it is possible to prevent thin three level stack bear on thin three level stack and Under respective material different heat expansion produce come from above and below out-of-balance force.

In embodiment, at least one electric insulation layer structure is included by least one of group for constituting as follows： Resin, particularly bismaleimide-triazine resin；Cyanate；Glass, particularly glass fibre；Half Curing materials；Polyimides；Liquid crystal polymer；Epoxy resin accumulating film；FR4 materials；Ceramics；With Metal-oxide.Although semi-solid preparation material (particularly B levels semi-solid preparation material) or F4 are typically preferred , but other materials can also be used.

In embodiment, at least one conductive coating structure is included in the group being made up of copper, al and ni at least One.Although copper is typically preferred, it can also be other materials.

In embodiment, each parts carrier includes odd number electric insulation layer structure.It is of the invention Exemplary embodiment, this can accomplish, because the centreless landform on the opposed interarea of leader of protection structure Into two parts carriers so that need not be in the opposite sides thereof of the one of parts carrier in each cycle Two new layers are applied symmetrically.Advantageously, keep relative to each other symmetrical only with respect to two parts carriers, And keep symmetrical relative to the inside composition of protection structure, and not with respect to parts carrier in corresponding portion The inside composition of part carrier keeps symmetrical.

In embodiment, at least a portion of protection structure is provided with least one, particularly multiple alignments Labelling, particularly aligned through holes.For example, alignment mark can be by protection structure or one part Carry out the through hole of machine drilling formation.For example, only in the copper-clad plate of division center of protection structure is formed, Through hole is formed enough.For example, this alignment mark can be formed at substantial rectangular semi-finished product or sheet material Four angular zones in.They help the space adjusted between semi-finished product or one part and manufacturing equipment to close System.

In embodiment, electronic unit face can be attached at least one parts carrier and/or embedded In at least one parts carrier.This face dress or embedded electricity can be selected from the following group for constituting Subassembly：Active electronic component, passive electrical components, electronic chip, storage facilities, wave filter, collection Into circuit, Signal Processing Element, power management component, optic electric interface element, electric pressure converter, password Part, transmitter and/or receiver, electromechanical transducer, sensor, actuator, MEMS, Microprocessor, capacitor, resistor, inducer, battery, switch, video camera, antenna and logic core Piece.However, it is also possible to by other electronic unit faces be attached on electronic equipment or embedded electronic equipment in.

In embodiment, parts carrier is configured in the group being made up of printed circuit board (PCB) and substrate.

In the environment of the application, term " printed circuit " can (PCB) be refered in particular to, for example, by such as Fruit needs are with heat supply applying pressure by several conductive coating structures and several electric insulation layer structural laminateds The plate-shaped member carrier of formation.Used as the preferred material of PCB technologies, conductive coating structure is made of copper, and Electric insulation layer structure can include resin and/or glass fibre, so-called semi-solid preparation material or FR4 materials Material.Through hole is formed through laminate by, for example, laser drill or machine drilling, and utilization is led Electric material (particularly copper) fills them, so as to form the path as through-hole interconnection, can be requiring Mode make the interconnection of various conductive coating structures.Do not consider can be embedded in printed circuit board (PCB) one more Individual electronic unit, generally constructs printed circuit board (PCB), with tabular printed circuit board (PCB) one or two are right Put.By welding, they may be coupled to corresponding interarea.

In the environment of the application, term " substrate " can be refered in particular to, with the ministry of electronics industry to be mounted above Part has the widget carrier of substantially the same size.

In embodiment, the method includes providing two Rotating fields, and each Rotating fields is discharged including center Layer, particularly peel ply, enhancement layer, particularly Copper Foil are covered on one interarea；And it is ultra-thin to lead Electric layer, the Copper Foil particularly with the thickness less than 5 μm, more particularly with the thickness less than 3 μm It is covered on its another opposed interarea, and division center and lazy flow is made between two enhancement layers Material connects, and wherein division center, enhancement layer and releasing layer form a part for protection structure, and its Middle very ultra thin conductor layers form a part for two parts carriers.For example, releasing layer can be on an interarea The first Copper Foil (as the example of very ultra thin conductor layers) with thickness between 2 μm and 3 μm and right Put on interarea with the second Copper Foil (example as layout is strengthened) that thickness is 18 μm.It is this very thin Three level stack be difficult to when used alone manipulate, and therefore, be supported on lazy flow semi-solid preparation material Upper (it is highly preferred which is attached to other division centers of protection structure again).By taking the measure, Can effectively prevent thin three level stack from undesirable absciss layer or corrugation occurring.Particularly very ultra thin conductor layers and Enhancement layer is particularly in the edge of the sheet material or layer stacking for forming final products it occur frequently that absciss layer and rising Wrinkle, may so cause integrity problem.When the centre junction that the thin three level stack is attached to protection structure When on structure, can forcefully suppress this absciss layer and corrugation, this is a big advantage.

In embodiment, the method includes discharging two parts carriers from protection structure.This can be by drawing What dynamic corresponding component carrier was realized, therefore corresponding component carrier is departed from from corresponding releasing layer.

In embodiment, the method includes carrying two parts that at least one electronic unit is installed to release On at least one of body.The direct result of the manufacture process is by being provided with least one above manufactured The electronic equipment that the parts carrier of individual electronic unit is constituted is (for example, by welding with parts carrier at least One conductive coating structure connection and electrical contact).

In embodiment, by lamination, parts carrier is formed in protection structure.By applying heat energy While to semi-finished product apply pressure, it is possible to achieve lamination.

In embodiment, the method includes, after lamination is completed, is particularly discharging from protection structure After parts carrier, at least one parts carrier, at least one conductive contact structure is formed, especially It is at least one perpendicular interconnection.Make parts carrier from after protection structure separation, can particularly manufacture logical Road, after release process, the path can pass through the electric insulation layer extensibility of structure of the parts carrier of release. The result of this processing sequence is the warpage for significantly reducing the parts carrier for having manufactured.

In embodiment, the method includes, by performing half addition of half addition process (SAP) or simulation Process (mSAP), forms at least one conductive contact structure.According to mSAP processes, not patterned plate There is a thin layer conductive material (such as copper) above.Then, apply negative mask.With subtract into process Mask is different, and the mask exposes.Additional conduction material is electroplated on the plate Material (such as copper).In unshielded region, conductive material (such as copper) can be electroplated onto any wanting The weight asked.Then, tin-lead plating or other surfaces plating are carried out.Mask is peelled off, and it is etched Journey removes the original naked copper plate for exposing now from plate, isolates each trace.

In another embodiment, the method includes forming at least one conductive contact knot using the process that subtracts into Structure.Subtract into method can from being entirely coated with the plate of conductive material the conductive material that removes such as copper, from And only leave the conductive material (such as conductive trace) for requiring figure.

In embodiment, the method includes, from protection structure release in the parts carrier this at least After one, electric insulation layer structure before release near protection structure arrange at least one described in portion At least one conductive contact structure is formed in the pure electric insulation layer structure of part carrier.When will be close to or most lean on The medium Rotating fields of nearly protection structure arrangement are configured to the homogeneous texture being only formed of an electrically insulating material, and not During including conductive inclusion or structure, lamination process does not cause warpage, because lazy flow material and homogenizing Dielectric layer keeps low mechanical stress and is distributed good.Thus, it is possible to obtain warpage trend is little or does not have The parts carrier of warpage trend.Release after parts carrier from protection structure, near electric insulation layer structure Above-mentioned homogenizing very close to corresponding component carrier surface (particularly only by very ultra thin conductor layers and the table Face separates).After performing corresponding release process, can produce in the prefect dielectric electric insulation layer of the homogenizing Raw conductive structure (such as path).

In one embodiment, the method includes, from before protection structure releasing parts carrier, is formed All electric insulation layer structures of parts carrier.In other variant embodiments, the method includes, from guarantor Before protection structure releasing parts carrier, form first of electric insulation layer structure of parts carrier, and from After protection structure releases parts carrier, second of the electric insulation layer structure of formation parts carrier.Therefore, The fabrication architecture of exemplary embodiment of the invention is very flexible.

According to other schemes of the example of the embodiments described below, solution described above and the present invention It is clear that and these examples of reference implementation example are explained solution described above and the present invention Other schemes.

Description of the drawings

Below with reference to the example more detailed description present invention of embodiment, but the invention is not limited in reality Apply example.

Fig. 1 illustrates the sectional view of the semi-finished product of exemplary embodiment of the invention.

Fig. 2 illustrates the sectional view of the semi-finished product of another exemplary embodiment of the invention.

Fig. 3 illustrates the sectional view of the semi-finished product of still another example embodiment of the invention.

Specific embodiment

Diagram in accompanying drawing is schematic diagram.

Before exemplary embodiment is described in greater detail with reference to the drawings, this is developed based on which by summarizing Some basic considerations of bright exemplary embodiment.

Exemplary embodiment of the invention, there is provided a kind of centreless manufacture process, the centreless were manufactured Journey is embodied as the semi-solid preparation material of lazy flow for producing the such as substrate of printed circuit board (PCB) (PCB) The material of protection structure.More specifically, lazy flow semi-solid preparation material for such as PCB's Carrier or protection knot of the thin core thickness realized on substrate for example in the range of 0.025mm and the 0.050mm In the case of structure, the exemplary embodiment of the present invention is adapted to centreless manufacturing technology.Corresponding fabrication architecture Can be applied to subtract into process (subtractive process) and mSPA (half addition processes of simulation (modified semi-additive process)), for fine rule PCB construction.

The conventional fabrication process of High Density Integration (HDI) parts carrier from sandwich layer laser drill, metallization and Graphically start.If however, core thickness too thin (for example, less than 50 μm), then when processing, wet Method processing equipment is likely difficult to convey or manipulate the thin core.For example, for mSAP process, with thickness Sandwich layer for 2 μm to 3 μm of Copper Foil is too thin, and for by the passage (issue) above the copper of the back side Laser drill there may be risk.

In contrast, realize the centreless technology with the carrier that thickness is 100 μm or more than 100 μm The exemplary embodiment of the present invention can overcome the light sheet mentioned in dry process and wet treatment Transportation problem.Laser drill, metallization and photoetching can after DIP layers (drilling thin layer) are completed, On carrier or protection structure two opposite sides or interarea, start to perform from outer lamination.Can be right Which applies reinforcing material and urges it against EP (outside) layer (that is, outer layer), then, by peeling off, Remove carrier or protection structure.Then, can be continued according to high integration (HDI) equipment and process Pile up outer coversheet.

It is very advantageous that the method for exemplary embodiment of the invention manufacture parts carrier can be The semi-solid preparation material of lazy flow is used between two metal formings (such as Copper Foil) so that need not be in layer Repaired after pressure.So very advantageously prevent after lamination at sheet material or the edge of semi-finished product Place forms bubble, and traditionally, in electroplating process, the bubble can result in chemistry and subside.

Another exemplary embodiment of the invention, there is provided a kind of centreless manufacture process, the centreless Manufacture process realizes center puppet core in protection structure, and the center puppet core has two opposed interareas, On the opposed interarea, the extra play of protection structure is asymmetrically formed in both sides.Preferably, by semi-solid preparation Made by material, two pieces are attached on the interarea of pseudo- core, are followed by enhancement layer, releasing layer (releasing ) and very ultra thin conductor layers layer (the latter has formed a part for parts carrier to be manufactured). Prove, stabilized pseudo core can effectively prevent enhancement layer and/or the undesirable corrugation of very ultra thin conductor layers, absciss layer Or pollution.Therefore, the composition of the described protection structure with pseudo- core placed in the middle improves manufactured portion The reliability of part carrier.

Still another example embodiment of the invention, there is provided a kind of centreless manufacture process, the nothing Core manufacture process, in the semi-finished product with the protection structure being inserted between to be manufactured two parts carrier On both sides, realize the electric insulation layer of untreated or pure (that is, nonpassage etc.), as near The dielectric material of protection structure.When the prefect dielectric layer of protection structure outermost is in combination, system is ensure that Lamination when making does not cause manufactured parts carrier that warpage occurs.Corresponding component carrier is made from protection knot After structure release or absciss layer, can be processed (all to the dielectric layer of the parts carrier near protection structure Such as, path formation, graphical metal material above etc.).By preventing because lamination causes parts carrier Warpage and bending, are obtained in that planar component carrier.Special declaration, when protection structure (each) most Outer dielectric layer with the CTE value of the most inner medium layer of parts carrier (it is in the plane of layer and/or along with Its orthogonal stacking direction) it is substantially the same when (it is particularly, different to be less than 10% or less than 20%), It is obtained in that the advantage.

Particularly, embodiments in accordance with the present invention, can perform following one or more and realize process：

1. the alignment mark of the layer L2 with carrier chamfering designs (referring to Fig. 1)

2. prepared according to the processing of the tectonic sieving of description and produce graphic diagram and laser drill program

3. the stripping process that carrier is removed

4. impedance and dielectric thickness are adjusted

Particularly, exemplary embodiment of the invention has to improve and overcome and processes and metal for virtual Change the conveying of the thin core that the traditional HDI equipment for processing is present and manipulate precipitous problem.Additionally, of the invention Exemplary embodiment advantageously prevent mSAP cores process when by the passage on the thin copper foil at the back side (issue) laser drill breaks down.

The exemplary embodiment of the present invention can be flexibly applied to any HDI plates for requiring the number of plies, lining The manufacture of bottom, printed circuit board (PCB) etc..For included process, the exemplary embodiment of the present invention with subtract It is compatible into process, half addition process of simulation (mSAP) and half addition process (SAP).

The centreless technology of the exemplary embodiment of the present invention can be advantageously applied for thickness and be less than 50 μm Bao Xin and the structurized mSAP technologies of fine rule (particularly, the L/S from 15 μm to 25 μm).

Fig. 1 illustrates the sectional view of the semi-finished product 100 of exemplary embodiment of the invention.

Semi-finished product 100 include：Center protection structure 102, the center protection structure is again with by low flowing Division center 106 made by the semi-solid preparation material of property.For example, the curing materials of lazy flow half have 80 Mobility in the range of mkl, and in 150 DEG C of viscosity with 30000 pools.Lazy flow material bag Include in the glass fibre and the matrix in epoxy resin-base, the matrix to forbid in the case of lamination The high molecular additive that flowing is especially selected.Therefore, by applying pressure and rising high-temperature being laminated During each Rotating fields of the semi-finished product 100 shown in Fig. 1, lazy flow material only has very limited amount of flowing Trend.Correspondingly, yield limit value can be less, and viscosity number can be more than for traditional method The viscosity number of the material of the protection structure of realization.

Except division center 106, protection structure 102 also includes two carriers or enhancement layer 110, should add Strong layer 110 may be implemented as Copper Foil, and can have such as 18 μm of larger thickness.Each adds Strong layer 110 can be attached to corresponding interarea A, B of division center 106.More precisely, each adds Strong layer 110 can be arranged between division center 106 and the corresponding releasing layer in two releasing layers 108. Therefore, two releasing layers 108 apply that two in enhancement layer 110 are opposed to expose on interarea, enhancement layer 1110 interarea A, B for covering division center 106 again.Construct each releasing layer 108, enabling from guarantor Corresponding component carrier in two parts carriers 104 of the release semi-finished product 100 of protection structure 102.Only pass through Corresponding component carrier 104 is peeled off from protection structure 102, it is possible to complete release.Therefore, in protection knot Two parts carriers 104 are formed on the opposed interarea of structure 102 releasedly.For example, protection structure 102 There can be 50 μm of gross thickness.

Semi-finished product 100 also include two parts carriers 104, and the parts carrier 104 can also be and manufacture Parts carrier pre-formed part (i.e., particularly after discharge, if it is desired, can make shown in Parts carrier 104 is further processed).Parts carrier 104 is configured to into centreless parts carrier 104, That is, core is not included on itself, so that manufacture them in a compact manner.From Fig. 1, it can be seen that Relative to symmetrical plane 140, two parts carriers 104 are formed with minute surface symmetrical configurations.Protection structure 102 This symmetric construction reduce manufacture process in the mechanical stress that produces and thermal stress.Advantageously, often Individual parts carrier 104 all with the respective interface of protection structure 102 at include very ultra thin conductor layers 112, should Very ultra thin conductor layers 112 can be realized by Copper Foil, and can have 2 μm with 3 μ ms in thickness. Release after parts carrier 104 from protection structure 102, can the graphical 112 (example of very ultra thin conductor layers Such as, during mSAP), to form conductive trace.Due to its thickness it is very thin, so patterned The q＆r of conductive layer 112 is fabulous.The chance for selecting the very thin conductive layer 112 of thickness is also By the result of the semi-solid preparation material manufacture division center 106 of lazy flow.

Start on two opposed interareas of protection structure 102, construct multiple symmetrical stack layer L1, L2, L3, to form a part for corresponding component carrier 104.Each layer L1, L2, L3 are (in protection structure 102 Each interarea on, 3 layers are shown in Fig. 1, but can also be layer amount more than 3 layers or few) Can sequentially be attached in the exposed surface of parts carrier 104 to be manufactured, and can be connected by lamination To existing stacking.In layer L1, L2, L3 of parts carrier 104 each can be including at least one electric Insulation layer structure 114 and/or at least one conductive coating structure 116.The conductive coating structure 116 can be by Copper into.The electric insulation layer structure 106 can be made up of semi-solid preparation material/FR4.Can be by parts carrier 104 are configured to printed circuit board (PCB) or substrate.

In order to obtain semi-finished product 100 shown in Fig. 1 and therefore manufacture parts carrier 104, formation includes The protection structure 102 of lazy flow semi-solid preparation material.According to the division center of lazy flow semi-solid preparation material 106, enhancement layer 110 is attached to into two opposed interarea A and B, then, by 108 attaching of releasing layer To in the exposed surface of enhancement layer 110.Then or afterwards, by lamination, i.e. apply high pressure and high temperature, Interconnect the configuration mentioned.

Then, using one or more lamination process, formed on the opposed interarea of protection structure 102 Equivalent layer L1, L2, L3 (interconnecting on the whole and releasable) of two parts carriers 104.This can By (semi-solid preparation layer (referring to electric insulation layer structure 114) and layers of copper are referred to such as thickness at 2 μm With the planar structure of the conductive coating structure 116 in 3 μ ms) it is mutually arranged above and by lamination Interconnect them to realize.As electric insulation layer structure 114 is made up of common semi-solid preparation material, rather than by low Mobility semi-solid preparation material is made, so in lamination process, they melt and flowable.Therefore, After hardening, interconnect each Rotating fields 114,116.

It will be seen from figure 1 that copper path can also be formed on the outermost layer L3 of parts carrier 104 (please Referring to the vertical interconnecting structure of conductive coating structure 116).As arrow 130 is schematically pointed out, according to simulation half Addition process (mSAP), can process extra play.

After the semi-finished product 100 that figure 1 illustrates are obtained, but not shown in this Figure, the method Can also include, by peeling off them in releasing layer 108, discharging husband's parts carrier from protection structure 102 104。

Advantageously, the method then includes：After completing to be laminated and discharge, unification or point From parts carrier 104 expose in facial (that is, particularly relevant with layer L1), formation especially includes The additional conductive contact structure of horizontal trace and/or perpendicular interconnection is (with identical shown in Ref. No. 116 Mode) process.Advantageously, after discharge, particularly only by forming path, can be notable The parts carrier 104 for reducing manufacture bends or bears the trend of warpage.

Although not shown in the figure, can be followed by welding, by one or more electronics Part side is attached on two parts carriers 104 of the unification for having manufactured, so as to ensure touching for electronic unit Point is connected with the exposed division of conductive coating structure 116.

From Fig. 1, it can be seen that each parts carrier 104 can include odd number electric insulation layer structure 114.With it is traditional have core pattern parts carrier compared with, which enhance the degree of freedom of design, this is due to nothing Core is designed, and on two opposed interareas of protection structure 102 is arranged symmetrically two parts carriers 104 As a result.

The example process that exemplary embodiment of the invention manufactures parts carrier 104 is presented herein below Workflow：

1. carrier or protection structure 102 are prepared；

The division center 106 of-offer lazy flow semi-solid preparation material

- enhancement layer 110 (for example, thickness is 18 μm of Copper Foil) is attached to into division center 106, and Releasing layer 108 is attached to into enhancement layer 110

- very ultra thin conductor layers 112 (for example, Copper Foil of the thickness between 2 μm and 3 μm) are attached to Protection structure 102

2. protection structure 102 or carrier (adjacent with interarea A, B) are utilized, mSAP processes are performed

- start mSAP structure layers L2 are utilized on carrier

- continue to build one or more DIP layer L3, L3, L5 ... (not shown) on layer L2

- after mSAP DIP constructions are completed, parts carrier 104 (such as PCM) is made with carrier or guarantor Protection structure 102 is separated

3. EP (outside) layer is completed

The mSAP of the EP layers of-laser/path filling/Cu/ graphics process

- carry out conventional process (SM/MF and other process such as to EP layers)

After completing DIP layers, from layer L2, L3 ... from the beginning of, can in the interarea A adjacent with carrier and Drilling, metallization and photoetching are performed on B sides.Reinforcing material can be applied to which and EP layers are urged it against, Then, by peeling off, remove carrier.Then, high integration (HDI) equipment and process can be utilized, EP is built and is processed.

Fig. 2 illustrates the sectional view of the semi-finished product 100 of another exemplary embodiment of the invention.Should Embodiment is related to the centreless technology built to holostrome.

According to the semi-finished product 100 of Fig. 2 with the difference of the semi-finished product 100 according to Fig. 1 in particular, in that protecting The composition of protection structure 102.According to Fig. 2, protection structure 102 includes division center 106, the division center Two of the 106 lazy flow materials covered from outside with the corresponding enhancement layer 110 in enhancement layer 110 The piece 220,222 being spatially separated.It is identical with Fig. 1, also include two according to the semi-finished product 100 of Fig. 2 It is individual to be located on the corresponding enhancement layer 110 of enhancement layer 110 and positioned at the opposed master of division center 106 respectively Releasing layer 108 above corresponding opposed interarea in face (thereon can be from 102 stripping portion of protection structure Part carrier is 104).With Fig. 1 conversely, having the group of division center 106 according to the protection structure 102 of Fig. 2 Include pseudo- core 200 into, the division center 106, two individual sheets 220 of lazy flow semi-solid preparation material, Corresponding individual sheets in 222 are covered on two interareas of the pseudo- core 200.Pseudo- core 200 includes (example again Such as normal flow) central core 202 of semi-solid preparation material and on central core 204 here by Copper Foil reality Existing two conductive layers 204,206.Therefore, pseudo- core 200 can be by copper-clad plate (Copper Clad Laminate) (CCL) realize.

This composition of protection structure 102 has notable technical advantage：First, there is provided lazy flow half is solid The advantage for changing two different pieces 220,222 of material is to occur without bubble at the edge of lamination, is being passed In system technology, as semi-solid preparation resin is being flowed laterally to outside layer stacking and generation bubble.Therefore, when right Piece 220,222 adopt lazy flow semi-solid preparation material when, marginal area is repaired after lamination or Any other further processes just unnecessary.It is secondly, additional that the pseudo- offer of core 200 additional stability is provided, And very advantageously prevent the Copper Foil of two opposed interareas for covering releasing layer 108 from (referring to reference to symbol Numbers 110,112) absciss layer or corrugation.So improve the reliability and matter of manufactured parts carrier 104 Amount.Additionally, by taking the measure, can avoid carrying out decontamination to ultra-thin layer 112.

With it is identical in FIG, near two electric insulation layer structures 114 of 102 opposed arrangement of protection structure It is untreated pure electric insulation layer, here is realized by pure semi-solid preparation material, no conductive material in which. Electric insulation layer structure 114 and lazy flow semi-solid preparation material near the arrangement of protection structure 102 is by having The material of same coefficient of thermal expansion (CTE) is made.The two measures more specifically each exclusive use simultaneously And be more that the two is applied in combination, the remarkable advantage having is, heating during lamination in three level stack or Dramatically different thermal expansion is not caused on two opposed interareas of person's Rotating fields 210.Therefore, the portion of manufacture There is no warpage or bending in part carrier 104.Although not shown in the figure, from protection structure 102 After release is only by the separated parts carrier 104 of very ultra thin conductor layers 112, near protection structure 102 The electric insulation layer structure 114 of arrangement is by the surface very close to corresponding component carrier 104.Therefore, releasing After putting, in the electric insulation layer structure 114 arranged near protection structure 102, can be formed such as The conductive structure of perpendicular interconnection (particularly path).It is then possible to graphical near protection structure 102 The electric insulation layer structure 114 of arrangement, to form conductive trace.

From Fig. 2 it can also be seen that pseudo- core 200 is provided with multiple alignment marks 208, this pair of fiducial mark of here Note 208 so, during fabrication, simplifies the alignment of semi-finished product 100 by aligned through holes realization.Alignment Labelling 208 can be realized by frame drilling, and can be arranged in the corner of rectangle puppet core 200.

When semi-finished product 100 are manufactured, correlation method can be from the beginning of two Rotating fields 210 be provided, each Rotating fields 210 all include center releasing layer 108, and enhancement layer 110 is covered in the center releasing layer 108 On one interarea and very ultra thin conductor layers 112 are covered in another opposed interarea of the center releasing layer 108 On.In order to improve manipulation, then, Rotating fields 210 are connected with the core of protection structure 102.Later, Division center 106, enhancement layer 110 and releasing layer 108 form a part for protection structure 102.With this Conversely, later, very ultra thin conductor layers 112 form a part for two parts carriers 104.

From the beginning of the semi-finished product 100 shown in Fig. 2, the further heap on outer surface 220,222 can be completed Long-pending one or more other layer.Using shown centreless technology, make parts carrier 104 and carrier or Before person's protection structure 102 is separated, being capable of holostrome accumulation.

Fig. 3 illustrates the sectional view of the semi-finished product 100 of still another example embodiment of the invention. The embodiment is related to the centreless technology with regard to 4 layer buildings.In addition, the architecture pair according to Fig. 3 Should be in the architecture of Fig. 2.

From the beginning of the semi-finished product 100 shown in Fig. 3, DIP can be further piled up on the layer of 1B sides.Therefore, Before parts carrier 104 is separated with carrier or protection structure 102, be able to carry out only on core and Centreless technology on 1 layer of DIP.Herein, term " IP " and " DIP " criticize normal highly integrated method Sandwich layer and 1xxx layers.

It is explained hereinafter the process of the wireless technology according to Fig. 2 and Fig. 3.

First, perform carrier to prepare, to prepare protection structure 102.

- preparing pseudo- core 200 or sheet material that thickness is for about 100 μm, wherein board dimension can be with PCB Board dimension is identical.

- and then, frame drilling is performed on pseudo- core 200, to produce alignment mark 208.

- then, pile up more than the semi-solid preparation layer (referring to Ref. No. 114) above pseudo- core 200 Layer 220,222,110,108,112, and by carrier layer or protection structure 102 and a PCB Layer presses together, as shown in the figure.

Secondly, 4 layers (referring to Fig. 3) or holostrome (referring to Fig. 2) are piled up, performs centreless side Method：

- for half addition process of simulation (mSAP), the process continues, with laser drill, electroless deposition, Dry film application, light sensation figure (photo pattern), plating.

- for High Density Integration process, the process continues, to perform black oxide process, laser drilling Hole, electroless deposition, path are formed and photo disposal.

- according to design and disposal ability, 4 layers (referring to Fig. 3) or holostrome (can be referred to Fig. 2) build using centreless method.

3rd, parts carrier 104 (PCB or preferably substrate) can be made with carrier layer or protection knot Structure 102 is separated；

- for example, parts carrier 104 is made manually with carrier or 108 points of the releasing layer of protection structure 102 From.

- carrier or protection structure 102 can be arranged because of other purposes.

- High Density Integration or mSAP processes can be utilized to continue to form 104 execution level of parts carrier.

As in the case of the embodiment according to fig. 2, from before 102 releasing parts carrier 104 of protection structure, institute There is electric insulation layer structure 114 be applied on semi-finished product 100.In the embodiment according to Fig. 3, From before 102 releasing parts carrier 104 of protection structure, only a part electric insulation layer structure 114 can It is applied on semi-finished product 100, and from after 102 releasing parts carrier 104 of protection structure, another portion Divide electric insulation layer structure 114 be applied on semi-finished product 100.

It should be noted that term " including " is not excluded for other elements or step, and " one " or " one " is not excluded for multiple.Furthermore, it is possible to the element for combining different embodiment descriptions is combined.

It should also be noted that, it is impossible to the reference markss in claim are not understood as into the scope to claim Restriction.

The enforcement of the present invention is not limited to some embodiments shown in the drawings and described above.Conversely, Even for substantially different embodiment, using shown solution and principle of the invention, There can be various modifications.

Claims

1. a kind of semi-finished product (100), including：

Protection structure (102), the protection structure (102) is including lazy flow material；

Two parts carriers (104), described two parts carriers (104) are releasedly formed on the opposed interarea of the protection structure (102).

2. semi-finished product (100) according to claim 1, wherein the lazy flow material includes lazy flow semi-solid preparation material or is made up of lazy flow semi-solid preparation material.

3. semi-finished product (100) according to claims 1 or 2, wherein the yield limit that the lazy flow material has is between 30mil and 140mil, particularly between 60mil and 120mil, more particularly between 60mil and 90mil.

4. semi-finished product (100) according to any one in claims 1 to 3, wherein at 150 DEG C, the viscosity that the lazy flow material has particularly between 5000 pools and 50000 pools, is more particularly moored and 35000 pools between 5000 between 5000 pools and 100000 pools.

5. semi-finished product (100) according to any one in Claims 1-4, wherein at a temperature of between 140 DEG C with 160 DEG C, the MV minium viscosity that the lazy flow material has is between 5000 pools and 100000 pools.

6. semi-finished product (100) according to any one in claim 1 to 5, wherein described lazy flow material includes fiber and the additive in the taboo stream matrix in resin matrix, described matrix, particularly high molecular additive, or be made up of the additive in the fiber in resin matrix, described matrix and the suppression matrix, particularly high molecular additive.

7. semi-finished product (100) according to any one in claim 1 to 6, wherein described protection structure (102) include the division center with lazy flow material (106) and including above two opposed interareas of the division center (106) or top releasing layer (108), particularly peel ply, each described releasing layer (108) is constructed wherein, so that peeling off the corresponding component carrier (104) especially by from the protection structure (102), the corresponding component carrier (104) can be discharged from the protection structure (102).

8. semi-finished product (100) according to claim 2, wherein described division center (106) is including pseudo- core (200), the lazy flow material, the corresponding separating sheet in the separating sheet (220,222) that the two spaces of more particularly lazy flow semi-solid preparation material separate is covered in above two interareas of the pseudo- core (200) or top.

9. semi-finished product (100) according to claim 8, wherein the pseudo- core (200) includes on the central core (204)：Central core (202), particularly semi-solid preparation material；With two conductive layers (204,206), particularly copper.

10. semi-finished product (100) according to claim 8 or 9, wherein the pseudo- core (200) is copper-clad plate.

11. semi-finished product (100) according to claim 7, wherein the division center (106) is only made up of lazy flow material, particularly lazy flow semi-solid preparation material.

12. semi-finished product (100) according to any one in claim 7 to 11; wherein described protection structure (102) also includes the enhancement layer (110) being respectively arranged between the division center (106) and the corresponding releasing layer (108) in the releasing layer (108), particularly Copper Foil.

13. semi-finished product (100) according to any one in claim 1 to 12, wherein at least one of described two parts carriers (104) are configured to centreless parts carrier (104).

14. semi-finished product (100) according to any one in claim 1 to 13, wherein the thickness that the lazy flow material has is between 40 μm with 260 μm, particularly between 40 μm with 60 μm.

15. semi-finished product (100) according to any one in claim 1 to 14; wherein described two parts carriers (104); the described two parts carriers (104) for particularly combining with the protection structure (102) are formed with symmetrical, the particularly configuration of specular.

16. semi-finished product (100) according to any one in claim 1 to 15; wherein each described parts carrier (104) with the respective interface of the protection structure (102) at include very ultra thin conductor layers (112); particularly thickness is less than 5 μm, more particularly layers of copper of the thickness less than 3 μm.

17. semi-finished product (100) according to any one in claim 1 to 16, wherein each described parts carrier (104) include at least one electric insulation layer structure (114) and at least one conductive coating structure (116).

18. semi-finished product (100) according to claim 17; it is wherein arranging near the protection structure (102), be each pure or untreated electric insulation layer with the relevant described two electric insulation layer structures (114) of corresponding component carrier (104) in the parts carrier (104), inside does not have conductive material.

19. semi-finished product (100) according to claim 18, wherein the pure electric insulation layer is semi-solid preparation layer.

20. semi-finished product (100) according to any one in claim 16 to 18, wherein arrange near the protection structure (102), each with the parts carrier (104) in the relevant described two electric insulation layer structures (114) of corresponding component carrier (104) and the lazy flow material be made up of the substantially material with the same coefficient of thermal expansion.

21. semi-finished product (100) according to any one in claim 17 to 20, wherein at least one electric insulation layer structure (114) is included by least one of described group for constituting as follows：Resin, particularly bismaleimide-triazine resin；Cyanate；Glass, particularly glass fibre；Semi-solid preparation material；Polyimides；Liquid crystal polymer；Epoxy resin accumulating film；FR4 materials；Ceramics；And metal-oxide.

22. semi-finished product (100) according to any one in claim 17 to 21, wherein at least one conductive coating structure (116) includes at least one of group being made up of copper, al and ni.

23. semi-finished product (100) according to any one in claim 17 to 22, wherein each described parts carrier (104) include odd number electric insulation layer structure (114).

24. semi-finished product (100) according to any one in claim 1 to 23; the a part of protection structure (102) of wherein at least is provided with least one; particularly multiple alignment marks (208), particularly aligned through holes.

25. semi-finished product (100) according to any one in claim 1 to 24, wherein in described group that the parts carrier (104) is configured to be made up of printed circuit board (PCB) and substrate.

A kind of 26. methods of manufacture parts carrier (104), methods described include：

Two parts carriers (104) are formed releasedly on the opposed interarea including the protection structure (102) of lazy flow material.

27. methods according to claim 26, wherein methods described include：

Two Rotating fields (210) are provided, each described Rotating fields (210) includes center releasing layer (108), particularly peel ply；Enhancement layer (110), particularly Copper Foil are covered on an interarea of the center releasing layer (108)；And very ultra thin conductor layers (112), particularly with the thickness less than 5 μm, the layers of copper more particularly with the thickness less than 3 μm is covered on another opposed interarea of the center releasing layer (108)；

Division center (106) of the connection with the lazy flow material between described two enhancement layers (110)；

Wherein described division center (106), the enhancement layer (110) and the releasing layer (108) form a part for the protection structure (102)；And

Wherein described very ultra thin conductor layers (112) form a part for described two parts carriers (104).

28. methods according to claim 26 or 27, wherein methods described include discharging described two parts carriers (104) from the protection structure (102).

29. methods according to claim 28, wherein methods described include at least one electronic unit being arranged at least one of described two releasing parts carriers (104) above and/or at least one electronic unit are embedded at least one of described two releasing parts carriers (104).

30. methods according to any one in claim 26 to 29, wherein at least a portion of the parts carrier (104) is formed in the protection structure (102) by lamination.

31. methods according to claim 30; wherein methods described includes; after the lamination is completed; particularly after the parts carrier (104) is released from the protection structure (102); on parts carrier described at least one (104) and/or in; form at least one conductive contact structure (116), in particular at least one perpendicular interconnection.

32. methods according to claim 30 or 31; wherein methods described includes; from after described at least one that the protection structure (102) releases in the parts carrier (104), electric insulation layer structure (114) before release arrange near the protection structure (102) at least one described in parts carrier (104) pure electric insulation layer structure (114) in form at least one conductive contact structure (116).

33. methods according to any one in claim 26 to 32, wherein methods described include, by performing half addition process of half addition process or simulation, at least one conductive contact structure of formation (116).

34. methods according to any one in claim 26 to 33; wherein methods described includes; before the parts carrier (104) being discharged from the protection structure (102), form all electric insulation layer structures (114) of the parts carrier (104).

35. methods according to any one in claim 26 to 33; wherein methods described includes; before the parts carrier (104) is discharged from the protection structure (102); form first of electric insulation layer structure (114) of the parts carrier (104); and after the parts carrier (104) is released from the protection structure (102), second of the electric insulation layer structure (114) of the formation parts carrier (104).