CN210444568U

CN210444568U - Composite copper thick substrate structure

Info

Publication number: CN210444568U
Application number: CN201920838685.5U
Authority: CN
Inventors: 李成; 王一雄; 廖明; 张仁德
Original assignee: Shenzhen Xunjiexing Technology Corp Ltd
Current assignee: Shenzhen Xunjiexing Technology Corp Ltd
Priority date: 2019-06-04
Filing date: 2019-06-04
Publication date: 2020-05-01
Anticipated expiration: 2029-06-04

Abstract

The utility model provides a thick base plate structure of compound copper, include: the base material layer, the first side of base material layer has set gradually basic copper pattern layer, prepreg layer and first copper foil pattern layer, the non-pattern area on basic copper pattern layer place fills up resin printing ink, first copper foil pattern layer place non-pattern area has set gradually first stagnant prepreg layer, copper clad laminated board layer, second stagnant prepreg and second copper foil pattern layer, wherein, the prepreg layer with first stagnant prepreg layer bonds. The utility model discloses can have the circuit design of two kinds of table copper on same block of boards skin, thick copper supplies the heavy current to pass through, thin copper preparation intensive circuit.

Description

Composite copper thick substrate structure

Technical Field

The utility model relates to a circuit board technical field, in particular to thick base plate structure of compound copper.

Background

The development of science and technology promotes the trend of multi-functionalization of circuit boards, and the circuit boards are used as carriers of electronic components and need to meet multiple functions at the same time. The copper thickness of the dense circuit is about 35 μm generally, and large current cannot pass through the dense circuit, while the copper thickness of 350 μm or more can pass large current, but the dense circuit cannot be manufactured. The copper foil in the industry has uniform thickness and is difficult to meet the functional requirements of the copper foil and the copper foil. The surface copper of the composite copper thick substrate has two types of thicknesses, wherein the large current corresponds to a 350-micron thick copper circuit, and the small current corresponds to a 35-micron thin copper dense circuit.

SUMMERY OF THE UTILITY MODEL

The utility model provides a thick base plate structure of compound copper to solve at least one above-mentioned technical problem.

In order to solve the above problem, as an aspect of the present invention, there is provided a thick base plate structure of composite copper, including: the base material layer, the first side of base material layer has set gradually basic copper pattern layer, prepreg layer and first copper foil pattern layer, the non-pattern area on basic copper pattern layer place fills up resin printing ink, first copper foil pattern layer place non-pattern area has set gradually first stagnant prepreg layer, copper clad laminated board layer, second stagnant prepreg and second copper foil pattern layer, wherein, the prepreg layer with first stagnant prepreg layer bonds.

Preferably, the second side of the substrate layer has the same structure as the first side of the substrate layer.

Since the technical scheme is used, the utility model discloses can have the circuit design of two kinds of table copper on same block of boards skin, thick copper supplies the heavy current to pass through, thin copper preparation intensive circuit.

Drawings

Fig. 1 schematically shows a schematic structural diagram of the present invention.

Detailed Description

The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.

The utility model discloses an aspect provides a thick base plate structure of compound copper, include: the base material layer 1, base copper pattern layer 2, prepreg layer 3 and first copper foil pattern layer 4 have set gradually to the first side of base material layer 1, the non-pattern area on base copper pattern layer 2 place fills up resin printing ink 5, first copper foil pattern layer 4 place non-pattern area has set gradually first stagnant prepreg layer 9, covers copper bare board layer 6, second stagnant prepreg 7 and second copper foil pattern layer 8, wherein, prepreg layer 3 with first stagnant prepreg layer 3 bonds.

Preferably, the second side of the substrate layer 1 has the same structure as the first side of the substrate layer 1.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A composite copper thick substrate structure, comprising: the copper-clad laminate comprises a base material layer (1), a base copper pattern layer (2), a prepreg layer (3) and a first copper foil pattern layer (4) are sequentially arranged on a first side of the base material layer (1), resin ink (5) is filled in a non-pattern area of the base copper pattern layer (2) position layer, a first non-flowing prepreg layer (9), a copper-clad optical plate layer (6), a second non-flowing prepreg (7) and a second copper foil pattern layer (8) are sequentially arranged in a non-pattern area of the first copper foil pattern layer (4), wherein the prepreg layer (3) is bonded with the first non-flowing prepreg layer (9).

2. The composite copper thick substrate structure according to claim 1, characterized in that the second side of the base material layer (1) has the same structure as the first side of the base material layer (1).