CN113597129A

CN113597129A - Circuit board and manufacturing method thereof

Info

Publication number: CN113597129A
Application number: CN202110868749.8A
Authority: CN
Inventors: 吴子明
Original assignee: Shenzhen Guangyunda Laser Application Technology Co ltd
Current assignee: Shenzhen Guangyunda Laser Application Technology Co ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2021-11-02
Also published as: CN114554712A

Abstract

The invention provides a manufacturing method of a circuit board, which comprises the following steps: s1: depositing a metal deposition layer on the surface of the metal substrate; s2: etching the metal deposition layer to form a circuit pattern layer and a plurality of openings arranged in an array; s3: depositing the same metal material as the metal deposition layer on the circuit pattern layer and the opening to form an additional circuit pattern; s4: depositing an insulating layer on the whole surface of the whole circuit pattern layer; s5: etching the metal substrate, removing the metal substrate, and reserving the whole circuit pattern layer and the insulating layer; s5: and etching the metal substrate and removing the metal substrate. The circuit board and the manufacturing method thereof achieve the purpose of increasing the thickness of the circuit pattern layer by depositing the additional circuit pattern, thus realizing that the thickness of the conductor structure of the circuit board is larger than the width of the conductor structure, realizing the circuit board with fine spacing and the integrated circuit carrier plate as well as the circuit board with thick conductors and fine circuits and/or the integrated circuit carrier plate, and increasing the integration performance and the conductor performance of the circuit board.

Description

Circuit board and manufacturing method thereof

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a circuit board and a manufacturing method thereof.

Background

The existing integrated circuit board or circuit board has a bottleneck of etching process, when the thickness of the conductor is larger than the width of the conductor, the traditional circuit board and integrated circuit process is adopted: the procedures of exposure-development-etching and the like cannot be realized, or the angle of the side etching is too large due to the problem of etching factors, so that the requirements of customers cannot be met.

Therefore, a new method for manufacturing a circuit board is needed.

Disclosure of Invention

The invention aims to provide a circuit board with increased integration performance and increased conductor performance and a manufacturing method thereof.

The invention provides a manufacturing method of a circuit board, which comprises the following steps:

s1: depositing a metal deposition layer on the surface of the metal substrate;

s2: etching the metal deposition layer to form a circuit pattern layer and a plurality of openings arranged in an array;

s3: depositing the same metal material as the metal deposition layer on the circuit pattern layer and the openings to form additional circuit patterns, wherein the circuit pattern layer and the additional circuit patterns form an integral circuit pattern layer;

s4: depositing an insulating layer on the whole surface of the whole circuit pattern layer;

s5: etching the metal substrate, removing the metal substrate, and reserving the whole circuit pattern layer and the insulating layer;

s5: and etching the metal substrate and removing the metal substrate, and reserving the whole circuit pattern layer and the insulating layer.

Further, the additional circuit patterns (15) comprise a first additional circuit pattern (151) located on the circuit pattern layer (13) and a second additional circuit pattern (152) located in the opening (14), and the height of the second additional circuit pattern (152) is not larger than the depth of the opening (14).

Further, the first additional line pattern is stepped.

Further, the first additional line pattern comprises a first part pattern positioned below and a second part pattern positioned above the first part pattern, and the width of the first part pattern is larger than that of the second part pattern; the height of the first partial pattern is equal to the height of the second additional line pattern.

Further, the method also comprises the following steps: s6: a single-sided wiring board is formed by forming an ink printed pattern and/or a protective film-applied laminate pattern of the wiring board on the insulating layer.

Further, first, a conductor structure including an integrated circuit pattern layer and an insulating layer is formed as in the above steps S1 to S5; then oppositely arranging the two conductor structures, and bonding the whole circuit pattern layers of the two conductor structures together; and finally, forming ink printing patterns and/or protective film pasting laminating patterns of the circuit board on the insulating layers of the two conductor structures respectively to form the double-sided circuit board.

Further, the bonding layer is a prepreg of the circuit board, a bonding pure glue film of the circuit board, or glue of the circuit board.

Further, with respect to step S2, the bottoms of the plurality of openings have the circuit pattern layers connected together so that the circuit pattern layers are one piece.

Further, with respect to step S3, the height of the additional wiring pattern is not greater than the depth of the opening, and the surface of the entire wiring pattern layer is concave-convex.

Further, in step S1, the metal substrate is a nickel sheet, an aluminum sheet, a stainless steel sheet, a tin foil, a metal sodium sheet, a copper sheet, a titanium foil, a titanium-copper alloy foil, a beryllium bronze foil, or other metal foils and alloy foils.

The invention also provides a circuit board which is manufactured and formed by adopting the manufacturing method.

According to the circuit board and the manufacturing method thereof, the metal deposition layer is deposited on the metal base material, the metal deposition layer is etched to form the circuit pattern layer, and then the purpose of increasing the thickness of the circuit pattern layer is achieved by depositing the additional circuit pattern, so that the thickness of the conductor structure of the circuit board is larger than the width of the conductor structure, the circuit board with fine spacing and the integrated circuit carrier plate as well as the circuit board with thick conductors and fine circuits and/or the integrated circuit carrier plate are realized, and the integration performance and the conductor performance of the circuit board are increased.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a flow chart of a method for manufacturing a wiring board according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of one of the steps of a method for manufacturing a wiring board according to an embodiment of the present invention;

FIG. 3 is a second schematic diagram of the steps of the method for manufacturing a circuit board according to the embodiment of the invention;

FIG. 4 is a third step of the method for manufacturing a circuit board according to the embodiment of the present invention;

FIG. 5 is a diagram illustrating a fourth step of the method for manufacturing a circuit board according to the embodiment of the present invention;

FIG. 6 is a fifth schematic view of the steps of the method for manufacturing a circuit board according to the embodiment of the present invention;

fig. 7 is a diagram illustrating a sixth step of the method for manufacturing a circuit board according to the embodiment of the present invention.

Fig. 8 is a schematic structural diagram of a double-sided circuit board according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

As shown in fig. 1, the present invention discloses a method for manufacturing a circuit board, comprising the following steps:

s1: as shown in fig. 2, a metal deposition layer 12 is deposited on the surface of the metal substrate 11;

wherein the metal base material 11 is intended for the purpose of fixing the integrated wiring pattern layer formed in step S3 as a base material for forming the integrated wiring pattern layer; the metal substrate 11 is a metal substrate, a metal conductor foil or a metal conductor sheet; the method for depositing the metal deposition layer 12 is electroless plating (such as electroplating) or water plating or magnetron sputtering or vacuum coating process such as PVD, CVD, MVCD, PMVD and the like, or printing process or spraying process.

S2: as shown in fig. 3, etching the metal deposition layer 12 to form a circuit pattern layer 13 and a plurality of openings 14 arranged in an array, wherein the bottom of the plurality of openings 14 is provided with the circuit pattern layer 13 connected together, so that the circuit pattern layer 13 is a whole;

in the present embodiment, the line pattern layer 13 is formed by etching using a laser beam, and the line pattern layer 13 may be formed by etching the metal deposition layer 12 using exposure of yellow light.

S3: as shown in fig. 4, an additional wiring pattern 15 is formed by depositing the same metal material as that of the metal deposition layer 12 on the wiring pattern layer 13 and the openings 14, and the wiring pattern layer 13 and the additional wiring pattern 15 constitute an integral wiring pattern layer;

the additional circuit pattern 15 comprises a first additional circuit pattern 151 located on the circuit pattern layer 13 and a second additional circuit pattern 152 located in the opening 14, and the height of the second additional circuit pattern 152 is not larger than the depth of the opening 14, so that the surface of the whole circuit pattern layer is concave-convex, and the contact area of the whole circuit pattern layer is increased. In the present embodiment, for the sake of example, the height of the additional wiring pattern 15 is smaller than the depth of the opening 14.

The first additional circuit pattern 151 is step-shaped, and the step-shaped first additional circuit pattern 151 is beneficial to increasing the height of the whole circuit pattern layer, so that the thickness of the conductor structure of the circuit board is larger than the width of the conductor structure.

The first additional routing pattern 151 includes a first partial pattern 1511 positioned below and a second partial pattern 1512 positioned above the first partial pattern 1511, and the width of the first partial pattern 1511 is greater than that of the second partial pattern 1512, so that the first additional routing pattern 151 is stepped. The height of the first partial pattern 1511 is equal to that of the second additional wiring pattern 152, which is also advantageous for increasing the height of the entire wiring pattern layer while increasing the integration performance and the conductor performance between the additional wiring pattern 15 and the wiring pattern layer 13.

The method of depositing the additional wiring pattern 15 is electroplating or electroless plating.

By depositing the additional wiring pattern 15, this may result in an increase in the height of the overall wiring pattern layer.

S4: as shown in fig. 5, an insulating layer 16 is deposited over the entire wiring pattern layer;

the insulating layer 16 is made of a slit insulating material, and the slit insulating material is filled in the entire circuit pattern layer and the opening 14, so that the metal substance or the conductor substance of the entire circuit pattern layer is protected, the metal substance or the conductor substance of the entire circuit pattern layer is prevented from being etched away by the etching solution in subsequent processing, and the metal substance or the conductor substance of the entire circuit pattern layer is prevented from being oxidized and/or scratched, and the like.

S5: as shown in fig. 6, the metal base material 11 is etched using an acid/alkali etching process and the metal base material 11 is removed, leaving the entire wiring pattern layer and the insulating layer 16, where the etching is located to the bottom of the entire wiring pattern layer (i.e., the bottom of the wiring pattern layer 13), where the entire wiring pattern layer and the insulating layer 16 are referred to as a conductor structure.

When a single-sided circuit board is required to be formed, the method further comprises the following steps: s6: as shown in fig. 7, an ink printed pattern of a wiring board and/or a protective film application laminated pattern 17 is formed on the insulating layer 16 to form a single-sided wiring board.

Wherein the specific position of the ink printed pattern and/or the protective film application laminated pattern 17 is determined according to the design requirements of the circuit board, in the present embodiment, the ink printed pattern and/or the protective film application laminated pattern 17 is located in the position corresponding to the opening 14, and actually, a plurality of ink printed patterns and/or protective film application laminated patterns 17 need to be connected together.

As shown in fig. 8, when it is desired to form a double-sided wiring board, first, a conductor structure including an integrated circuit pattern layer and an insulating layer 16 is formed as in the above-described steps S1 to S5; then oppositely arranging the two conductor structures, bonding the whole circuit pattern layers of the two conductor structures together by using a bonding layer, and performing compression joint by using a press device; finally, ink printing patterns and/or protective film pasting laminated patterns 17 of the circuit board are formed on the insulating layers 16 of the two conductor structures respectively, and a double-sided circuit board is formed.

Wherein the bonding layer is a PP prepreg of the circuit board, or a bonding pure glue film of the circuit board, or glue of the circuit board, and the like.

In step S1, the metal substrate 11 is a nickel sheet, an aluminum sheet, a stainless steel sheet, a tin foil, a metal sodium sheet, a copper sheet, a titanium foil, a titanium copper alloy foil, a beryllium bronze foil, or other metal foils and alloy foils, wherein the thickness of the metal substrate 11 is 3um to 500 mm.

The metal deposition layer 12 is made of conductive metal and alloy such as copper, aluminum, nickel, tin, sodium sheet, constantan, or conductive substance such as conductive graphene, graphite, carbon fiber, etc.; the thickness of the metal deposition layer 12 is 0.2um to 1000 um.

The deposited additional circuit pattern 15 may increase the thickness of the metal deposition layer 12 in step S3, so that the whole circuit pattern layer reaches the requirement that its thickness is larger than its width.

For step S2, the laser beam is a fiber laser, or CO₂Laser, or UV laser, or green laser, or infrared laser, or excimer laser, or deep ultraviolet laser; the wavelength of the laser beam is 199nm to 1064nm, and the etching depth of the laser beam is0.01um to 1000 um.

In step S5, the etching solution for the metal substrate 11 is an acid-base etching solution used for existing circuit boards, metals, alloys, etc., or a tin stripping solution or a nickel stripping solution commonly used in the circuit board industry.

With respect to step S6, the protective film application lamination pattern 17 is a protective film of a combination of PI and glue in the FPC of the related art, or a PI pure glue film, or a TPi film, or a polymer film material such as PET, pen, pps, or LCP; the ink print pattern 17 is a protective layer (containing an epoxy material) such as a photosensitive and thermosetting ink/photoresist for PCB, or ceramic ink/powder, or a vacuum plating process such as magnetron sputtering, PVD, CVD, MVCD, and PMVD, and a layer of an insulating material is added to the insulating layer 16, and the insulating material is a protective insulating material, or alumina, aluminum nitride, a ceramic film, or the like.

The invention also discloses a circuit board which is manufactured by adopting the method and is applied to the field of circuit boards such as wireless charging coils, inductors, capacitors, resistors, strain gauges, VCM motors, driving motor circuits, earphones, hearing aids, mobile phones, automobile sensors and the like.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A method for manufacturing a circuit board, comprising the steps of:

s1: depositing a metal deposition layer (12) on the surface of the metal substrate (11);

s2: etching the metal deposition layer (12) to form a circuit pattern layer (13) and a plurality of openings (14) arranged in an array;

s3: depositing additional circuit patterns (15) on the circuit pattern layer (13) and the openings (14) by using the same metal material as the metal deposition layer (12), wherein the circuit pattern layer (13) and the additional circuit patterns (15) form an integral circuit pattern layer;

s4: depositing an insulating layer (16) over the entire circuit pattern layer;

s5: the metal base material (11) is etched and the metal base material (11) is removed, leaving the entire wiring pattern layer and the insulating layer (16).

2. The method for manufacturing a wiring board according to claim 1, wherein the additional wiring pattern (15) comprises a first additional wiring pattern (151) on the wiring pattern layer (13) and a second additional wiring pattern (152) in the opening (14), and the height of the second additional wiring pattern (152) is not greater than the depth of the opening (14).

3. The method of manufacturing a wiring board according to claim 2, wherein the first additional wiring pattern (151) is stepped.

4. The manufacturing method of the circuit board according to claim 2, wherein the first additional circuit pattern (151) comprises a first part pattern (1511) positioned below and a second part pattern (1512) positioned above the first part pattern (1511), and the width of the first part pattern (1511) is greater than that of the second part pattern (1512); the height of the first partial pattern (1511) is equal to the height of the second additional wiring pattern (152).

5. The method for manufacturing a wiring board according to claim 1, further comprising the steps of:

s6: a laminated pattern (17) is applied to the insulating layer (16) to form an ink printed pattern and/or a protective film of a wiring board, thereby forming a single-sided wiring board.

6. The method of manufacturing a wiring board according to claim 1, wherein a conductor structure comprising an integrated wiring pattern layer and an insulating layer (16) is first formed in accordance with the above-mentioned steps S1 to S5; then oppositely arranging the two conductor structures, and bonding the whole circuit pattern layers of the two conductor structures together; finally, ink printing patterns and/or protective film pasting laminating patterns (17) of the circuit board are formed on the insulating layers (16) of the two conductor structures respectively, and the double-sided circuit board is formed.

7. The manufacturing method of the circuit board according to claim 5, wherein the two integral circuit pattern layers of the conductor structure are bonded together through a bonding layer, and the bonding layer is a prepreg of the circuit board, or a bonding pure glue film of the circuit board, or glue of the circuit board.

8. The method of manufacturing a wiring board according to claim 1, wherein, for step S2, the bottom of the plurality of openings (14) has the wiring pattern layer (13) joined together so that the wiring pattern layer (13) is one piece.

9. The method for manufacturing a wiring board according to claim 1, wherein in step S1, the metal substrate (11) is a nickel sheet, an aluminum sheet, a stainless steel sheet, a tin foil, a sodium metal sheet, a copper sheet, a titanium foil, a titanium copper alloy foil, a beryllium bronze foil, or other metal foils and alloy foils.

10. A wiring board produced by the production method as set forth in any one of claims 1 to 9.