CN109862705A - A kind of PCB circuit board manufacture craft preparing high aspect ratio fine rule road - Google Patents
A kind of PCB circuit board manufacture craft preparing high aspect ratio fine rule road Download PDFInfo
- Publication number
- CN109862705A CN109862705A CN201910246249.3A CN201910246249A CN109862705A CN 109862705 A CN109862705 A CN 109862705A CN 201910246249 A CN201910246249 A CN 201910246249A CN 109862705 A CN109862705 A CN 109862705A
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- Prior art keywords
- circuit board
- laser
- aspect ratio
- high aspect
- line
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Abstract
The present invention provides a kind of PCB circuit board manufacture craft that can prepare high aspect ratio fine rule road, includes the following steps, S1: preparing for carrying out the copper foil of circuit board making；One layer of metal and metal alloy or organic matter and inorganic matter are plated on one side in copper foil；Metal includes copper, nickel, palladium, aluminium, lead, zinc, cadmium, tin, titanium, palladium, chromium or indium, and metal alloy includes copper, nickel, palladium, aluminium, lead, zinc, cadmium, tin, titanium, palladium, chromium, the multiple combinations in indium；S2: laser-induced thermal etching processing；Laser ablation is carried out to copper foil using laser, forms default line pattern；S3: the cleaning of the laser residue between rear route and route in channel cleaning and drying: is etched using plasma gas and ultrasonic liquid；Or cleaned using the potassium permanganate line such as Desmear, PCB factory containing acid/base cleaning line, plasma Plasma cleaning line, in actual application, can preferably realization prepare high aspect ratio fine rule road PCB circuit board effect.
Description
[technical field]
The present invention relates between PCB circuit board technical field of manufacturing process more particularly to a kind of achievable route and line width
High aspect ratio, between superfine line conductor width and conductor and conductor spacing the PCB for preparing high aspect ratio fine rule road
Process for manufacturing circuit board.
[background technique]
Using " yellow light " preparative layer in traditional PCB/FPC production procedure, the preparative layer mode of " exposure " " development " " etching "
Thinner route can not be obtained, and when " line-spacing (the Line Space) " in conductor metal layer is than conductor wire body " line width
(Linewidth) " in the case where also wanting small with the thickness of conductor, traditional etching (Ecthing) occur can not effectively be etched
Completely, or etching is excessive, excessive, leads to the route that cannot obtain customer satisfaction.
Traditional etching method, the molding of route do not accomplish that up and down (route top can be thinner than following route, forms ladder straight
Shape causes signal to interfere up and down) and route it is excessive in corner's circular arc R, can not accomplish that corner is straight, to influence line
The loss of road signal.
How process could be effectively saved, reduce extra process, improve the density and precision of route forming, it is final real
The production of existing ultra fine-line, is that those skilled in the art often considers the problems of, also carried out accordingly a large amount of research and development and
Experiment, and achieve preferable achievement.
[summary of the invention]
To overcome the problems of prior art, the present invention provide between a kind of achievable route and line width it is high in length and breadth
Than, between superfine line conductor width and conductor and conductor spacing the PCB circuit board system for preparing high aspect ratio fine rule road
Make technique.
The scheme that the present invention solves technical problem is to provide a kind of PCB circuit board production that can prepare high aspect ratio fine rule road
Technique includes the following steps,
S1: prepare for carrying out the copper foil of circuit board making；Copper foil plate on one side one layer of metal and metal alloy or
Organic matter and inorganic matter；The metal includes copper, nickel, palladium, aluminium, lead, zinc, cadmium, tin, titanium, palladium, chromium or indium, and metal alloy includes
Copper, nickel, palladium, aluminium, lead, zinc, cadmium, tin, titanium, palladium, chromium, the multiple combinations in indium；
S2: laser-induced thermal etching processing；Laser ablation is carried out to copper foil using laser；
S3: channel between rear route and route cleaning and drying: is etched using plasma gas and ultrasonic liquid
The cleaning of interior laser residue；Or line, plasma are cleaned containing acid/base using the potassium permanganate lines such as Desmear, PCB factory
Plasma cleaning line or sandblasting are cleaned with mechanical polish-brush line；
S4: conductor surface substrate/protective film pressing: on having cleaned the circuit board laser ablation face complete with production line pattern
Using the technique of pressing or printing, increases protection insulating layer and outer layer copper-clad base plate (can be used as the multiple-plate centre of production
Substrate layer, or mono-/bis-panel outer layer)；It is described protection insulating layer material be PI cover film (FPC coverlayer),
PET cover film, polyester cover film, polyimides cover film, acrylic cover film, acrylic acid cover film, epoxy resin cover film,
PVC film substrate, PEN film, polytetrafluoroethylene (PTFE) substrate or LCP polymeric liquid crystal copolymer (Liquid Crystal
Polymer)；
S5: carrier removal；Carrier is removed using acid or alkali etching method；
S6: residue in channel cleaning and drying: is carried out between route and route using plasma gas and ultrasonic liquid
Cleaning；Or using the potassium permanganate lines such as Desmear, PCB factory containing acid/base cleaning line, plasma Plasma cleaning line or spray
Sand is cleaned with mechanical polish-brush line.
Preferably, the inorganic matter is silicon carbide；The organic matter is nickel-fluorographite or graphite.
Preferably, after the step S6, when carrying out mono-/bis-panel outer layer and multilayer circuit makes, by the erosion of laser
Facet is pressed together in multilayer circuit board, the route as internal layer and outer layer.
Preferably, the processing method of coating is splashed including plating, electrophoresis, chemical plating, vacuum sputtering, magnetic control in the step S1
It penetrates, be deposited or water depositing process；And the thickness range of coating is 0.1um-1000um.
Preferably, laser used by progress laser-induced thermal etching is handled in the step S2 includes that wave-length coverage is 480nm-
UV purple light light source laser that the green-light source laser of 580nm, wave-length coverage are 280nm-410nm, wave-length coverage are
The CO2 light source laser and wave-length coverage of 750nm-2500nm is the dark purple radiant laser of UV of 199nm-299nm；And institute
The spot size of laser is stated to handle by optical shaping, the diameter scope control of hot spot between 1um-500um, hot spot
Shape is circle, rectangle, square, rectangle, diamond shape or ellipse；The line width range of laser ablation is 1um-100um,
Etching depth range is 0.2um-500um.
Preferably, the protection insulating layer in the step S5 further include the photosensitive of acid-fast alkali-proof, acrylic acid and epoxy with
The ink material layer or thermoplastic of non-photo-sensing and the glue line of thermosetting.Or outer layer copper-clad base plate.
Preferably, after the step S6, also progress PCB surface processing, wiring board punch, place component technique
Process.
Preferably, it after the step S3, is exposed, develops, etches；It is exposed using PCB circuit board etching with yellow light room
Light processing procedure or LDI Exposure mode carry out other graphic makings.
Compared with prior art, the PCB circuit board manufacture craft that one kind of the present invention can prepare high aspect ratio fine rule road passes through
It is handled using laser-induced thermal etching, working process is etched to the coating substance that copper foil surface is formed using laser, is formed default
Line pattern, in conjunction with the other parts such as control of copper foil material, conductor surface substrate/protective film pressing etc., in actual application,
Can preferably realization prepare high aspect ratio fine rule road PCB circuit board effect.
[Detailed description of the invention]
Fig. 1 and Fig. 2 is the process signal for the PCB circuit board manufacture craft that one kind of the present invention can prepare high aspect ratio fine rule road
Figure.
[specific embodiment]
To make the purpose of the present invention, technical solution and advantage are more clearly understood, with reference to the accompanying drawings and embodiments, to this
Invention is further elaborated.It should be appreciated that specific embodiment described herein is used only for explaining the present invention, not
For limiting the invention.
Fig. 1 and Fig. 2 are please referred to, the PCB circuit board manufacture craft 1 that one kind of the present invention can prepare high aspect ratio fine rule road includes
Following steps,
S1: prepare for carrying out the copper foil of circuit board making；Copper foil plate on one side one layer of metal and metal alloy or
Organic matter and inorganic matter；The metal includes copper, nickel, palladium, aluminium, lead, zinc, cadmium, tin, titanium, palladium, chromium or indium, and metal alloy includes
Copper, nickel, palladium, aluminium, lead, zinc, cadmium, tin, titanium, palladium, chromium, the multiple combinations in indium；
S2: laser-induced thermal etching processing；Laser ablation is carried out to copper foil using laser；
S3: channel between rear route and route cleaning and drying: is etched using plasma gas and ultrasonic liquid
The cleaning of interior laser residue；Or line, plasma are cleaned containing acid/base using the potassium permanganate lines such as Desmear, PCB factory
Plasma cleaning line or sandblasting are cleaned with mechanical polish-brush line；
S4: conductor surface substrate/protective film pressing: on having cleaned the circuit board laser ablation face complete with production line pattern
Using the technique of pressing or printing, increases protection insulating layer and outer layer copper-clad base plate (can be used as the multiple-plate centre of production
Substrate layer, or mono-/bis-panel outer layer)；It is described protection insulating layer material be PI cover film (FPC coverlayer),
PET cover film, polyester cover film, polyimides cover film, acrylic cover film, acrylic acid cover film, epoxy resin cover film,
PVC film substrate, PEN film, polytetrafluoroethylene (PTFE) substrate or LCP polymeric liquid crystal copolymer (Liquid Crystal
Polymer)；
S6: carrier removal；Carrier is removed using acid or alkali etching method；
S6: residue in channel cleaning and drying: is carried out between route and route using plasma gas and ultrasonic liquid
Cleaning；Or using the potassium permanganate lines such as Desmear, PCB factory containing acid/base cleaning line, plasma Plasma cleaning line or spray
Sand is cleaned with mechanical polish-brush line.
The application is handled by using laser-induced thermal etching, is etched working process to copper foil surface formation using laser,
Default line pattern is formed, in conjunction with the other parts such as control of copper foil material, conductor surface substrate/protective film pressing etc., is actually answered
With in the process, can preferably realization prepare high aspect ratio fine rule road PCB circuit board effect.
Preferably, the inorganic matter is silicon carbide；The organic matter is nickel-fluorographite or graphite.
Preferably, after the step S6, when carrying out mono-/bis-panel outer layer and multilayer circuit makes, by the erosion of laser
Facet is pressed together in multilayer circuit board, the route as internal layer and outer layer.
Preferably, the processing method of coating is splashed including plating, electrophoresis, chemical plating, vacuum sputtering, magnetic control in the step S1
It penetrates, be deposited or water depositing process；And the thickness range of coating is 0.1um-1000um.
Preferably, laser used by progress laser-induced thermal etching is handled in the step S2 includes that wave-length coverage is 480nm-
UV purple light light source laser that the green-light source laser of 580nm, wave-length coverage are 280nm-410nm, wave-length coverage are
The CO2 light source laser and wave-length coverage of 750nm-2500nm is the dark purple radiant laser of UV of 199nm-299nm；And institute
The spot size of laser is stated to handle by optical shaping, the diameter scope control of hot spot between 1um-500um, hot spot
Shape is circle, rectangle, square, rectangle, diamond shape or ellipse；The line width range of laser ablation is 1um-100um,
Etching depth range is 0.2um-500um.
Preferably, the protection insulating layer in the step S5 further include the photosensitive of acid-fast alkali-proof, acrylic acid and epoxy with
The ink material layer or thermoplastic of non-photo-sensing and the glue line of thermosetting and outer layer copper-clad base plate.
Preferably, after the step S6, also progress PCB surface processing, wiring board punch, place component technique
Process.
Preferably, it after the step S3, is exposed, develops, etches；It is exposed using PCB circuit board etching with yellow light room
Light processing procedure or LDI Exposure mode carry out other graphic makings.
Compared with prior art, the PCB circuit board manufacture craft 1 that one kind of the present invention can prepare high aspect ratio fine rule road passes through
It is handled using laser-induced thermal etching, working process is etched to the coating substance that copper foil surface is formed using laser, is formed default
Line pattern, in conjunction with the other parts such as control of copper foil material, conductor surface substrate/protective film pressing etc., in actual application,
Can preferably realization prepare high aspect ratio fine rule road PCB circuit board effect.
The embodiments of the present invention described above are not intended to limit the scope of the present invention.It is any in the present invention
Spirit and principle within made modifications, equivalent substitutions and improvements etc., should be included in claim protection model of the invention
Within enclosing.
Claims (8)
1. the PCB circuit board manufacture craft that one kind can prepare high aspect ratio fine rule road, it is characterised in that: include the following steps,
S1: prepare for carrying out the copper foil of circuit board making；One layer of metal and metal alloy or organic are plated on one side in copper foil
Object and inorganic matter；The metal includes copper, nickel, palladium, aluminium, lead, zinc, cadmium, tin, titanium, palladium, chromium or indium, metal alloy include copper,
Nickel, palladium, aluminium, lead, zinc, cadmium, tin, titanium, palladium, chromium, the multiple combinations in indium；
S2: laser-induced thermal etching processing；Laser ablation is carried out to copper foil using laser；
S3: it cleaning and drying: is etched between rear route and route in channel using plasma gas and ultrasonic liquid
The cleaning of laser residue；Or it is clear containing acid/base cleaning line, plasma Plasma using the potassium permanganate lines such as Desmear, PCB factory
Line or sandblasting is washed to be cleaned with mechanical polish-brush line；
S4: it conductor surface substrate/protective film pressing: is used on having cleaned the circuit board laser ablation face complete with production line pattern
The technique of pressing or printing, increases protection insulating layer and outer layer copper-clad base plate (can be used as the multiple-plate intermediate base material of production
Layer, or mono-/bis-panel outer layer)；The material of the protection insulating layer is PI cover film (FPC coverlayer), PET
Cover film, polyester cover film, polyimides cover film, acrylic cover film, acrylic acid cover film, epoxy resin cover film, PVC
Film substrate, PEN film, polytetrafluoroethylene (PTFE) substrate or LCP polymeric liquid crystal copolymer (Liquid Crystal Polymer)；
S5: carrier removal；Carrier is removed using acid or alkali etching method；
S6: the clear of residue in channel cleaning and drying: is carried out between route and route using plasma gas and ultrasonic liquid
It is clean；Or using the potassium permanganate line such as Desmear, PCB factory containing acid/base cleaning line, plasma Plasma cleaning line or sandblasting with
Mechanical polish-brush line is cleaned.
2. one kind as described in claim 1 can prepare the PCB circuit board manufacture craft of high aspect ratio fine rule road, feature exists
In: the inorganic matter is silicon carbide；The organic matter is nickel-fluorographite or graphite.
3. one kind as described in claim 1 can prepare the PCB circuit board manufacture craft of high aspect ratio fine rule road, feature exists
In: after the step S6, when carrying out mono-/bis-panel outer layer and multilayer circuit makes, the etching face of laser is pressed together on more
Route in layer circuit board, as internal layer and outer layer.
4. one kind as described in claim 1 can prepare the PCB circuit board manufacture craft of high aspect ratio fine rule road, feature exists
In: the processing method of coating includes plating, electrophoresis, chemical plating, vacuum sputtering, magnetron sputtering, vapor deposition or water in the step S1
Depositing process；And the thickness range of coating is 0.1um-1000um.
5. one kind as described in claim 1 can prepare the PCB circuit board manufacture craft of high aspect ratio fine rule road, feature exists
In: it includes the green light that wave-length coverage is 480nm-580nm that laser used by laser-induced thermal etching is handled is carried out in the step S2
UV purple light light source laser that light source laser, wave-length coverage are 280nm-410nm, wave-length coverage are 750nm-2500nm's
The dark purple radiant laser of UV that CO2 light source laser and wave-length coverage are 199nm-299nm；And the hot spot of the laser is big
Small to handle by optical shaping, for the diameter scope control of hot spot between 1um-500um, the shape of hot spot is round, long
Rectangular, square, rectangle, diamond shape or ellipse；The line width range of laser ablation is 1um-100um, etching depth range
For 0.2um-500um.
6. one kind as described in claim 1 can prepare the PCB circuit board manufacture craft of high aspect ratio fine rule road, feature exists
In: the protection insulating layer in the step S5 further includes the ink of the photosensitive and non-photo-sensing of acid-fast alkali-proof, acrylic acid and epoxy
The glue line and outer layer copper-clad base plate of material layer or thermoplastic and thermosetting.
7. one kind as described in claim 1 can prepare the PCB circuit board manufacture craft of high aspect ratio fine rule road, feature exists
In: after the step S6, also progress PCB surface processing, wiring board punching, placement component process flow.
8. one kind as described in claim 1 can prepare the PCB circuit board manufacture craft of high aspect ratio fine rule road, feature exists
In: after the step S3, it is exposed, develops, etches；Using PCB circuit board etching and yellow light room exposure manufacture process or LDI
Exposure mode carries out other graphic makings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910246249.3A CN109862705A (en) | 2019-03-29 | 2019-03-29 | A kind of PCB circuit board manufacture craft preparing high aspect ratio fine rule road |
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| CN201910246249.3A CN109862705A (en) | 2019-03-29 | 2019-03-29 | A kind of PCB circuit board manufacture craft preparing high aspect ratio fine rule road |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112123939A (en) * | 2019-06-24 | 2020-12-25 | 东芝泰格有限公司 | Liquid ejection head, method of manufacturing liquid ejection head, and liquid ejection apparatus |
| CN112739035A (en) * | 2020-12-25 | 2021-04-30 | 深圳光韵达激光应用技术有限公司 | Manufacturing process of superfine thick conductor circuit board |
| CN113068307A (en) * | 2021-03-29 | 2021-07-02 | 福建福强精密印制线路板有限公司 | Circuit board anti-seepage plating method |
| CN113926703A (en) * | 2021-11-17 | 2022-01-14 | 陈波 | Method for manufacturing electroformed screen |
| CN114390792A (en) * | 2022-01-06 | 2022-04-22 | 东莞市龙谊电子科技有限公司 | Manufacturing method of flexible circuit board and flexible circuit board |
| CN114554712A (en) * | 2021-07-30 | 2022-05-27 | 深圳光韵达激光应用技术有限公司 | Circuit board and manufacturing method thereof |
| CN114669866A (en) * | 2022-04-08 | 2022-06-28 | 吉林建筑科技学院 | Laser ablation manufacturing method applied to net-shaped product |
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| CN101123849A (en) * | 2006-08-11 | 2008-02-13 | 高陆股份有限公司 | Making method and structure for high power thin line carrier board |
| CN108282964A (en) * | 2018-01-31 | 2018-07-13 | 深圳光韵达激光应用技术有限公司 | A kind of circuit board machining process forming circuit and figure using laser ablation |
| CN108601232A (en) * | 2018-05-02 | 2018-09-28 | 深圳光韵达激光应用技术有限公司 | A kind of laser ablation PCB circuit board line pattern processing technology |
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| US20030180448A1 (en) * | 2002-03-21 | 2003-09-25 | T.L.M. Advanced Laser Technology Ltd. | Method for fabrication of printed circuit boards |
| CN101123849A (en) * | 2006-08-11 | 2008-02-13 | 高陆股份有限公司 | Making method and structure for high power thin line carrier board |
| CN108282964A (en) * | 2018-01-31 | 2018-07-13 | 深圳光韵达激光应用技术有限公司 | A kind of circuit board machining process forming circuit and figure using laser ablation |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112123939A (en) * | 2019-06-24 | 2020-12-25 | 东芝泰格有限公司 | Liquid ejection head, method of manufacturing liquid ejection head, and liquid ejection apparatus |
| CN112123939B (en) * | 2019-06-24 | 2022-05-24 | 东芝泰格有限公司 | Liquid ejection head, method of manufacturing liquid ejection head, and liquid ejection apparatus |
| CN112739035A (en) * | 2020-12-25 | 2021-04-30 | 深圳光韵达激光应用技术有限公司 | Manufacturing process of superfine thick conductor circuit board |
| CN113068307A (en) * | 2021-03-29 | 2021-07-02 | 福建福强精密印制线路板有限公司 | Circuit board anti-seepage plating method |
| CN114554712A (en) * | 2021-07-30 | 2022-05-27 | 深圳光韵达激光应用技术有限公司 | Circuit board and manufacturing method thereof |
| CN113926703A (en) * | 2021-11-17 | 2022-01-14 | 陈波 | Method for manufacturing electroformed screen |
| CN114390792A (en) * | 2022-01-06 | 2022-04-22 | 东莞市龙谊电子科技有限公司 | Manufacturing method of flexible circuit board and flexible circuit board |
| CN114390792B (en) * | 2022-01-06 | 2023-07-04 | 东莞市龙谊电子科技有限公司 | Manufacturing method of flexible circuit board and flexible circuit board thereof |
| CN114669866A (en) * | 2022-04-08 | 2022-06-28 | 吉林建筑科技学院 | Laser ablation manufacturing method applied to net-shaped product |
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Application publication date: 20190607 |