CN112739035A - Manufacturing process of superfine thick conductor circuit board - Google Patents
Manufacturing process of superfine thick conductor circuit board Download PDFInfo
- Publication number
- CN112739035A CN112739035A CN202011564144.1A CN202011564144A CN112739035A CN 112739035 A CN112739035 A CN 112739035A CN 202011564144 A CN202011564144 A CN 202011564144A CN 112739035 A CN112739035 A CN 112739035A
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- China
- Prior art keywords
- laser
- metal
- etching
- layer
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a manufacturing process of a superfine thick conductor circuit board, which comprises the following steps of S1: etching one surface of the metal composite plate to another metal through laser beam etching to form a required circuit pattern and circuit; s2: cleaning the laser beam etching processing surface by adopting a common cleaning method of circuits such as a PCB/FPC (printed Circuit Board/Flexible printed Circuit) and a semiconductor; s3: after cleaning, a covering film is attached to the etching surface of the laser; bonding the covering surface layer on the etching surface of the laser by adopting a high-temperature laminating process; s4: the product with the cover film is etched in acid or alkali state on the other side, and the application range is wide and the good manufacturing effect can be achieved.
Description
[ technical field ]
The invention relates to the technical field of circuit board manufacturing processes, in particular to a manufacturing process of a circuit board with an ultra-thin and thick conductor.
[ background art ]
At present, no good manufacturing method which can be applied to an inductance coil, an NFC wireless coil, a wireless charging coil, an earphone winding coil, a mobile phone camera motor VCM coil and a loudspeaker circuit coil ultra-thin thick conductor circuit board exists, and the requirements of actual production and manufacturing cannot be met.
[ summary of the invention ]
In order to overcome the problems in the prior art, the invention provides a manufacturing process of a superfine thick conductor circuit board.
The technical proposal for solving the technical problem of the invention is to provide a manufacturing process of a superfine thick conductor circuit board, which comprises the following steps,
s1: etching one surface of the metal composite plate to another metal through laser beam etching to form a required circuit pattern and circuit;
s2: cleaning the laser beam etching processing surface by adopting a common cleaning method of circuits such as a PCB/FPC (printed Circuit Board/Flexible printed Circuit) and a semiconductor;
s3: after cleaning, a covering film is attached to the etching surface of the laser; bonding the covering surface layer on the etching surface of the laser by adopting a high-temperature laminating process;
s4: etching the other surface of the product with the cover film by acid or alkali;
s5: and (4) carrying out the subsequent process manufacture on the product with the etched back metal according to the normal circuit board flow.
Preferably, in step S1, the depth of the laser etching is: from the etching surface, the laser beam etches the first layer of metal and etches the first layer of metal to the joint of the first metal and the second metal, and the thickness range of the laser beam which can damage the surface of the second layer of metal is 0.1-2000 um; the thicknesses of each of the two metal layers were: 1um to 2000 um; and the thickness of each layer can be different according to the requirement; the range of the line pattern and the space of the laser etching is 1um-10000 um.
Preferably, in step S1, 2 different metals in the metal composite plate are used up and down: cold rolling, hot rolling, explosion cladding method, explosion rolling method, molecular diffusion welding method, high-temperature pressing method, ultrasonic welding method and intermediate tin melting welding method, wherein 2 metals with different substances are welded together, and the upper layer and the lower layer are bonded by a high-temperature bonding method; or the other layer of metal is attached to one layer of metal foil/alloy foil by adopting the processes of electroplating, tin spraying and the like, chemical plating, water plating 2 and the like.
Preferably, the laser beam is a fiber laser, a CO2 laser, a UV laser, a green laser, an infrared laser, an excimer laser, a deep ultraviolet laser; the wavelength of the laser is as follows: 199nm-1064 nm.
Preferably, the metal composite board is a copper-aluminum composite board, a copper-stainless steel composite board, a copper-tin composite board, a copper-silicon composite board, an aluminum-stainless steel composite board, an aluminum-tin composite board, an aluminum-silicon composite board, a copper-tungsten composite board, a copper-chromium composite board, an aluminum-chromium composite board, and other metal and alloy composite boards.
Preferably, in step S3, the attaching cover film may be of a non-adhesive structure or a adhesive structure, and the type of the glue is: high molecular adhesive glue such as acrylic adhesive, epoxy or modified epoxy adhesive, phenolic aldehyde-butyraldehyde adhesive and the like; the cover film can be selected from: polyimide PI, PEEK, TPI, PTFE, PPS, PET, PP, nylon LCP Liquid Crystal Polymer (Liquid Crystal Polymer), pen, aluminum nitride and alumina ceramic or teflon, wood, epoxy glass fiber of PCB, FR4 fiberboard, wood pulp board, phenolic board or other films with insulation.
Preferably, in step S3, before laminating the cover insulating layer: insulating high-molecular adhesive colloid can be filled in the cleaned line slot body etched by laser through the processes of printing, coating, soaking and the like.
Preferably, in step S4, the chemical solution only reacts and etches the metal layer on the reverse side of the laser beam etched surface, but does not react and etch the metal layer on the etched surface.
Compared with the prior art, the manufacturing process of the superfine thick conductor circuit board has wide application range and can achieve better manufacturing effect.
[ description of the drawings ]
FIG. 1 is a schematic flow chart of a process for manufacturing a circuit board with an ultra-thin and thick conductor according to the present invention.
[ detailed description of the invention ]
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, a manufacturing process 1 of a circuit board with ultra-thin and thick conductors according to the present invention includes the following steps,
s1: etching one surface of the metal composite plate to another metal through laser beam etching to form a required circuit pattern and circuit;
s2: cleaning the laser beam etching processing surface by adopting a common cleaning method of circuits such as a PCB/FPC (printed Circuit Board/Flexible printed Circuit) and a semiconductor;
s3: after cleaning, a covering film is attached to the etching surface of the laser; bonding the covering surface layer on the etching surface of the laser by adopting a high-temperature laminating process;
s4: etching the other surface of the product with the cover film by acid or alkali;
s5: and (4) carrying out the subsequent process manufacture on the product with the etched back metal according to the normal circuit board flow.
Preferably, in step S1, the depth of the laser etching is: from the etching surface, the laser beam etches the first layer of metal and etches the first layer of metal to the joint of the first metal and the second metal, and the thickness range of the laser beam which can damage the surface of the second layer of metal is 0.1-2000 um; the thicknesses of each of the two metal layers were: 1um to 2000 um; and the thickness of each layer can be different according to the requirement; the range of the line pattern and the space of the laser etching is 1um-10000 um.
Preferably, in step S1, 2 different metals in the metal composite plate are used up and down: cold rolling, hot rolling, explosion cladding method, explosion rolling method, molecular diffusion welding method, high-temperature pressing method, ultrasonic welding method and intermediate tin melting welding method, wherein 2 metals with different substances are welded together, and the upper layer and the lower layer are bonded by a high-temperature bonding method; or the other layer of metal is attached to one layer of metal foil/alloy foil by adopting the processes of electroplating, tin spraying and the like, chemical plating, water plating 2 and the like.
Preferably, the laser beam is a fiber laser, a CO2 laser, a UV laser, a green laser, an infrared laser, an excimer laser, a deep ultraviolet laser; the wavelength of the laser is as follows: 199nm-1064 nm.
Preferably, the metal composite board is a copper-aluminum composite board, a copper-stainless steel composite board, a copper-tin composite board, a copper-silicon composite board, an aluminum-stainless steel composite board, an aluminum-tin composite board, an aluminum-silicon composite board, a copper-tungsten composite board, a copper-chromium composite board, an aluminum-chromium composite board, and other metal and alloy composite boards.
Preferably, in step S3, the attaching cover film may be of a non-adhesive structure or a adhesive structure, and the type of the glue is: high molecular adhesive glue such as acrylic adhesive, epoxy or modified epoxy adhesive, phenolic aldehyde-butyraldehyde adhesive and the like; the cover film can be selected from: polyimide PI, PEEK, TPI, PTFE, PPS, PET, PP, nylon LCP Liquid Crystal Polymer (Liquid Crystal Polymer), pen, aluminum nitride and alumina ceramic or teflon, wood, epoxy glass fiber of PCB, FR4 fiberboard, wood pulp board, phenolic board or other films with insulation.
Preferably, in step S3, before laminating the cover insulating layer: insulating high-molecular adhesive colloid can be filled in the cleaned line slot body etched by laser through the processes of printing, coating, soaking and the like.
Preferably, in step S4, the chemical solution only reacts and etches the metal layer on the reverse side of the laser beam etched surface, but does not react and etch the metal layer on the etched surface.
The above-described embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (8)
1. A manufacturing process of a circuit board with an ultra-thin and thick conductor is characterized in that: comprises the following steps of (a) carrying out,
s1: etching one surface of the metal composite plate to another metal through laser beam etching to form a required circuit pattern and circuit;
s2: cleaning the laser beam etching processing surface by adopting a common cleaning method of circuits such as a PCB/FPC (printed Circuit Board/Flexible printed Circuit) and a semiconductor;
s3: after cleaning, a covering film is attached to the etching surface of the laser; bonding the covering surface layer on the etching surface of the laser by adopting a high-temperature laminating process;
s4: etching the other surface of the product with the cover film by acid or alkali;
s5: and (4) carrying out the subsequent process manufacture on the product with the etched back metal according to the normal circuit board flow.
2. The process for manufacturing a circuit board with an ultra-thin and thick conductor according to claim 1, wherein: in step S1, the depth of the laser etching is: from the etching surface, the laser beam etches the first layer of metal and etches the first layer of metal to the joint of the first metal and the second metal, and the thickness range of the laser beam which can damage the surface of the second layer of metal is 0.1-2000 um; the thicknesses of each of the two metal layers were: 1um to 2000 um; and the thickness of each layer can be different according to the requirement; the range of the line pattern and the space of the laser etching is 1um-10000 um.
3. The process for manufacturing a circuit board with an ultra-thin and thick conductor according to claim 1, wherein: in step S1, 2 different metals in the metal composite plate are vertically used: cold rolling, hot rolling, explosion cladding method, explosion rolling method, molecular diffusion welding method, high-temperature pressing method, ultrasonic welding method and intermediate tin melting welding method, wherein 2 metals with different substances are welded together, and the upper layer and the lower layer are bonded by a high-temperature bonding method; or the other layer of metal is attached to one layer of metal foil/alloy foil by adopting the processes of electroplating, tin spraying and the like, chemical plating, water plating 2 and the like.
4. The process for manufacturing a circuit board with an ultra-thin and thick conductor according to claim 1, wherein: the laser beam is fiber laser, CO2 laser, UV laser, green laser, infrared laser, excimer laser, deep ultraviolet laser; the wavelength of the laser is as follows: 199nm-1064 nm.
5. The process for manufacturing a circuit board with an ultra-thin and thick conductor according to claim 1, wherein: the metal composite board is a copper-aluminum composite board, a copper-stainless steel composite board, a copper-tin composite board, a copper-silicon composite board, an aluminum-stainless steel composite board, an aluminum-tin composite board, an aluminum-silicon composite board, a copper-tungsten composite board, a copper-chromium composite board, an aluminum-chromium composite board and other metal and alloy composite boards.
6. The process for manufacturing a circuit board with an ultra-thin and thick conductor according to claim 1, wherein: in step S3, the attaching cover film may be of a non-adhesive structure or a adhesive structure, and the type of the glue is: high molecular adhesive glue such as acrylic adhesive, epoxy or modified epoxy adhesive, phenolic aldehyde-butyraldehyde adhesive and the like; the cover film can be selected from: polyimide PI, PEEK, TPI, PTFE, PPS, PET, PP, nylon LCP Liquid Crystal Polymer (Liquid Crystal Polymer), pen, aluminum nitride and alumina ceramic or teflon, wood, epoxy glass fiber of PCB, FR4 fiberboard, wood pulp board, phenolic board or other films with insulation.
7. The process for manufacturing a circuit board with an ultra-thin and thick conductor according to claim 1, wherein: in step S3, before laminating the cover insulating layer: insulating high-molecular adhesive colloid can be filled in the cleaned line slot body etched by laser through the processes of printing, coating, soaking and the like.
8. The process for manufacturing a circuit board with an ultra-thin and thick conductor according to claim 1, wherein: in step S4, the chemical solution only reacts and etches the metal layer on the reverse side of the laser beam etched surface, but does not react and etch the metal layer on the etched surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011564144.1A CN112739035A (en) | 2020-12-25 | 2020-12-25 | Manufacturing process of superfine thick conductor circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011564144.1A CN112739035A (en) | 2020-12-25 | 2020-12-25 | Manufacturing process of superfine thick conductor circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN112739035A true CN112739035A (en) | 2021-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011564144.1A Pending CN112739035A (en) | 2020-12-25 | 2020-12-25 | Manufacturing process of superfine thick conductor circuit board |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113692133A (en) * | 2021-08-13 | 2021-11-23 | 黄石永兴隆电子有限公司 | Preparation and processing method of circuit board |
| CN114554712A (en) * | 2021-07-30 | 2022-05-27 | 深圳光韵达激光应用技术有限公司 | Circuit board and manufacturing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273497A (en) * | 2002-03-15 | 2003-09-26 | Kyocera Corp | Transfer sheet and method of manufacturing the same, and wiring board and method of manufacturing the same |
| CN101913065A (en) * | 2010-08-26 | 2010-12-15 | 叶淦波 | Etching method of metal micro-holes |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
| CN107995792A (en) * | 2017-11-27 | 2018-05-04 | 深圳光韵达激光应用技术有限公司 | A kind of FPC flexibilities wireless charging transmission coil module manufacture craft |
| CN108601232A (en) * | 2018-05-02 | 2018-09-28 | 深圳光韵达激光应用技术有限公司 | A kind of laser ablation PCB circuit board line pattern processing technology |
| CN109743846A (en) * | 2018-09-27 | 2019-05-10 | 常州市武进三维电子有限公司 | The manufacture craft of the hollow-out flexible wiring board of new-energy automobile |
| CN109862705A (en) * | 2019-03-29 | 2019-06-07 | 深圳光韵达激光应用技术有限公司 | A kind of PCB circuit board manufacture craft preparing high aspect ratio fine rule road |
-
2020
- 2020-12-25 CN CN202011564144.1A patent/CN112739035A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273497A (en) * | 2002-03-15 | 2003-09-26 | Kyocera Corp | Transfer sheet and method of manufacturing the same, and wiring board and method of manufacturing the same |
| CN101913065A (en) * | 2010-08-26 | 2010-12-15 | 叶淦波 | Etching method of metal micro-holes |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
| CN107995792A (en) * | 2017-11-27 | 2018-05-04 | 深圳光韵达激光应用技术有限公司 | A kind of FPC flexibilities wireless charging transmission coil module manufacture craft |
| CN108601232A (en) * | 2018-05-02 | 2018-09-28 | 深圳光韵达激光应用技术有限公司 | A kind of laser ablation PCB circuit board line pattern processing technology |
| CN109743846A (en) * | 2018-09-27 | 2019-05-10 | 常州市武进三维电子有限公司 | The manufacture craft of the hollow-out flexible wiring board of new-energy automobile |
| CN109862705A (en) * | 2019-03-29 | 2019-06-07 | 深圳光韵达激光应用技术有限公司 | A kind of PCB circuit board manufacture craft preparing high aspect ratio fine rule road |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114554712A (en) * | 2021-07-30 | 2022-05-27 | 深圳光韵达激光应用技术有限公司 | Circuit board and manufacturing method thereof |
| CN113692133A (en) * | 2021-08-13 | 2021-11-23 | 黄石永兴隆电子有限公司 | Preparation and processing method of circuit board |
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Effective date of registration: 20211231 Address after: 518000 1st floor, Tsinghua Ziguang science and Technology Park, No.13, Langshan Road, north high tech Zone, Nanshan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN GUANGYUNDA LASER APPLICATION TECHNOLOGY Co.,Ltd. Address before: 518000 1st floor, Tsinghua Ziguang science and Technology Park, No.13, Langshan Road, north high tech Zone, Nanshan District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN GUANGYUNDA LASER APPLICATION TECHNOLOGY Co.,Ltd. Applicant before: Wu Ziming Applicant before: Cao Hanyi |
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