CN210807778U - Composite copper thick substrate - Google Patents

Composite copper thick substrate Download PDF

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Publication number
CN210807778U
CN210807778U CN201921302195.XU CN201921302195U CN210807778U CN 210807778 U CN210807778 U CN 210807778U CN 201921302195 U CN201921302195 U CN 201921302195U CN 210807778 U CN210807778 U CN 210807778U
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China
Prior art keywords
prepreg
hole
conductive pattern
copper
penetrating
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Active
Application number
CN201921302195.XU
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Chinese (zh)
Inventor
李成
王一雄
张仁德
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Shenzhen Xunjiexing Technology Corp ltd
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Shenzhen Xunjiexing Technology Corp ltd
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Priority to CN201921302195.XU priority Critical patent/CN210807778U/en
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Publication of CN210807778U publication Critical patent/CN210807778U/en
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Abstract

A composite copper thick substrate comprises a first copper layer, a first prepreg, a second prepreg, a third prepreg, a base layer, a fourth prepreg, a fifth prepreg, a sixth prepreg and a second copper layer which are sequentially arranged from top to bottom, wherein the composite copper thick substrate comprises a first through hole only penetrating through the first copper layer and the first prepreg, a second through hole only penetrating through the sixth prepreg and the second copper layer, a third through hole only penetrating through the third prepreg and a fourth through hole only penetrating through the fourth prepreg, a first conductive pattern is arranged in the first through hole, a second conductive pattern is arranged in the second through hole, a third conductive pattern is arranged in the third through hole, and a fourth conductive pattern is arranged in the fourth through hole, wherein the thicknesses of the first conductive pattern and the second conductive pattern are respectively greater than those of the third conductive pattern and the fourth conductive pattern. The utility model discloses can have the circuit design of two kinds of table copper on same block of boards skin, thick copper supplies the heavy current to pass through, thin copper preparation intensive circuit.

Description

Composite copper thick substrate
Technical Field
The utility model relates to a circuit board technical field, in particular to thick base plate of compound copper.
Background
The development of science and technology promotes the trend of multi-functionalization of circuit boards, and the circuit boards are used as carriers of electronic components and need to meet multiple functions at the same time. The copper thickness of the dense circuit is about 35 μm generally, and large current cannot pass through the dense circuit, while the copper thickness of 350 μm or more can pass large current, but the dense circuit cannot be manufactured. The copper foil in the industry has uniform thickness and is difficult to meet the functional requirements of the copper foil and the copper foil. The surface copper of the composite copper thick substrate has two types of thicknesses, wherein the large current corresponds to a 350-micron thick copper circuit, and the small current corresponds to a 35-micron thin copper dense circuit.
SUMMERY OF THE UTILITY MODEL
The utility model provides a thick base plate of compound copper to solve above-mentioned technical problem.
In order to solve the above problem, as an aspect of the present invention, there is provided a thick copper clad base plate, including: the composite copper thick substrate comprises a first copper layer, a first prepreg, a second prepreg, a third prepreg, a base layer, a fourth prepreg, a fifth prepreg, a sixth prepreg and a second copper layer which are sequentially arranged from top to bottom and compounded, wherein the composite copper thick substrate comprises a first through hole only penetrating through the first copper layer and the first prepreg, a second through hole only penetrating through the sixth prepreg and the second copper layer, a third through hole only penetrating through the third prepreg and a fourth through hole only penetrating through the fourth prepreg, a first conductive pattern is arranged in the first through hole, a second conductive pattern is arranged in the second through hole, a third conductive pattern is arranged in the third through hole, a fourth conductive pattern is arranged in the fourth through hole, and the thicknesses of the first conductive pattern and the second conductive pattern are respectively larger than the thicknesses of the third conductive pattern, Thickness of the fourth conductive pattern.
Since the technical scheme is used, the utility model discloses can have the circuit design of two kinds of table copper on same block of boards skin, thick copper supplies the heavy current to pass through, thin copper preparation intensive circuit.
Drawings
Fig. 1 schematically shows a schematic structural diagram of the present invention.
Reference numbers in the figures: 1. a first copper layer; 2. a first conductive pattern; 3. a first semi-cured sheet; 4. a second prepreg; 5. a third prepreg; 6. a base layer; 7. a fourth prepreg; 8. a fifth prepreg; 9. a sixth prepreg; 11. a third conductive pattern; 12. a fourth conductive pattern; 13. a second conductive pattern.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
The utility model discloses an aspect provides a compound thick copper base plate, include: the composite copper thick substrate comprises a first copper layer 1, a first prepreg 3, a second prepreg 4, a third prepreg 5, a base layer 6, a fourth prepreg 7, a fifth prepreg 8, a sixth prepreg 9 and a second copper layer 10 which are sequentially arranged from top to bottom and compounded, wherein the composite copper thick substrate only penetrates through a first through hole of the first copper layer 1 and the first prepreg 3, a second through hole only penetrating through the sixth prepreg 9 and the second copper layer 10, a third through hole only penetrating through the third prepreg 5 and a fourth through hole only penetrating through the fourth prepreg 7, a first conductive pattern 2 is arranged in the first through hole, a second conductive pattern 13 is arranged in the second through hole, a third conductive pattern 11 is arranged in the third through hole, a fourth conductive pattern 12 is arranged in the fourth through hole, wherein the first conductive pattern 2, The thickness of the second conductive pattern 13 is greater than the thickness of the third conductive pattern 11 and the thickness of the fourth conductive pattern 12, respectively. Wherein the first to fourth through holes may be formed by means of laser cutting.
The lamination and lamination are performed sequentially from inside to outside during the processing, and may be performed in two stages, for example. In the first stage, the second prepreg 4, the third prepreg 5, the base layer 6, the fourth prepreg 7, and the fifth prepreg 8 are used to obtain an intermediate plate. Then, a first conductive pattern 2 and a fourth conductive pattern 12 are sequentially formed on both sides of the intermediate plate, and the first copper layer 1 and the first prepreg 3, the sixth prepreg 9 and the second copper layer 10 are formed on both sides of the intermediate plate.
Since the technical scheme is used, the utility model discloses can have the circuit design of two kinds of table copper on same block of boards skin, thick copper supplies the heavy current to pass through, thin copper preparation intensive circuit.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (1)

1. A composite copper thick substrate, comprising: the composite copper thick substrate comprises a first through hole, a second through hole, a third through hole and a fourth through hole, wherein the first through hole only penetrates through the first copper layer (1) and the first prepreg (3), the second through hole only penetrates through the sixth prepreg (9) and the second copper layer (10), the third through hole only penetrates through the third prepreg (5) and the fourth through hole only penetrates through the fourth prepreg (7), a first conductive pattern (2) is arranged in the first through hole, a second conductive pattern (13) is arranged in the second through hole, and a third conductive pattern (11) is arranged in the third through hole, and a fourth conductive pattern (12) is arranged in the fourth through hole, wherein the thicknesses of the first conductive pattern (2) and the second conductive pattern (13) are respectively greater than the thicknesses of the third conductive pattern (11) and the fourth conductive pattern (12).
CN201921302195.XU 2019-08-09 2019-08-09 Composite copper thick substrate Active CN210807778U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921302195.XU CN210807778U (en) 2019-08-09 2019-08-09 Composite copper thick substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921302195.XU CN210807778U (en) 2019-08-09 2019-08-09 Composite copper thick substrate

Publications (1)

Publication Number Publication Date
CN210807778U true CN210807778U (en) 2020-06-19

Family

ID=71225394

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921302195.XU Active CN210807778U (en) 2019-08-09 2019-08-09 Composite copper thick substrate

Country Status (1)

Country Link
CN (1) CN210807778U (en)

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