CN219893509U

CN219893509U - Circuit board with blind holes of 0.5mm aperture and thick copper HDI

Info

Publication number: CN219893509U
Application number: CN202321602360.XU
Authority: CN
Inventors: 周飞; 钟岳松; 张恒
Original assignee: Zhuhai Mutailai Circuit Co ltd
Current assignee: Zhuhai Mutailai Circuit Co ltd
Priority date: 2023-06-25
Filing date: 2023-06-25
Publication date: 2023-10-24
Anticipated expiration: 2033-06-25

Abstract

The utility model discloses a circuit board with blind holes of 0.5mm in aperture and thick copper HDI, which comprises a plurality of core boards, prepregs and copper foil layers, wherein the number of the core boards is multiple, adjacent core boards are adhered and fixed through the prepregs, the copper foil layers are adhered and fixed on the outer side surfaces of the core boards of the outer layers through the prepregs, and the circuit board also comprises through holes, in-tray holes, buried holes and laser blind holes, wherein the through holes are arranged through the circuit board, the holes penetrate through the core boards and the prepregs, and the laser blind holes penetrate through the copper foil layers and the prepreg between the core boards, and the holes penetrate through the holes of 0.5mm in aperture. The beneficial effects of the utility model are as follows: through setting the blind hole with the aperture of 0.5mm, the current carrying requirement of the PCB and the requirement on the aperture can be ensured; the laser blind holes are vacuum plugged by adopting low Z-CTE resin, so that the flatness and reliability of blind hole plugging are ensured.

Description

Circuit board with blind holes of 0.5mm aperture and thick copper HDI

Technical Field

The utility model belongs to the technical field of PCBs, and particularly relates to a circuit board with blind holes of 0.5mm in aperture thickness and copper HDI.

Background

The thick copper plate is smaller and smaller in wiring space while improving power, continuous blind hole design is needed, kong Youyan is demanding in current carrying requirement, and a via hole with the aperture of 0.5mm in the traditional processing mode is processed by a numerical control drilling machine, so that cross blind cannot be realized.

Disclosure of Invention

The embodiment of the utility model aims to provide a circuit board with blind holes of 0.5mm in aperture thickness and copper HDI, which can solve at least one technical problem in the background art.

In order to solve the technical problems, the utility model is realized as follows:

the utility model provides a circuit board of blind hole 0.5mm aperture thick copper HDI, includes core, prepreg and copper foil layer, the quantity of core is the multilayer, adjacent pass through between the core the prepreg bonds fixedly, the copper foil layer passes through the prepreg bonds fixedly in the outside surface of outer core, the circuit board still includes run through the through-hole that the circuit board set up, run through core with the dish mesopore of prepreg, run through the buried hole of prepreg between core with the core and run through the copper foil layer with the laser blind hole of 0.5mm aperture of prepreg between the core.

Optionally, the number of layers of the core plate is five.

Optionally, the copper of the core is 4OZ thick.

Optionally, the laser blind holes are vacuum plugged with a low Z-CTE resin.

The beneficial effects of the utility model are as follows: through setting the blind hole with the aperture of 0.5mm, the current carrying requirement of the PCB and the requirement on the aperture can be ensured; the laser blind holes are vacuum plugged by adopting low Z-CTE resin, so that the flatness and reliability of blind hole plugging are ensured.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board with blind holes with 0.5mm aperture thick copper HDI according to an embodiment of the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present utility model may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

The circuit board with the blind hole with the aperture of 0.5mm and the thick copper HDI provided by the embodiment of the utility model is described in detail through a specific embodiment and an application scene thereof by combining the attached drawings.

Referring to fig. 1, an embodiment of the utility model provides a circuit board with blind holes of 0.5mm in aperture thickness and copper HDI, which comprises a core board 1, prepregs 2 and copper foil layers 3, wherein the number of the core boards 1 is multiple, and adjacent core boards 1 are adhered and fixed through the prepregs 2.

The copper foil layer 3 is adhesively fixed to the outer side surface of the core plate 1 of the outer layer through the prepreg 2. Specifically, the copper foil layers 3 are respectively arranged on the upper side and the lower side of the circuit board.

The circuit board further comprises a through hole 4 which penetrates through the circuit board, a disc middle hole 5 which penetrates through the core board 1 and the prepreg 2, a buried hole 6 which penetrates through the prepreg 2 between the core board 1 and the core board 1, and a laser blind hole 7 which penetrates through the 0.5mm aperture of the prepreg 2 between the copper foil layer 3 and the core board 1.

In some embodiments, the number of layers of the core plate 1 is five, and the copper thickness of the core plate 1 is 4OZ.

The laser blind holes 7 are vacuum plugged by adopting low Z-CTE resin, so that the flatness and reliability of the laser blind holes are ensured, and meanwhile, the current carrying requirement of the PCB and the requirement on the aperture can be ensured.

The laser blind holes 7 are processed in the following processing mode, firstly, the copper foil layer 3 at the laser hole position is firstly windowed, the dielectric layer is exposed in an etching mode, after the laser drilling and the photoresist residue removal are completed, the laser blind holes 7 are metallized, and then, the holes are blocked by adopting low Z-CTE resin in a vacuum mode, so that the cross blind buried holes are realized.

The embodiments of the present utility model have been described above with reference to the accompanying drawings, but the present utility model is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present utility model and the scope of the claims, which are to be protected by the present utility model.

Claims

1. The circuit board is characterized by comprising a plurality of core plates, prepregs and copper foil layers, wherein the number of the core plates is multiple, adjacent core plates are fixedly bonded through the prepregs, the copper foil layers are fixedly bonded on the outer side surfaces of the outer core plates through the prepregs, and the circuit board further comprises through holes penetrating through the circuit board, through holes penetrating through the core plates and the prepregs, buried holes penetrating through the prepregs between the core plates and the laser blind holes penetrating through 0.5mm of the holes of the prepregs between the copper foil layers and the core plates.

2. The blind hole 0.5mm aperture thick copper HDI circuit board of claim 1 wherein the number of layers of the core is five.

3. The blind hole 0.5mm aperture thick copper HDI circuit board of claim 2 wherein the copper of the core plate is 4OZ thick.

4. The blind hole 0.5mm bore thick copper HDI circuit board of claim 1 wherein the laser blind holes are vacuum plugged with a low Z-CTE resin.