CN213186673U - Utilize multiply wood to prevent PCB circuit board of wane technical production - Google Patents
Utilize multiply wood to prevent PCB circuit board of wane technical production Download PDFInfo
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- CN213186673U CN213186673U CN202021679510.3U CN202021679510U CN213186673U CN 213186673 U CN213186673 U CN 213186673U CN 202021679510 U CN202021679510 U CN 202021679510U CN 213186673 U CN213186673 U CN 213186673U
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Abstract
The utility model discloses an utilize multiply wood to prevent PCB circuit board of wane technical production, including roof, proof warp mechanism, space, base plate and bottom plate, roof bottom bonding base plate top, base plate bottom bonding bottom plate top, the space has been seted up on base plate left side and right side, and roof, base plate and bottom plate are close to space left side and right side fixed connection proof warp mechanism outer wall. This utilize multiply wood to prevent PCB circuit board of wane technical production, can be with the manufacturing process in addition to keeping the circuit, other copper foil positions all can be etched away, consequently the space that can leave is connected, and first fin and the second of preventing warp piece keep away from the emergence that the circuit copper foil can effectually prevent the wane phenomenon, the normal circular telegram that can also not influence the circuit simultaneously uses, copper plating production connection copper sheathing and first fin and the second of preventing warp piece fixed connection will be prevented to warp downthehole wall through the copper-plated mode, can further effectually prevent the emergence of wane phenomenon between the multiply wood.
Description
Technical Field
The utility model relates to a PCB circuit board technical field specifically is an utilize multiply wood to prevent PCB circuit board of wane technical production.
Background
A PCB, i.e., a printed wiring board, which is called a printed board for short, is one of important parts in the electronic industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate.
In the prior art, in addition to the circuit remaining in the manufacturing process of the multilayer circuit board, other copper foil positions are etched away, so that a gap is left, and the warpage phenomenon of the multilayer circuit board occurs, therefore, the improvement is needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an utilize multiply wood to prevent PCB circuit board of wane technical production to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an utilize multiply wood to prevent PCB circuit board of wane technical production, includes roof, proof warp mechanism, space, base plate and bottom plate, roof bottom bonding base plate top, base plate bottom bonding bottom plate top, the space has been seted up on base plate left side and right side, roof, base plate and bottom plate are close to space left side and right side fixed connection proof warp mechanism outer wall.
The top plate comprises a first copper foil piece, first insulating glue, a first copper foil sleeve, a first pressing plate and second insulating glue, the top of the second insulating glue is bonded with the bottom of the first pressing plate, the top of the first pressing plate is close to the left side of the first insulating glue layer, the top of the first insulating glue layer is bonded with the bottom of the first copper foil piece, a first connecting hole is formed in the middle of the first copper foil piece, and the first copper foil piece is fixedly connected with the outer wall of the top of the first copper foil sleeve through the first connecting hole.
Proof warp mechanism includes that the first fin, the connection copper sheathing, the second of preventing warp, fixed copper foil piece and third insulating cement, it is close to the first fin and the second of preventing of middle part outer wall fixed connection and prevents warp the piece middle part to connect the copper sheathing, it is inboard to connect the fixed copper foil piece of copper sheathing top and bottom fixed connection, the inboard space connection copper sheathing outer lane of fixed copper foil bonds the third insulating cement inboard.
The base plate comprises a second copper foil, a fourth insulating glue, a second pressing plate, a second copper foil sleeve, a fifth insulating glue and a third copper foil, the top of the second pressing plate is bonded with the bottom of the fourth insulating glue, the top of the fourth insulating glue is bonded with the bottom of the second copper foil, the bottom of the second pressing plate is bonded with the top of the fifth insulating glue, the bottom of the fifth insulating glue is bonded with the top of the third copper foil, second connecting holes are formed in the middle of the second copper foil and the third copper foil, and the second copper foil and the third copper foil are fixedly connected with the top and the bottom outer wall of the second copper foil sleeve through the second connecting holes.
Preferably, the first copper foil sleeve penetrates through the first insulating glue, the first pressing plate and the second insulating glue, and the first insulating glue, the first pressing plate and the second insulating glue are provided with first connecting holes corresponding to the first copper foil sleeve.
Preferably, first proof warp piece and the setting of second proof warp piece are in the space, first proof warp piece top bonds the second insulating cement bottom, first proof warp piece bottom bonds the fourth insulating cement top, the second proof warp piece top bonds the fifth insulating cement bottom, the second proof warp piece bottom bonds the bottom plate top.
Preferably, roof, base plate and bottom plate are close to space left side and right side through connection copper sheathing, roof, base plate and bottom plate correspond and connect the copper sheathing and have seted up the hole of upwarping prevention, roof, base plate and bottom plate are through upwarping prevention hole fixed connection copper sheathing outer wall.
Preferably, the top plate and the bottom plate are designed in the same manner, and the bottom plate is provided with a first copper foil sheet, a first insulating adhesive, a first copper foil sleeve, a first connecting hole, a first pressing plate and a second insulating adhesive of the top plate.
Preferably, the second copper foil sleeve penetrates through the second copper foil, the fourth insulating glue, the second pressing plate, the fifth insulating glue and the third copper foil, second connecting holes are formed in the second copper foil, the fourth insulating glue, the second pressing plate, the fifth insulating glue and the third copper foil, and the second copper foil, the fourth insulating glue, the second pressing plate, the fifth insulating glue and the third copper foil are fixedly connected with the outer wall of the second copper foil sleeve through the second connecting holes.
Compared with the prior art, the beneficial effects of the utility model are that:
1. this utilize multiply wood to prevent PCB circuit board of wane technical production, first anti-warp piece and the second anti-warp piece through setting up, can be with in the manufacturing process except that keeping the circuit, other copper foil positions all can be etched away, the space that consequently can leave is connected, and first anti-warp piece and second anti-warp piece keep away from the emergence that the circuit copper foil can effectually prevent the wane phenomenon, can also not influence the normal circular telegram use of circuit simultaneously.
2. This utilize multiply wood to prevent PCB circuit board of wane technical production, through the connection copper sheathing that sets up, can set up in the middle of the first fin of preventing of circuit board and the second fin of preventing warp and prevent warping the hole, will prevent warping the downthehole wall copper plating through copper-plated mode and produce and connect the copper sheathing and prevent warp and second fin fixed connection with first, can further effectually prevent the emergence of wane phenomenon between the multiply wood.
Drawings
FIG. 1 is a schematic view of the layered structure of the present invention;
FIG. 2 is a schematic structural view of a cut-out anti-warping mechanism;
fig. 3 is an enlarged schematic view of a structure in fig. 3.
In the figure: 1. a top plate; 11. a first copper foil; 12. a first insulating glue; 13. a first copper foil sleeve; 14. a first connection hole; 15. a first platen; 16. a second insulating glue; 2. a machine-defense structure; 21. a warping-proof hole; 22. a first anti-warping sheet; 23. connecting the copper sleeve; 24. a second anti-warping sheet; 25. fixing the copper foil; 26. third insulating glue; 3. a void; 4. a substrate; 41. a second copper foil; 42. fourth insulating glue; 43. a second platen; 44. a second copper foil sleeve; 45. a fifth insulating glue; 46. a third copper foil; 47. a second connection hole; 5. a base plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a PCB circuit board produced by utilizing a multilayer board warping prevention technology comprises a top board 1, a warping prevention mechanism 2, a gap 3, a base board 4 and a bottom board 5, wherein the bottom of the top board 1 is adhered to the top of the base board 4, the bottom of the base board 4 is adhered to the top of the bottom board 5, the left side and the right side of the base board 4 are provided with the gap 3, the top board 1, the base board 4 and the bottom board 5 are close to the left side and the right side of the gap 3 and fixedly connected with the outer wall of the warping prevention mechanism 2, the top board 1, the base board 4 and the bottom board 5 are penetrated and connected with copper sleeves 23 close to the left side and the right side of the gap 3, the top board 1, the base board 4 and the bottom board 5 are correspondingly provided with warping prevention holes 21, the top board 1, the base board 4 and the bottom board 5 are fixedly connected with the outer wall of the copper sleeves 23 through the warping prevention holes 21, the top board 1 and the bottom board 5 are, through the connection copper sheathing 23 that sets up, can set up in the middle of the first fin 22 of preventing of circuit board and the second fin 24 and prevent warping hole 21, will prevent warping hole 21 inner wall copper plating through copper-plated mode and produce and connect copper sheathing 23 and prevent fin 22 and second with first and prevent fin 24 fixed connection, can further effectually prevent the emergence of the fin phenomenon between the multiply wood.
The top plate 1 comprises a first copper foil 11, first insulating glue 12, a first copper foil sleeve 13, a first pressing plate 15 and second insulating glue 16, the top of the second insulating glue 16 is bonded with the bottom of the first pressing plate 15, the top of the first pressing plate 15 is close to the bottom of a left bonded first insulating glue layer 12, the top of the first insulating glue layer 12 is bonded with the bottom of the first copper foil 11, a first connecting hole 14 is formed in the middle of the first copper foil 11, the first copper foil 11 is fixedly connected with the outer wall of the top of the first copper foil sleeve 13 through the first connecting hole 14, the first copper foil sleeve 13 penetrates through the first insulating glue 12, the first pressing plate 15 and the second insulating glue 16, and the first insulating glue 12, the first copper foil 15 and the second insulating glue 16 correspond to the first copper foil sleeve 13 and are provided with the first connecting hole 14.
The anti-warping mechanism 2 comprises a first anti-warping sheet 22, a connecting copper sleeve 23, a second anti-warping sheet 24, a fixed copper foil 25 and a third insulating glue 26, the connecting copper sleeve 23 is close to the middle part of the outer wall of the middle part and is fixedly connected with the middle parts of the first anti-warping sheet 22 and the second anti-warping sheet 24, the top part and the bottom part of the connecting copper sleeve 23 are fixedly connected with the inner sides of the fixed copper foil 25, the inner side of the fixed copper foil 25 is spatially connected with the outer ring of the copper sleeve 23 and is bonded with the inner side of the third insulating glue 26, the first anti-warping sheet 22 and the second anti-warping sheet 24 are arranged in a gap 3, the top part of the first anti-warping sheet 22 is bonded with the bottom part of the second insulating glue 16, the bottom part of the first anti-warping sheet 22 is bonded with the top part of the fourth insulating glue 42, the top part of the second anti-warping sheet 24 is bonded with the bottom part of the fifth insulating glue 45, the bottom part of the bottom plate 5 is bonded with the bottom part of the, therefore, the gap 3 left is connected, and the first anti-warping piece 22 and the second anti-warping piece 24 are far away from the circuit copper foil, so that the occurrence of warping phenomenon can be effectively prevented, and meanwhile, the normal power-on use of the circuit can not be influenced.
The substrate 4 comprises a second copper foil 41, a fourth insulating glue 42, a second pressing plate 43, a second copper foil sleeve 44, a fifth insulating glue 45 and a third copper foil 46, the top of the second pressing plate 43 is adhered to the bottom of the fourth insulating glue 42, the top of the fourth insulating glue 42 is adhered to the bottom of the second copper foil 41, the bottom of the second pressing plate 43 is adhered to the top of the fifth insulating glue 45, the bottom of the fifth insulating glue 45 is adhered to the top of the third copper foil 46, a second connecting hole 47 is formed in the middle of the second copper foil 41 and the third copper foil 46, the second copper foil 41 and the third copper foil 46 are fixedly connected with the top and the bottom outer wall of the second copper foil sleeve 44 through the second connecting hole 47, the second copper foil sleeve 44 penetrates through the second copper foil 41, the fourth insulating glue 42, the second pressing plate 43, the fifth insulating glue 45 and the third copper foil 46, the second copper foil 41, the fourth insulating glue 42, the second pressing plate 43, the fifth insulating glue 45 and the third copper foil 46 are all provided with a second connecting hole 47, the second copper foil 41, the fourth insulating glue 42, the second pressing plate 43, the fifth insulating glue 45 and the third copper foil 46 are all fixedly connected with the outer wall of the second copper foil sleeve 44 through a second connecting hole 47.
Wherein: the top plate 1, the substrate 4 and the bottom plate 5 are connected through the first copper foil sleeve 13 and the second copper foil sleeve 44 to achieve the electricity conduction among multiple layers.
When using, leave first anti-warp piece 22 and second anti-warp piece 24 when the etching, then offer in the middle of the first anti-warp piece 22 of circuit board and second anti-warp piece 24 and proof warp hole 21, will prevent warping the copper production of hole 21 inner wall and connecting copper sheathing 23 and first anti-warp piece 22 and second anti-warp piece 24 fixed connection through copper-plated mode, can prevent the emergence of wane phenomenon between the multiply wood.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an utilize multiply wood to prevent PCB circuit board of wane technical production, includes roof (1), proof warp mechanism (2), space (3), base plate (4) and bottom plate (5), its characterized in that: the bottom of the top plate (1) is bonded with the top of a base plate (4), the bottom of the base plate (4) is bonded with the top of a bottom plate (5), gaps (3) are formed in the left side and the right side of the base plate (4), and the top plate (1), the base plate (4) and the bottom plate (5) are close to the left side and the right side of the gaps (3) and are fixedly connected with the outer wall of the anti-warping mechanism (2);
the top plate (1) comprises a first copper foil (11), first insulating glue (12), a first copper foil sleeve (13), a first pressing plate (15) and second insulating glue (16), the top of the second insulating glue (16) is adhered to the bottom of the first pressing plate (15), the top of the first pressing plate (15) is close to the left side and is adhered to the bottom of the first insulating glue (12), the top of the first insulating glue (12) is adhered to the bottom of the first copper foil (11), a first connecting hole (14) is formed in the middle of the first copper foil (11), and the first copper foil (11) is fixedly connected with the outer wall of the top of the first copper foil sleeve (13) through the first connecting hole (14);
the anti-warping mechanism (2) comprises a first anti-warping sheet (22), a connecting copper sleeve (23), a second anti-warping sheet (24), a fixed copper foil sheet (25) and a third insulating glue (26), wherein the connecting copper sleeve (23) is close to the middle part of the outer wall and is fixedly connected with the middle parts of the first anti-warping sheet (22) and the second anti-warping sheet (24), the top and the bottom of the connecting copper sleeve (23) are fixedly connected with the inner sides of the fixed copper foil sheet (25), and the inner side space of the fixed copper foil sheet (25) is connected with the inner side of the third insulating glue (26) which is bonded with the outer ring of the copper sleeve (23);
the base plate (4) comprises a second copper foil (41), a fourth insulating glue (42), a second pressing plate (43), a second copper foil sleeve (44), a fifth insulating glue (45) and a third copper foil (46), wherein the top of the second pressing plate (43) is bonded with the bottom of the fourth insulating glue (42), the top of the fourth insulating glue (42) is bonded with the bottom of the second copper foil (41), the bottom of the second pressing plate (43) is bonded with the top of the fifth insulating glue (45), the bottom of the fifth insulating glue (45) is bonded with the top of the third copper foil (46), a second connecting hole (47) is formed in the middle of the second copper foil (41) and the middle of the third copper foil (46), and the second copper foil (41) and the third copper foil (46) are fixedly connected with the top and the bottom outer wall of the second copper foil sleeve (44) through the second connecting hole (47).
2. A PCB board produced by using multilayer board warpage prevention technology according to claim 1, wherein: the first copper foil sleeve (13) penetrates through the first insulating glue (12), the first pressing plate (15) and the second insulating glue (16), and the first insulating glue (12), the first pressing plate (15) and the second insulating glue (16) correspond to the first copper foil sleeve (13) and are provided with the first connecting hole (14).
3. A PCB board produced by using multilayer board warpage prevention technology according to claim 1, wherein: first fin (22) and second fin (24) are prevented and are set up in space (3), first fin (22) top bonding second insulating cement (16) bottom is prevented, first fin (22) bottom bonding fourth insulating cement (42) top is prevented, fifth insulating cement (45) bottom is prevented bonding at second fin (24) top, bottom plate (5) top is prevented bonding by second fin (24) bottom.
4. A PCB board produced by using multilayer board warpage prevention technology according to claim 1, wherein: roof (1), base plate (4) and bottom plate (5) are close to space (3) left side and right side through connection copper sheathing (23), roof (1), base plate (4) and bottom plate (5) correspond and connect copper sheathing (23) and have seted up and have prevented upwarp hole (21), roof (1), base plate (4) and bottom plate (5) are through preventing upwarp hole (21) fixed connection copper sheathing (23) outer wall.
5. A PCB board produced by using multilayer board warpage prevention technology according to claim 1, wherein: the top plate (1) and the bottom plate (5) are designed in the same mode, and the bottom plate (5) is provided with a first copper foil piece (11), a first insulating glue (12), a first copper foil sleeve (13), a first connecting hole (14), a first pressing plate (15) and a second insulating glue (16) of the top plate (1).
6. A PCB board produced by using multilayer board warpage prevention technology according to claim 1, wherein: the second copper foil sleeve (44) penetrates through a second copper foil (41), a fourth insulating glue (42), a second pressing plate (43), a fifth insulating glue (45) and a third copper foil (46), second connecting holes (47) are formed in the second copper foil (41), the fourth insulating glue (42), the second pressing plate (43), the fifth insulating glue (45) and the third copper foil (46), and the second copper foil (41), the fourth insulating glue (42), the second pressing plate (43), the fifth insulating glue (45) and the third copper foil (46) are fixedly connected with the outer wall of the second copper foil sleeve (44) through the second connecting holes (47).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021679510.3U CN213186673U (en) | 2020-08-12 | 2020-08-12 | Utilize multiply wood to prevent PCB circuit board of wane technical production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021679510.3U CN213186673U (en) | 2020-08-12 | 2020-08-12 | Utilize multiply wood to prevent PCB circuit board of wane technical production |
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| Publication Number | Publication Date |
|---|---|
| CN213186673U true CN213186673U (en) | 2021-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021679510.3U Active CN213186673U (en) | 2020-08-12 | 2020-08-12 | Utilize multiply wood to prevent PCB circuit board of wane technical production |
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| Country | Link |
|---|---|
| CN (1) | CN213186673U (en) |
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- 2020-08-12 CN CN202021679510.3U patent/CN213186673U/en active Active
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