CN221409234U - Via hole structure of printed circuit board - Google Patents
Via hole structure of printed circuit board Download PDFInfo
- Publication number
- CN221409234U CN221409234U CN202323207395.6U CN202323207395U CN221409234U CN 221409234 U CN221409234 U CN 221409234U CN 202323207395 U CN202323207395 U CN 202323207395U CN 221409234 U CN221409234 U CN 221409234U
- Authority
- CN
- China
- Prior art keywords
- top surface
- coil
- bonding pad
- layer
- circuit board
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- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000003466 welding Methods 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000010410 layer Substances 0.000 claims description 74
- 239000011889 copper foil Substances 0.000 claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a via hole structure of a printed circuit board, which comprises a substrate layer, a top surface circuit layer and a bottom surface circuit layer, wherein the top surface circuit layer and the bottom surface circuit layer are covered on the substrate layer; the top surface bonding pad and the bottom surface bonding pad are welded through resistance welding, and welding points of the resistance welding of the top surface bonding pad and the bottom surface bonding pad are located in corresponding through holes. The manufacturing process of the via structure is simple and environment-friendly, and conductive materials such as silver paste or copper paste are not required to be additionally used.
Description
[ Technical field ]
The present utility model relates to printed circuit boards, and more particularly, to a via structure of a printed circuit board.
[ Background Art ]
The main function of the printed circuit board via is to make electrical connection between the circuit layers. Vias are one of the important components of a multi-layer PCB that allow current to flow from one layer of circuitry to another.
The utility model of patent number CN200920007377.4 discloses a blind hole type double-sided printed circuit board, which comprises two circuit layers and an insulating film layer clamped between the two circuit layers, wherein one or more through holes are arranged in the insulating film layer, one of the two circuit layers is penetrated by the through holes, and conductive glue is filled in the through holes, so that the two circuit layers are in conductive communication through the through holes filled with the conductive glue. The via hole of the utility model needs to be filled with conductive adhesive, which not only consumes conductive materials such as silver adhesive, copper adhesive or graphite adhesive, but also needs to be baked and cured by baking equipment; the printed circuit board has complex production process, more material consumption and higher product cost.
[ Summary of the invention ]
The utility model aims to solve the technical problem of providing a via structure of a printed circuit board, which has the advantages of simple production process, less material consumption and lower product cost.
In order to solve the technical problem, the technical scheme adopted by the utility model is that the printed circuit board comprises a substrate layer, a top surface circuit layer and a bottom surface circuit layer which are covered on the substrate layer, wherein the substrate layer comprises at least one through hole used as a through hole, the top surface circuit layer comprises a corresponding top surface bonding pad above the through hole, the bottom surface circuit layer comprises a corresponding bottom surface bonding pad below the through hole, and the diameter of the top surface bonding pad and the diameter of the bottom surface bonding pad are respectively larger than the diameter of the through hole; the top surface bonding pad and the bottom surface bonding pad are welded through resistance welding, and welding points of the resistance welding of the top surface bonding pad and the bottom surface bonding pad are located in corresponding through holes.
In the above-mentioned via structure of the printed circuit board, the bottom surface of the top surface pad is recessed into the corresponding through hole and/or the top surface of the bottom surface pad is recessed into the corresponding through hole.
The substrate layer comprises a substrate, a first adhesive layer covering the top surface of the substrate and a second adhesive layer covering the bottom surface of the substrate; the top surface circuit layer be the top surface copper foil layer, the bottom surface circuit layer be the bottom surface copper foil layer, the top surface copper foil layer is pasted at the top surface of base plate through first bonding glue film, the bottom surface copper foil layer is pasted at the bottom surface of base plate through the second bonding glue film.
In the above-mentioned via structure of the printed circuit board, the substrate is a flexible board or a rigid board.
The via structure of the printed circuit board is characterized in that the flexible board is a paper flexible board.
The printed circuit board is a circuit board of an electronic tag, the substrate layer comprises two through holes used as the through holes, the top surface circuit layer comprises a top surface coil, a chip bonding pad and two top surface bonding pads, the bottom surface circuit layer comprises a bottom surface coil and two bottom surface bonding pads, and the top surface coil and the bottom surface coil are both plane spiral coils; the first top surface bonding pad is connected with the inner end of the top surface coil through the chip bonding pad, and the second top surface bonding pad is connected with the outer end of the top surface coil; the first bottom surface bonding pad is connected with the inner end of the bottom surface coil, and the second bottom surface bonding pad is connected with the outer end of the bottom surface coil; the welding point of the first bottom surface welding plate and the first top surface welding plate in the resistance welding mode is located in the first through hole, and the welding point of the second bottom surface welding plate and the second top surface welding plate in the resistance welding mode is located in the second through hole.
In the via hole structure of the printed circuit board, the diameter of the top coil is larger than that of the bottom coil, and the pitch of the top coil is the same as that of the bottom coil; the spiral line of the top coil has the same rotation direction as the spiral line of the bottom coil.
The manufacturing process of the via structure of the printed circuit board is simple and environment-friendly, and because the upper bonding pad and the lower bonding pad are directly communicated through welding, no additional conductive materials such as silver paste or copper paste are needed, and compared with the prior art, the via structure of the printed circuit board has lower cost and better conductive performance.
[ Description of the drawings ]
The utility model will be described in further detail with reference to the drawings and the detailed description.
Fig. 1 is a schematic structural diagram of an electronic tag printed circuit board according to an embodiment of the present utility model.
Fig. 2 is a front view of an electronic label printed circuit board according to an embodiment of the present utility model.
Fig. 3 is a rear view of an electronic label printed circuit board according to an embodiment of the present utility model.
FIG. 4 is a schematic diagram of a substrate layer opening according to an embodiment of the utility model.
Fig. 5 is a sectional view A-A in fig. 1.
Fig. 6 is a partial enlarged view of the portion i in fig. 5.
Detailed description of the preferred embodiments
The structure of the electronic tag printed circuit board according to the embodiment of the present utility model is shown in fig. 1 to 6, and includes a substrate layer 10, a top circuit layer 20 and a bottom circuit layer 30 that cover the substrate layer 10.
The substrate layer 10 includes a substrate 11, a first adhesive layer 12 covering the top surface of the substrate 11, and a second adhesive layer 13 covering the bottom surface of the substrate 11. The top surface circuit layer 20 is a top surface copper foil layer, the bottom surface circuit layer 30 is a bottom surface copper foil layer, the copper foil of the top surface circuit layer 20 is adhered to the top surface of the substrate 11 through the first adhesive layer 12, and the copper foil of the bottom surface circuit layer 30 is adhered to the bottom surface of the substrate 11 through the second adhesive layer 13. The substrate layer 10 has two through holes 14 serving as vias.
The substrate 11 may be a flexible board or a rigid board. The flexible board may be a paper flexible board.
The top wiring layer 20 includes a top coil 21, a chip pad 22, and two top pads 23, and the bottom wiring layer 30 includes a bottom coil 31 and two bottom pads 33, and both the top coil 21 and the bottom coil 31 are planar spiral coils. The first top surface pad 23A is connected to the inner end of the top surface coil 21 through the chip pad 22, and the second top surface pad 23B is connected to the outer end of the top surface coil 21. The first bottom land 33A is connected to the inner end of the bottom coil 31, and the second bottom land 33B is connected to the outer end of the bottom coil 31.
The diameter of the top surface pad 23 and the diameter of the bottom surface pad 33 are respectively larger than the diameter of the through hole 14. The top surface pad 23 and the bottom surface pad 33 are welded by resistance welding. The bonding pad 24 of the first bottom surface bonding pad 33A and the first top surface bonding pad 23A which are resistance-welded is located in the first through hole 14A, and the bonding pad 24 of the second bottom surface bonding pad 33B and the second top surface bonding pad 23B which are resistance-welded is located in the second through hole 14B.
When the top surface land 23 and the bottom surface land 33 are spot-welded by resistance welding, the bottom surface of the top surface land 23 is recessed into the corresponding through hole 14 due to the pressure of the spot welding and the local thermal deformation of the welding spot 24, and the top surface of the bottom surface land 33 is also recessed into the corresponding through hole 14. However, if the thickness of the top copper foil layer is significantly greater than the thickness of the bottom copper foil layer, the top pads 23 are not significantly deformed during soldering, and only the top surfaces of the bottom pads 33 are recessed into the corresponding through holes 14; if the thickness of the bottom copper foil layer is significantly greater than the thickness of the top copper foil layer, the bottom land 33 is not significantly deformed during soldering, and only the bottom surface of the top land 23 is recessed into the corresponding through hole 14.
As shown in fig. 1, the diameter of the top coil 21 is larger than the diameter of the bottom coil 31, and the pitch of the top coil 21 is the same as the pitch of the bottom coil 31. The spiral direction of the spiral line of the bottom surface coil 31 is the same as the spiral line of the top surface coil 21.
The manufacturing process of the electronic tag printed circuit board provided by the embodiment of the utility model is as follows:
1) Gluing the two sides of the substrate 11, forming a first adhesive layer 12 on the top surface of the substrate 11, and forming a second adhesive layer 13 on the bottom surface of the substrate 11 to obtain a substrate layer 10;
2) According to the design of the circuit board, two through holes 14 are drilled on the substrate layer 10 to form a first through hole 14A and a second through hole 14B, and the method for drilling the through holes can adopt modes of die punching, drilling, laser drilling and the like;
3) Copper foil layers are respectively coated on the top surface and the bottom surface of the substrate layer 10 to form a top copper foil layer and a bottom copper foil layer; in order to ensure reliable bonding and conductive communication, bonding the copper foil layers simultaneously or after bonding the copper foil layers, and bonding the double-sided copper-clad plate bonded with the copper foil layers by adopting vacuum bonding equipment at the temperature of 150-200 ℃;
4) Carrying out graphical treatment on the top copper foil layer and the bottom copper foil layer: including dry film pasting, exposure, development, etching, film stripping, film pasting (or solder mask pasting), film pressing, curing, surface treatment (OSP), forming a top circuit layer 20 and a bottom circuit layer 30 on the substrate layer 10;
5) The pad portion having the through hole 14 is subjected to resistance welding spot by spot, so that a welding point 24 is formed between the top pad and the bottom pad corresponding to the through hole 14, and electrical communication is realized. Resistance welding (spot welding) can be performed using a CCD automatic identification welding device.
The via structure of the printed circuit board provided by the embodiment of the utility model has the advantages of simple manufacturing process and environmental protection, and does not need to use a process affecting the environment; because the upper bonding pad and the lower bonding pad are directly communicated through welding, no additional conductive materials such as silver paste or copper paste are needed, and compared with the prior art, the cost is lower, and the conductivity is better.
Claims (7)
1. The printed circuit board comprises a substrate layer, a top surface circuit layer and a bottom surface circuit layer which are covered on the substrate layer, wherein the substrate layer comprises at least one through hole used as a through hole; the top surface bonding pad and the bottom surface bonding pad are welded through resistance welding, and welding points of the resistance welding of the top surface bonding pad and the bottom surface bonding pad are located in corresponding through holes.
2. The via structure of a printed circuit board of claim 1, wherein a bottom surface of the top surface pad is recessed into a corresponding via and/or a top surface of the bottom surface pad is recessed into a corresponding via.
3. The via structure of claim 1, wherein the substrate layer comprises a substrate, a first adhesive layer covering the top surface of the substrate, and a second adhesive layer covering the bottom surface of the substrate; the top surface circuit layer be the top surface copper foil layer, the bottom surface circuit layer be the bottom surface copper foil layer, the top surface copper foil layer is pasted at the top surface of base plate through first bonding glue film, the bottom surface copper foil layer is pasted at the bottom surface of base plate through the second bonding glue film.
4. A printed circuit board via structure according to claim 3, wherein the substrate is a flexible board or a rigid board.
5. The printed circuit board via structure of claim 4, wherein the flexible board is a paper flexible board.
6. The printed circuit board via structure of claim 3, wherein the printed circuit board is an electronic tag circuit board, the substrate layer comprises two through holes for the via holes, the top circuit layer comprises a top coil, a chip pad and two top pads, the bottom circuit layer comprises a bottom coil and two bottom pads, and the top coil and the bottom coil are planar spiral coils; the first top surface bonding pad is connected with the inner end of the top surface coil through the chip bonding pad, and the second top surface bonding pad is connected with the outer end of the top surface coil; the first bottom surface bonding pad is connected with the inner end of the bottom surface coil, and the second bottom surface bonding pad is connected with the outer end of the bottom surface coil; the welding point of the first bottom surface welding plate and the first top surface welding plate in the resistance welding mode is located in the first through hole, and the welding point of the second bottom surface welding plate and the second top surface welding plate in the resistance welding mode is located in the second through hole.
7. The printed circuit board via structure of claim 6, wherein the top surface coil has a diameter greater than the bottom surface coil, and wherein the top surface coil has a pitch equal to the bottom surface coil; the spiral line of the top coil has the same rotation direction as the spiral line of the bottom coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323207395.6U CN221409234U (en) | 2023-11-27 | 2023-11-27 | Via hole structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323207395.6U CN221409234U (en) | 2023-11-27 | 2023-11-27 | Via hole structure of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221409234U true CN221409234U (en) | 2024-07-23 |
Family
ID=91944011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323207395.6U Active CN221409234U (en) | 2023-11-27 | 2023-11-27 | Via hole structure of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221409234U (en) |
-
2023
- 2023-11-27 CN CN202323207395.6U patent/CN221409234U/en active Active
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| GR01 | Patent grant | ||
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