CN217241074U

CN217241074U - LED circuit board module of copper closes aluminium foil material preparation

Info

Publication number: CN217241074U
Application number: CN202120684963.3U
Authority: CN
Inventors: 王定锋
Original assignee: Zhongshan Guozhan Optoelectronic Technology Co ltd
Current assignee: Zhongshan Guozhan Optoelectronic Technology Co ltd
Priority date: 2021-03-28
Filing date: 2021-03-28
Publication date: 2022-08-19
Anticipated expiration: 2031-03-28

Abstract

The utility model relates to a LED circuit board module of copper closes aluminium foil material preparation particularly, glue behind the aluminium foil rubber coating on PET or PI membrane, then, electroplate the processing with the one side that the aluminium foil exposes, electroplate the back, the metal that outwards exposes is copper, according to circuit design, get rid of unnecessary metal with etching method or cross cutting method, form the circuit, with covering membrane or printing ink preparation solder mask, made the circuit board, weld LED or LED and control element on the circuit board, make the LED circuit board module of a copper closes aluminium foil material preparation.

Description

LED circuit board module of copper closes aluminium foil material preparation

Technical Field

The utility model relates to a LED field, concretely relates to LED circuit board module of copper alloy aluminium foil material preparation.

Background

In the LED circuit board module in the prior art, the circuit board is made of copper foil, and the copper cost is high.

The circuit board is directly made of aluminum, although the cost is low, the poor aluminum soldering property causes the infirm soldering of elements, and the circuit board cannot be used all the time.

How to use low-cost aluminum for manufacturing the circuit of the circuit board and solve the problem of soldering tin?

We use the following utility model method to make a copper closes LED circuit board module of aluminium foil material preparation, have solved above problem, have overcome the not enough of prior art, concrete method:

the method comprises the following steps of gluing an aluminum foil, adhering the aluminum foil on a PET (polyethylene terephthalate) or PI (polyimide) film, then carrying out electroplating processing on the exposed surface of the aluminum foil, wherein the metal exposed outwards after electroplating is copper, removing unnecessary metal by using an etching method or a die cutting method according to circuit design to form a circuit, manufacturing a solder mask layer by using a cover film or printing ink to manufacture a circuit board, and welding an LED (light-emitting diode) or an LED and a control element on the circuit board to manufacture the LED circuit board module made of the copper-aluminum foil material.

The problems that the cost of completely using copper is too high, elements such as LEDs and the like are welded on the copper, and the pure aluminum is used as a circuit element and is welded on the aluminum and is not firmly welded are solved.

SUMMERY OF THE UTILITY MODEL

According to the utility model provides a LED circuit board module of copper alloy aluminium foil material preparation, include: a PI film or PET film substrate layer; an adhesive layer; a circuit layer of a copper-aluminum material; a surface solder mask layer; LED or LED and control element; the PI film is a resin material film taking polyimide as a main component, the PET film is a resin material film taking polyethylene glycol terephthalate as a main component, the aluminum surface of a copper-aluminum material layer is combined with the PET film or the PI film through an adhesive layer, all circuits of a copper-aluminum material circuit layer are circuits formed by combining copper and aluminum, the main components of the circuit layer are copper and aluminum, the upper surface and the lower surface of each circuit are copper layers, the other surface of each circuit is an aluminum layer, the thickness of each copper layer is smaller than that of each aluminum layer, a surface solder resist layer covers the surface of each copper layer, pads on the surface of a circuit board are copper pads, the copper soldering pad part or all the copper soldering pad part is covered by tin, the surface solder resist layer is an ink solder resist layer or a cover film solder resist layer, and the LED or the LED and a control element are welded on the copper pads of the circuit board.

According to the utility model discloses a preferred embodiment, a LED circuit board module of copper alloy aluminium foil material preparation, a characterized in that, a flexible line way board of copper alloy aluminium material preparation, can use after flexible line's pad department punches, in hole department, the front solder joint and the back conductor of module circuit board form the intercommunication.

According to the utility model discloses a preferred embodiment, a LED circuit board module of copper alloy aluminium foil material preparation, a serial communication port, copper thickness be A, 2um is less than or equal to A and is less than or equal to 15 um.

According to the utility model discloses a preferred embodiment, a LED circuit board module of copper alloy aluminium foil material preparation, a serial communication port, aluminium thickness be B, 10um is less than or equal to B and is less than or equal to 400 um.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.

Drawings

The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.

FIG. 1 is a partial schematic view of a whole roll of single-sided aluminum substrate.

FIG. 2 is a partial view of a whole roll of single-sided copper-aluminum-based substrate with copper exposed on one side.

Fig. 3 is a schematic plan view of a circuit board semi-finished product with a circuit pattern.

Fig. 4 is a schematic plan view of a semi-finished circuit board with exposed copper on the front insulating layer.

Fig. 5 is a schematic plan view of a connected circuit board with a pre-breaking connection point.

FIG. 6 is a partial schematic cross-sectional view of a one-piece circuit board with pre-break connection points.

Fig. 7 is a schematic plan view of a connected LED circuit board module having a pre-cut connection point.

Fig. 8 is a schematic plan view of an LED board module made of a copper-clad aluminum foil material divided into individual pieces along pre-cut connection points.

Detailed Description

The present invention will be described in detail below by taking preferred embodiments as examples.

It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.

Examples

1, preparation of aluminum substrate

One side of the aluminum foil 1.1 is coated with glue 1.2 by a coating machine, then the solvent is dried, and then the aluminum foil is bonded with a PET film 1.3 to form a whole roll of single-sided aluminum substrate (shown in figure 1).

Description of the invention: (PI film is also possible, but this example is described as PET film).

2, electroplating

A coil plating line is used for carrying out a plurality of pretreatments on the aluminum surface of the single-sided aluminum substrate, and then the whole surface of the aluminum is plated with copper 2.1 with the thickness of 3-15 um, the thickness of the copper is A, the thickness of the aluminum is B, and the whole coil single-sided copper-aluminum-based substrate with copper exposed on one surface is manufactured (shown in figure 2).

3, circuit fabrication

The whole roll of single-sided copper-aluminum base material with copper exposed on one side is cut into single pieces, and then the copper-aluminum unnecessary for the circuit is completely removed by an etching process or a die cutting process to manufacture a circuit board semi-finished product with a circuit pattern (shown in figure 3).

4, solder mask layer fabrication

Applying an insulating layer 3.1 on the circuit board semi-finished product with the circuit pattern, manufacturing a screen printing screen, printing solder resist ink on the semi-finished product of the circuit board, or punching a PET film with glue and then attaching the PET film on the semi-finished product of the circuit board to manufacture the circuit board semi-finished product with the insulating layer exposed with copper on the front surface (shown in figure 4).

5, OSP preparation

The semi-finished circuit board with exposed copper on the front insulating layer is coated with an oxidation-preventing film 4.1 (shown in fig. 5) at the exposed copper position by OSP.

6, forming

And cutting the circuit board with the anti-oxidation film into a connected circuit board with pre-cut connection points by using a cutting die (shown in figures 5 and 6).

7, pasting sheet

The tin cream is printed on the conjoined circuit board containing the pre-breaking connection point through the customized steel mesh, then the LED5.1 is pasted on the tin cream of the circuit board, the LED5.1 is welded on the circuit board after the tin cream is melted through reflow soldering equipment, and after the test is lightened, the LED circuit board module made of the copper-aluminum foil material is divided into single strips along the pre-breaking connection point (shown in figures 7 and 8).

The present invention has been described in detail with reference to the accompanying drawings, in which the present invention is illustrated in detail. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.

Claims

1. The utility model provides a LED circuit board module of copper closes aluminium foil material preparation, includes:

a PI film or PET film substrate layer;

an adhesive layer;

a circuit layer of a copper-aluminum material;

a surface solder mask layer;

an LED or an LED and a control element;

the PI film is a resin material film with polyimide as a main component, the PET film is a resin material film with polyethylene glycol terephthalate as a main component, the aluminum surface of a copper-aluminum alloy material layer is combined with the PET film or the PI film through an adhesive layer, all circuits of the copper-aluminum alloy material layer are circuits formed by combining copper and aluminum, the main components of the circuit layer are copper and aluminum, the upper surface and the lower surface of each circuit are copper layers, the other surface of each circuit is an aluminum layer, the thickness of the copper layers is smaller than that of the aluminum layers, a surface solder resist layer covers the surface of the copper layers, pads on the surface of the circuit board are copper pads, the part of a brazing solder pad or the whole part of the brazing solder pad is covered by tin, the surface solder resist is an ink solder resist layer or a cover film solder resist layer, and the LED circuit board or the LED and a control element are welded on the copper pads.

2. The LED circuit board module made of copper-aluminum foil material according to claim 1, wherein the copper-aluminum foil layer is used after holes are drilled in the pads of the LED circuit board module, and the front solder pads and the back conductors of the module circuit board are communicated at the holes.

3. The LED circuit board module made of the copper-clad aluminum foil material as claimed in claim 1, wherein the thickness of the copper is A, and A is larger than or equal to 2um and smaller than or equal to 15 um.

4. The LED circuit board module made of the copper-clad aluminum foil material as recited in claim 1, wherein the thickness of the aluminum is B, and B is greater than or equal to 10um and less than or equal to 400 um.