CN215222594U

CN215222594U - Circuit board made of copper-aluminum material

Info

Publication number: CN215222594U
Application number: CN202120684082.1U
Authority: CN
Inventors: 张�林
Original assignee: Tongling Guozhan Electronic Co ltd
Current assignee: Tongling Guozhan Electronic Co ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2021-12-17
Anticipated expiration: 2031-03-29

Abstract

The utility model relates to a circuit board of copper closes aluminium material preparation particularly, glues on PET or PI membrane after with the aluminium foil rubber coating, then, the one side that exposes the aluminium foil carries out electroplating process, electroplates the back, and the metal that outwards exposes is copper, according to circuit design, gets rid of the metal that does not need with etching method or cross cutting method, forms the circuit, makes the solder mask with covering membrane or printing ink, has made the circuit board of copper closes aluminium material preparation.

Description

Circuit board made of copper-aluminum material

Technical Field

The utility model relates to a circuit board field, concretely relates to circuit board of copper alloy material preparation.

Background

In the prior art, the circuit board is made of copper foil, and the cost of copper is high.

The circuit board is directly made of aluminum, although the cost is low, the poor soldering property of the aluminum causes the elements to be not firmly soldered, and the aluminum cannot be used all the time.

How to use low-cost aluminum for making circuits of circuit boards and solve the problem of solderability?

The circuit board made of the copper-aluminum material is manufactured by the following method of the utility model, the problems are solved, the defects of the prior art are overcome, and the method comprises the following steps:

the aluminum foil is glued and then adhered on a PET or PI film, then the non-glued surface of the aluminum foil is electroplated, the metal exposed outwards is copper, according to the circuit design, the unnecessary metal is removed by an etching method or a die cutting method to form a circuit, and a covering film or ink is used for manufacturing a solder mask layer, thus the circuit board made of the copper-aluminum material is manufactured.

And the thickness of copper is less than the thickness of aluminium, has both solved and has used copper cost too high completely, and the component welds on the copper when this kind of circuit board uses, has avoided making circuit component with pure aluminium and has welded on aluminium not firm problem again.

SUMMERY OF THE UTILITY MODEL

According to the utility model provides a circuit board of copper alloy aluminium material preparation, include: a PI film or PET film substrate layer; an adhesive layer; a copper-aluminum material circuit layer; a surface solder mask layer; the polyimide/polyimide composite printed circuit board is characterized in that the PI film is a resin material film taking polyimide as a main component, the PET film is a resin material film taking polyethylene terephthalate as a main component, the aluminum surface of a copper-aluminum material layer is combined with the PET film or the PI film through an adhesive layer, all circuits of the copper-aluminum material circuit layer are circuits formed by combining copper and aluminum, the main components of the circuit layer are copper and aluminum, the upper surface and the lower surface of each circuit are copper layers, the other surface of each circuit is an aluminum layer, the thickness of each copper layer is smaller than that of each aluminum layer, a surface solder resist layer covers the surface of each copper layer, a pad exposed on the surface of each circuit board is a copper pad, and the surface solder resist layer is an ink solder resist layer or a cover film solder resist layer.

According to the utility model discloses a preferred embodiment, a circuit board of copper alloy aluminium material preparation, its characterized in that, a flexible circuit board of copper alloy aluminium material preparation, can use after flexible circuit's pad department punches, hole department after punching is used for welding the direct component of cutting straightly or the via hole welding switches on the back.

According to the utility model discloses a preferred embodiment, a circuit board of copper alloy aluminium material preparation, its characterized in that, the thickness of copper be A, 2um is less than or equal to A and is less than or equal to 15 um.

According to the utility model discloses a preferred embodiment, a circuit board of copper alloy aluminium material preparation, its characterized in that, aluminium thickness be B, 10um is less than or equal to B and is less than or equal to 400 um.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.

Drawings

The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.

FIG. 1 is a partial schematic view of a whole roll of single-sided aluminum substrate.

FIG. 2 is a partial view of a whole roll of single-sided copper-aluminum-based substrate with copper exposed on one side.

Fig. 3 is a schematic plan view of a circuit board blank with a circuit pattern.

Fig. 4 is a schematic plan view of a circuit board semi-finished product with exposed copper on the front insulating layer.

FIG. 5 is a schematic plan view of a circuit board made of a Cu-Al material with pre-broken connection points.

Fig. 6 is a cross-sectional partial schematic view of a circuit board fabricated from a copper-aluminum material.

Detailed Description

The present invention will be described in detail below by taking preferred embodiments as examples.

It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.

Examples

1, preparation of aluminum substrate

One side of the aluminum foil 1.1 is coated with glue 1.2 by a coating machine, then the solvent is dried, and then the aluminum foil is bonded with a PET film 1.3 to form a whole roll of single-sided aluminum substrate (shown in figure 1).

Description of the drawings: (PI film is also possible, but this example is described as PET film).

2, electroplating

A coil plating line is used for carrying out a plurality of pretreatments on the aluminum surface of the single-sided aluminum substrate, and then the whole surface of the aluminum is plated with copper 2.1 with the thickness of 3-15 um, the thickness of the copper is A, the thickness of the aluminum is B, and the whole coil single-sided copper-aluminum-based substrate with copper exposed on one surface is manufactured (shown in figure 2).

3, circuit fabrication

The whole roll of single-sided copper-aluminum base material with copper exposed on one side is cut into single pieces, and then the copper-aluminum unnecessary for the circuit is completely removed by an etching process or a die cutting process to manufacture a circuit board semi-finished product with a circuit pattern (shown in figure 3).

4, solder mask layer fabrication

Applying an insulating layer 3.1 on the circuit board semi-finished product with circuit patterns, manufacturing a screen printing screen, printing solder resist ink on the circuit board semi-finished product, or punching a PET film with glue and then attaching the PET film on the circuit board semi-finished product to manufacture the circuit board semi-finished product with the insulating layer exposed with copper on the front surface (shown in figure 4).

5, OSP preparation

The semi-finished circuit board with exposed copper on the front insulating layer is coated with an oxidation-preventing film 4.1 (shown in fig. 5) at the exposed copper position by OSP.

6, forming

The oxidation-resistant film-formed circuit board was cut into a copper-aluminum material circuit board with pre-cut connection points by a cutting die (see fig. 5 and 6).

The present invention has been described in detail with reference to the accompanying drawings, in which the present invention is illustrated in the following drawings. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.

Claims

1. A circuit board made of a cupper-aluminum material, comprising:

a PI film or PET film substrate layer;

an adhesive layer;

a copper-aluminum material circuit layer;

a surface solder mask layer;

the polyimide/polyimide composite printed circuit board is characterized in that the PI film is a resin material film taking polyimide as a main component, the PET film is a resin material film taking polyethylene terephthalate as a main component, the aluminum surface of a copper-aluminum material layer is combined with the PET film or the PI film through an adhesive layer, all circuits of the copper-aluminum material circuit layer are circuits formed by combining copper and aluminum, the main components of the circuit layer are copper and aluminum, the upper surface and the lower surface of each circuit are copper layers, the other surface of each circuit is an aluminum layer, the thickness of each copper layer is smaller than that of each aluminum layer, a surface solder resist layer covers the surface of each copper layer, a pad exposed on the surface of each circuit board is a copper pad, and the surface solder resist layer is an ink solder resist layer or a cover film solder resist layer.

2. The circuit board made of a cupper-aluminum material as claimed in claim 1, wherein the flexible circuit board made of a cupper-aluminum material is used after punching holes at the pads of the flexible circuit, and the punched holes are used for soldering direct-insert components or are soldered and conducted to the back surface through the holes.

3. The circuit board made of the copper-aluminum alloy material according to claim 1, wherein the thickness of the copper is A, 2um is larger than or equal to A and smaller than or equal to 15 um.

4. The circuit board made of the copper-aluminum material according to claim 1, wherein the thickness of the aluminum is B, and B is greater than or equal to 10um and less than or equal to 400 um.