CN112576962A - Thick metal LED long lamp strip and manufacturing method - Google Patents
Thick metal LED long lamp strip and manufacturing method Download PDFInfo
- Publication number
- CN112576962A CN112576962A CN201910953013.3A CN201910953013A CN112576962A CN 112576962 A CN112576962 A CN 112576962A CN 201910953013 A CN201910953013 A CN 201910953013A CN 112576962 A CN112576962 A CN 112576962A
- Authority
- CN
- China
- Prior art keywords
- thick metal
- circuit
- layer
- circuit board
- lamp strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention relates to a thick metal LED long lamp belt and a manufacturing method thereof, in particular to a method for manufacturing a plurality of double-layer or three-layer lamp belt circuit boards, wherein the lamp belt circuit boards are connected short circuit boards which are connected by a plurality of short lamp belt circuit boards, the back metal of the circuit boards is a thick metal circuit, the back metal is exposed at two ends, after an element is pasted by an SMT, the circuit boards are connected end to end, the method for connecting the circuit boards is that thick metals corresponding to back metal circuits at the end are overlapped and collided together or flatly collided together, the positive electrode is collided with the positive electrode, the negative electrode is collided with the negative electrode, the metal is welded and connected together by a current welding or laser welding method, the metals at the two welded ends of the welding points are completely fused together after welding to form very firm connection and conduction, at least more than two circuit boards welded with elements are connected end to end and welded into a connected long lamp strip, and then the long lamp strip is made into a single thick metal LED long lamp strip by striping.
Description
Technical Field
The invention relates to the field of LED lamp belts, in particular to a thick metal LED long lamp belt and a manufacturing method thereof.
Background
The long LED lamp strip is manufactured by connecting a plurality of short LED lamp strips end to end by soldering, and then welding two or more wires on the back to ensure the current-carrying capacity requirement.
In order to overcome the defects and the shortcomings, the double-layer or three-layer circuit board is adopted, the requirement of large current-carrying capacity is met by a thick metal circuit on the back surface, and the circuit board is fixed on the circuit board, meanwhile, the problems that the wiring of the traditional LED long lamp strip is scattered, the LED long lamp strip is easy to short and unsafe are solved.
Disclosure of Invention
The invention relates to a thick metal LED long lamp belt and a manufacturing method thereof, in particular to a method for manufacturing a plurality of double-layer or three-layer lamp belt circuit boards, wherein the lamp belt circuit boards are connected short circuit boards which are connected by a plurality of short lamp belt circuit boards, the back metal of the circuit boards is a thick metal circuit, the back metal is exposed at two ends, after an element is pasted by an SMT, the circuit boards are connected end to end, the method for connecting the circuit boards is that thick metals corresponding to back metal circuits at the end are overlapped and collided together or flatly collided together, the positive electrode is collided with the positive electrode, the negative electrode is collided with the negative electrode, the metal is welded and connected together by a current welding or laser welding method, the metals at the two welded ends of the welding points are completely fused together after welding to form very firm connection and conduction, at least more than two circuit boards welded with elements are connected end to end and welded into a connected long lamp strip, and then the long lamp strip is made into a single thick metal LED long lamp strip by striping.
According to the invention, a method for manufacturing a thick metal LED long lamp strip is provided, specifically, after a front single-layer circuit board is manufactured, a back thick metal circuit is manufactured to manufacture a single-layer circuit board, two layers of circuits are aligned and laminated together by glue to form a double-layer lamp strip circuit board, or a double-layer circuit board is manufactured firstly and is used as a front circuit and a middle circuit, then a single-layer thick metal circuit board is manufactured and is used as a back circuit, the double-layer circuit board and the back circuit are aligned and laminated together by glue to form a three-layer lamp strip circuit board, the double-layer or three-layer lamp strip circuit board is a one-piece short circuit board of a plurality of short lamp strip circuit boards, conducting connection points are arranged at positions on the short circuit board where the circuits need to be conducted, the copper thickness of the back thick metal circuit of the circuit board is more than or equal to 0.1mm, the back thick, the two layers of circuit boards are provided with conduction connection points, the conduction connection points also form welding during SMT welding elements, the upper layer of circuit board and the lower layer of circuit board form connection and conduction, thick metal LED short lamp strip modules are manufactured, the circuit boards are connected end to end, the connection method is that copper corresponding to copper circuits on the back surfaces of the end and the tail are overlapped and collided together or flatly collided and leaned together, the anode collides with the anode, after the cathode collides with the cathode, a current welding or laser welding method is used for connecting the copper together in a welding mode, the welding points are completely fused by copper at two welded ends after welding, very firm connection and conduction are formed, a plurality of circuit boards welded with elements are connected end to be welded into a connected long lamp strip, and then the thick metal LED long lamp strip with a single strip is manufactured in a strip.
According to the present invention, there is also provided a thick metal LED strip comprising: a plurality of double-layer or three-layer short circuit boards; the components which are welded on the short circuit board and comprise the LEDs are arranged on the short circuit board; connecting welding spots between the short circuit boards; the LED short circuit board is characterized in that the double-layer short circuit board comprises a front single-layer circuit and a back thick metal circuit, the three-layer short circuit board comprises a front double-layer circuit and a back thick metal circuit, the two ends of the back thick metal circuit are exposed to form connecting welding spots, the back thick metal circuit is thick metal with large current-carrying capacity, the metal thickness is larger than or equal to 0.1mm, when the circuit is a double-layer circuit, the front single-layer circuit is conducted with the back thick metal circuit by using tin solder, when the circuit is a three-layer circuit, the front double-layer circuit is conducted with the back thick metal circuit by using tin solder, a plurality of short circuit boards welded with components comprising LEDs are connected end to form a long lamp strip, the end to end is formed by welding the end and end thick metals together in a melting way, the end and end thick metals are in a lap joint or are in a flat joint, the anode is connected with the anode, the cathode is connected with the cathode, the thick metal is firmly connected by self fusion welding, and the long lamp strip is a thick metal LED long lamp strip formed by firmly welding the head and the tail of the long lamp strip.
According to a preferred embodiment of the present invention, the thick metal LED long light strip is characterized in that the thick metal is copper, aluminum, copper-aluminum clad metal, or copper-aluminum mixed metal
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a front-side circuit board, which is a single-layer circuit board or a double-layer circuit board, and through holes are formed in the front-side circuit board.
Fig. 2 is a schematic plan view of a thick metal line on the back side.
Fig. 3 is a schematic plan view of the integrated short lamp strip circuit board formed by bonding and laminating the front surface circuit board and the back surface thick metal circuit together by using glue, exposing the back surface thick metal circuit from the hole at the via hole, and exposing the two ends of the back surface thick metal circuit to form connecting welding spots.
Fig. 4 is a schematic plane view of the conjoined short lamp with a circuit board after the circuit board is subjected to SMT soldering and containing LED components.
Fig. 5 is a schematic plane view of a plurality of connected short lamp strip circuit boards which are subjected to surface welding and contain LED components, and the head and tail connecting welding points are welded together through cold welding.
Fig. 6 is a schematic plan view of a thick metal LED long strip after being cut into individual strips.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Manufacturing a front circuit board:
the manufacturing method comprises the steps of adopting a traditional circuit board manufacturing process, manufacturing a front circuit by screen printing circuit anti-corrosion ink on a single-sided flexible copper-clad plate, baking, curing, etching and removing a film, testing again, attaching a cover film with a window on the front circuit in an aligned mode, exposing a resistor bonding pad 1.1a and an LED lamp bonding pad 1.1b, coating glue on the back, printing characters, punching out a via hole 1.2a by using a die, exposing a front circuit bonding pad 1.3a on the hole edge of the via hole 1.2a, manufacturing a front single-layer circuit board 1 shown in figure 1, and in the processing step, a mark 1 in figure 1 represents a single-layer circuit board.
Or drilling, copper deposition, copper plating, dry film pasting, scene exposure, etching and film removal are carried out on a double-sided flexible copper-clad plate to manufacture a double-layer circuit on the front side, testing is carried out again, a cover film with a window is pasted and pressed on the circuit of a front side welding element in an aligned mode, a resistance pad 1.1a and an LED lamp pad 1.1b are exposed, another cover film is pasted and pressed on the back circuit of the double-layer circuit on the front side, glue and characters are coated on the back side, a through hole 1.2a is punched out by a die, a front side circuit pad 1.3a is exposed on the hole edge of the through hole 1.2a, the double-layer circuit board 1 on the front side shown in the figure 1 is manufactured, and in the processing step, the mark 1.
Manufacturing a back thick metal circuit:
cutting a copper plate with the thickness of 0.15mm into a copper plate with the width of 250mm and the length of 510mm by adopting the traditional circuit board manufacturing process, aligning and pressing the copper plate with a covering film 2.2 with the width of 250mm and the length of 500mm together to manufacture a single-sided copper-clad plate, manufacturing a thick metal circuit 2.1 by silk-screen circuit anti-corrosion printing ink, baking and curing, etching and film stripping, wherein the thick metal circuit 2.1 is exposed at two ends of the covering film 2.2 (as shown in figure 2)
Manufacturing the short lamp belt circuit board:
the method comprises the steps of aligning and attaching the glue surface of a glued front-surface circuit board 1 and a back-surface thick metal circuit 2.1 together, then pressing the front-surface circuit board 1 and the back-surface thick metal circuit 2.1 together on a quick press by using a pressure parameter of 120kg at a temperature of 150 ℃, enabling the front-surface circuit board 1 and the back-surface thick metal circuit 2.1 to be firmly bonded together, exposing the thick metal circuit 2.1 from a hole at a through hole 1.2a, exposing a front-surface circuit pad 1.3a on the edge of the through hole 1.2a, exposing the thick metal circuit 2.1 at two ends to form a connecting welding spot 2.1a, baking the thick metal circuit board in an oven for 90 minutes at a temperature of 150 ℃, baking and curing glue, and performing surface anti-oxidation on the welding spot through OSP to manufacture a short circuit.
Manufacturing the thick metal LED long lamp strip:
adopting a traditional SMT paster process, printing solder paste on an LED lamp bead bonding pad 1.1b and a resistor bonding pad 1.1a of a short lamp strip circuit board by using a steel mesh on a solder paste printing machine, simultaneously printing the solder paste on a via hole 1.2a, respectively correspondingly mounting an LED lamp bead 3.1 and a resistor 3.2 on the solder paste printed bonding pad by using an SMT paster, welding the lamp bead 3.1 and the resistor 3.2 on the short lamp strip circuit board by using a reflow welding machine, welding and connecting a back thick metal and a front circuit by using the solder paste printed on the via hole 1.2a to manufacture a plurality of connected short lamp strips (as shown in figure 4), then overlapping the connection welding spots 2.1a at the head and the tail of the two connected short lamp strips together, touching the anode and the cathode, welding the cold welding machine, welding the overlapped connection welding spots 2.1a together to form a plurality of welding structures 2.1b, thus welding the connected short lamp strips together one by one, and (3) manufacturing the connected long lamp strip (as shown in figure 5), and then slitting on a slitting machine to manufacture the single thick metal LED long lamp strip (as shown in figure 6).
The invention is described in detail with reference to the drawings by using a specific embodiment of a thick metal LED long strip and a manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (3)
1. A method for manufacturing a thick metal LED long lamp strip comprises the steps of manufacturing a front single-layer circuit board, manufacturing a back thick metal circuit to manufacture a single-layer circuit board, aligning and laminating two layers of circuits together by glue to form a double-layer lamp strip circuit board, or manufacturing a double-layer circuit board to serve as a front circuit and a middle layer circuit, manufacturing a single-layer thick metal circuit board to serve as a back circuit, aligning and laminating the double-layer circuit board and the back circuit together by glue to form a three-layer lamp strip circuit board, wherein the double-layer or three-layer lamp strip circuit board is a one-piece short circuit board of a plurality of short lamp strip circuit boards, arranging conduction connection points at positions, needing to be conducted, of each layer of circuits on the short circuit board, the copper thickness of the back thick metal circuit of the circuit board is more than or equal to 0.1mm, exposing the back thick metal circuit at two ends, the method comprises the steps of arranging a plurality of short lamp belt modules end to end, overlapping and colliding copper corresponding to back copper circuits together or flatly colliding the copper to the back, colliding an anode with a cathode, welding copper at two welded ends together by using a current welding or laser welding method, forming very firm connection and conduction, welding a plurality of circuit boards with elements end to end into a connected long lamp belt, and then dividing the connected long lamp belt into single thick metal LED long lamp belts.
2. A thick metal LED strip comprising:
a plurality of double-layer or three-layer short circuit boards;
the components which are welded on the short circuit board and comprise the LEDs are arranged on the short circuit board;
connecting welding spots between the short circuit boards;
the LED short circuit board is characterized in that the double-layer short circuit board comprises a front single-layer circuit and a back thick metal circuit, the three-layer short circuit board comprises a front double-layer circuit and a back thick metal circuit, the two ends of the back thick metal circuit are exposed to form connecting welding spots, the back thick metal circuit is thick metal with large current-carrying capacity, the metal thickness is larger than or equal to 0.1mm, when the double-layer circuit is formed, the front single-layer circuit is conducted with the back thick metal circuit by using tin solder, when the double-layer circuit is formed, the front double-layer circuit is conducted with the back thick metal circuit by using tin solder, a plurality of short circuit boards welded with components comprising LEDs are connected end to form a long lamp strip, the end to end is formed by welding the end and the tail thick metal together in a melting way, the end and the tail thick metal are in a lap joint or are in a flat joint, the anode is connected with the anode, the cathode is connected with the cathode, the thick metal is firmly connected by self fusion welding, and the long lamp strip is a thick metal LED long lamp strip formed by firmly welding the head and the tail of the long lamp strip.
3. A thick metal LED long lamp strip according to claim 1 or 2, wherein said thick metal is copper or aluminum or copper aluminum clad metal or copper aluminum mixed metal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910953013.3A CN112576962A (en) | 2019-09-27 | 2019-09-27 | Thick metal LED long lamp strip and manufacturing method |
| PCT/CN2020/109146 WO2021057320A1 (en) | 2019-09-27 | 2020-08-14 | Thick-metal led long lamp strip and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910953013.3A CN112576962A (en) | 2019-09-27 | 2019-09-27 | Thick metal LED long lamp strip and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112576962A true CN112576962A (en) | 2021-03-30 |
Family
ID=75117218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910953013.3A Pending CN112576962A (en) | 2019-09-27 | 2019-09-27 | Thick metal LED long lamp strip and manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112576962A (en) |
| WO (1) | WO2021057320A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799388A (en) * | 2022-04-15 | 2022-07-29 | 深圳市子轩光电子科技有限公司 | Horizontal welding process for bridging flexible lamp strip |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6914194B2 (en) * | 2003-10-29 | 2005-07-05 | Ben Fan | Flexible LED cable light |
| DE202005006643U1 (en) * | 2005-04-26 | 2005-09-08 | Fan, Ben, Hsitzu | Light emitting diode cable illuminator for decorating e.g. house, has insulating body with slots, wires embedded parallel in body, and protective layer made of transparent material covering insulating body and light emitting diodes |
| CN202074316U (en) * | 2010-11-10 | 2011-12-14 | 张�林 | Combined type LED long lamp belt |
| CN204313089U (en) * | 2014-09-28 | 2015-05-06 | 王定锋 | A kind of 6VLED lamp pearl 220V high pressure non-resistance LED |
| CN109812721A (en) * | 2017-11-21 | 2019-05-28 | 王定锋 | A kind of LED light strip and preparation method thereof |
| CN209355013U (en) * | 2019-01-21 | 2019-09-06 | 铜陵睿变电路科技有限公司 | LED light string made of three conducting wires of one kind |
-
2019
- 2019-09-27 CN CN201910953013.3A patent/CN112576962A/en active Pending
-
2020
- 2020-08-14 WO PCT/CN2020/109146 patent/WO2021057320A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799388A (en) * | 2022-04-15 | 2022-07-29 | 深圳市子轩光电子科技有限公司 | Horizontal welding process for bridging flexible lamp strip |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021057320A1 (en) | 2021-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206181548U (en) | LED stripe shape lamp double layers of circuit boards module | |
| CN110958787A (en) | Welding method for multilayer interconnection FPC preset solder paste | |
| CN110996511A (en) | Multilayer interconnected FPC | |
| CN106455472A (en) | Method for manufacturing high heat radiation LED circuit board bulb module group | |
| CN110996556A (en) | Welding method of multilayer interconnected FPC | |
| CN112576962A (en) | Thick metal LED long lamp strip and manufacturing method | |
| CN109757039B (en) | Circuit board of composite metal circuit and manufacturing method thereof | |
| CN110972410B (en) | Method for realizing rapid tin conduction of multilayer interconnected FPC (flexible printed circuit) | |
| WO2012009842A1 (en) | Method of manufacturing single sided circuit board by using carrier glue film and juxtaposition flat wiring | |
| CN211821838U (en) | Discontinuous layered flexible laminated circuit board lamp strip | |
| CN115151053A (en) | LED circuit board module made of copper-clad aluminum foil material and manufacturing method thereof | |
| CN217825568U (en) | Double-layer flexible circuit board | |
| CN206181549U (en) | LED fluorescent lamp double layers of circuit boards module | |
| CN211059851U (en) | Aluminum strip lamp module | |
| CN201860515U (en) | Two-sided LED circuit board component for welding, connecting and conducting | |
| CN212381476U (en) | Wavy LED circuit board lamp area | |
| CN211063888U (en) | Novel lamp area of bowl hole double-sided circuit board preparation | |
| CN212381453U (en) | LED lamp area of wave stromatolite circuit board preparation | |
| CN211821837U (en) | Long lamp strip assembled by wavy LED short lamp strips | |
| WO2021057311A1 (en) | Light strip having discontinuously layered flexible laminated circuit board, and manufacturing method | |
| CN212381469U (en) | Double-layer circuit board manufactured by combining single-layer circuit board on flat cable | |
| CN211047390U (en) | Circuit board with winding displacement reinforcing connection | |
| CN212211553U (en) | Solder resist is double-layer wire circuit board that printing ink hinders solder resist | |
| CN207750797U (en) | A kind of wire circuit plate LED light strip | |
| CN110958769A (en) | Multilayer interconnection FPC with lead tin via hole fast |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210330 |