CN211821838U - Discontinuous layered flexible laminated circuit board lamp strip - Google Patents
Discontinuous layered flexible laminated circuit board lamp strip Download PDFInfo
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- CN211821838U CN211821838U CN201921680896.7U CN201921680896U CN211821838U CN 211821838 U CN211821838 U CN 211821838U CN 201921680896 U CN201921680896 U CN 201921680896U CN 211821838 U CN211821838 U CN 211821838U
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Abstract
The utility model relates to a discontinuous layered flexible laminated circuit board lamp strip, in particular to a single-layer flexible circuit board or a double-layer flexible circuit board designed with a via hole, printing adhesive on multiple positions of the back surface, making a metal single-layer circuit board, sticking the circuit board with the printed adhesive on the back surface and the metal single-layer circuit board together to form a discontinuous adhesion and discontinuous layered structure, namely, the part of the metal circuit board on the lower layer of the back and the part between the single-layer circuit board or the double-layer circuit board on the upper layer are in a layered structure without adhesive bonding at a plurality of local positions to manufacture a double-layer or three-layer flexible laminated circuit board which is discontinuously layered, components including LED lamps are bonded by an SMT process to manufacture a connected lamp strip comprising a plurality of lamp strips, and after the strips are separated by a slitting machine, a discontinuous layered flexible laminated circuit board strip is manufactured, and the strip is more resistant to bending when bent for use.
Description
Technical Field
The utility model relates to a LED lamp area field, concretely relates to be interrupted flexible laminated circuit board lamp area of layering.
Background
The LED circuit board lamp strip is always bent for use at a plurality of positions according to requirements when in use, the circuit board is very easy to bend and break when the lamp strip is bent for use, or the circuit board is broken, or the long lamp belt is broken due to the self weight and the stretching when being installed, or the back of the lamp belt circuit board is provided with a thick copper wire or a thick copper flat cable, when the circuit board is bent, the thick copper pushes the circuit board to be broken, or the circuit board is broken when the waterproof resin of the lamp strip bag is bent, and the long lamp strips are manufactured by using a tin soldering connection mode, however, when the extra-long lamp strip is required to be manufactured, because of large load and large current-carrying capacity, thick copper is required to be used as a circuit conductor, however, the thicker the copper which needs to be welded and connected, the firmer the copper is by soldering, the bending resistance is not good, how to solve the problem of easy breakage of bending and stretching and improve the bending resistance is a difficult problem in the industry.
In order to overcome defect more than and solve above technical problem, the utility model discloses make into the flexible lamination circuit board that is interrupted the layering with the lamp area circuit board, with the individual layer or the double-deck flexible line way board of openly welding the component, be interrupted the printing adhesive at the back part, paste together with the metal individual layer circuit board at the back again, form and be interrupted the bonding, be interrupted the layered structure, improved the resistant bending nature in lamp area greatly, solved the disconnected board problem that the lamp area a great deal of factor leads to when installation is used, the utility model discloses still take copper self solder joint to melt the mode of fusing together, with the positive negative pole copper welding of many short lamp area head and the tail, the long lamp area of making is very firm, and the junction is constantly cracked when the inflection, has solved traditional soldering anti book, problem that tensile strength is not enough.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a discontinuous layered flexible laminated circuit board lamp strip, in particular to a single-layer flexible circuit board or a double-layer flexible circuit board designed with a via hole, printing adhesive on multiple positions of the back surface, making a metal single-layer circuit board, sticking the circuit board with the printed adhesive on the back surface and the metal single-layer circuit board together to form a discontinuous adhesion and discontinuous layered structure, namely, the part of the metal circuit board on the lower layer of the back and the part between the single-layer circuit board or the double-layer circuit board on the upper layer are in a layered structure without adhesive bonding at a plurality of local positions to manufacture a double-layer or three-layer flexible laminated circuit board which is discontinuously layered, components including LED lamps are bonded by an SMT process to manufacture a connected lamp strip comprising a plurality of lamp strips, and after the strips are separated by a slitting machine, a discontinuous layered flexible laminated circuit board strip is manufactured, and the strip is more resistant to bending when bent for use.
According to the utility model provides a be interrupted layered flexible laminated circuit board lamp area, include: a component layer comprising an LED; a single-layer circuit board or a double-layer circuit board stacked on the upper layer; an intermediate adhesive layer; a single-layer circuit board stacked on the lower layer; the circuit board of the discontinuous layered flexible laminated circuit board strip is characterized in that the circuit board of the discontinuous layered flexible laminated circuit board strip is a laminated circuit board formed by bonding a single-layer circuit board or a double-layer circuit board on an upper layer to a single-layer circuit board on a lower layer through an adhesive layer, or a laminated circuit board formed by bonding a plurality of single-layer circuit boards or double-layer circuit boards in an end-to-end manner to a single-layer circuit board on a lower layer through an adhesive layer, wherein the bonding between all the upper-layer circuit boards and the lower-layer circuit board of the laminated circuit board strip is the discontinuous bonding of a plurality of locally formed adhesives, a plurality of positions which are not bonded are formed with separated gaps, the formed flexible laminated circuit board strip is the discontinuous layered flexible laminated circuit board strip, and the discontinuous layered flexible laminated circuit board strip circuit board is the laminated circuit board formed by discontinuously bonding one or a plurality of, the formed laminated circuit board is a double-layer or three-layer circuit board, and a plurality of mutually-communicated conduction connection points are formed between the upper layer circuit board and the lower layer single-layer circuit board, the conduction connection points are arranged at the edge of the upper layer circuit board, a plurality of metal connection points are arranged at the edge of the upper layer circuit board and are aligned with a plurality of metal connection points on the lower layer circuit board, or/and a through hole is arranged in the upper layer circuit board, the edge of the through hole is provided with a metal conduction connection point on the front circuit of the upper layer circuit board, the lower layer circuit board is provided with metal to form the conduction connection points at the through hole, and the upper layer conduction connection point and the lower layer conduction connection point are welded together to form conduction through soldering tin, the discontinuous layered flexible laminated lamp belt circuit board is a double-layer circuit board or three-layer circuit board with a plurality of discontinuous layered gaps formed, the circuit metal or/and the non-metal on the circuit on the single-layer circuit board on the lower layer and the back of the circuit board on the single upper layer or the backs of the circuit boards on the multiple upper layers are bonded by glue, and discontinuous bonding at multiple positions is formed, the thickness of the circuit metal on the circuit board on the back of the lower layer is larger than or equal to that of the circuit metal on the circuit boards on the upper layers, and the lamp strip is formed by welding components including LED lamps on a discontinuous and layered flexible laminated circuit strip circuit board.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, a serial communication port, fold on the upper strata when the double-deck circuit board, the mode that switches on mutually between its double-deck circuit is, two-layer soldering tin switches on the department and switches on with the soldering tin conduction mode about the design, perhaps switches on through the copper-plated mode of through-hole that forms between two-layer, perhaps switches on with electrically conductive printing ink.
According to a preferred embodiment of the present invention, the discontinuous layered flexible laminated circuit board strip is characterized in that the adhesive is a curable or cured adhesive or a non-setting adhesive.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible stromatolite circuit board lamp area, its characterized in that, the individual layer circuit board of folding at the lower floor be the circuit board of individual layer membrane, bear the rete of circuit, press from both sides the one side of the inherent layering of board at the stromatolite, perhaps the rete is all naked outside at the lowermost floor of stromatolite circuit board, perhaps, the individual layer circuit board of folding at the lower floor be the circuit board of bilayer membrane, middle circuit layer is pressed from both sides to two-layer membrane.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that, the individual layer circuit board of folding at the lower floor, be the winding displacement circuit board that many metal lines were arranged in parallel, parallel winding displacement is positive negative pole power supply line, the effect is used for supplying power for upper circuit and components and parts.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that, the individual layer circuit board of folding at the lower floor, be formed with a plurality of gaps of cutting, the gap of formation is between two adjacent metal lines, multidirectional turning installation when the lamp area of being convenient for uses.
According to a preferred embodiment of the present invention, the discontinuous layered flexible laminated circuit board strip is characterized in that the circuit metal of the single-layer circuit board stacked on the lower layer is copper, aluminum nickel plating, aluminum tin plating, aluminum copper plating, copper-clad aluminum, or copper-clad steel.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that, LED sets up in just to layered structure's layering department, LED lamp area, when there is the LED lamp in the turn, turn buckle and be difficult for causing LED lamp pearl to break away from or the fracture.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that, the lamp area has clearly been designed and has been made into and only turn at the position that does not contain the component, the turn is layered structure, welding LED's pad setting is just to the bonding department between the upper and lower two-layer circuit board.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible stromatolite circuit board lamp area, a characterized in that, the single-layer circuit board or the double-deck circuit board of folding on upper strata, be the circuit board that contains the circuit of a plurality of cycles, the circuit design of every cycle is the same, when upper strata circuit board design positive negative pole power mainline from beginning to end, the tie point that switches on between upper strata circuit board and the lower floor's circuit board sets up at a cycle position or sets up at a plurality of cycle positions, connect and switched on upper and lower two-layer circuit at a cycle position or a plurality of cycle positions, when upper strata circuit board did not design the power mainline from beginning to end, every cycle between upper strata circuit board and the lower floor's circuit board all is provided with and switches on the tie point, and all formed the connection and switched on.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that, switching on of upper and lower two-layer circuit board, the contact that the bare metal that is in the layering department formed between upper circuit board and the lower layer circuit board switches on.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, a serial communication port, fold on the upper strata when the double-deck circuit board, the mode that switches on mutually between its double-deck circuit is, two-layer soldering tin switches on the department and switches on with the soldering tin conduction mode about the design, perhaps switches on through the copper-plated mode of through-hole that forms between two-layer, perhaps switches on with electrically conductive printing ink.
According to a preferred embodiment of the present invention, the discontinuous layered flexible laminated circuit board strip is characterized in that the adhesive is a curable or cured adhesive or a non-setting adhesive.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible stromatolite circuit board lamp area, its characterized in that, the individual layer circuit board of folding at the lower floor be the circuit board of individual layer membrane, bear the rete of circuit, press from both sides the one side of the inherent layering of board at the stromatolite, perhaps the rete is all naked outside at the lowermost floor of stromatolite circuit board, perhaps, the individual layer circuit board of folding at the lower floor be the circuit board of bilayer membrane, middle circuit layer is pressed from both sides to two-layer membrane.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that, the individual layer circuit board of folding at the lower floor, be the winding displacement circuit board that many metal lines were arranged in parallel, parallel winding displacement is positive negative pole power supply line, the effect is used for supplying power for upper circuit and components and parts.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that, the individual layer circuit board of folding at the lower floor, be formed with a plurality of gaps of cutting, the gap of formation is between two adjacent metal lines, multidirectional turning installation when the lamp area of being convenient for uses.
According to a preferred embodiment of the present invention, the discontinuous layered flexible laminated circuit board strip is characterized in that the circuit metal of the single-layer circuit board stacked on the lower layer is copper, aluminum nickel plating, aluminum tin plating, aluminum copper plating, or copper clad aluminum.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that, LED sets up in just to layered structure's layering department, LED lamp area, when there is the LED lamp in the turn, turn buckle and be difficult for causing LED lamp pearl to break away from or the fracture.
According to a preferred embodiment of the utility model, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that the lamp area of line has clearly been designed and has been made into and only turn at the position that does not contain the component, and the turn is layered structure, and welding LED's pad setting is just to the bonding department between the upper and lower two-layer circuit board.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible stromatolite circuit board lamp area, a characterized in that, the single-layer circuit board or the double-deck circuit board of folding on upper strata, be the circuit board that contains the circuit of a plurality of cycles, the circuit design of every cycle is the same, when upper strata circuit board design positive negative pole power mainline from beginning to end, the position of switching on between upper strata circuit board and the lower floor's circuit board sets up at a cycle position or sets up at a plurality of cycle positions, it has switched on upper and lower two-layer circuit to connect at a cycle position or a plurality of cycle positions, when upper strata circuit board did not design the power mainline from beginning to end, every cycle between upper strata circuit board and the lower floor's circuit board has all formed the intercommunication and has switched on.
According to the utility model discloses a preferred embodiment, a be interrupted layered flexible laminated circuit board lamp area, its characterized in that, switching on of upper and lower two-layer circuit board, the contact that the bare metal that is in the layering department formed between upper circuit board and the lower layer circuit board switches on.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of an upper-layer circuit board, a via hole is arranged at a via soldering position, a front-side circuit pad of the upper-layer circuit board is exposed at the edge of the via hole, and a metal of a lower-layer circuit board is exposed at the via hole from the front side to form a solder joint.
Fig. 2 is a schematic plan view of the upper layer circuit board with conducting soldering positions at two ends, and a plurality of soldering points on the edge of the upper layer circuit board for aligning with a plurality of soldering points of the lower layer circuit board.
Fig. 3 is a schematic plan view of the upper-layer circuit board after printing adhesive at a plurality of positions on a part of the back surface of the upper-layer circuit board.
Fig. 4 is a schematic plan view of a metal single-layer circuit of a backside underlayer.
FIG. 5 is a schematic plan view of a metal single-layer circuit board formed by attaching a film having holes to a metal single-layer circuit board of a lower layer on the back surface.
Fig. 6 is a schematic plan view of a plurality of slits disposed between two adjacent circuits of the metal single-layer circuit board.
Fig. 7 is a schematic plan view of the intermittently laminated flexible laminated tape circuit board of the intermittently laminated structure, in which the upper layer circuit board of fig. 1 is attached to the lower layer single layer circuit board by an adhesive to form an intermittent adhesive.
Fig. 8 is a schematic plan view of the intermittently layered flexible laminated tape circuit board of the intermittently layered structure, in which the upper layer circuit board of fig. 2 is attached to the lower layer single layer circuit board by an adhesive to form an intermittent adhesive.
Fig. 9 is a schematic plan view of a plurality of upper-layer circuit boards aligned end to end and attached to a lower-layer circuit board.
Fig. 10 is a schematic cross-sectional view of a discontinuously layered flexible laminate tape cord board at the via location.
Fig. 11 is a schematic cross-sectional view of a discontinuous layered flexible laminated tape wiring board at a conduction welding position at both ends.
Fig. 12 is a schematic plan view of a flexible laminated circuit board strip manufactured by mounting and welding LEDs on a laminated circuit board strip by SMT to form discontinuous layers.
Fig. 13 is a schematic cross-sectional view of a flexible laminated circuit board strip manufactured by mounting and welding LEDs on a laminated circuit board strip by SMT to form a discontinuous layer.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Manufacturing an upper-layer circuit board:
the manufacturing method comprises the steps of adopting a traditional circuit board manufacturing process, carrying out silk-screen printing on a single-sided flexible copper-clad plate through circuit anti-corrosion ink, baking and curing, etching, film stripping and silk-screen printing on front ink solder resist to expose a resistance pad 1.1a and an LED lamp pad 1.1b, baking and character printing, baking and curing, punching out a through hole 1.2a by using a die, wherein the front circuit pad 1.3a of an upper-layer circuit board is exposed at the hole edge of the through hole 1.2a, so as to manufacture the upper-layer single-layer circuit board 1 shown in figure 1, or shortening the upper-layer circuit on pads at the conducting and welding positions at two ends of the circuit board to expose only half of conducting pads 1.3b of the upper-layer circuit on the conducting and form holes 1.2b on the conducting and manufacture the upper-layer single-layer circuit board 1 shown in figure 2, wherein in the processing step, the figure 1 and the figure 2, a mark 1.
Or drilling a double-sided flexible copper-clad plate, depositing copper, plating copper, pasting a dry film, exposing and displaying a scene, etching, removing a film, silk-screening front ink solder resist, exposing a resistance pad 1.1a and an LED lamp pad 1.1b, baking, silk-screening back ink solder resist, baking, characters, baking, punching out a via hole 1.2a by using a die, wherein the front circuit pad 1.3a of the upper-layer circuit board is exposed at the hole edge of the via hole 1.2a, so as to manufacture the upper-layer double-layer circuit board 1 shown in figure 1, or shortening the upper-layer circuit on the pads at the conducting and welding positions at the two ends of the circuit board, so that only half of the conducting pad 1.3b of the upper-layer circuit is exposed at the conducting and welding point, and the other half of the via hole 1.2b are formed, so as to manufacture the upper-layer double-layer circuit board 1 shown in figure 2, wherein the mark 1 in the figure 1 and figure 2 shows the double.
According to the engineering data of design, the 18T silk screen printing glue is used at a plurality of local positions on the back surface of the upper layer circuit board 1, the silk screen does not leak glue at the glue leaking part position of the partial position, a net frame is erected on a silk screen printing bench, a positioning nail is arranged on an alignment back surface, the back surface of the circuit board is placed on a table top upwards, the positioning nail enters a positioning hole for positioning, glue is added on the net, an acrylic acid adhesive 2 for a flexible board is printed on a plurality of pre-designed position surfaces (shown in figure 3) on the board, the circuit board enters a tunnel furnace for 120 ℃ and 3 minutes, and the solvent in the acrylic acid adhesive 2 is heated and volatilized.
Manufacturing a back lower-layer metal single-layer circuit board:
the method comprises the steps of adopting a traditional circuit board manufacturing process, printing circuit anti-corrosion ink on a single-sided flexible copper clad laminate with the copper thickness of 0.15mm by silk screen printing, baking, curing, etching, removing a film, manufacturing a metal circuit 3.1 (shown in figure 4), then attaching a PI cover film with holes on the metal circuit 3.1, exposing the metal circuit 3.1 from the holes of the PI cover film, pressing and baking to manufacture a lower-layer metal single-layer circuit board (shown in figure 5), wherein the length of the lower-layer metal single-layer circuit board is 0.5-300 m, punching a plurality of gaps 3.2 (shown in figure 6) between two adjacent circuits 3.1 on the metal single-layer circuit board by using a cutting die, and cutting the gaps 3.2 to facilitate multidirectional turning installation of a subsequent lamp strip.
Discontinuous layered flexible laminated lamp strip circuit board manufacturing:
preferred embodiment (1) combination of a single upper layer wiring board and a lower layer metal single layer board
A template with positioning nails is used for placing a lower layer metal single-layer board 3 with the length of 0.5 meter on the template, the positioning nails are inserted into positioning holes of the board, and then the single-layer board 1 or the double-layer board 1 with the upper layer printed with the adhesive 2 is folded downwards, the adhesive 2 is also folded downwards onto the metal single-layer board 3, and the positioning nails on the board are inserted into the positioning holes to align the upper layer and the lower layer, at the moment, the metal circuit 3.1 is exposed at the through hole 1.2a of the upper layer circuit board, the front circuit pad 1.3a of the upper layer circuit board is exposed at the edge of the through hole 1.2a, the metal circuit 3.1 of the lower layer circuit board is exposed from the front side at the through hole 1.2a (as shown in figures 7 and 10), or, at the two ends of the circuit board, the pads at the through welding positions are shortened, the upper layer circuit is exposed on the through welding points, only half of the through welding points are exposed, and the through welding points 1.3b of the upper layer circuit board at the other half of the through welding points are exposed (as shown in figure 8, Fig. 11), then an iron is used to heat the upper plate to transfer heat to the 2 adhesive layers, the 2 adhesive layers are adhered to the upper circuit board 1, the lower metal single-layer circuit board 3 is transferred to a faster press, the stacked boards are pressed for 1 minute at 150 degrees and 120KG, and then are taken out and put into an oven, and the boards are baked for 60 minutes at 150 degrees to solidify the adhesive, so that the discontinuous and layered flexible laminated lamp strip circuit board (as shown in fig. 7, 8, 10 and 11) is manufactured and specially used for manufacturing the LED strip.
Preferred embodiment (2), combination of a plurality of upper-layer wiring boards and lower-layer metal single-layer board
A template with a positioning nail is used, a first section of a lower metal single-layer plate 3 with the length of 100 meters is placed on the template, the positioning nail is inserted into a positioning hole of the plate, a first single-layer plate 1 with an upper layer printed with an adhesive 2 or a double-layer plate 1 is folded downwards, the adhesive 2 is overlapped on the first section of the metal single-layer plate 3, the positioning nail on the plate is also inserted into the positioning hole, the upper layer and the lower layer are aligned, at the moment, a metal circuit 3.1 is exposed at a through hole 1.2a on the upper layer circuit board 1, a front circuit pad 1.3a of the upper layer circuit board is exposed at the edge of the through hole 1.2a, the metal circuit 3.1 of the lower layer is exposed from the front side at the through hole 1.2a (as shown in figures 9 and 10), or, at two ends of the circuit board, on a pad at a conducting welding position, the upper layer circuit is shortened, so that only half of the conducting welding point 1.3b of the upper layer circuit is exposed at the conducting welding, the metal circuit 3.1 of the lower layer of wiring board is exposed from the front side at the other half-hole 1.2b (as shown in figures 9 and 11), then heating the upper layer board by an iron to transfer heat to the adhesive 2 layer, enabling the adhesive 2 layer to stick the upper layer circuit board 1 and the lower layer metal single layer circuit board 3, then sequentially sticking the second, third and fourth boards until the last single layer board 1 or double layer board 1 with the adhesive 2 printed on the upper layer is aligned and stuck to the lower layer metal single layer circuit board 3 end to end according to the method, then pressing the materials section by section in a faster press with each section at 150 ℃ under 120KG for 1 minute, putting the materials into an oven, baking the materials at 150 ℃ for 60 minutes to solidify the glue, namely, the discontinuous and layered flexible laminated strip circuit board (as shown in fig. 7, fig. 8, fig. 10 and fig. 11) is manufactured and specially used for manufacturing the LED strip.
Manufacturing a discontinuous layered flexible laminated circuit board lamp:
the method comprises the steps of printing solder paste on an LED lamp bead bonding pad 1.1b and a resistance bonding pad 1.1a of a discontinuous layered flexible laminated lamp strip circuit board by using a steel mesh on a solder paste printing machine, correspondingly and respectively bonding an LED lamp bead 4.1 and a resistor 4.2 on the bonding pad printed with the solder paste by using an SMT chip mounter, welding the LED lamp bead 4.1 and the resistor 4.2 on an upper layer circuit board 1 of the discontinuous layered flexible laminated lamp strip by using a reflow welding machine to manufacture the conjoined lamp strip containing a plurality of lamp strips, and dividing the lamp strip on a slitting machine to manufacture the discontinuous layered flexible laminated circuit board lamp strip (as shown in figures 12 and 13).
The utility model discloses make into the flexible laminated circuit board that is interrupted the layering with the lamp area circuit board, weld the individual layer or the double-deck flexible line way board of component with openly, be interrupted the printing adhesive at the back part, paste together with the metal individual layer circuit board at the back again, form and be interrupted the bonding, be interrupted the structure of layering, improved the resistant bending nature in lamp area greatly, solved the disconnected board problem that a great deal of factor leads to when the installation is used in the lamp area.
The present invention has been described in detail with reference to the accompanying drawings, which illustrate a specific embodiment of a discontinuous layered flexible laminated circuit board strip. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.
Claims (11)
1. A discontinuous layered flexible laminated wiring board strip comprising:
a component layer comprising an LED;
a single-layer circuit board or a double-layer circuit board stacked on the upper layer;
an intermediate adhesive layer;
a single-layer circuit board stacked on the lower layer;
the circuit board of the discontinuous layered flexible laminated circuit board strip is characterized in that the circuit board of the discontinuous layered flexible laminated circuit board strip is a laminated circuit board formed by bonding a single-layer circuit board or a double-layer circuit board on an upper layer to a single-layer circuit board on a lower layer through an adhesive layer, or a laminated circuit board formed by bonding a plurality of single-layer circuit boards or double-layer circuit boards in an end-to-end manner to a single-layer circuit board on a lower layer through an adhesive layer, wherein the bonding between all the upper-layer circuit boards and the lower-layer circuit board of the laminated circuit board strip is the discontinuous bonding of a plurality of locally formed adhesives, a plurality of positions which are not bonded are formed with separated gaps, the formed flexible laminated circuit board strip is the discontinuous layered flexible laminated circuit board strip, and the discontinuous layered flexible laminated circuit board strip circuit board is the laminated circuit board formed by discontinuously bonding one or a plurality of, the formed laminated circuit board is a double-layer or three-layer circuit board, and a plurality of mutually-communicated conduction connection points are formed between the upper layer circuit board and the lower layer single-layer circuit board, the conduction connection points are arranged at the edge of the upper layer circuit board, a plurality of metal connection points are arranged at the edge of the upper layer circuit board and are aligned with a plurality of metal connection points on the lower layer circuit board, or/and a through hole is arranged in the upper layer circuit board, the edge of the through hole is provided with a metal conduction connection point on the front circuit of the upper layer circuit board, the lower layer circuit board is provided with metal to form the conduction connection points at the through hole, and the upper layer conduction connection point and the lower layer conduction connection point are welded together to form conduction through soldering tin, the discontinuous layered flexible laminated lamp belt circuit board is a double-layer circuit board or three-layer circuit board with a plurality of discontinuous layered gaps formed, the circuit metal or/and the non-metal on the circuit on the single-layer circuit board on the lower layer and the back of the circuit board on the single upper layer or the backs of the circuit boards on the multiple upper layers are bonded by glue, and discontinuous bonding at multiple positions is formed, the thickness of the circuit metal on the circuit board on the back of the lower layer is larger than or equal to that of the circuit metal on the circuit boards on the upper layers, and the lamp strip is formed by welding components including LED lamps on a discontinuous and layered flexible laminated circuit strip circuit board.
2. An intermittently laminated flexible printed circuit board strip as claimed in claim 1, wherein when the upper layer is a double-layer circuit board, the double-layer circuits are electrically connected to each other by soldering at the solder joints of the upper and lower layers, or by copper plating through holes formed between the two layers, or by conductive ink.
3. A intermittently laminated flexible laminated circuit board strip as claimed in claim 1, wherein said adhesive is a curable or cured-formed adhesive or a non-tacky adhesive.
4. A intermittently laminated flexible printed circuit board strip as claimed in claim 1, wherein said single-layer circuit board laminated on the lower layer is a single-layer circuit board, a circuit-carrying film layer is sandwiched between the circuit boards on the laminated side, or the film layer is exposed on the lowermost layer of the laminated circuit board, or said single-layer circuit board laminated on the lower layer is a double-layer circuit board, and the two layers sandwich the middle circuit layer.
5. A discontinuous layered flexible printed circuit board strip according to claim 1, wherein said single layer circuit board stacked on the lower layer is a flat cable circuit board with a plurality of metal circuits arranged in parallel, and the parallel flat cables are positive and negative power circuits for supplying power to the upper layer circuit and the components.
6. A intermittently laminated flexible printed circuit board strip as claimed in claim 1, wherein said single layer circuit board laminated on the lower layer is formed with a plurality of slits formed between two adjacent metal traces for facilitating multi-directional turning of the strip during use.
7. A discontinuous layered flexible laminated circuit board strip according to claim 1, wherein the circuit metal of the single layer circuit board layered on the lower layer is copper, aluminum, nickel-plated aluminum, tin-plated aluminum, copper-plated aluminum, or copper-plated steel.
8. The intermittent layered flexible laminated circuit board strip according to claim 1, wherein the LEDs are arranged at the layered positions opposite to the layered structure, and when the LED lamp is arranged at a turning position, the LED lamp strip is not easy to break away or break due to turning bending.
9. A strip of intermittently laminated flexible laminated circuit boards according to claim 1, wherein the strip has been specifically designed to make turns only at locations where no components are present, the turns being of a laminated structure, and the pads for soldering the LEDs being located directly opposite the bond between the upper and lower layers of circuit boards.
10. An intermittently laminated flexible printed circuit board strip as claimed in claim 1, wherein said single-layer circuit board or double-layer circuit board stacked on the upper layer is a circuit board having a plurality of cycles, the circuit design of each cycle is the same, when the upper layer circuit board is designed with positive and negative power supply main lines from the head to the tail, the conducting connection point between the upper layer circuit board and the lower layer circuit board is arranged at a cycle position or at a plurality of cycle positions, the upper layer circuit board and the lower layer circuit board are connected and conducted at one cycle position or a plurality of cycle positions, and when the upper layer circuit board is not designed with a positive power supply main line from the head to the tail, the conducting connection point is arranged at each cycle between the upper layer circuit board and the lower layer circuit board and the conducting connection point is formed.
11. A discontinuous layered flexible laminated circuit board strip as claimed in claim 1, wherein the conduction between the upper and lower layers of circuit boards is a contact conduction between the upper and lower layers of circuit boards formed by bare metal at the layered position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921680896.7U CN211821838U (en) | 2019-09-27 | 2019-09-27 | Discontinuous layered flexible laminated circuit board lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921680896.7U CN211821838U (en) | 2019-09-27 | 2019-09-27 | Discontinuous layered flexible laminated circuit board lamp strip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112576963A (en) * | 2019-09-27 | 2021-03-30 | 王定锋 | Discontinuously layered flexible laminated circuit board lamp strip and manufacturing method thereof |
| CN112770544A (en) * | 2020-12-16 | 2021-05-07 | 中山市立体光电科技有限公司 | Manufacturing method of composite flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112576963A (en) * | 2019-09-27 | 2021-03-30 | 王定锋 | Discontinuously layered flexible laminated circuit board lamp strip and manufacturing method thereof |
| CN112770544A (en) * | 2020-12-16 | 2021-05-07 | 中山市立体光电科技有限公司 | Manufacturing method of composite flexible circuit board |
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