CN106455472A - Method for manufacturing high heat radiation LED circuit board bulb module group - Google Patents
Method for manufacturing high heat radiation LED circuit board bulb module group Download PDFInfo
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- CN106455472A CN106455472A CN201610620900.5A CN201610620900A CN106455472A CN 106455472 A CN106455472 A CN 106455472A CN 201610620900 A CN201610620900 A CN 201610620900A CN 106455472 A CN106455472 A CN 106455472A
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- Prior art keywords
- circuit board
- led
- bulb
- heat dissipation
- module
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- 238000004519 manufacturing process Methods 0.000 title claims abstract 9
- 238000000034 method Methods 0.000 title claims abstract 4
- 230000005855 radiation Effects 0.000 title abstract 7
- 229910052751 metal Inorganic materials 0.000 claims abstract 37
- 239000002184 metal Substances 0.000 claims abstract 37
- 239000000758 substrate Substances 0.000 claims abstract 18
- 229910000679 solder Inorganic materials 0.000 claims abstract 9
- 238000005452 bending Methods 0.000 claims abstract 5
- 239000010410 layer Substances 0.000 claims 32
- 230000017525 heat dissipation Effects 0.000 claims 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 7
- 239000011889 copper foil Substances 0.000 claims 6
- 238000003466 welding Methods 0.000 claims 4
- 239000003292 glue Substances 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 238000005520 cutting process Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 2
- 239000007787 solid Substances 0.000 claims 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- 238000009423 ventilation Methods 0.000 claims 1
- 230000001795 light effect Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention relates to a method for manufacturing a high heat radiation LED circuit board bulb module group. According to the invention, the bulb module group includes a metal carrying plate, an insulating layer, a metal circuit layer, a solder mask layer, and a LED element which is welded to the metal circuit layer. The method is characterized by: parts of aforementioned components being provided with an insulating layer, a circuit layer, a solder mask layer and an element layer, the rest of the components exposing a large area of a heat radiation metal substrate outside an element surface, forming a high heat radiation LED circuit board module group with multiple surfaces for conducting heat radiation, vertically arranging one or more than one LED circuit board module groups in a bulb, or bending the one or more than one LED circuit board module groups and constituting a stereoscopic geometrical body and vertically disposing the stereoscopic geometrical body in the bulb, thus making a LED bulb using the high heat radiation LED circuit board bulb module group. According to the invention, heat produced by the LED element of the bulb module group and other electric devices thereof are rapidly transmitted to the metal carrier with large area exposed to the outside and further transmitted to the outside. The bulb module group effectively addresses the problem of heat radiation of LEDs, thus increasing the light effects of LEDs.
Description
Technical Field
The invention relates to the field of circuit boards and LED application, in particular to a manufacturing method of a high-heat-dissipation LED circuit board bulb module.
Background
In the LED circuit board bulb modules on the market, a heat dissipation metal base plate on the surface of a component for soldering an LED component or other power devices is usually blocked by multiple layers of an insulating layer, a circuit layer and a solder mask layer, or by the insulating layer, the circuit layer, the solder mask layer and packaging glue. The unblocked metal substrate only has the back without a circuit, so that the heat dissipation area is not large enough, the heat dissipation is not good, and the luminous efficiency of the LED is not high.
In order to overcome the defects, the LED circuit board bulb module with high heat dissipation is only provided with a part of insulating layer, a circuit layer and a solder mask layer on the surface of an element, and the rest part exposes the metal carrier out of the surface of the element in a large area, so that heat generated by an LED element and other power supply devices is quickly conducted to the exposed metal carrier with a large area and dissipated, the heat dissipation of the LED module is greatly improved, the light efficiency of an LED is improved, and the service life of the LED is prolonged
Disclosure of Invention
The invention relates to a manufacturing method of a high-heat-dissipation LED circuit board bulb module, which specifically comprises the following steps: a metal carrier plate; an insulating layer; a metal circuit layer; a solder resist layer; and an LED element or an LED element and other power supply devices soldered on the metal circuit layer. The LED bulb module is characterized in that an insulating layer, a circuit layer and a solder mask layer are arranged only on a circuit part and a part for welding an LED element or the LED element and other power supply devices, a metal carrier is exposed outside in a large area on the rest part to manufacture the LED circuit board bulb module with high heat dissipation, 1 or more than 1 LED circuit board bulb module with high heat dissipation is vertically arranged in a bulb, or 1 or more than 1 LED circuit board bulb module with high heat dissipation is bent or combined into a solid geometric body after being bent and then vertically arranged in the bulb to manufacture the LED bulb using the LED circuit board bulb module with high heat dissipation. According to the LED circuit board bulb module with high heat dissipation, heat generated by the LED elements and other power supply devices is quickly conducted to the large-area metal carrier exposed outside and dissipated from the periphery, so that the heat dissipation problem of the LED is effectively solved, and the lighting effect of the LED is improved.
The invention provides a manufacturing method of a high-heat-dissipation LED circuit board bulb module, which comprises the following steps: applying an insulating adhesive layer on a copper foil, cutting off the copper foil and the insulating adhesive layer at the position where a large area of the heat-dissipation metal substrate is required to be exposed, pasting the copper foil on the heat-dissipation metal substrate, etching the copper foil to manufacture a circuit, performing screen printing solder resist, exposing and leaving a bonding pad, exposing the large-area heat-dissipation metal substrate, performing surface treatment on a welding spot, and performing SMT (surface mount technology) welding on an LED lamp or an LED lamp and other power supply elements to manufacture a high-heat-dissipation LED circuit board bulb module; the copper foil covers one surface of the heat dissipation metal substrate, a high-heat-dissipation single-sided LED circuit board module is manufactured, the manufactured high-heat-dissipation single-sided LED circuit board module is bent into a geometric shape, and the multi-surface light-emitting high-heat-dissipation LED circuit board bulb module is manufactured; or the copper foil covers two sides of the heat dissipation metal substrate to manufacture the LED circuit board module with circuits on two sides, the LEDs are welded on the two sides to manufacture the high-heat-dissipation double-side light-emitting LED circuit board module, and the high-heat-dissipation double-side light-emitting LED circuit board module can be directly assembled in an LED bulb or can be assembled in the LED bulb after being bent into a geometric body.
The invention also provides a manufacturing method of the LED circuit board bulb module with high heat dissipation, which comprises the following steps: after the back of the manufactured single-sided flexible circuit board is coated with glue, the single-sided flexible circuit board and the glue which need to be exposed out of the position of the heat dissipation metal substrate in a large area are cut off, then the single-sided flexible circuit board and the glue are attached to the heat dissipation metal substrate, baked and cured, and after the surface of a welding spot is treated, an LED lamp or an LED lamp and other power supply elements are welded to manufacture a high-heat-dissipation LED circuit board bulb module; sticking a single-sided flexible circuit board on one side of the radiating metal substrate to manufacture a high-radiating single-sided LED circuit board module, bending the manufactured high-radiating single-sided LED circuit board module into a geometric shape, and manufacturing a multi-surface luminous high-radiating LED circuit board bulb module; or the flexible circuit boards are pasted on the two surfaces of the radiating metal substrate to manufacture the LED circuit board module with circuits on the two surfaces, the LEDs are welded on the two surfaces to manufacture the high-radiating double-sided luminous LED circuit board module, and the high-radiating double-sided luminous LED circuit board module can be directly assembled in the LED bulb or can be assembled in the LED bulb after being bent into a geometric body.
According to the invention, the invention also provides a high-heat-dissipation LED circuit board bulb module, which comprises: a heat-dissipating metal substrate; an insulating layer; a metal circuit layer; a solder resist layer; the LED element or the LED element and other power supply devices are welded on the bonding pad of the metal circuit layer; the LED circuit board bulb module is characterized in that an insulating layer, a circuit layer, a solder mask layer and an element layer are arranged in only one part of the area, and the rest part exposes the radiating metal substrate out of the element surface in a large area to form a multi-surface radiating high-radiating LED circuit board bulb module.
According to the invention, the invention also provides a high-heat-dissipation LED circuit board bulb module, which comprises: a heat dissipation metal substrate disposed in the middle; insulating layers respectively arranged on two sides of the heat dissipation metal substrate; metal circuit layers respectively arranged on the two insulating layers; solder mask layers respectively arranged on the two surfaces; LED elements or LED elements and other power supply devices which are respectively welded on the bonding pads of the two metal circuit layers; the LED circuit board bulb module comprises a heat dissipation metal substrate, wherein an insulating layer, a circuit layer, a solder mask layer and an element layer are arranged on two sides of the heat dissipation metal substrate only in partial positions, and a metal carrier is exposed out of the element surface in a large area by the rest parts to form a multi-surface heat dissipation high-heat dissipation LED circuit board bulb module.
According to a preferred embodiment of the invention, the high heat dissipation LED circuit board bulb module is characterized in that the heat dissipation metal substrate is cut off a small part of metal in advance at a position corresponding to a bend or at a position exposed from the heat dissipation metal substrate according to design requirements to form a hole convenient for bending or ventilation and heat dissipation.
According to a preferred embodiment of the invention, the LED circuit board bulb module with high heat dissipation performance is characterized in that the LED is an LED flip chip or a packaged LED chip element.
According to a preferred embodiment of the present invention, the LED board light bulb module with high heat dissipation performance is characterized in that the LED element is an LED chip, and is connected to the circuit pad by a bonding wire, and the bonding wire is a bonding wire between chips and/or a bonding wire between the chips and the pad.
According to a preferred embodiment of the present invention, the LED circuit board and bulb module with high heat dissipation performance is characterized in that the metal carrier plate is aluminum, aluminum alloy, copper alloy, or electroplated copper.
According to a preferred embodiment of the invention, the circuit board bulb module with high heat dissipation performance is characterized in that the other power supply devices are patch power supply devices, and the other power supply devices and the LED element are patch-welded and conducted on the same circuit board together to form the LED circuit board bulb module with the light source device and the power supply device integrated.
According to a preferred embodiment of the present invention, the other power supply element is a patch power supply element and/or a pin power supply element, the patch element and the LED element are together patch-welded and conducted on the surface of the same circuit board, the pin element is welded on the pad hole, and the back metal carrier at the pad hole has been removed or a small piece of insulating board is adhered, so as to form the LED circuit board bulb module with the light source device and the power source device integrated.
According to a preferred embodiment of the invention, the high heat dissipation LED pcb lamp module is characterized in that a module pcb on the LED pcb lamp module is provided with an extended flexible pcb, and the extended flexible pcb is directly soldered to a wiring position on the power pcb to form a light source and power integrated pcb lamp module.
According to a preferred embodiment of the invention, the high heat dissipation LED circuit board bulb module is characterized in that 1, or more than 1, of the high heat dissipation LED circuit board bulb modules are vertically arranged in a bulb.
According to a preferred embodiment of the present invention, the LED pcb lamp module with high heat dissipation is characterized in that 1 or more than 1 LED pcb lamp module with high heat dissipation is bent into a solid geometry, or is bent and combined into a solid geometry and then erected in a lamp.
According to a preferred embodiment of the invention, the LED circuit board bulb module with high heat dissipation is characterized in that when the metal circuit layers respectively arranged on the two insulating layers need to be conducted with circuits on two sides, the metal circuit layers bypass the edge of the circuit board, and are conducted by welding metal conductors or by welding elements.
According to a preferred embodiment of the invention, when the metal circuit layers respectively arranged on the two insulating layers need to conduct the circuits on two sides, the two circuit layers are adhered together at the periphery of the circuit board or in the middle of the circuit board through the two insulating layers, the adhesion position does not have a metal carrier plate, the adhesion position has pads which are opened at two sides and close to each other, and the two pads are conducted by soldering tin or welding conductors.
According to a preferred embodiment of the present invention, the method for manufacturing a high heat dissipation LED circuit board bulb module is characterized in that when the metal circuit layers respectively disposed on the insulating layers on the two sides require two-sided circuit conduction, at least one circuit layer and the insulating layer are extended out of the metal carrier plate at the edge of the circuit board to form a flexible circuit, and the flexible circuit is bent to bypass the edge of the circuit board and is soldered to the solder joint on the other side of the circuit board to form conduction.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a high heat dissipation LED circuit board bulb module with one side emitting light.
Fig. 2 is a schematic cross-sectional view of "fig. 1".
Fig. 3 is a schematic plan view of another two-sided light-emitting high-heat-dissipation LED circuit board bulb module, in which metal conductors are used to bypass the edge of the circuit board to solder and connect the two-sided circuits.
Fig. 4 is a schematic cross-sectional view of "fig. 3".
Fig. 5 is a schematic plan view of a double-sided LED circuit board bulb module with high heat dissipation, in which a flexible circuit board is extended from both sides, the extended circuit board is bonded together beyond a metal carrier board, and circuits on both sides are soldered and conducted through via holes.
Fig. 6 is a schematic cross-sectional view of "fig. 5".
Fig. 7 is a schematic plan view of another two-sided light-emitting high-heat-dissipation LED circuit board bulb module, in which one side of the LED circuit board extends to lead out a flexible circuit board, and the flexible circuit board is bent and wound to the other side of the LED circuit board bulb module and is soldered and conducted with a circuit on the other side of the LED circuit board bulb module.
Fig. 8 is a schematic cross-sectional view of "fig. 7".
Fig. 9 is a schematic plan view of a high heat dissipation LED circuit board bulb module with LEDs soldered on only one side.
Fig. 10 is a perspective view of the high heat dissipation LED circuit board bulb module set vertically placed in a bulb.
Fig. 11 is a schematic perspective view of two LED circuit board bulb modules with high heat dissipation, which are bent and assembled into a solid geometry and then erected in a bulb.
Fig. 12 is a schematic perspective view of the LED circuit board bulb module with high heat dissipation, one surface of which is welded with LEDs, of fig. 9, which is bent into a solid geometry and then erected in a bulb.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Detailed description of the preferred embodiment
In fig. 1 and 2, a mark (1) is a circuit board, which is composed of an insulating layer, a circuit layer and a solder resist layer; the mark (2) is an LED element; the mark (3) is a heat dissipation metal carrier plate; the label (3.1) is the exposed area of the heat dissipation metal carrier plate.
As shown in fig. 1, 2 and 9, only in the region corresponding to the soldering of the LED element (2) or the LED element (2) and other power devices, a small portion of the circuit board (1) adhered to the heat dissipation metal carrier plate (3) is left on one surface of the heat dissipation metal carrier plate (3), so that most of the region (3.1) on the front surface of the heat dissipation metal carrier plate (3) is exposed, and the back surface of the heat dissipation metal carrier plate (3) is completely exposed, and the specific manufacturing method thereof is as follows:
1. firstly coating a layer of glue on the back of a single-sided flexible copper-clad plate, punching by using a die which is designed according to engineering data in advance, removing the single-sided flexible copper-clad plate at an exposed area (3.1), then pasting on an aluminum plate, carrying out hot pressing at 180 ℃ and 120kg for 120 seconds, and baking and curing at 150 ℃ for 60 minutes to prepare the aluminum-based copper-clad substrate.
2. Printing alkaline etching resistant circuit ink on the copper surface of an aluminum-based copper-clad substrate, baking and curing, etching a circuit on an alkaline etching production line, removing the circuit ink by using etching resistant aluminum-containing ink removing liquid, silk-screening solder resist on the circuit, baking and curing, performing oxidation resistant treatment on the surface of the OSP, and punching the shape to manufacture the aluminum-based circuit board.
3. The traditional SMT welding component mounting method is adopted, solder paste is printed on a welding pad of a welding component by using a steel mesh on an aluminum-based circuit board, an SMT chip mounter is used for mounting an LED component on the welding pad printed with the solder paste, the LED component is welded on the aluminum-based circuit board through reflow soldering to manufacture a high-heat-dissipation LED circuit board bulb module, then the high-heat-dissipation LED circuit board bulb module shown in figure 9 is bent into a high-heat-dissipation LED circuit board bulb module with an eight-pyramid upper part and an eight-prism lower part, and then the high-heat-dissipation LED circuit board bulb module is assembled in a bulb to manufacture an LED bulb (shown in figure 12) manufactured by the high-heat-dissipation LED circuit board bulb module. The LED circuit board bulb module with the high heat dissipation structure enables heat generated by LED elements and other power supply devices to be quickly conducted to the large-area heat dissipation metal carrier plate (3) exposed on the front side and the back side to be dissipated, effectively improves heat dissipation of the LED, and accordingly improves lighting effect and service life of the LED.
Detailed description of the invention
In fig. 3, 4, 5, 6, 7 and 8, the mark (1) is a circuit board, which is composed of an insulating layer, a circuit layer and a solder resist layer; the mark (1.1) is a metal conductor which bypasses the edge of the circuit board; the mark (1.2) is a flexible circuit board with two surfaces extending out and exceeding the metal carrier board to be bonded together; the mark (1.3) is a structure which is welded and conducted by a flexible circuit board, wherein the two sides of the flexible circuit board extend out and exceed the metal carrier board and are bonded together through a conducting hole; the mark (1.4) is a flexible circuit board with one surface extending out, is bent and wound to the other surface and is welded and conducted with the circuit on the other surface; the mark (2) is an LED element; the mark (3) is a heat dissipation metal carrier plate; the label (3.1) is the exposed area of the heat dissipation metal carrier plate. The other specific manufacturing method is as follows:
1. coating a layer of glue on the back surface of each single-sided flexible circuit board to be attached to the two surfaces of the heat dissipation metal carrier plate (3), and then punching by using a die which is designed and manufactured in advance according to engineering data to remove the part of the single-sided flexible circuit board at the exposed area (3.1).
2. The heat-dissipating metal carrier plate (3) is die-cut to remove unwanted portions of aluminum.
3. And aligning and pasting the two punched single-sided flexible circuit boards to two sides of the punched heat dissipation metal carrier board (3), hot-pressing for 120 seconds at the temperature of 180 ℃ and under the pressure of 120kg, baking and curing for 60 minutes at the temperature of 150 ℃, then carrying out OSP surface anti-oxidation treatment, punching the appearance and manufacturing the aluminum-based circuit board with two sides.
4. Firstly, an LED element is pasted and welded on one surface of an aluminum-based double-sided circuit board by SMT, firstly, red glue is pasted at a bonding pad hole needing to be conducted on two surfaces of the edge of the other surface, then, a solder paste is printed on the bonding pad of the welding element by using a steel mesh on one surface of the aluminum-based double-sided circuit board, the solder paste is also printed at the conducting hole, then, the LED element is pasted on the bonding pad printed with the solder paste by an SMT pasting machine, the LED element is welded on the aluminum-based circuit board by reflow soldering, and meanwhile, part of the solder is filled in the conducting. Tear the red glue off after that, seal the tin cream on welded element's pad with the steel mesh at the another side of aluminium base double-sided circuit board, the conducting hole department also prints the tin cream simultaneously, reuse SMT chip mounter pastes the LED component on the pad that is printed with the tin cream, cross reflow soldering with the LED component welding on aluminium base circuit board, the circuit board on the two sides of heat dissipation metal carrier board (3) simultaneously switches on through conducting hole welded connection, makes into the luminous high radiating LED circuit board bulb module in several kinds of two sides as follows, for example:
as shown in fig. 3 and 4, on both sides of the heat dissipation metal carrier plate (3), only in the area corresponding to the soldering of the LED element (2) or the LED element (2) and other power devices, a small portion of the conductive circuit board (1) adhered to the heat dissipation metal carrier plate (3) is left, so that the large area (3.1) on both sides of the heat dissipation metal carrier plate (3) is exposed, and the metal conductors (1.1) are respectively used to bypass the edge of the circuit board to weld and conduct the positive electrode and the positive electrode, and the negative electrode of the circuit board (1) on both sides of the heat dissipation metal carrier plate (3), thereby forming a high heat dissipation LED circuit board bulb module with two-side light emission.
As shown in fig. 5 and 6, on both sides of the heat dissipation metal carrier plate (3), only in the region corresponding to the soldering of the LED element (2) or the LED element (2) and other power devices, a small portion of the conductive circuit board (1) adhered to the heat dissipation metal carrier plate (3) is left, so that the large portion region (3.1) on both sides of the heat dissipation metal carrier plate (3) is exposed, the flexible circuit board (1.2) extended out from both sides of the heat dissipation metal carrier plate (3) and adhered to exceed the metal carrier plate (3) is formed, and through the via welding, the conductive structure (1.3) is formed to respectively conduct the positive electrode and the positive electrode of the circuit board (1) on both sides of the heat dissipation metal carrier plate (3), and the negative electrode are welded to form another high heat dissipation LED circuit board bulb module with two sides emitting light.
As shown in fig. 7 and 8, only in the area corresponding to the soldering of the LED element (2) or the LED element (2) and other power devices, a small portion of the conductive circuit board (1) adhered to the heat dissipation metal carrier plate (3) is left on both sides of the heat dissipation metal carrier plate (3), so that the large area (3.1) on both sides of the heat dissipation metal carrier plate (3) is exposed, a flexible circuit board (1.4) is extended from one side of the heat dissipation metal carrier plate (3), bent and wound to the other side, and soldered to the circuit on the other side, and the positive electrode, the negative electrode and the negative electrode of the circuit board (1) on both sides of the heat dissipation metal carrier plate (3) are respectively soldered and conducted to form another high heat dissipation LED circuit board bulb module with two light emitting surfaces.
Then directly assembling and installing the high-heat-dissipation LED circuit board bulb module in a bulb to manufacture an LED bulb made of the high-heat-dissipation LED circuit board bulb module (as shown in figure 10), and in addition, respectively bending two high-heat-dissipation LED circuit board bulb modules into an L-shaped LED circuit board bulb module, then combining the two L-shaped LED circuit board bulb modules into an X-shaped body, and then assembling and installing the X-shaped LED circuit board bulb module in the bulb to manufacture an LED bulb of the X-shaped module made of the high-heat-dissipation LED circuit board bulb module (as shown in figure 11).
The LED circuit board bulb module with the high heat dissipation structure enables heat generated by the LED elements and other power devices to be quickly conducted to the exposed large-area heat dissipation metal carrier plate (3) on the front side and the back side to be dissipated, so that the heat dissipation problem of the LED is effectively solved, and the luminous efficiency of the LED is improved.
The invention is described in detail with reference to the accompanying drawings by using a specific embodiment of a method for manufacturing a high-heat-dissipation LED circuit board bulb module. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and is not intended to limit the scope of the invention, particularly the scope of the claims.
Claims (16)
1. A manufacturing method of a high-heat-dissipation LED circuit board bulb module comprises the following steps:
applying an insulating adhesive layer on a copper foil, cutting off the copper foil and the insulating adhesive layer at the position where a large area of the heat-dissipation metal substrate needs to be exposed, pasting the copper foil on the heat-dissipation metal substrate, etching the copper foil to manufacture a circuit, performing screen printing solder resist, exposing a bonding pad, exposing the large-area heat-dissipation metal substrate, performing surface treatment on a welding spot, and performing SMT (surface mount technology) welding on an LED lamp or an LED lamp and other power supply elements to manufacture a high-heat-dissipation LED circuit board bulb module;
the cut copper foil covers one surface of the heat dissipation metal substrate, then a high-heat-dissipation single-sided LED circuit board module is manufactured, the manufactured high-heat-dissipation single-sided LED circuit board module is bent into a geometric shape, and then the high-heat-dissipation LED circuit board bulb module with multi-surface light emitting is manufactured; or,
the cut copper foil covers two surfaces of the heat dissipation metal substrate, then an LED circuit board module with circuits on two surfaces is manufactured, LEDs are welded on two surfaces, the high-heat-dissipation double-surface light-emitting LED circuit board module is manufactured, and the high-heat-dissipation double-surface light-emitting LED circuit board module can be directly assembled in an LED bulb or can be assembled in the LED bulb after being bent into a geometric body.
2. A manufacturing method of a high-heat-dissipation LED circuit board bulb module comprises the following steps:
after the back of the manufactured single-sided flexible circuit board is coated with glue, the single-sided flexible circuit board and the glue which need to be exposed out of the position of the heat dissipation metal substrate in a large area are cut off, then the single-sided flexible circuit board and the glue are attached to the heat dissipation metal substrate, baked and cured, and after the surface of a welding spot is treated, an LED lamp or an LED lamp and other power supply elements are welded to manufacture a high-heat-dissipation LED circuit board bulb module;
sticking the cut single-sided flexible circuit board on one side of the radiating metal substrate, then manufacturing a high-radiating single-sided LED circuit board module, bending the manufactured high-radiating single-sided LED circuit board module into a geometric shape, and manufacturing a multi-surface luminous high-radiating LED circuit board bulb module; or,
the cut flexible circuit boards are adhered to two sides of the heat dissipation metal substrate, then the LED circuit board module with circuits on two sides is manufactured, LEDs are welded on two sides, the high-heat-dissipation double-side light-emitting LED circuit board module is manufactured, and the high-heat-dissipation double-side light-emitting LED circuit board module can be directly assembled in an LED bulb or assembled in the LED bulb after being bent into a geometric body.
3. The utility model provides a high radiating LED circuit board bulb module, includes:
a heat-dissipating metal substrate;
an insulating layer;
a metal circuit layer;
a solder resist layer;
the LED element or the LED element and other power supply devices are welded on the bonding pad of the metal circuit layer;
the LED circuit board module comprises a heat dissipation metal substrate, an insulation layer, a circuit layer, a solder mask layer and an element layer, wherein the insulation layer, the circuit layer, the solder mask layer and the element layer are arranged in only one part of the area, and the heat dissipation metal substrate is exposed out of the element surface in a large area by the rest part of the area to form a multi-surface heat dissipation high-heat-. And then bending to form the multi-surface luminous high-heat-dissipation LED circuit board bulb module.
4. The utility model provides a high radiating LED circuit board bulb module, includes:
a heat dissipation metal substrate disposed in the middle;
insulating layers respectively arranged on two sides of the heat dissipation metal substrate;
metal circuit layers respectively arranged on the two insulating layers;
solder mask layers respectively arranged on the two surfaces;
LED elements or LED elements and other power supply devices which are respectively welded on the bonding pads of the two metal circuit layers;
the LED circuit board bulb module is characterized in that an insulating layer, a circuit layer, a solder mask layer and an element layer are arranged on two sides of the radiating metal substrate only in partial positions, and the metal carrier is exposed out of the element surface in a large area by the rest parts to form the multi-surface high-radiating multi-surface luminous LED circuit board bulb module.
5. The LED circuit board bulb module with high heat dissipation of claim 1, or 2, or 3, or 4, wherein the heat dissipation metal substrate is formed with holes for facilitating bending or ventilation and heat dissipation by cutting off a small portion of metal in advance at a position corresponding to bending or at a position where the heat dissipation metal substrate is exposed according to design requirements.
6. The LED circuit board bulb module with high heat dissipation performance as recited in claim 1, 2, 3 or 4, wherein the LED is an LED flip chip or a packaged LED chip element.
7. The LED circuit board bulb module with high heat dissipation performance as claimed in claim 1, 2, 3 or 4, wherein the LED element is an LED forward-mounted chip and is connected to the circuit pad by wire bonding, and the wire bonding is a wire bonding between chips and/or a wire bonding connection between the chip and the pad.
8. The LED circuit board bulb module with high heat dissipation performance as recited in claim 1, or 2, or 3, or 4, wherein the metal carrier plate is aluminum, or aluminum alloy, or copper alloy, or electroplated copper.
9. The PCB lamp bulb module with high heat dissipation performance as claimed in claim 1, 2, 3 or 4, wherein the other power devices are patch power devices, and the other power devices are patch-welded together with the LED element and conducted on the same PCB to form the LED PCB lamp bulb module with the light source device and the power device integrated.
10. The light bulb module with high heat dissipation of claim 1, 2, 3 or 4, wherein the other power supply components are patch power supply components and/or pin power supply components, the patch components and the LED components are together patch-welded and conducted on the surface of the same circuit board, the pin components are welded on the pad holes, and the metal carrier on the back side of the pad holes is removed or a small piece of insulating board is adhered, so as to form the LED light bulb module with integrated light source device and power supply device.
11. The LED breadboard bulb module with high heat dissipation as recited in claim 1, 2, 3 or 4, characterized in that the module breadboard on the LED breadboard bulb module is provided with an extended flexible printed circuit, and the extended flexible printed circuit is directly soldered at the wiring position on the power breadboard to form a breadboard bulb module with integrated light source and power supply.
12. The LED circuit board bulb module with high heat dissipation of claim 1, 2, 3 or 4, wherein 1 or more than 1 LED circuit board bulb module with high heat dissipation is vertically arranged in a bulb.
13. The LED circuit board bulb module with high heat dissipation of claim 1, 2, 3 or 4, wherein 1 or more than 1 LED circuit board bulb module with high heat dissipation is bent into a solid geometric shape, or is bent and combined into a solid geometric shape and then is erected in a bulb.
14. The LED circuit board bulb module with high heat dissipation of claim 4, wherein when the metal circuit layers respectively disposed on the two insulating layers need to conduct the two circuits, the metal circuit layers are routed around the edge of the circuit board, and the metal conductors are soldered or the components are soldered.
15. The LED circuit board bulb module with high heat dissipation of claim 4, wherein when the metal circuit layers respectively disposed on the two insulating layers need to conduct the two-sided circuit, the two circuit layers are bonded together at the periphery of the circuit board or at the middle of the circuit board through the two insulating layers, the bonding position has no metal carrier plate, the bonding position has pads which are opened at two sides and close to each other, and the two pads are conducted by soldering tin or by welding conductors.
16. The method as claimed in claim 4, wherein when the metal circuit layers respectively disposed on the insulating layers on both sides need to be connected to the circuit on both sides, the metal carrier plate is extended from at least one of the circuit layers and the insulating layer at the edge of the circuit board to form a flexible circuit, and the flexible circuit is bent around the edge of the circuit board and soldered to the solder joint on the other side of the circuit board to form a connection.
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| CN201610620900.5A CN106455472A (en) | 2016-07-28 | 2016-07-28 | Method for manufacturing high heat radiation LED circuit board bulb module group |
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