CN106455472A - Method for manufacturing high heat radiation LED circuit board bulb module group - Google Patents
Method for manufacturing high heat radiation LED circuit board bulb module group Download PDFInfo
- Publication number
- CN106455472A CN106455472A CN201610620900.5A CN201610620900A CN106455472A CN 106455472 A CN106455472 A CN 106455472A CN 201610620900 A CN201610620900 A CN 201610620900A CN 106455472 A CN106455472 A CN 106455472A
- Authority
- CN
- China
- Prior art keywords
- led
- circuit board
- bulb
- module
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention relates to a method for manufacturing a high heat radiation LED circuit board bulb module group. According to the invention, the bulb module group includes a metal carrying plate, an insulating layer, a metal circuit layer, a solder mask layer, and a LED element which is welded to the metal circuit layer. The method is characterized by: parts of aforementioned components being provided with an insulating layer, a circuit layer, a solder mask layer and an element layer, the rest of the components exposing a large area of a heat radiation metal substrate outside an element surface, forming a high heat radiation LED circuit board module group with multiple surfaces for conducting heat radiation, vertically arranging one or more than one LED circuit board module groups in a bulb, or bending the one or more than one LED circuit board module groups and constituting a stereoscopic geometrical body and vertically disposing the stereoscopic geometrical body in the bulb, thus making a LED bulb using the high heat radiation LED circuit board bulb module group. According to the invention, heat produced by the LED element of the bulb module group and other electric devices thereof are rapidly transmitted to the metal carrier with large area exposed to the outside and further transmitted to the outside. The bulb module group effectively addresses the problem of heat radiation of LEDs, thus increasing the light effects of LEDs.
Description
Technical field
The present invention relates to wiring board art and LED application, and in particular to a kind of LED circuit board bulb mould of high radiating
The manufacture method of group.
Background technology
LED circuit board bulb module on the market, is all generally to weld LED element or LED element and other electricity now
The heat radiating metal base plate of the component side of source device side by insulating barrier, circuit layer and solder mask multilayer barrier, or by insulating barrier, electricity
Road floor, solder mask and packaging plastic water resistance gear.The only metal basal board not being blocked does not have the back side of circuit, and area of dissipation is inadequate
Greatly, radiate bad, the light efficiency so as to cause LED is not high.
In order to overcome the shortcomings of above defect, the LED circuit board bulb module of the high radiating of the present invention, only in component side
Partial insulative layer, circuit layer and solder mask is provided with, remainder will be large-area for metallic carrier exposed outside component side so as to
The heat that LED element and other power supply apparatus are produced rapidly is conducted to the large-area metallic carrier of exposed multiaspect, dissipates
Send out, the radiating of the module of LED is greatly increased, so as to improve light efficiency and the service life of LED
Content of the invention
The present invention relates to a kind of manufacture method of the LED circuit board bulb module of high radiating, specifically, including：Metal
Carrier board；Insulating barrier；Metal circuitry；Solder mask；With the LED element being welded on metal circuitry or LED element and other
Power supply apparatus.It is characterized in that, only arrange at the position of circuit part and welding LED element or LED element and other power supply apparatus
Have insulating barrier, circuit layer and solder mask, remainder by large-area for metallic carrier exposed outside, be fabricated to a kind of high radiating
LED circuit board bulb module, the high-heat-dispersion LED wiring board bulb module of 1 or more than 1 is erect and is placed in bulb
In or the high-heat-dispersion LED wiring board bulb module of 1 or more than 1 is bent into or bending after combination set up
It is erected in after body geometrical body in bulb, is fabricated to a kind of LED bulb of the LED circuit board bulb module with high radiating.This
The LED circuit board bulb module of bright high radiating so as to which the heat that LED element and other power supply apparatus are produced rapidly is conducted to
Exposed large-area metallic carrier is distributed from surrounding, effectively solves the heat dissipation problem of LED, so as to improve
The light efficiency of LED.
According to the invention provides a kind of high radiating LED circuit board bulb module manufacture method, including：Copper Foil is applied
Plus insulation glue-line, it would be desirable to large area expose the Copper Foil at heat radiation metal substrate position apply and insulate glue-line cut off, be attached to radiating
On metal basal board, circuit produced by etching Copper Foil, and silk-screen welding resistance is exposed and leaves pad, exposes large-area heat radiation metal substrate,
Pad surface is processed, and SMT welds LED or LED and other source elements, is fabricated to a kind of LED circuit board of high radiating
Bulb module；The Copper Foil overlays on the one side of heat radiation metal substrate, then is fabricated to the high one side LED circuit board module for radiating, will
The one side LED circuit board module of the high radiating that makes is bent into a geometrical body shape, and making becomes the high radiating of multifaceted light-emitting
LED circuit board bulb module；Or, the Copper Foil overlays on the two sides of heat radiation metal substrate and is fabricated to two sides the LED of circuit
Wiring board module, all welds LED on two sides, is fabricated to the LED circuit board module of the double-side of high radiating, can direct-assembling
Assembled in LED bulb again in LED bulb or after being bent into geometrical body.
According to present invention also offers a kind of high radiating LED circuit board bulb module manufacture method, including：Made
After the single side floppy back of circuit board gluing for performing, it would be desirable to which large area exposes the single side floppy electricity at heat radiation metal substrate position
Road plate and glue cut off, and are then attached on heat radiation metal substrate, baking-curing, after pad surface is processed, weld LED or LED
Lamp and other source elements, are fabricated to a kind of LED circuit board bulb module of high radiating；In described heat radiation metal substrate one
Single side floppy circuit board is pasted in face, makes the one side LED circuit board module of high radiating, by the one side LED line of the high radiating that makes
Road template die group is bent into a geometrical body shape, makes the LED circuit board bulb module of the high radiating for becoming multifaceted light-emitting；Or,
Flexible circuit board is all pasted on the two sides of described heat radiation metal substrate, being fabricated to two sides has the LED circuit board module of circuit,
LED is all welded on two sides, is fabricated to the LED circuit board module of the double-side of high radiating, can direct-assembling in LED bulb
In or assembled in LED bulb again after being bent into geometrical body.
According to present invention also offers a kind of LED circuit board bulb module of high radiating, including：Heat radiation metal substrate；Absolutely
Edge layer；Metal circuitry；Solder mask；The LED element being welded on metal circuitry pad or LED element and other power devices
Part；Wherein, insulating barrier, circuit layer, solder mask and element layer are provided with only a part of region, remainder is by heat radiating metal base
Plate large area is exposed outside component side, forms the high-heat-dispersion LED wiring board bulb module of multiaspect radiating.
According to present invention also offers a kind of LED circuit board bulb module of high radiating, including：It is arranged on the radiating of centre
Metal basal board；It is separately positioned on the insulating barrier on heat radiation metal substrate two sides；The metallic circuit being separately positioned on the insulating barrier of two sides
Layer；It is separately positioned on the solder mask on two sides；The LED element being respectively welded on the metal circuitry pad of two sides or LED element and
Other power supply apparatus；Wherein, on the two sides of the heat radiation metal substrate, only portion be provided with insulating barrier, circuit layer and
Solder mask and element layer, remainder forms the high-heat-dispersion LED of multiaspect radiating by exposed for metallic carrier large area outside component side
Wiring board bulb module.
According to a preferred embodiment of the present invention, described high-heat-dispersion LED wiring board bulb module, it is characterised in that
The heat radiation metal substrate, according to design requirement, at the corresponding position of bending or be in the exposed position of heat radiation metal substrate
The place of putting cuts off small part metal in advance and formed to be easy to bending or is easy to the hole of ventilation and heat.
According to a preferred embodiment of the present invention, the LED circuit board bulb module of described a kind of high radiating, its feature
It is, described LED is LED flip chip or is packaged LED surface mount elements.
According to a preferred embodiment of the present invention, the LED circuit board bulb module of described a kind of high radiating, its feature
Be, described LED element is the positive cartridge chip of LED, it be conducting on circuit land by bonding wire welding, described bonding wire is
Between chip, between bonding wire, and/or chip and pad, bonding wire is connected conducting.
According to a preferred embodiment of the present invention, the LED circuit board bulb module of described a kind of high radiating, its feature
It is, described metallic carrier plate is aluminum or aluminium alloy or copper or copper alloy or the copper after plating.
According to a preferred embodiment of the present invention, the wiring board bulb module of described a kind of high radiating, its feature exists
In other power supply apparatus described are paster power supply apparatus, are turned on same wiring board with the welding of LED element together paster
, form the LED circuit board bulb module of light source device and power supply apparatus integration.
According to a preferred embodiment of the present invention, the wiring board bulb module of described a kind of high radiating, its feature exists
It is paster source element, and/or pin source element in, other source elements described, surface mount elements and LED element paster together
Welding conducting is on the surface of same wiring board, and pin member is welded in pad hole, and the back metal carrier at pad hole
Have been removed by or be the insulation board of having pasted small pieces, formation be light source device and power supply apparatus integration LED line
Road plate bulb module.
According to a preferred embodiment of the present invention, described high-heat-dispersion LED wiring board bulb module, it is characterised in that
Module wiring board on LED circuit board bulb module is provided with the flexible circuit board that an extension is stretched out, and described extension is stretched out
Flexible circuit board be directly welded at the wiring position on power circuit plate, form the wiring board lamp of light source and power supply integration
Bubble module.
According to a preferred embodiment of the present invention, described high-heat-dispersion LED wiring board bulb module, it is characterised in that
The high-heat-dispersion LED wiring board bulb module of 1 or more than 1 is erect and is placed in bulb.
According to a preferred embodiment of the present invention, described high-heat-dispersion LED wiring board bulb module, it is characterised in that
The high-heat-dispersion LED wiring board bulb module of 1 or more than 1 is bent into after solid geometry body or bending and is combined
It is erected in bulb after becoming three-dimensional geometrical body.
According to a preferred embodiment of the present invention, the LED circuit board bulb module of described a kind of high radiating, its feature
It is, when the metal circuitry being separately positioned on the insulating barrier of two sides needs two sides circuit turn-on, by-pass edges of boards edge is taken,
The conducting of welding metal conductor or soldered elements conducting.
According to a preferred embodiment of the present invention, the LED circuit board bulb module of described a kind of high radiating, its feature
It is, when the metal circuitry being separately positioned on the insulating barrier of two sides needs two sides circuit turn-on, two sides circuit layer passes through two-layer
Insulating barrier assist side peripheral bond bonds together together or in the middle of assist side, abutting edge no metallic carrier plate, glues
There are the pad adjacent to each other that both sides are opened, the conducting of two pad scolding tin or weldering conductor conducting in the place of connecing.
According to a preferred embodiment of the present invention, the making of the LED circuit board bulb module of described a kind of high radiating
Method, it is characterised in that when the metal circuitry being separately positioned on the insulating barrier of two sides needs two sides circuit turn-on, takes near
Few one layer of circuit layer and insulating barrier assist side edge stretch out metallic carrier plate shape and become flexible circuit, bend by-pass edges of boards
Edge, welds on the solder joint of the another side for being conducting to wiring board and forms conducting.
In the following description to the drawings and specific embodiments, the thin of one or more embodiments of the invention will be illustrated
Section.
Description of the drawings
By reading this specification in conjunction with the following drawings, features, objects and advantages of the invention will become more to show and easy
See, accompanying drawing is briefly described as follows.
Fig. 1 is the floor map of the LED circuit board bulb module of the luminous high radiating of one side.
Fig. 2 is the schematic cross-section of " Fig. 1 ".
Fig. 3 is the LED circuit board bulb module of the high radiating of another kind of lighting at two sides, with metallic conductor by-pass edges of boards
Edge, two sides circuit is welded the floor map of conducting.
Fig. 4 is the schematic cross-section of " Fig. 3 ".
Fig. 5 draws a flexibility while extending for the LED circuit board bulb module of the height radiating of lighting at two sides, wherein two sides
Wiring board, is extended the wiring board that draws and is bonded together beyond metallic carrier plate, welded the circuit on conducting two sides by via
Floor map.
Fig. 6 is the schematic cross-section of " Fig. 5 ".
Fig. 7 is the LED circuit board bulb module of the high radiating of another kind of lighting at two sides, and it is soft that one side therein extends extraction one
Property wiring board, bend around another side, the floor map with the circuit welding conducting of another side.
Fig. 8 is the schematic cross-section of " Fig. 7 ".
Fig. 9 is the floor map for being only welded with the LED circuit board bulb module of the high radiating of LED in one side.
Figure 10 is that high-heat-dispersion LED wiring board bulb module erects the schematic perspective view being placed in bulb.
Figure 11 is to be erected in lamp with being combined into after solid geometry body after two high-heat-dispersion LED wiring board bulb module bendings
Schematic perspective view in bubble.
Figure 12 is that the LED circuit board bulb module of the high radiating that the one side of " Fig. 9 " is welded with LED is bent into solid geometry body
The schematic perspective view being erected in bulb afterwards.
Specific embodiment
By taking preferred embodiment as an example, the present invention will be described in detail below.
It should be appreciated to those skilled in the art that described below is merely illustrative and describes some sides of being preferable to carry out
Formula, does not have any restriction to the claim of the present invention.
Specific embodiment one
In Fig. 1, Fig. 2, mark (1) is wiring board, to be made up of insulating barrier, circuit layer and solder mask；Mark (2) is LED
Element；Mark (3) is heat radiating metal carrier board；Mark (3.1) is the exposed region of heat radiating metal carrier board.
As shown in Figure 1, Figure 2, shown in Fig. 9, in the one side of heat radiating metal carrier board (3), only in welding LED element (2) or
LED element (2) and the corresponding region portion of other power supply apparatus, leave one and least a portion of are pasted onto heat radiating metal carrier board (3)
On wiring board (1) so as to heat radiating metal carrier board (3) front major part region (3.1) exposed outside, while heat radiating metal
The back side of carrier board (3) all exposed outside, its concrete manufacture method is as follows：
1st, first in single side floppy copper-clad plate backside coating last layer glue, then with designing and producing previously according to engineering data
Good mould punching, removes the single side floppy copper-clad plate at exposed region (3.1) place, then is attached on aluminium sheet, with the temperature of 180 degree,
120kg pressure hot pressing 120 seconds, with 150 DEG C of temperature baking-curing 60 minutes, is fabricated to a kind of aluminium base and covers Copper base material.
2nd, cover in Copper base material in aluminium base, only on copper face, alkali resistant etching circuit ink is printed, baking-curing, then in alkali
Property etching production line on etch circuit, then strip circuit ink with the ink retreating liquid of the aluminum of erosion containing resistance, then silk-screen resistance on the line
Weldering, baking-curing, following OSP surface anti-oxidation is processed, and is punched profile, is fabricated to a kind of aluminum-based circuit board.
3rd, using the method for traditional SMT attachment soldered elements, in aluminum-based circuit board with steel mesh soldered elements weldering
Stamp tin cream on disk, then with SMT chip mounter, LED element is mounted on and is printed on the pad of tin cream, cross Reflow Soldering and LED element is welded
It is connected in aluminum-based circuit board, a kind of LED circuit board bulb module of high radiating is fabricated to, then by height radiating as shown in Figure 9
LED circuit board bulb module be bent into top for one or eight pyramids, bottom is the high radiating of a few body bodily forms of one or eight prisms
LED circuit board bulb module, reassemble assembling in the bulb, be fabricated to a kind of LED circuit board bulb of high radiator structure
The LED bulb (as shown in figure 12) that module is made.The LED circuit board bulb module of this high radiator structure so as to LED element and
The heat that other power supply apparatus are produced rapidly is conducted to large-area heat radiating metal carrier board (3) of exposed positive and negative
Distribute, the radiating of LED is effectively raised, so as to improve light efficiency and the service life of LED.
Specific embodiment two
In Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, mark (1) is wiring board, by insulating barrier, circuit layer and solder mask group
Become；Mark (1.1) is the metallic conductor of by-pass edges of boards edge；Mark (1.2) extends for two sides draws beyond metallic carrier plate
The flexible circuit board being bonded together；Mark (1.3) is to be welded by via, two sides is extended and is drawn beyond metallic carrier plate
The structure of the flexible circuitry plate weld conducting being bonded together；Mark (1.4) is that one side extends the flexible circuit board that draws, bending
Around another side, the structure with the circuit welding conducting of another side；Mark (2) is LED element；Mark (3) is carried for heat radiating metal
Body plate；Mark (3.1) is the exposed region of heat radiating metal carrier board.Its another kind of concrete manufacture method is as follows：
1st, will prepare each single side floppy circuit board on heat radiating metal carrier board (3) two sides is attached to, overleaf apply and be covered with one
Layer glue, then with the mould punching for designing and producing previously according to engineering data, removes the single side floppy at exposed region (3.1) place
Circuit plate part.
Heat radiating metal carrier board (3) the 2nd, is removed the part aluminum being not required to mould punching.
3rd, the single side floppy wiring board para-position after being punched two is attached to two of the heat radiating metal carrier board (3) after being punched
Face, with the temperature of 180 degree, 120kg pressure hot pressing 120 seconds, with 150 DEG C of temperature baking-curing 60 minutes, following OSP surface
Anti-oxidation process, is punched profile, is fabricated to a kind of two-sided road plate of aluminium base line.
4th, first in the one side SMT attachment welding LED element of aluminium base double-sided wiring board, need to lead on another side edge two sides first
Red glue is sticked at logical pad hole, is then stamped on the pad of soldered elements with steel mesh in the one side of aluminium base double-sided wiring board
Tin cream, also stamps tin cream at via, then is mounted on LED element with SMT chip mounter and is printed on the pad of tin cream, crosses Reflow Soldering
LED element is welded in aluminum-based circuit board, is simultaneously turned on Kong Liyi part and fill in tin welding.Then red glue is torn off, double in aluminium base
The another side steel mesh of face wiring board stamps tin cream on the pad of soldered elements, also stamps tin cream simultaneously, then use at via
LED element is mounted on and is printed on the pad of tin cream by SMT chip mounter, crosses Reflow Soldering and LED element is welded in aluminum-based circuit board,
While the wiring board on heat radiating metal carrier board (3) two sides is welded to connect conducting by via, it is fabricated to as described below several
The LED circuit board bulb module of the high radiating of lighting at two sides, for example：
As shown in Figure 3, Figure 4, on the two sides of heat radiating metal carrier board (3), only in welding LED element (2) or LED unit
Part (2) and the corresponding region portion of other power supply apparatus, stay one least a portion of be pasted onto on heat radiating metal carrier board (3) lead
Electric line plate (1) so as to which two sides major part region (3.1) of heat radiating metal carrier board (3) is exposed outside, uses metallic conductor respectively
(1.1) by-pass edges of boards edge is by the positive pole of the wiring board (1) on heat radiating metal carrier board (3) two sides and positive pole, negative pole and negative pole
Welding conducting, forms a kind of LED circuit board bulb module of the high radiating of lighting at two sides.
As shown in Figure 5, Figure 6, on the two sides of heat radiating metal carrier board (3), only in welding LED element (2) or LED unit
Part (2) and the corresponding region portion of other power supply apparatus, stay one least a portion of be pasted onto on heat radiating metal carrier board (3) lead
Electric line plate (1) so as to which two sides major part region (3.1) of heat radiating metal carrier board (3) is exposed outside, in heat radiating metal carrier
The two sides of plate (3) extends the flexible circuit board (1.2) that draws and be bonded together beyond metallic carrier plate (3), by via
Welding, forms conducting structure (1.3) and will bear in the positive pole of the wiring board (1) on heat radiating metal carrier board (3) two sides and positive pole respectively
Pole and negative pole welding conducting, form the LED circuit board bulb module of the high radiating of another kind of lighting at two sides.
As shown in Figure 7, Figure 8, on the two sides of heat radiating metal carrier board (3), only in welding LED element (2) or LED unit
Part (2) and the corresponding region portion of other power supply apparatus, stay one least a portion of be pasted onto on heat radiating metal carrier board (3) lead
Electric line plate (1) so as to which two sides major part region (3.1) of heat radiating metal carrier board (3) is exposed outside, in heat radiating metal carrier
The one side of plate (3) extends draws a flexible circuit board (1.4), bends around another side, welds with the circuit of another side, respectively will
In positive pole and the positive pole of the wiring board (1) on heat radiating metal carrier board (3) two sides, negative pole and negative pole welding are turned on, and are formed another kind of
The LED circuit board bulb module of the high radiating of lighting at two sides.
Then high-heat-dispersion LED wiring board bulb module direct-assembling is installed in the bulb, is fabricated to the high radiating of one kind
The LED bulb (as shown in Figure 10) that the LED circuit board bulb module of structure is made, in addition also can be by two high-heat-dispersion LED circuits
Plate bulb module is first bent into the LED circuit board bulb module of L geometrical body dress respectively, then by two L geometrical bodies
LED circuit board bulb module is combined into an X geometrical body, and then assembling is installed in the bulb, is fabricated to the high radiating of one kind
The LED bulb (as shown in figure 11) of the X geometrical body shape module that the LED circuit board bulb module of structure is made.
The LED circuit board bulb module of several high radiator structures described above so as to LED element and other power supply apparatus
The heat of generation is rapidly conducted to exposed positive and negative large-area heat radiating metal carrier board (3) and distributes, effectively
The heat dissipation problem for solving LED, so as to improve the light efficiency of LED.
Above in association with accompanying drawing by a kind of specific embodiment of the manufacture method of the LED circuit board bulb module of high radiating to this
Invention is described in detail.It will be understood by those skilled in the art, however, that the above is merely illustrative and describes
Some specific embodiments, to this with the scope of new scope, especially claim, do not have any restriction.
Claims (16)
1. the manufacture method of the LED circuit board bulb module of a kind of high radiating, including：
Copper Foil is applied insulation glue-line, it would be desirable to which large area exposes that the Copper Foil at heat radiation metal substrate position is applied and the glue-line that insulate is cut
Remove, be attached on heat radiation metal substrate, circuit produced by etching Copper Foil, silk-screen welding resistance, exposed pad, expose large-area radiating gold
Category substrate, pad surface is processed, and SMT welds LED or LED and other source elements, is fabricated to a kind of high radiating
LED circuit board bulb module；
Copper Foil after the excision overlays on the one side of heat radiation metal substrate, then is fabricated to the high one side LED circuit board module for radiating,
The one side LED circuit board module of the high radiating that makes is bent into a geometrical body shape, then making becomes the height of multifaceted light-emitting
The LED circuit board bulb module of radiating；Or,
Copper Foil after the excision overlays on the two sides of heat radiation metal substrate, and being then fabricated to two sides has the LED circuit board of circuit
Module, all welds LED on two sides, is fabricated to the LED circuit board module of the double-side of high radiating, can direct-assembling in LED
Assembled in LED bulb again in bulb or after being bent into geometrical body.
2. the manufacture method of the LED circuit board bulb module of a kind of high radiating, including：
After the single side floppy back of circuit board gluing that has made, it would be desirable to which large area is exposed at heat radiation metal substrate position
Single side floppy circuit board and glue cut off, and are then attached on heat radiation metal substrate, baking-curing, after pad surface is processed, weld LED
Lamp or LED and other source elements, are fabricated to a kind of LED circuit board bulb module of high radiating；
The single side floppy circuit board after cutting off being pasted in the one side of described heat radiation metal substrate, then makes the one side of high radiating
LED circuit board module, the one side LED circuit board module of the high radiating that makes is bent into a geometrical body shape, and making becomes many
The LED circuit board bulb module of the luminous high radiating in face；Or,
The flexible circuit board that cut off all is pasted on the two sides of described heat radiation metal substrate, being then fabricated to two sides has circuit
LED circuit board module, and all weld LED on two sides, be fabricated to the LED circuit board module of the double-side of high radiating,
Can direct-assembling assembled in LED bulb again in LED bulb or after being bent into geometrical body.
3. the LED circuit board bulb module of a kind of high radiating, including：
Heat radiation metal substrate；
Insulating barrier；
Metal circuitry；
Solder mask；
The LED element being welded on metal circuitry pad or LED element and other power supply apparatus；
Wherein, insulating barrier, circuit layer, solder mask and element layer are provided with only a part of region, remainder is by heat radiating metal
Substrate large area is exposed outside component side, forms the high-heat-dispersion LED wiring board module of multiaspect radiating.Then bending forms multiaspect and sends out
The high-heat-dispersion LED wiring board bulb module of light.
4. the LED circuit board bulb module of a kind of high radiating, including：
It is arranged on the heat radiation metal substrate of centre；
It is separately positioned on the insulating barrier on heat radiation metal substrate two sides；
The metal circuitry being separately positioned on the insulating barrier of two sides；
It is separately positioned on the solder mask on two sides；
The LED element being respectively welded on the metal circuitry pad of two sides or LED element and other power supply apparatus；
Wherein, on the two sides of the heat radiation metal substrate, insulating barrier, circuit layer and solder mask and unit are provided with only portion
Part layer, remainder forms the LED circuit board of the high radiating multifaceted light-emitting of multiaspect by exposed for metallic carrier large area outside component side
Bulb module.
5. the high-heat-dispersion LED wiring board bulb module according to claim 1 or 2 or 3 or 4, it is characterised in that described
Heat radiation metal substrate, according to design requirement, at the corresponding position of bending or be at the exposed position of heat radiation metal substrate
Cut off small part metal in advance and formed and be easy to bending or be easy to the hole of ventilation and heat.
6. the LED circuit board bulb module of a kind of high radiating according to claim 1 or 2 or 3 or 4, its feature exists
In described LED is LED flip chip or is packaged LED surface mount elements.
7. the LED circuit board bulb module of a kind of high radiating according to claim 1 or 2 or 3 or 4, its feature exists
In described LED element is the positive cartridge chip of LED, is conducting on circuit land by bonding wire welding, and described bonding wire is core
Between piece, between bonding wire, and/or chip and pad, bonding wire is connected conducting.
8. the LED circuit board bulb module of a kind of high radiating according to claim 1 or 2 or 3 or 4, its feature exists
In described metallic carrier plate is aluminum or aluminium alloy or copper or copper alloy or the copper after plating.
9. the wiring board bulb module of a kind of high radiating according to claim 1 or 2 or 3 or 4, it is characterised in that institute
It is paster power supply apparatus to state other power supply apparatus, is with the welding conducting of LED element together paster on same wiring board, is formed
Light source device and the LED circuit board bulb module of power supply apparatus integration.
10. the wiring board bulb module of a kind of high radiating according to claim 1 or 2 or 3 or 4, it is characterised in that
Other source elements described are paster source element, and/or pin source element, surface mount elements and LED element paster weldering together
Conducting is connect on the surface of same wiring board, pin member is welded in pad hole, and the back metal carrier at pad hole is
Through being removed or being the insulation board of having pasted small pieces, formation be light source device and power supply apparatus integration LED line road
Plate bulb module.
The 11. high-heat-dispersion LED wiring board bulb modules according to claim 1 or 2 or 3 or 4, it is characterised in that
Module wiring board on LED circuit board bulb module is provided with the flexible circuit board that an extension is stretched out, and described stretches out
Flexible circuit board is directly welded at the wiring position on power circuit plate, forms the wiring board bulb of light source and power supply integration
Module.
The 12. high-heat-dispersion LED wiring board bulb modules according to claim 1 or 2 or 3 or 4, it is characterised in that by 1
Individual or more than 1 high-heat-dispersion LED wiring board bulb module is erect and is placed in bulb.
The 13. high-heat-dispersion LED wiring board bulb modules according to claim 1 or 2 or 3 or 4, it is characterised in that by 1
Individual or more than 1 high-heat-dispersion LED wiring board bulb module is combined into after being bent into solid geometry body or bending
It is erected in bulb after solid geometry body.
The LED circuit board bulb module of 14. a kind of high radiatings according to claim 4, it is characterised in that be separately positioned on
When metal circuitry on the insulating barrier of two sides needs two sides circuit turn-on, by-pass edges of boards edge is taken, welding metal conductor is led
The conducting of logical or soldered elements.
The LED circuit board bulb module of 15. a kind of high radiatings according to claim 4, it is characterised in that be separately positioned on
When metal circuitry on the insulating barrier of two sides needs two sides circuit turn-on, two sides circuit layer is by outside dielectric layers assist side
Enclose bond together or assist side in the middle of bond together, abutting edge no metallic carrier plate, abutting edge has both sides to open
Pad adjacent to each other, the conducting of two pad scolding tin or weldering conductor conducting.
A kind of manufacture method of the LED circuit board bulb module of 16. high radiatings according to claim 4, it is characterised in that
When the metal circuitry being separately positioned on the insulating barrier of two sides needs two sides circuit turn-on, take at least one of which circuit layer and absolutely
Edge layer assist side edge stretches out metallic carrier plate shape and becomes flexible circuit, bends by-pass edges of boards edge, and welding is conducting to circuit
Conducting is formed on the solder joint of the another side of plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610620900.5A CN106455472A (en) | 2016-07-28 | 2016-07-28 | Method for manufacturing high heat radiation LED circuit board bulb module group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610620900.5A CN106455472A (en) | 2016-07-28 | 2016-07-28 | Method for manufacturing high heat radiation LED circuit board bulb module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455472A true CN106455472A (en) | 2017-02-22 |
Family
ID=58184324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610620900.5A Pending CN106455472A (en) | 2016-07-28 | 2016-07-28 | Method for manufacturing high heat radiation LED circuit board bulb module group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106455472A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108518594A (en) * | 2018-02-09 | 2018-09-11 | 中山市立体光电科技有限公司 | A kind of LED light source and preparation method thereof of big light emitting anger |
| CN108695428A (en) * | 2017-04-05 | 2018-10-23 | 广州武宏科技股份有限公司 | A kind of LED light source and preparation method thereof of the soft or hard combination without substrate |
| CN108954266A (en) * | 2018-05-31 | 2018-12-07 | 重庆九日电子科技有限公司 | The waterproof processing technique of fountain underground lamp |
| CN110300490A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive multilayer circuit board and preparation method thereof |
| WO2020041995A1 (en) * | 2018-08-29 | 2020-03-05 | 东莞励国照明有限公司 | Flame candle lamp |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080156520A1 (en) * | 2006-12-29 | 2008-07-03 | Bothhand Enterprise Inc. | Complex printed circuit board structure |
| CN101404276A (en) * | 2007-09-25 | 2009-04-08 | 三洋电机株式会社 | Light emitting module and method for manufacturing the same |
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| CN102655713A (en) * | 2012-04-09 | 2012-09-05 | 苏睿 | Manufacturing process of high-conduction metal-based circuit board of metal substrate |
| CN202652681U (en) * | 2012-06-08 | 2013-01-02 | 王定锋 | LED three-dimensional circuit board |
| CN102889480A (en) * | 2012-07-19 | 2013-01-23 | 王定锋 | Three-dimensional luminous light emitting diode (LED) lamp bulb module and manufacturing method thereof |
| CN102959327A (en) * | 2010-05-11 | 2013-03-06 | 波利布瑞特国际公司 | High intensity led replacement of incandescent lamps |
| CN103167744A (en) * | 2011-12-08 | 2013-06-19 | 王定锋 | Light-emitting diode (LED) strip printed circuit board with element and manufacture method thereof |
| CN206093582U (en) * | 2016-07-28 | 2017-04-12 | 王定锋 | High radiating LED circuit board bulb module |
-
2016
- 2016-07-28 CN CN201610620900.5A patent/CN106455472A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080156520A1 (en) * | 2006-12-29 | 2008-07-03 | Bothhand Enterprise Inc. | Complex printed circuit board structure |
| CN101404276A (en) * | 2007-09-25 | 2009-04-08 | 三洋电机株式会社 | Light emitting module and method for manufacturing the same |
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| CN102959327A (en) * | 2010-05-11 | 2013-03-06 | 波利布瑞特国际公司 | High intensity led replacement of incandescent lamps |
| CN103167744A (en) * | 2011-12-08 | 2013-06-19 | 王定锋 | Light-emitting diode (LED) strip printed circuit board with element and manufacture method thereof |
| CN102655713A (en) * | 2012-04-09 | 2012-09-05 | 苏睿 | Manufacturing process of high-conduction metal-based circuit board of metal substrate |
| CN202652681U (en) * | 2012-06-08 | 2013-01-02 | 王定锋 | LED three-dimensional circuit board |
| CN102889480A (en) * | 2012-07-19 | 2013-01-23 | 王定锋 | Three-dimensional luminous light emitting diode (LED) lamp bulb module and manufacturing method thereof |
| CN206093582U (en) * | 2016-07-28 | 2017-04-12 | 王定锋 | High radiating LED circuit board bulb module |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108695428A (en) * | 2017-04-05 | 2018-10-23 | 广州武宏科技股份有限公司 | A kind of LED light source and preparation method thereof of the soft or hard combination without substrate |
| CN108518594A (en) * | 2018-02-09 | 2018-09-11 | 中山市立体光电科技有限公司 | A kind of LED light source and preparation method thereof of big light emitting anger |
| CN110300490A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive multilayer circuit board and preparation method thereof |
| CN108954266A (en) * | 2018-05-31 | 2018-12-07 | 重庆九日电子科技有限公司 | The waterproof processing technique of fountain underground lamp |
| WO2020041995A1 (en) * | 2018-08-29 | 2020-03-05 | 东莞励国照明有限公司 | Flame candle lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106455472A (en) | Method for manufacturing high heat radiation LED circuit board bulb module group | |
| CN103325932B (en) | Light-emitting element mounting package, manufacturing method of the same, and light-emitting element package | |
| CN206181548U (en) | LED stripe shape lamp double layers of circuit boards module | |
| CN201860505U (en) | Combined two-sided PCB | |
| CN107331659B (en) | LED circuit board, terminal equipment and manufacturing method of LED circuit board | |
| CN202048540U (en) | LED (Light Emitting Diode) lamp circuit board made of three flat conducting wires | |
| CN101109501A (en) | Cooling device for light emitting diode (led) module and method for fabricating the same | |
| CN104584208B (en) | Electronic component package and its manufacture method | |
| CN106413249A (en) | LED lamp band circuit board module containing multifunctional aluminum foil, and manufacturing method | |
| CN102449756B (en) | In conjunction with package assembling and its manufacture method of radiator | |
| CN205746247U (en) | A kind of double-sided PCB LED of electrically conductive ink conducting double-sided circuit | |
| CN102544825A (en) | Land grid array interconnect | |
| WO2012009838A1 (en) | Method for fabricating single-sided circuit board using apposition wires | |
| CN102612261A (en) | High-heat conduction metal core printed circuit board and preparation method for high-heat conduction metal core printed circuit board | |
| WO2012009841A1 (en) | Single-sided circuit board made by bonding juxtaposition flat wiring with thermosetting glue film | |
| CN103681559A (en) | Chip packaging basal plate and preparation method thereof | |
| JP2006287126A (en) | Led lamp and its unit sheet manufacturing method | |
| CN201491372U (en) | Module for directly manufacturing circuit board and electronic component on radiator | |
| CN202488866U (en) | Printed circuit board applying metal substrate to penetrate heat path | |
| CN110030507A (en) | A kind of wire circuit plate LED light strip and preparation method thereof | |
| CN203072249U (en) | Aluminum substrate used for mounting LED lamps | |
| CN206093582U (en) | High radiating LED circuit board bulb module | |
| CN105140255A (en) | Flip-chip camera head encapsulating sheet and manufacturing method thereof | |
| CN202206656U (en) | LED (light-emitting diode) circuit board | |
| WO2012009842A1 (en) | Method of manufacturing single sided circuit board by using carrier glue film and juxtaposition flat wiring |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Xu Wenhong Document name: First notice of examination opinions |
|
| DD01 | Delivery of document by public notice | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170222 |
|
| WD01 | Invention patent application deemed withdrawn after publication |