CN201499370U - Metal-based circuit board for etched metal heat dissipating surface - Google Patents

Metal-based circuit board for etched metal heat dissipating surface Download PDF

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Publication number
CN201499370U
CN201499370U CN2009201496761U CN200920149676U CN201499370U CN 201499370 U CN201499370 U CN 201499370U CN 2009201496761 U CN2009201496761 U CN 2009201496761U CN 200920149676 U CN200920149676 U CN 200920149676U CN 201499370 U CN201499370 U CN 201499370U
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CN
China
Prior art keywords
layer
circuit board
metal
base circuit
metal base
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Application number
CN2009201496761U
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Chinese (zh)
Inventor
王定锋
张平
王晟齐
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惠州国展电子有限公司
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Abstract

The utility model relates to a metal-based circuit board for an etched metal heat dissipating surface. Particularly, the utility model provides a metal-based circuit board, which comprises a metal substrate and a circuit layer, wherein the inside of the metal substrate is provided with one or more grooves which can increase the heat dissipating area. According to the utility model, a metal surface of the metal substrate can be etched to form the grooves with various sizes and shapes and a certain depth so as to increase the heat dissipating area of the substrate surface and improve the heat dissipating efficiency.

Description

The metal base circuit board of etching metal radiating surface

Technical field

The utility model relates to the printed substrate field, is specifically related to the metal base circuit board of etching metal radiating surface.

Background technology

Traditional metal base circuit board bottom surface is all metal substrate; expose and mainly play thermolysis outside; but all be the metal covering of planar structure. the production technology of generally taking is but that the slow extremely glued membrane hot pressing by one deck heat conduction of certain thickness metallic plate and Copper Foil is laminated with the Metal Substrate copper-clad plate substrate that together forms a single face; stick layer protecting film at metal covering again and offer printed substrate factory, make the flow process making with conventional wiring board and produce the single face metal base circuit board.

Chang Gui Metal Substrate double-sided wiring board in addition, but be to cover Copper Foil with the slow extremely glued membrane two sides of heat conduction earlier to be hot pressed into double face copper, use conventional wiring board manufacture method then, by boring, hole metallization, copper facing, line transitions, the method that etching etc. are generally adopted, produce the wiring board of double-sided circuit, then but sticking slow extremely glued membrane and the metal substrate that applies heat conduction of a line layer pressed together, again solder joint is exposed in another circuit aspect (generally being the soldered elements face) printing welding resistance printing ink, exposure, development, last butt welding point is carried out surface treatment to help scolding tin.

Its metal covering of metal substrate of above traditional mode is all level and smooth metal covering, and area of dissipation is consistent with the plate area, and for the more application of heating, radiating effect is unsatisfactory.

In the art, more and more need to make the metal covering of metal substrate can increase area of dissipation, thereby realize better radiating effect.

Summary of the invention

According to the utility model, a kind of metal base circuit board is provided, comprise metal substrate and line layer, wherein, in described metal substrate, be formed with one or more groove that can increase area of dissipation.

According on the other hand of the present utility model, described groove adopts etching method to form.

According on the other hand of the present utility model, described metal base circuit board is aluminium base circuit board, copper base circuit board or iron-based circuit board.

According on the other hand of the present utility model, described metal base circuit board is the wiring board of single face circuit, and its structure is: the 1st layer is the metal substrate of channel form, but the 2nd layer be the insulating barrier of heat conduction, the 3rd layer is line layer, the 4th layer is solder mask.

According on the other hand of the present utility model, described metal base circuit board is the wiring board of double-deck circuit, its structure comprises: the 1st layer is the metal substrate of channel form, but the 2nd layer is the insulating adhesive film layer of heat conduction, the 3rd layer is first line layer, but the 4th layer is the insulating adhesive film layer of heat conduction, and the 5th layer is second copper wire layer of opposing face, and the 6th layer is solder mask; Wherein, be conductive communication between described first line layer and described second copper wire layer.

Between described first line layer and described second copper wire layer, realize conductive communication by means of metallized plated-through-hole.

According on the other hand of the present utility model, the metal base circuit board of described channel form is the wiring board of multilayer line, its structure comprises: the 1st layer of the bottom is the metal substrate of channel form, the superiors are solder mask, the centre is one or more combination layers, but each described combination layer is made of the insulating barrier and the line layer of heat conduction; Wherein, these line layers are conductive communication each other.

These line layers are realized conductive communication by means of metallized plated-through-hole each other.

Another object of the present invention is the manufacture craft that discloses a kind of metal base circuit board, is preferably very intensive groove owing to having etched metal substrate by etching mode, area of dissipation is increased, thereby improved radiating effect.

Described etching method can carry out according to the following steps.

1. component side (front) and the metal covering (back side) that will produce the metal base printed circuit board of finishing not moulding stamp photosensitive etch resistant printing ink, only pass through film contraposition at metal covering, and exposure imaging comes out;

2. make etching solution with ferric chloride aqueous solutions, etch the different shape various sizes at metal covering, the groove of the various degree of depth with the etched mode of spray;

3. adopting NaOH aqueous solution two sides to return anti-etching printing ink has together promptly completed and has had the metal base circuit board of groove radiating surface;

4. carry out the anti-oxidant weldering processing that helps with OSP method butt welding point;

5. on punch press, wiring board is carried out the profile moulding with mould and promptly all finished the needed metal base circuit board that possesses the large tracts of land radiating surface.

According to above-described various aspects of the present utility model, can be etched into the metal covering of metal substrate the groove of various sizes shape and certain depth, thereby increase the area of dissipation of real estate, improve radiating efficiency.

Description of drawings

Fig. 1 has shown the single-sided aluminum-base wiring board that completes by traditional handicraft, and wherein 1 is aluminium base, and 2 is insulating barrier, and 3 is line layer, and 4 is solder mask, and 7,8 is solder joint;

Fig. 2 has shown that component side is put in order plate to be protected with anti-etching printing ink, the structure of aluminium base selectivity anti-etching printing ink protection, and wherein 5 and 6 is anti-etching printing inks;

Fig. 3 has shown that the aluminium base after the ferric trichloride etching presents the structure of groove;

Fig. 4 shown take off the protection printing ink after, have the heat radiation groove metal substrate;

Fig. 5 has shown the structure of the double-sided metal substrate with heat radiation groove.

Embodiment

Below, at first the embodiment in conjunction with the single-sided aluminum-base plate comes embodiment of the present utility model is described.

But it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, does not have any restriction to claim of the present utility model.

One, the single-sided aluminum-base plate is made

Single-sided aluminum-base sheet material is produced the single-sided aluminum-base plate with figure and not moulding of welding resistance (PNL) through traditional manufacture craft.Structure as shown in Figure 1.

This is the making flow process that industry is known already, just no longer carefully states at this.

Two, component side protection and aluminium sheet figure transfer

The single-sided aluminum-base plate (PNL) of not moulding is adopted all-pass TY-CP6080 screen printer, with the 43T nylon mesh with the prosperous SPI-150A anti-etching printing ink 5 full plate silk-screens of Thailand on component side, be positioned in the holy SOR-7A baking box of will, with 80 degree, toasted 20 minutes, then, with same method with prosperous SPI-150A anti-etching printing ink 6 silk-screens of Thailand at aluminium base, aim at printing ink 6 according to the figure film of client's design in advance with CAM again, be positioned in the holy UVE-7KW exposure machine of will, energy with 300-500mj/cm exposes, pass through the horizontal developing machine in universe then, the sodium carbonate liquor with 1%, 50% development point develops, to need etched aluminium face to expose out, obtain structure as shown in Figure 2.

Three, etching forms the heat radiation figure

With structure shown in Figure 2, the horizontal etching line through universe with the ferric trichloride etching solution, is carried out etching to the aluminium base that exposes out, and etching speed is 0.2-3m/min, and etch temperature is 40-50 ℃.Figure after etching can be linearity or curve-like according to the requirement of heat radiation, also can control etched gash depth according to the area of dissipation of different demands.As shown in Figure 3, shown among Fig. 3 that the cross section is roughly the groove of U-shaped, in Fig. 4 and Fig. 5, all shown the U-shaped groove that forms in this aluminium base 1 under shed.But, it will be understood by those skilled in the art that the groove of Any shape and structure all is fine, as long as it is just passable to increase area of dissipation.

Four, stripping anti-etching printing ink

Through etching the aluminum-based circuit board of groove, need to move back the film machine, with the sodium hydroxide solution of 1-5% through level; 30~50 ℃ of humidity are moved back 20~60 seconds film time, and the anti-etching protection printing ink 5,6 of component side and aluminium base face is taken off together; obtain structure as shown in Figure 4, promptly required aluminum-based circuit board.This process must be controlled concentration sodium hydroxide and temperature well, move back the film time and just return till the printing ink, otherwise the time has been grown NaOH aluminium is had stronger corrosion.If but NaOH has slight corrosion to the aluminium below the printing ink then does not influence product quality and radiating effect.

Five, solder joint surface treatment

After taking off anti-etching printing ink, through the horizontal OSP line of grand moral, with 40-45 ℃, speed is the speed of 1.5-2.0m/min with plate, handles making the solder joint copper face adhere to the anti-oxidant weldering film that helps of one deck by OSP.

Six, moulding

After benefit ZK-H-2A CCP drilling machine, go out location hole according to the contraposition target hole drill that designs in advance in the figure, use die-cut mode then, aluminium sheet is die-cut into the overall dimension of customer requirement, promptly obtained the aluminium base circuit board of the final etching metal radiating surface that we need.

Different is for the metal base circuit board with radiating surface that the method is made and traditional aluminium base, and its area of dissipation is 3~6 times of conventional aluminum substrate, and the efficiently radiates heat area is bigger, radiating effect is better, be more suitable in high-power heating circuit, and its manufacture craft is simple, produces quick.

The method not only is suitable for the single face metal base circuit board, equally also is applicable to the double-sided metal base circuit board.Be with single face metal base circuit board difference; the double-sided metal base circuit board; need is binding agent with the conductive adhesive film earlier; earlier two-layer Copper Foil is pressed together; form traditional double-sided substrate; then by traditional brill via; hole metallization; copper facing; figure transfer; develop; after film is moved back in etching; be binding agent again with the conductive adhesive film; press together with certain thickness aluminium sheet; form traditional double-sided metal substrate, do top layer welding resistance ink lay again, again line layer is protected with anti-etching printing ink at last; and after metal substrate carried out figure transfer with anti-etching photosensitive-ink, metal substrate is etched the heat radiation groove of certain figure through ferric trichloride.Thereafter processing procedure is the same with the production process of single face metal substrate, does not just run business into particular one at this and states.

According to above-mentioned method, we can know the double sided board and the multilayer aluminium base of channel form, and the manufacture method of its aluminium base groove is consistent with the manufacture method of single face groove aluminium base.Its difference is two-sided and making multilayer circuit board, and this manufacturing process is traditional manufacturing process, just no longer carefully states at this.And those skilled in the art are appreciated that obviously substrate not only can make of aluminium, and can adopt any suitable metal such as copper, iron, stainless steel and their alloy or the like to be made.

Shown in Figure 5 is the double sided board metal substrate with groove radiating surface, and those skilled in the art can make this two-sided and multiple layer metal substrate with reference to above-mentioned manufacturing process, therefore repeat no more.

Claims (8)

1. a metal base circuit board comprises metal substrate and line layer, it is characterized in that, is formed with one or more groove in described metal substrate.
2. metal base circuit board according to claim 1 is characterized in that, described groove is the heat radiation groove.
3. metal base circuit board according to claim 1 is characterized in that, described metal base circuit board is aluminium base circuit board, copper base circuit board or iron-based circuit board.
4. according to each described metal base circuit board among the claim 1-3, it is characterized in that, described metal base circuit board is the wiring board of single face circuit, its structure is: the 1st layer is the metal substrate of channel form (1), but the 2nd layer is the insulating barrier (2) of heat conduction, the 3rd layer is line layer (3), and the 4th layer is solder mask (4).
5. according to each described metal base circuit board among the claim 1-3, it is characterized in that, described metal base circuit board is the wiring board of double-deck circuit, its structure comprises: the 1st layer is the metal substrate of channel form (1), but the 2nd layer is the insulating adhesive film layer (2) of heat conduction, and the 3rd layer is first line layer (3), but the 4th layer is the insulating adhesive film layer of heat conduction, the 5th layer is second copper wire layer (3) of opposing face, and the 6th layer is solder mask (4);
Wherein, be conductive communication between described first line layer (3) and described second copper wire layer (3).
6. metal base circuit board according to claim 5 is characterized in that, realizes conductive communication by means of metallized plated-through-hole between described first line layer (3) and described second copper wire layer (3).
7. according to each described metal base circuit board among the claim 1-3, it is characterized in that, described metal base circuit board is the wiring board of multilayer line, its structure comprises: the 1st layer of the bottom is the metal substrate of channel form (1), the superiors are solder mask (4), the centre is one or more combination layers, but each described combination layer is by the insulating barrier (2) and line layer (3) formation of heat conduction;
Wherein, these line layers (3) are conductive communication each other.
8. metal base circuit board according to claim 7 is characterized in that, these line layers (3) are realized conductive communication by means of metallized plated-through-hole each other.
CN2009201496761U 2009-04-16 2009-04-16 Metal-based circuit board for etched metal heat dissipating surface CN201499370U (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102036476A (en) * 2010-12-04 2011-04-27 廖萍涛 Two-sided metal based circuit board and production method thereof
CN102448256A (en) * 2010-10-11 2012-05-09 台湾利他股份有限公司 Circuit forming process
CN103182832A (en) * 2011-12-29 2013-07-03 上海百嘉电子有限公司 Process for high-precision screen printing by straight screen printing technology
CN103531815A (en) * 2013-10-25 2014-01-22 深圳清华大学研究院 Perforated foil used for current collector and its making method
CN104597300A (en) * 2014-12-15 2015-05-06 黄山市中显微电子有限公司 Manufacturing method of electric test board for electric performance test
CN105491804A (en) * 2015-11-30 2016-04-13 胜华电子(惠阳)有限公司 Corrosion inhibitor for aluminum-based circuit board and method for fabricating aluminum-based circuit board by corrosion inhibitor
CN105744718A (en) * 2014-12-11 2016-07-06 深南电路有限公司 Heat dissipation PCB and processing method thereof
CN105925982A (en) * 2016-05-30 2016-09-07 苏州安洁科技股份有限公司 Etching solution used for preparing aluminum double-sided special-shaped circuit board
CN108135084A (en) * 2017-11-27 2018-06-08 广德鼎星电子科技有限公司 A kind of processing method of aluminum-base flexible circuit board
CN110809367A (en) * 2019-10-16 2020-02-18 胜宏科技(惠州)股份有限公司 Production process for machining metal-based bevel edge by etching method

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102448256A (en) * 2010-10-11 2012-05-09 台湾利他股份有限公司 Circuit forming process
CN102036476A (en) * 2010-12-04 2011-04-27 廖萍涛 Two-sided metal based circuit board and production method thereof
CN103182832A (en) * 2011-12-29 2013-07-03 上海百嘉电子有限公司 Process for high-precision screen printing by straight screen printing technology
CN103182832B (en) * 2011-12-29 2016-05-04 上海仪电电子印刷科技有限公司 A kind of technique that adopts straight platemaking technology to carry out high-precision silk screen printing
CN103531815B (en) * 2013-10-25 2015-12-09 深圳清华大学研究院 Collector perforated foil and preparation method thereof
CN103531815A (en) * 2013-10-25 2014-01-22 深圳清华大学研究院 Perforated foil used for current collector and its making method
CN105744718A (en) * 2014-12-11 2016-07-06 深南电路有限公司 Heat dissipation PCB and processing method thereof
CN104597300A (en) * 2014-12-15 2015-05-06 黄山市中显微电子有限公司 Manufacturing method of electric test board for electric performance test
CN104597300B (en) * 2014-12-15 2018-11-09 黄山市中显微电子有限公司 A kind of production method of electrical measurement plate for electric performance test
CN105491804A (en) * 2015-11-30 2016-04-13 胜华电子(惠阳)有限公司 Corrosion inhibitor for aluminum-based circuit board and method for fabricating aluminum-based circuit board by corrosion inhibitor
CN105491804B (en) * 2015-11-30 2018-06-26 胜华电子(惠阳)有限公司 A kind of aluminum base circuit board erosion-control agent and the method using its progress aluminum base circuit board making
CN105925982A (en) * 2016-05-30 2016-09-07 苏州安洁科技股份有限公司 Etching solution used for preparing aluminum double-sided special-shaped circuit board
CN105925982B (en) * 2016-05-30 2018-07-06 苏州安洁科技股份有限公司 A kind of etching solution for being used to prepare the two-sided Special-shaped circuit board of aluminium
CN108135084A (en) * 2017-11-27 2018-06-08 广德鼎星电子科技有限公司 A kind of processing method of aluminum-base flexible circuit board
CN110809367A (en) * 2019-10-16 2020-02-18 胜宏科技(惠州)股份有限公司 Production process for machining metal-based bevel edge by etching method

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IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20150126

Decision number of declaring invalidation: 24898

Granted publication date: 20100602