JP2006287126A - Led lamp and its unit sheet manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lamp whose loss of light emitting is less than that of a prior LED lamp; and to provide an LED lamp unit sheet which is preferred for manufacturing the LED lamp of the little loss of light emitting and uses a substrate applicable to high density and multicolor. <P>SOLUTION: The LED lamp 1 is shaped in a such manner that a portion of a substrate 12 with an LED chip 11 mounted thereon extrudes upper from a portion where a reflector 14 is mounted. Consequently, the light emitted from the LED chip 11 is prevented from reaching an adhesive 15, and the emitting loss of light reduces. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a novel LED lamp and a method for manufacturing the unit plate, and an LED lamp having improved processability and improved heat extraction efficiency by using a substrate having high heat conductivity, and the unit plate. It relates to the manufacturing method.

  As a conventional surface mount type LED lamp, for example, using a copper-clad glass epoxy laminated plate containing a large amount of white inorganic filler, a three-layer plate with the LED chip mounting pattern portion as an inner layer is appropriately produced. In some cases, the mounting portion is exposed by counterbore or etching, the LED chip is mounted, resin-sealed as appropriate, and cut into individual LED lamps to be separated. The reason for using a large amount of white inorganic filler here is to make ultrasonic bonding easier by improving heat resistance with inorganic filler, and to reflect light with white filler. The aim is to increase the brightness by improving the rate.

  7A and 7B show an LED lamp on which a flip-chip type LED chip is mounted, in which FIG. 7A is a plan view and FIG. 7B is a cross-sectional view taken along line AA in FIG. FIG. 8 is a partially enlarged view of FIG. In this LED lamp 101, an LED chip 111 is mounted on the upper surface of a substrate 112, and a reflecting plate 114 having a reflecting surface 113 for controlling the light emission direction is provided on the same plane of the substrate 112 on which the LED chip 111 is mounted. , And bonded through an adhesive 115. The hole 116 of the reflecting plate 114 is sealed with a sealing resin 117.

  9A and 9B show another conventional surface mount type LED lamp, in which FIG. 9A is a plan view, FIG. 9B is a cross-sectional view taken along the line A-A in FIG. It is the elements on larger scale of 9 (b). The LED lamp 101 is formed by mounting a face-up type LED chip 111 having an electrode on a light extraction surface as a light source.

  In addition, ceramics, particularly those using a sintered body made of alumina, are disclosed, and by using ceramics, it is disclosed that ultrasonic bonding that is a defect of conventional resin substrates can be obtained. (For example, refer to Patent Documents 1 and 2).

  As symbolized by the invention of blue LEDs and the progress of their practical application, the progress of LEDs is also remarkable, and there is a need to solve problems such as higher density, more colors, and use in automobile headlamps. It has come to be.

The LED is a light-emitting element with high efficiency. However, the heat generation density and amount of the LED lamp that satisfies these requirements are high and cannot be handled by using a conventional resin substrate.
JP 2003-8071 A JP 2003-37298 A

  However, in the LED lamps shown in FIGS. 7 to 10, the adhesive 115 has a slight thickness, but it is not a thickness that can be ignored from the viewpoint of the size of the LED lamp. Furthermore, the angle formed by the reflecting surface 113 and the lower surface of the reflecting plate 114 is never an acute angle, and the tip is slightly rounded when viewed in minute units.

  Therefore, as shown in FIGS. 8 and 10, among the emitted light from the LED chip 111, the emitted light 51 toward the substrate 112 and the emitted light 52 toward the reflecting surface 113 are reflected in a desired direction. The emitted light 53 toward the adhesive 115 is absorbed, and the emitted light 54 toward the vicinity of the lower end portion of the reflecting surface 113 is reflected in another direction, and none is reflected in a desired direction. Therefore, a loss of light emission has occurred.

  In addition, as means for solving the problems such as the above-mentioned demands for high density, multiple colors, use for automobile headlamps, etc., there is the use of ceramics with high thermal conductivity. Is extremely difficult to manufacture. That is, it is expensive and practically impossible to produce ceramics, typical alumina hot water, and industrially by post-processing. Therefore, manufacturing by the green sheet method is indispensable, but the target individual LED lamp is small, the portion where a plurality of LED chips are mounted is small, and there are also resin sealing hole portions, etc. It is difficult to overcome the distortion that occurs in the product. For this reason, even if it can be applied to mass production, it is difficult in terms of cost to apply it to production of a variety of products of medium or less mass. In addition, the difficulty in manufacturing by post-processing as described above is to take a manufacturing method in which a large number are produced on a single fired plate, LED chips are mounted, resin-sealed, etc., and then separated into individual products. Although it is required from the request of productivity including inspection, it shows that it is essential to consider from the viewpoint of facilitating the cutting and separating method using a dicing saw.

  Accordingly, the object of the present invention is to provide an LED lamp with less emission loss than conventional LED lamps, and suitable for the manufacture of LED lamps with less emission loss, and also supports higher density and more colors. An object of the present invention is to provide an LED lamp unit plate manufacturing method using a possible substrate.

  In order to achieve the above-mentioned object, the present invention has an LED chip mounting pattern on the front surface, and a terminal pattern electrically connected to the LED chip mounting pattern is provided on the back surface portion or the outer peripheral portion corresponding to the LED chip mounting pattern. The present invention provides an LED lamp comprising a printed wiring board, wherein the LED chip mounting pattern on the surface has a convex portion protruding at a predetermined height.

  The printed wiring board may use a double-sided copper-clad resin composite ceramics board, and may further be provided with electric wiring for supplying electricity to the LED chip inside the convex portion. .

  Further, in order to achieve the above object, the present invention is formed by arranging LED chip mounting patterns on the surface in a grid pattern, and the rear surface portion corresponding to each of the LED chip mounting patterns or the outer periphery corresponding portion. A printed wiring board having a terminal pattern electrically connected to the LED chip mounting pattern is manufactured, and a through hole in which the LED chip mounting pattern protrudes to a predetermined height by cutting and removing the periphery of the LED chip mounting pattern on the surface to a predetermined depth. A first step of manufacturing a printed wiring board, and a through hole forming plate having a through hole corresponding to the periphery of the LED chip mounting pattern and having the hole wall surface as a light reflecting plate or a mounting portion of the light reflecting plate A second step, a third step of mounting an LED chip on the through-hole printed wiring board, and a first step of aligning and bonding the through-hole forming plate There processes and, also intended to provide a method of manufacturing a LED lamp unit plate, characterized in that it consists of.

The through-hole printed wiring board may have a thermal conductivity of 10 W (mK) ⁻¹ or more, or may use a double-sided copper-clad resin composite ceramic board.

  The LED chip mounting pattern can be silver-plated on the surface.

  Moreover, as for the depth of the said cutting removal, it is more desirable that it is 0.1-0.4 mm.

  The bonding is more preferably performed using a thermoplastic polyimide resin, and the wall surface of the through hole is preferably a partial rotating body surface having the bonding surface side as a meridian and subjected to light reflection increasing treatment.

  A reflection plate may be mounted between the protruding wall surface of the LED chip mounting pattern and the wall surface of the through hole forming plate.

  Further, according to the present invention, one or a plurality of LED chip mounting patterns protruding from the peripheral surface are arranged in a base pattern, and the LED chip mounting is performed on the back surface portion corresponding to each of the LED chip mounting patterns or the outer peripheral equivalent portion. The present invention also provides a through-hole printed wiring board characterized in that a terminal pattern electrically connected to the pattern is provided.

  A double-sided copper-clad resin composite ceramic board can be used for the through-hole printed wiring board.

  According to the present invention, more emitted light can be radiated forward than a conventional LED chip, and light emission loss can be reduced.

  The configuration of the present invention will be described below with reference to the drawings.

[Configuration of LED Lamp According to the Present Invention]
FIG. 1 shows a configuration of an LED lamp according to a first embodiment of the present invention, where (a) is a plan view of the entire LED lamp using a flip-chip type LED chip, and (b) is a diagram of (a). It is sectional drawing in the AA part.

  The LED lamp 1 includes an LED chip 11, a substrate 12 having a wiring pattern 112 </ b> A made of copper foil, a reflecting plate 14 having a reflecting surface 13, and an adhesive 15 that bonds the substrate 12 and the reflecting plate 14.

  The substrate 12 is provided with a convex portion 18 that is slightly larger than the LED chip 11 at the center of the upper surface and has an area that is slightly smaller than a lower portion of a hole 16 of the reflector 14 described later. The LED chip 11 is mounted. Further, the wiring pattern 112A is electrically connected through a conduction pattern 112B provided from the element mounting side to the bottom surface side.

  The reflecting plate 14 has a substantially same width as the outer periphery of the substrate 12, and is provided with a hole 16 having a substantially circular cross section so as to be located at a substantially center from the upper surface to the lower surface. At this time, the diameter of the air holes 16 is provided so as to narrow from the upper surface side to the lower surface side, and the cross section of the wall surface is linear as shown in FIG. This wall surface becomes the reflecting surface 3.

  Further, the convex portion 18 is configured to have a sufficient height as compared with the thickness of the adhesive 15.

  The operation of the LED lamp 1 according to the first embodiment of the present invention configured as described above will be described. Of the emitted light emitted from the light emitting surface of the LED chip 11, the light is directed toward the upper surface of the convex portion 18. The emitted light is reflected as it is and travels upward. Further, the emitted light directed toward the reflecting surface 13 is also reflected by the reflecting surface 13 and travels upward. On the other hand, the light emitted toward the lower end portion of the adhesive 15 and the reflecting surface 13 as seen in the conventional LED chip does not reach the adhesive 15 because it is blocked by the convex 18, Reflected on the top surface. Therefore, the emitted light can be emitted upward without causing a light emission loss as in the conventional LED lamp.

  2A and 2B show the configuration of an LED lamp according to a second embodiment of the present invention, in which FIG. 2A is an overall view of an LED lamp using a face-up type LED chip, and FIG. It is sectional drawing in -A part.

  In the second embodiment, as shown in FIG. 2A, the face-up type LED chip 11 is mounted on the convex portion 18 and electrically connected to the wiring pattern 112A by the wire 19. This is different from the first embodiment. Even with such a configuration, the same effect as in the first embodiment can be obtained.

  As shown in FIG. 2B, the substrate 12 has a conduction pattern provided from the element mounting side to the bottom side in the same manner as described in FIG. 1B even when the face-up type LED chip 11 is used. The wiring pattern 112A can be electrically connected through 112B.

  In the first and second embodiments, in the LED lamp 1, the upper planar shape of the convex portion 18 provided on the substrate 12 is a square shape. It may have a rectangular convex portion, and may have any shape other than these as long as the above effect can be obtained.

  In FIG. 3, the upper top view of the LED lamp 1 of the said modification is shown. FIG. 3A shows a modification in which the upper planar shape of the convex portion 18 is rectangular. FIG. 3B shows a modification in which the upper planar shape of the convex portion 18 is circular. Each is shown.

  In the first and second embodiments, the LED lamp 1 has only one LED chip 11 mounted on the substrate 12, but the present invention is not limited to this, and a plurality of LED chips 11 are provided. An LED chip may be mounted at the same time.

  4A and 4B show the configuration of the LED lamp 1 on which three LED chips are simultaneously mounted. FIG. 4A is an overall view of the LED lamp, and FIG. 4B is a cross-sectional view taken along the line AA in FIG. In FIG. 4, any LED chip uses a wire bonding type LED chip, but the combination is not limited.

[LED lamp unit plate manufacturing method]
Adopting the LED lamp configuration as described above is suitable for suppressing light emission loss. However, when a material conventionally used for a substrate is used, processing for adopting such a configuration is difficult. Therefore, in the present invention, an LED lamp unit plate having a desired shape can be manufactured after selecting the material. Hereinafter, the manufacturing method of the LED lamp unit board which concerns on this invention is demonstrated.

  5 and 6 are views showing a manufacturing process of the LED lamp unit plate 3 according to the present invention. As shown in FIG. 6C, the LED lamp unit plate 3 is a combination of a through-hole printed wiring board 4 and a through-hole forming plate 5.

The through-hole printed wiring board 4 is preferably manufactured using a material having a thermal conductivity of 10 W (mK) ⁻¹ or more, more preferably 30 W (mK) ⁻¹ or more, and has good machinability. Preferably there is. From these, double-sided copper-clad resin composite ceramic plates, particularly those using an aluminum nitride-boron nitride-based continuous pore sintered body are suitable. Examples of the double-sided copper-clad resin composite ceramic plate and resin composite ceramic plate include trade name: Cerazine (manufactured by Mitsubishi Gas Chemical Co., Ltd.).

  A through-hole printed wiring board 4 using a suitable double-sided copper-clad resin composite ceramics board is usually provided with an LED chip mounting pattern and a terminal pattern in a through hole formed in an LED chip mounting pattern portion on which a plurality of chips that are usually resin-sealed are mounted The through hole is used by filling it. Further, the pattern surface is preferably plated with high reflectivity, preferably silver-plated, and sufficient consideration is given to preventing rust.

  Further, the terminal pattern is provided on at least one of the back surface or the outer peripheral equivalent portion. The method of providing the terminals in the outer peripheral equivalent part is to form through holes of a desired shape such as a circle or a square at the peripheral terminal forming positions according to the number of terminals (usually formed as shared with the adjacent LED lamp unit) It is based on a method in which through-hole plating is performed, and when divided into individual LED lamps, the side terminals are usually divided.

  The through-hole forming plate 5 is formed with a through-hole 47 (see FIG. 5B) corresponding to or wider than the LED chip mounting pattern portion to be resin-sealed. The shape of the hole to be formed is a reflection surface shape for allowing the light emitted from the LED to be emitted more effectively over the entire surface, or a mounting portion shape of the reflection plate having such a function.

  The surface shape in the case where the wall surface is used as a reflection surface is easily formed by a deformed drill or a router process, so that the wall surface of the through hole is a surface where the adhesive surface side is narrowed. Then, the wall surface is subjected to a treatment such as application of a light-reflecting paint containing a white inorganic filler or gloss metal plating (for example, silver, nickel, chromium, etc.) to increase the reflectance of light.

  When making the shape of the mounting portion of the reflecting plate, for example, in a press process or the like, a reflecting plate for mounting in which a predetermined shape of the reflecting surface and the fixing portion are integrated with a plurality of coupling portions that are easily separated in a predetermined arrangement, This is mounted and fixed and separated into individual LED lamps. Mounting and fixing of the mounting reflector is fixed by simply fitting or bonding with an adhesive or the like.

  Here, an example of the method of manufacturing the through-hole printed wiring board 4 using a double-sided copper clad resin composite ceramic board is described.

  As shown in FIG. 5A, first, drilling of a reference hole, front and back pattern conduction through holes, terminal through holes, and the like is performed at predetermined positions of the double-sided copper-clad resin composite ceramic plate 41. FIG. 5B shows a state in which the front and back pattern conduction through holes 42 are formed, and the reference holes and the terminal through holes are not shown. After through-hole plating, the through-holes 42 for conducting the front and back patterns are permanently filled with a conductive ink 43 or the like as appropriate (FIG. 5C).

  Next, as shown in FIG. 5D, a resist pattern is formed and etched to produce a double-sided pattern (front surface pattern 44, back surface pattern 45). If the terminal hole cannot be protected by resist during the etching process, the terminal hole is filled in advance. After the resist is peeled off, the pattern surface including the terminal hole is nickel-plated, the back surface and the terminal hole are protected and silver-plated, and a protective film is applied to the silver-plated surface. If necessary, remove the protection of the back surface and terminal hole, and after gold plating, protect the terminal hole filling and back surface.

  Then, a predetermined portion of the surface, that is, the periphery of the plurality of LED chip mounting patterns 46 is cut and removed to a predetermined depth, and the LED chip mounting pattern 46 protrudes to a predetermined height as shown in FIG. Through-hole printed wiring board 4 is obtained.

  The third step, which is the LED chip mounting step shown in FIG. 6A, is usually performed as a pre-step of the fourth step in which the through hole forming plate 5 shown in FIG. 6B is aligned and bonded. To do. This is because the LED chip mounting pattern 46 is located next to the LED chip mounting pattern 46, and if there is an obstacle to automatic mounting, it is already mounted in the case of a plurality of LED chip mounting patterns 46. Since only the LED chip 11 does not substantially hinder automatic mounting, one of the problems of the small LED lamp manufacturing method is solved. On the other hand, since the heat resistance of the LED chip 11, particularly the red LED chip, is relatively low, there is a limitation that the process after the bonding of the LED chip 11 to the mounting portion is performed so as not to be heated to 200 ° C. or higher. .

  The third step is usually the bonding of the LED chip to the mounting part (first process: see FIG. 6A) → sealing the LED chip with a transparent resin (second process: see FIG. 6C). ) → According to the procedure of sealing or applying (third treatment) with a resin composition containing a fluorescent agent as necessary. In the case of sealing, the third treatment is usually after the fourth step, and when the reflection plate is attached, the reflection surface is formed in the fourth step after the attachment. In this case, a method of performing the third process applying step subsequent to the second process is exemplified. In this case, it is preferable to add a fluorescent agent to the reflecting surface.

  The through-hole printed wiring board 4 and the through-hole forming board 5 manufactured above are aligned and bonded to each other. The size to be used is usually an LED chip mounting size having a large number of one or a plurality of LED chip mounting patterns.

  Adhesives used for mutual adhesion can be used as long as they exhibit heat resistance and light resistance that can withstand the use conditions. Adhesives such as polyesters, acrylics, epoxies, and silicones, polyesters, polyetherimides Examples thereof include those using a thermoplastic resin solution such as polycarbonate, polyesterimide and polyimide.

  Among these, in order to make it possible to assemble the LED lamp by soldering or the like, those having high heat resistance are preferable. Specifically, Iupitite UPA-N111, N221 (trade name, Ube Industries, Ltd.) And Rika Coat EN20 (trade name, manufactured by Shin Nippon Rika Co., Ltd.). In particular, adhesion using a large amount of thermoplastic resin can also be applied to holding different types of materials because a slight difference in thermal expansion functions as a stress relaxation layer.

  However, in order to perform “the step after bonding of the LED chip is performed so as not to be heated to 200 ° C. or higher” as described above, these thermoplastic resins cannot be used as they are and good bonding cannot be performed. Therefore, in order to enable bonding by heating and pressing at 200 ° C. or lower, the solvent of these resins remains, and after bonding, phase separation is performed even in the process of removing the solvent by drying and drying. Adopting a method that improves the heat resistance by curing the thermosetting resin component as it is, with the same effect as the solvent, lowering the melting point, and adhering it as a composition containing a thermosetting grease component that does not .

  From the viewpoint of good adhesion, it is preferable to form an adhesive layer between the adherends.

  When an adhesive layer is formed on the through-hole printed wiring board 4, it is formed by a stamp method, a screen printing method, a photoresist method, or the like. Further, in the case of the through hole forming plate, it is sufficient that the adhesive layer is uniformly formed on the entire surface of the adhesive surface, and it can be suitably produced by a printing method.

  The through-hole printed wiring board 4 or the through-hole forming board 5 in which the adhesive layer is formed in advance is used for adhesion by heating and pressing. Place this through-hole printed wiring board on the press auxiliary plate such as an aluminum plate or resin composite ceramic plate with the LED chip mounting surface as the upper side, place this through-hole forming plate on it, align it under the magnifying glass, Temporarily fixed, a press auxiliary plate is placed, and this is inserted between press hot plates via a heat-resistant cushion, and is usually bonded by heating at a low pressure. Here, when thermoplastic polyimide or the like is used as the adhesive, the positional deviation during heating and pressurization is relatively small, but when using thermosetting resins with high fluidity, heating and pressurization is used. Careful attention should be paid to prevent misalignment so that misalignment does not occur.

  The LED lamp unit plate 3 manufactured as described above is divided into individual LED lamps 1 as shown in FIG. The division can be suitably performed with a dicing saw when a preferred embodiment of the present invention, that is, a double-sided copper-clad resin composite ceramic plate or a resin composite ceramic plate is selected.

[Example 1]
Examples of the present invention will be described below.

  An LED lamp unit substrate was manufactured in which 11 high-intensity white LED lamp units each having 3 LED chips mounted thereon were formed in 11 vertical and 11 horizontal intervals at a cutting allowance of about 0.2 mm.

  The LED lamp unit has an outer shape of 5.0 mm square and a height of 1.5 mm, and has a 2.0 mm square silver electrode portion for LED bonding at a height portion of 0.7 mm from the lower surface at the center. The silver electrode portion is electrically connected to the back surface by copper through-hole plating. The lower portion of the corresponding portion around each LED lamp unit has 4/10 (6 in total) of copper through-hole plating portions having a diameter of 1.0 mm, and is used as an attachment portion of the LED lamp unit.

  The reflector is attached last.

  This through-hole printed wiring board is made of a low profile electrolytic copper foil having a thickness of 12 μm, an aluminum nitride-boron nitride sintered body (h-BN 20%, impregnated with cyanate ester-epoxy resin) It was manufactured using a double-sided copper foil-clad resin composite ceramic substrate (trade name: Cerazine CCL-ANB21, manufactured by Mitsubishi Gas Chemical Co., Ltd.) stretched to a porosity of 21 vol%.

  Moreover, this through-hole formation board was manufactured using the resin composite ceramic substrate (Brand name: Cerazine UCL-ANB21, Mitsubishi Gas Chemical Co., Ltd.) of thickness 1.0mm.

(Manufacture of through-hole printed wiring board 4)
First, a reference hole is formed in a double-sided copper foil-clad resin composite ceramic substrate, and a 0.15 mm diameter front and back pattern conduction through hole and a 1.0 mm diameter diamond chip drill are used to attach the through hole using a diamond coating drill. After forming, the through hole was plated with copper. Next, the through hole for conduction was permanently filled with silver paste, and the through hole of the attachment portion was filled with a filling ink.

  Next, a resist pattern was formed, and a predetermined front and back pattern was formed by etching.

  Next, the resist and hole filling ink were removed and electroless nickel plating was performed.

  Next, after forming a resist film on the LED chip mounting pattern on the surface, electroless gold plating was performed.

  Next, the through hole of the mounting portion is filled with hole filling ink, and after a protective film is attached to the back surface, the resist film on the LED chip mounting pattern on the front surface is removed, and after the silver plating, a protective film is formed thereon. Formed.

  Next, the periphery of the LED chip mounting pattern on the surface was cut and removed, and the through-hole printed wiring board 4 in which the LED chip mounting pattern was about 0.2 mm higher than the periphery was manufactured.

(Manufacture of through-hole forming plate 5)
A reference hole is formed in a resin composite ceramic substrate, a through hole is drilled with a diamond tip drill with a diameter of 4.0 mm, and then cut to a depth of 0.7 mm or more with a drill with a diameter of 4.4 mm and a smooth tip. Thus, a through hole forming plate 5 having an edge having a width of 0.2 mm and a height of less than 0.3 mm around the lower surface of the hole was manufactured.

  The through-hole printed wiring board 4 and the through-hole forming board 5 manufactured as described above were externally processed to a size for mounting an LED chip. It overlapped using the positioning hole of the obtained both board | substrates, and it confirmed that it was able to unify adhesive from the mutual positional relationship.

(LED chip mounting)
Next, an LED chip was mounted on the through-hole printed wiring board 4.

  Next, a 0.4 mm × 0.7 mm × 0.2 mm LED chip was placed and fixed on a predetermined position with a silver paste, and then a gold wire was bonded.

  Next, using a polymethylpentene-1 film having a thickness of 0.2 mm, a position corresponding to the protruding LED chip mounting pattern was punched out.

  Next, this punched film is aligned and mounted on the four through-hole printed wiring board 4 to which the LED chip is bonded, and an epoxy resin transparent paint is applied and heat-cured (temperature 150 ° C.) to remove the punched film. It was set as the insulation sealing.

(assembly)
Polyimide resin solution (trade name: Iupitite UPA-N-221, manufactured by Ube Industries, Ltd.) and epoxy resin (trade name: Epicron EXP-4850-1000, Dainippon Ink Co., Ltd.) with respect to 100 parts of resin solid content. (Manufactured) 100 parts were added to form a low-temperature curable adhesive solution.

  An adhesive was applied to the entire bonding surface side of the through hole forming plate 5 and dried so that the surface became the lower surface. Visual observation was made on the shortage portion opposite to the large excess portion of the adhesive, but there was no particular problem.

  Place the through-hole printed wiring board 4 with the LED chip mounting surface on the press auxiliary plate made of resin composite ceramic plate, and place the through-hole forming plate 5 with the adhesive layer on it, and align it under the magnifying glass Temporarily fixed, and a press auxiliary plate is put on, and this is inserted between press hot plates set at a temperature of 180 ° C. through a heat-resistant cushion, and the upper hot plate is slowly lowered. After maintaining for 30 minutes, the hot platen temperature was set to 130 ° C. in 30 minutes, and the adhesion was completed by a method of taking out.

  When the adhesive product obtained above was cut with a dicing saw, good cutting was achieved.

[Example 2]
In Example 1, it was the same except that the through hole forming plate 5 also serves as a reflector, that is, the through hole forming plate 5 was manufactured as follows.

(Manufacture of through-hole forming plate 5)
After setting the resin composite ceramic substrate in a drilling machine and forming a reference hole, a through hole having a 45 ° inclined wall surface was drilled using a diamond tip drill having a diameter of 4.4 mm and a blade tip angle of 90 °. Here, the machine control position accuracy of the maximum lowering point of the drill is ± 20 μm, and the maximum lowering point is a position where the position corresponding to the drill diameter is lowered by 50 μm from the surface of the resin composite ceramic substrate. Next, a white weather resistant paint containing titanium oxide was applied to the hole wall surface of the perforated plate to obtain a through hole forming plate 5.

It is (a) top view and (b) sectional drawing in the AA part of 1st Embodiment of the LED lamp which concerns on this invention. It is (a) top view and (b) sectional drawing in the AA part of 2nd Embodiment of the LED lamp which concerns on this invention. It is a figure which shows the modification of the shape of a convex part of the structure of the LED lamp which concerns on this invention. It is a figure which shows the modification when the structure of the LED lamp which concerns on this invention has three LED chips. It is the 1st figure which shows the manufacturing process of the LED lamp unit board which concerns on this invention. It is the 2nd figure which shows the manufacturing process of the LED lamp unit board which concerns on this invention. It is (a) top view and (b) sectional drawing in the AA part of the conventional LED lamp. It is the elements on larger scale of FIG.7 (b). It is sectional drawing in the (a) top view and (b) AA part of another form of the conventional LED lamp. It is the elements on larger scale of FIG.9 (b).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, LED lamp 3, LED lamp unit board 4, Through-hole printed wiring board 5, Through-hole formation board 11, LED chip 12, Board | substrate 13, Reflecting surface 14, Reflecting plate 15, Adhesive 16, Hole 17, Sealing Resin 18, convex portion 19, wire 21, 22, 23, 51, 52, 53, 54, emitted light 41, double-sided copper-clad resin composite ceramic plate 42, through hole 43, conductive ink 44, surface pattern 45, back surface pattern 46, LED chip mounting pattern 47, through hole 112A, wiring pattern 112B, conduction pattern

Claims (11)

  An LED chip mounting pattern on the surface, and a printed wiring board provided with a terminal pattern electrically connected to the LED chip mounting pattern on the back surface or the outer periphery corresponding to the LED chip mounting pattern. An LED lamp, wherein the mounting pattern has a convex portion protruding at a predetermined height.   2. The LED lamp according to claim 1, wherein the printed wiring board comprises a double-sided copper-clad resin composite ceramic board.   2. The LED lamp according to claim 1, wherein the printed wiring board is provided with an electrical wiring for supplying electricity to the LED chip inside the convex portion. A print formed by arranging LED chip mounting patterns on the front surface in a grid pattern, and providing a terminal pattern that is electrically connected to the LED chip mounting pattern on the back surface or the outer periphery corresponding to each of the LED chip mounting patterns. A first step of manufacturing a wiring board, and manufacturing a through-hole printed wiring board in which the LED chip mounting pattern protrudes by a predetermined height by cutting and removing the periphery of the LED chip mounting pattern on the surface;
A second step of producing a through hole forming plate having a through hole corresponding to the periphery of the LED chip mounting pattern and having the hole wall surface as a light reflecting plate or a mounting portion of the light reflecting plate;
A third step of mounting an LED chip on the through-hole printed wiring board;
And a fourth step of aligning and bonding the through-hole forming plate, and manufacturing the LED lamp unit plate. 5. The method of manufacturing an LED lamp unit board according to claim 4, wherein the through-hole printed wiring board has a thermal conductivity of 10 W (mK) ⁻¹ or more.   5. The method of manufacturing an LED lamp unit board according to claim 4, wherein the through-hole printed wiring board is a double-sided copper-clad resin composite ceramic board.   5. The method of manufacturing an LED lamp unit plate according to claim 4, wherein the LED chip mounting pattern is silver-plated on the surface.   5. The method of manufacturing an LED lamp unit plate according to claim 4, wherein a depth of the cutting removal is 0.1 to 0.4 mm.   5. The method of manufacturing an LED lamp unit plate according to claim 4, wherein the bonding is performed using a thermoplastic polyimide resin.   5. The method of manufacturing an LED lamp unit plate according to claim 4, wherein the wall surface of the through hole is a partial rotating body surface having a small diameter on the bonding surface side and is subjected to a light reflection increasing process.   5. The method of manufacturing an LED lamp unit plate according to claim 4, wherein a reflecting plate is mounted between the protruding wall surface of the LED chip mounting pattern and the wall surface of the through hole forming plate.

Images