CN108518594A - A kind of LED light source and preparation method thereof of big light emitting anger - Google Patents
A kind of LED light source and preparation method thereof of big light emitting anger Download PDFInfo
- Publication number
- CN108518594A CN108518594A CN201810421654.XA CN201810421654A CN108518594A CN 108518594 A CN108518594 A CN 108518594A CN 201810421654 A CN201810421654 A CN 201810421654A CN 108518594 A CN108518594 A CN 108518594A
- Authority
- CN
- China
- Prior art keywords
- led
- light source
- light emitting
- metal
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title description 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 54
- 239000002184 metal Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000005452 bending Methods 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 229910052742 iron Inorganic materials 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 238000004080 punching Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 241001465382 Physalis alkekengi Species 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 239000012774 insulation material Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 238000005286 illumination Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention discloses a kind of LED light source of big light emitting anger, it includes a multi-panel body support frame and LED component, which be made of the metal substrate bending for being coated with insulating layer up and down, and the LED component welding is connected on metallic substrates and with metal circuitry；Multi-panel body support frame bottom edge is equipped with metal terminal, the multi-panel body support frame includes a prism portion and pyramid portion, multiple LED components are laid on the side in prism portion and pyramid portion, LED component is all distributed in every one side in prism portion and pyramid portion, forms the LED light source of the big light emitting angle around one with top light emitting.The metal substrate is the wiring board that specific shape is struck out using the copper or iron material with excellent toughness, covering insulating material, then punching press open-circuit line form the metal substrate that circuit methods are made, the LED light source, it has service life long, the feature that stability is good and production efficiency is high.
Description
Technical field
The present invention relates to the technical field of LED illumination device, especially a kind of LED light source of big light emitting anger.
Background technology
Currently, the comprehensive light source used in LED bulb mainly uses on aluminum substrate after attachment SMD LED chips, then
The hollow columnar light source for being connected into a multi-panel is enclosed by bending technique, and adds a piece of aluminum substrate in the top surface of hollow posts, is combined into
The luminous LED light source in top and surrounding side.Due to the poor toughness of aluminum substrate, can only bending very little angle；In bending
Cheng Zhong, the layers of copper circuit being laid on aluminum substrate, which is easily broken off, causes circuit to disconnect so that is fabricated to multi-panel LED light with aluminum substrate
The yield rate in source is low.And using the light source of aluminum substrate and patch lamp bead combination, it is easy to be formed during energization use
Heat is assembled, and the service life of LED lamp is caused to reduce.If the metal terminal with light bulb input power welds, aluminum substrate is
Butt-joint technique can not be used to weld, need to weld out metal terminal on aluminum substrate in advance, butt-joint could be carried out with power pins
Technique connects.
Invention content
The purpose of the present invention is：In order to solve the problem above-mentioned, a kind of LED light source of big light emitting anger is provided, it has and makes
With long lifespan, stability is good and improves the production efficiency of the LED light source of big light emitting anger, yields.
The invention is realized in this way：A kind of LED light source of big light emitting anger, it includes a multi-panel body support frame and LED devices
Part, the multi-panel body support frame are made of the metal substrate bending for being coated with insulating layer up and down；
The metal substrate includes that metal circuitry, upper insulating layer and lower insulating layer, the LED component are welded on Metal Substrate
It is connected on plate and with metal circuitry；
Multi-panel body support frame bottom edge is equipped with metal terminal, which connect electric conduction with positive/negative electrode pin
Road.
Specifically, the multi-panel body support frame is in hollow comprising a prism portion and pyramid portion, prism portion and pyramid portion
Lay multiple LED components on side, every one side in prism portion and pyramid portion is all light-emitting surface, is formed around one and top hair
The light source of the big light emitting angle of light.
The prism portion is to be closed into a multi-sided column by the main bent part of metal substrate.
The pyramid portion is to piece together a multi-sided pyramid by the top bending of metal substrate.
Preferentially, the prism portion is four-prism shape, and pyramid portion is square quadrangular pyramid shape.
Preferentially, the metal circuitry is copper sheet material or iron plate material.
A kind of production method of the LED light source of big light emitting anger comprising following steps：
1. providing platelet-like metal piece, which has satisfactory electrical conductivity and bending, such as copper, iron material, according to
Shape, size and the power demand of multi-panel body support frame, strike out the wiring board of multiple units of specific shape, which includes
Place the electrode terminal outside the welding disking area and connection of LED chip.
2. being removed except welding disking area, electrode terminal and bending part on wiring board, other regions are using Shooting Technique absolutely
Edge material covers the upper and lower surface of assist side, makes a complete sheet metal base plate.
3. the part circuit cut-out on metal substrate is formed required serial/parallel by punching press or cutting technique again
Join the circuit of electric current.
4. LED chip is welded at the welding disking area of metal substrate and is connected with metal layer, then glue is covered, also may be used
The LED core chip level packaging for being covered with glued membrane is used to be welded at welding disking area and be connected with metal layer with direct.
5. the metal substrate that LED component is welded by bending is formed as that LED devices are all distributed with around one and on top
The polyhedron light source of part.
The LED light source of a kind of big light emitting anger provided by the invention, due to being fabricated to using thin metal layers such as irony or copper
Metal substrate on each surface that LED chip is arranged on holder, is formed by being bent into variously-shaped multi-panel body support frame
The LED light source of one multifaceted light-emitting so that the illumination range of the LED light source increases, and the brightness of light source is more uniform.
Description of the drawings
Fig. 1 is the structural schematic diagram of the embodiment of the present invention；
Fig. 2 is the unfolding assumption diagram of the embodiment of the present invention
Specific implementation mode
Embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
As shown in Figs. 1-2, a kind of LED light source of big light emitting anger, it includes a multi-panel body support frame 1 and plurality of LEDs device
2, which formed by 3 bending of metal substrate for being coated with insulating layer up and down, and the metal substrate 3 includes interposition
Metal circuitry, upper insulating layer and the lower insulating layer set, the LED component 2 is welded on metal substrate 3 and and metal circuitry
Conducting, the LED component 2 are to cover the LED core chip level packaging of glued membrane, or LED chip is welded on after the holder again
Cover the device of glue.
1 bottom edge of multi-panel body support frame is equipped with metal terminal 4, which is connected with the welding of positive and negative electrode pin
Circuit.
Specifically, the multi-panel body support frame 1 is in hollow comprising a prism portion 11 and pyramid portion 12,11 He of prism portion
Lay multiple LED components on the side in pyramid portion 12, every one side in prism portion and pyramid portion is all light-emitting surface, to form one
The big light emitting anger LED light source of a surrounding and top light emitting.
The prism portion 11 is the column that a multiple sides are closed by 3 bending of metal substrate.
The pyramid portion 12 is the pyramid that a multiple sides are pieced together by the top bending of metal substrate 3.
Preferentially, the prism portion 11 is four-prism shape, and pyramid portion 12 is square quadrangular pyramid shape.
A kind of production method of the LED light source of big light emitting anger comprising following steps：
1. providing platelet-like metal piece, which has satisfactory electrical conductivity and bending, such as copper, iron material, root
The wiring board of specific shape is struck out according to the shape, size and power demand of multi-panel body support frame, which includes placing LED devices
The welding disking area and the electrode terminal 4 outside connection of part.
2. being removed except welding disking area, electrode terminal and bending part on wiring board, other regions are using Shooting Technique absolutely
Edge material covers the upper and lower surface of assist side, makes the metal substrate of a sheet.
3. the circuit of the portion connection on metal substrate is cut off by punching press or cutting technique again, needed for formation
The access for the series/parallel electric current wanted.
4. LED chip is welded at the welding disking area of metal substrate and is connected with metal layer, then glue is covered,
It can also be directly welded at welding disking area using the LED core chip level packaging for being covered with glued membrane and be led with metal layer
It is logical.
5. the circuit board that LED component is welded by bending is formed as that LED component is all distributed with around one and on top
Polyhedron light source.
Using the irony of thin layer shape it is either copper made of metal substrate irony or copper good tough is utilized
Property, bendable is converted into variously-shaped multi-panel body support frame, on each surface that LED component is arranged on holder, forms a multi-panel
Luminous LED light source so that the illumination range of the LED light source increases, and the brightness of light source is more uniform.
The above-mentioned technical solution is only the preferred embodiments of the present invention.It should be pointed out that for this field
For those of ordinary skill, without departing from the principles of the present invention, it can also make several improvements and modification, this is also considered as
In protection scope of the present invention.
Claims (7)
1. a kind of LED light source of big light emitting anger, it includes a multi-panel body support frame and LED component, which is characterized in that the polyhedron
Holder is made of the metal substrate bending for being coated with insulating layer up and down；
The metal substrate includes metal circuitry, upper insulating layer and lower insulating layer, and the LED component welding is on metallic substrates
And it is connected with metal circuitry；
Multi-panel body support frame bottom edge is equipped with metal terminal, which can pass through the input of the techniques such as butt-joint and lamps and lanterns
End link turning circuit.
2. a kind of LED light source of big light emitting anger according to claim 1, which is characterized in that during the multi-panel body support frame is in
Empty comprising multiple LED components, prism portion and rib are laid on the side in a prism portion and pyramid portion, prism portion and pyramid portion
Every one side in tapering is all that light-emitting surface forms the big light emitting angle light source with top light emitting around one.
3. a kind of LED light source of big light emitting anger according to claim 2, which is characterized in that the prism portion is by metal
The main bent part of substrate is closed into a multi-sided column；
The pyramid portion is to piece together a multi-sided pyramid by the top bending of metal substrate.
4. a kind of LED light source of big light emitting anger according to claim 2, which is characterized in that the prism portion is positive tetragonous
Post shapes, pyramid portion are square quadrangular pyramid shape.
5. a kind of LED light source of big light emitting anger according to any one of claim 1-5, which is characterized in that the gold
It is copper sheet material to belong to circuit layer.
6. a kind of LED light source of big light emitting anger according to any one of claim 1-5, which is characterized in that the gold
It is iron plate material to belong to circuit layer.
7. making a kind of production method of the LED light source of big light emitting anger as described in claim 1, which is characterized in that including with
Lower step：
1. providing platelet-like metal piece, which has satisfactory electrical conductivity and bending, such as copper, iron material, according to multi-panel
Shape, size and the power demand of body support frame, strike out the wiring board of multiple units of specific shape, which includes placing
The welding disking area and the electrode terminal outside connection of LED component.
2. being removed except welding disking area, electrode terminal and bending part on wiring board, other regions are using Shooting Technique insulation material
The upper and lower surface of material covering assist side, makes a complete sheet metal base plate.
3. the part circuit cut-out on metal substrate is formed required series/parallel electricity by punching press or cutting technique again
The circuit of stream.
4. LED chip is welded at the welding disking area of metal substrate and is connected with metal layer, then glue is covered, it can also be straight
It connects and is welded at welding disking area and is connected with metal layer using the LED core chip level packaging for being covered with glued membrane.
5. the metal substrate that LED component is welded by bending is formed as that LED component is all distributed with around one and on top
Polyhedron light source.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2018101364785 | 2018-02-09 | ||
| CN201810136478 | 2018-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108518594A true CN108518594A (en) | 2018-09-11 |
Family
ID=63430395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810421654.XA Pending CN108518594A (en) | 2018-02-09 | 2018-05-04 | A kind of LED light source and preparation method thereof of big light emitting anger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108518594A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111365681A (en) * | 2020-04-18 | 2020-07-03 | 江西瀚霖智能车灯有限公司 | Vehicle headlamp and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151444A (en) * | 2013-02-27 | 2013-06-12 | 上舜照明（中国）有限公司 | Base plate group for flexible LED (Light Emitting Diode) light source and manufacturing method thereof |
| CN203131524U (en) * | 2013-03-06 | 2013-08-14 | 乐健科技（珠海）有限公司 | Bendable light-emitting diode (LED) light source module |
| CN105114834A (en) * | 2015-07-30 | 2015-12-02 | 邓放明 | Corn-shaped LED lamp with safely-exposed surface-mounted lamp beads |
| CN106455472A (en) * | 2016-07-28 | 2017-02-22 | 王定锋 | Method for manufacturing high heat radiation LED circuit board bulb module group |
| CN208170018U (en) * | 2018-02-09 | 2018-11-30 | 中山市立体光电科技有限公司 | A kind of LED light source of big light emitting anger |
-
2018
- 2018-05-04 CN CN201810421654.XA patent/CN108518594A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151444A (en) * | 2013-02-27 | 2013-06-12 | 上舜照明（中国）有限公司 | Base plate group for flexible LED (Light Emitting Diode) light source and manufacturing method thereof |
| CN203131524U (en) * | 2013-03-06 | 2013-08-14 | 乐健科技（珠海）有限公司 | Bendable light-emitting diode (LED) light source module |
| CN105114834A (en) * | 2015-07-30 | 2015-12-02 | 邓放明 | Corn-shaped LED lamp with safely-exposed surface-mounted lamp beads |
| CN106455472A (en) * | 2016-07-28 | 2017-02-22 | 王定锋 | Method for manufacturing high heat radiation LED circuit board bulb module group |
| CN208170018U (en) * | 2018-02-09 | 2018-11-30 | 中山市立体光电科技有限公司 | A kind of LED light source of big light emitting anger |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111365681A (en) * | 2020-04-18 | 2020-07-03 | 江西瀚霖智能车灯有限公司 | Vehicle headlamp and manufacturing method thereof |
| CN111365681B (en) * | 2020-04-18 | 2023-09-22 | 江西瀚霖智能车灯有限公司 | Headlight and manufacturing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20211103 Address after: 528400 building 1-10 / building 11, first floor / building 12-15, No. 1, MuLinSen Avenue, Xiaolan Town, Zhongshan City, Guangdong Province (two business places are added, No. 6, Yucheng Third Street, Xiaolan Town, No. 1, Nantai street, Xiaolan Town) Applicant after: ZHONGSHAN MLS ELECTRONIC Co.,Ltd. Address before: 528415 one of the first and second floors of Building 9, No. 45, Industrial Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Applicant before: ZHONGSHAN LITI LIGHTING TECHNOLOGY Co.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180911 |
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| RJ01 | Rejection of invention patent application after publication |