CN103151444A - Base plate group for flexible LED (Light Emitting Diode) light source and manufacturing method thereof - Google Patents
Base plate group for flexible LED (Light Emitting Diode) light source and manufacturing method thereof Download PDFInfo
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- CN103151444A CN103151444A CN2013100609725A CN201310060972A CN103151444A CN 103151444 A CN103151444 A CN 103151444A CN 2013100609725 A CN2013100609725 A CN 2013100609725A CN 201310060972 A CN201310060972 A CN 201310060972A CN 103151444 A CN103151444 A CN 103151444A
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Abstract
The invention provides a base plate group for a flexible LED (Light Emitting Diode) light source, which is mainly used in a wide-angle light-emitting lamp and belongs to the field of semiconductor lighting. The base plate group comprises insulating layers, reflecting layers and at least two base plates; the front surfaces of the base plates are fixedly arranged on one surfaces of the insulating layers; a gap is arranged between the base plates; openings are arranged in the parts of the insulating layers opposite to the base plates; line layers for connecting chip encapsulation bodies are arranged on the other surfaces of the insulating layers; and light-reflecting layers are arranged on the line layers and the insulating layers. A manufacturing method mainly comprises the following steps of: connecting a plurality of mutually-spaced base layers on the insulating layers, arranging the line layers as well as welding plates on the insulating layers, mutually connecting with a chip and attaching the upper light-reflecting layer to obtain the base plate group for the LED light source. The LED lamp manufactured by the base plate group for the flexible LED light source has the advantages of large spatial light emitting angle, uniform spatial light emitting, simple lamp production and manufacturing process and the like.
Description
Technical field
The invention provides a kind of flexible LED light source substrate of using in the wide-angle light-emitting lamp of being mainly used in, belong to field of semiconductor illumination.
Background technology
As lighting technology of new generation, LED development is very fast, and technology constantly promotes, market scale constantly enlarges, and constantly replaces the traditional lighting light fixture by feat of advantages such as energy-saving and environmental protection, all solid state, long-lives.
Over the past two years, the problem of the space luminescence angle existence of light fixture becomes consumers in general and the common focus of paying close attention to of the producer, the space luminescence angle of traditional incandescent lamp and fluorescent lamp can reach more than 300 °, luminous close to the total space, and in the space luminescence angle of product nominal, lamp luminescence is very even, does not have obvious dark space and glare phenomenon.Present LED light fixture, space luminescence angle as: light fixtures such as LED bulb lamp, LED candle lamp, LED fluorescent tube is all less, its main cause is: all LED light sources all are positioned at same plane, light emission direction is identical, and lampshade is only hemisphere or little dome-type, adopting in theory the light fixture maximum space light emitting anger of this lampshade is 180 °, yet due to the problem of luminous intensity distribution, generally can only reach 120 ° of left and right.in order to address this problem, people have carried out very many-sided improvement, such as using the frosted lampshade, increase frosted by the inner surface at lampshade, make light inner through Multi reflection, scattering at lampshade, purpose with the space luminescence angle of realize improving light adopts this method generally can realize the space luminescence angle of 130 °～160 °, someone further, increase the profile of lampshade, make it to surpass semicircle, further promote the space luminescence angle of light fixture by lampshade, this method also can improve light fixture the space luminescence angle, can reach 160 °～230 °, obviously improve the optical issue that of light fixture, but fundamentally do not address this problem, because all light sources still at grade, when light emits from light source, remain to approximate same direction emission, in order further to improve the space luminescence angle of light fixture, address this problem fully, someone has been configured to each light source in light fixture on different planes, the light-emitting area of light fixture is arranged to a plurality of independently light-emitting areas, so just can make different light sources shine respectively different directions, CN101893180 provides a kind of LED candle lamp that adopts this scheme design, in this candle lamp, some LEDs light sources are welded on respectively the correspondence position of radiator, made it substantially to realize the space luminescence more than 300 °, yet still there are some technical problems in this scheme, mainly contain: owing to there being the carrier radiator as strutting piece and heat sink to exist, each concave edges profile place at radiator, all more or less have a light-baffling phenomena, each profile can block the light that the light source of this profile place one side sends, thereby make light periodic dark space occur in the distribution in space.
Summary of the invention
To be solved by this inventionly be: LED light fixture space luminescence angle is less than normal, and there are periodically the technical problems such as dark space in the light fixture space luminescence.The invention provides a kind of flexible LED light source substrate in batch and manufacture method, the LED light source that several separate substrates are made folds or enclosing with substrate in batch, can realize needed light fixture space luminescence demand.Concrete technical scheme is:
A kind of flexible LED light source substrate in batch includes insulating barrier, reflector layer and at least 2 substrates, and the one side of insulating barrier is fixed in the front of described substrate, and substrate leaves the gap each other; The position that insulating barrier is relative with substrate is provided with opening, is provided with on the insulating barrier another side for the line layer that connects chip packing-body; Be provided with reflector layer on described line layer and insulating barrier another side.
It is inner that this LED light source can be assemblied in the LED lamp with substrate in batch, and when it was made LED light source, the COB that installs in substrate in batch (chip on board) quantity of light source can be selected according to the structure of the LED lamp of reality, usually can be set to 3～6; The material of insulating barrier can adopt the conventional materials such as FR4, FR5, and it has certain pliability, makes substrate in batch to bend according to actual conditions, and the light source module after guaranteeing to make can throw light on towards different directions.The arrangement of the COB light source in substrate in batch arranges according to actual conditions, for example: can be made as single file, also can be set to multiple lines and multiple rows; For common LED bulb, a plurality of COB light sources are arranged by single file got final product, if when needing in light to use the light source module of multirow, the light source module that both can adopt a plurality of this single files to arrange also can adopt multiple lines and multiple rows to be arranged into whole light source module; The light source module that adopts single file to arrange is better, and it is convenient processing and manufacture not only, when mounted LED lamp, also is convenient to install.
Be to couple together between with chip packing-body in the effect of the line layer that arranges on insulating barrier, connected mode can adopt series, parallel or series-parallel connection.When needing, also the pad that is connected with line layer can be set on the insulating barrier of substrate in batch, by pad, substrate in batch is connected with external circuit, the position of pad does not need to be particularly limited, arrange according to the side circuit situation and get final product, for example: when adopting the light source module of single file arrangement, can on the substrate with two ends in module, pad be installed.
Owing to by insulating barrier, each substrate being connected between substrate in batch, it has certain flexibility or bendable folding endurance, it can be bent to given shape, to reach to the purpose of different directions irradiation.Crooked shape can be according to actual needs or the structure of LED lamp set, both can become certain cambered surface, also the light source module can be surrounded cast, to reach the purpose of throwing light on to surrounding.
Substrate can adopt aluminium base or ceramic substrate, and the space between substrate is 2～10mm preferably; Above-mentioned reflector layer can adopt conventional welding resistance wet goods.
The present invention also provides a kind of method that is suitable for the substrate in batch of industrialized production, specifically:
A kind of flexible LED light source comprises the steps: with the manufacture method of substrate in batch
S1: be taken to few 2 substrates, described substrate be fixed on the one side of insulating barrier with being spaced from each other, described insulating barrier and substrate contacted position is provided with opening;
S2: line layer and pad are installed on the another side of insulating barrier;
S3: not pasted reflector layer by the zone of line layer and pad covering on line layer and on described insulating barrier another side, obtain flexible LED light source substrate in batch.
When using this substrate in batch to make light source, chip is installed on opening part, the encapsulation of insulating barrier on substrate in batch, then line layer is connected with chip, get final product.
Technique effect
Flexible LED light source provided by the invention is mainly used to make the LED light fixture with wide-angle space luminescence with substrate in batch, as the LED candle lamp, the LED bulb lamp, the light fixtures such as LED fluorescent lamp, it is large that the LED light fixture that adopts flexible LED light source provided by the invention to produce with substrate in batch has the space luminescence angle, space luminescence is even, the advantage such as the production of light fixture, manufacturing process are simple.
Description of drawings
Fig. 1 is the agent structure schematic diagram that flexible LED light source provided by the invention is used substrate in batch;
Fig. 2 is the flexible LED light source substrate in batch structural representation of a kind of cascaded structure provided by the invention;
Fig. 3 is the flexible LED light source substrate in batch structural representation of a kind of parallel-connection structure provided by the invention;
Fig. 4 is the cross section structure schematic diagram that flexible LED light source provided by the invention is used substrate in batch.
Fig. 5 is that flexible LED light source provided by the invention becomes to have the structural representation of large space light emitting anger light source with the substrate in batch enclosing.
Wherein the 11,12, the 13rd, substrate; 21, the 22, the 23rd, insulating barrier; 31, the 32,33, the 34th, line layer; 41, the 42, the 43rd, reflector layer; 51, the 52, the 53rd, chip packing-body; 61, the 62nd, pad.
Embodiment
The present invention is described further below in conjunction with the drawings and specific embodiments.
Embodiment 1
referring to Fig. 1, 2, 4, a larger aluminium base section bar of area is cut into 3 independently little substrates 11, 12, 13, remove waste material, be arranged as single file between these independently little substrates, distance between adjacent substrate is 2 mm, then paste insulating barrier 21 at independently little substrate surface, 22, 23, according to technological requirement, pasting insulating barrier 21, 22, before 23, can be at little substrate 11, 12, 13 surface-coated glue layer, insulating barrier 21, 22, 23 are covered in substrate 11, 12, part on 13 is provided with opening, make substrate 11, 12, in the middle of 13, expose in some zone, chip after this zone of exposing is used for is installed.As a rule, when pasting insulating barrier on substrate, adopt the insulating layer material of a monoblock to get final product, again with each little substrate sticking on this insulating barrier, therefore in Fig. 1,2,4, due to the insulating barrier middle opening, respectively the insulating barrier of opening both sides is represented with Reference numeral 21,22,23.As shown in Figure 4, with on the cross section of substrate in batch, insulating barrier 21,22,23 will couple together between adjacent substrate 11,12,13, forms an integral body from LED light source, and the subregion that is positioned on substrate 11,12,13 is disconnected, and represents with insulating barrier 21,22,23 in Fig. 4.Dotted line in Fig. 1 and Fig. 2 represents be below insulating barrier 21,22,23, the substrate 11,12 that is blocked, 13 outline line.
use it for when making light source, need to be according to the circuit design requirement, at insulating barrier 21, 22, paste line layer 31 on 23, 32, 33, 34, in Fig. 2, circuit layer 31, 32, 33, 34 adopt series system, adopt series system to couple together in the circuit of three luminous zones, pad 61, 62 are connected with circuit layer, and finally by pad 61, 62 are connected with external circuit, then line layer and be not coated with line layer and the insulating barrier of pad above paste reflector layer 41, 42, 43, obtained flexible LED light source substrate in batch this moment, then adopt conventional packaging technology, install chip in the luminous zone of insulating barrier opening, encapsulate, obtain chip packing- body 51, 52, 53, get final product.
In Fig. 2, be succinct demonstration, be positioned at insulating barrier 21,22,23 and the reflector layer 41,42,43 of circuit layer 31,32,33,34 tops do not draw.
Embodiment 2
referring to Fig. 1, 3, 4, a larger ceramic wafer section bar of area is cut into 3 independently little substrates 11, 12, 13, remove waste material, be arranged as single file between these independently little substrates, distance between adjacent substrate is 10 mm, then paste insulating barrier 21 at independently little substrate surface, 22, 23, according to technological requirement, pasting insulating barrier 21, 22, before 23, can be at little substrate 11, 12, 13 surface-coated glue layer, insulating barrier 21, 22, 23 are covered in substrate 11, 12, part on 13 is provided with opening, make substrate 11, 12, in the middle of 13, expose in some zone, chip after this zone of exposing is used for is installed.As a rule, when pasting insulating barrier on substrate, adopt the insulating layer material of a monoblock to get final product, again with each little substrate sticking on this insulating barrier, therefore in Fig. 1,3,4, due to the insulating barrier middle opening, respectively the insulating barrier of opening both sides is represented with Reference numeral 21,22,23.As shown in Figure 4, with on the cross section of substrate in batch, insulating barrier 21,22,23 will couple together between adjacent substrate 11,12,13, forms an integral body from LED light source, and the subregion that is positioned on substrate 11,12,13 is disconnected, and represents with insulating barrier 21,22,23 in Fig. 4.Dotted line in Fig. 1 and Fig. 3 represents be below insulating barrier 21,22,23, the substrate 11,12 that is blocked, 13 outline line.
use it for when making light source, need to be according to the circuit design requirement, at insulating barrier 21, 22, paste line layer 31 on 23, 32, 33, 34, in Fig. 3, circuit layer 31, 32, 33, 34 adopt parallel way, adopt series system to couple together in the circuit of three luminous zones, pad 61, 62 are connected with circuit layer, and finally by pad 61, 62 are connected with external circuit, then line layer and be not coated with line layer and the insulating barrier of pad above paste reflector layer 41, 42, 43, obtained flexible LED light source substrate in batch this moment, then adopt conventional packaging technology, install chip in the luminous zone of insulating barrier opening, encapsulate, obtain chip packing- body 51, 52, 53, get final product.
In Fig. 3, be succinct demonstration, be positioned at insulating barrier 21,22,23 and the reflector layer 41,42,43 of circuit layer 31,32,33,34 tops do not draw.
Embodiment 3
Referring to Fig. 5, with flexible LED light source provided by the invention with the substrate in batch enclosing on an assembly that three sides are arranged, and fixing, then this sub-assembly overall package can be produced a kind of LED light fixture with large space light emitting anger on light fixture.
Claims (6)
1. flexible LED light source substrate in batch, include insulating barrier (21,22,23), reflector layer (41,42,43) and at least 2 substrates, it is characterized in that: the one side of insulating barrier (21,22,23) is fixed in the front of described substrate, and substrate leaves the gap each other; Insulating barrier (21,22, the 23) position relative with substrate is provided with opening; Be provided with on the another side of insulating barrier (21,22,23) for the line layer (31,32,33,34) that connects chip packing-body (51,52,53); Be provided with reflector layer (41,42,43) on described line layer (31,32,33,34) and insulating barrier (21,22,23) another side.
2. flexible LED light source substrate in batch according to claim 1, it is characterized in that: described substrate is 3～6.
3. flexible LED light source substrate in batch according to claim 1, it is characterized in that: described substrate is single-row and arranges.
4. according to claim 1～3 described flexible LED light source of any one substrate in batch, it is characterized in that: the spacing between described substrate is 2～10mm.
5. flexible LED light source substrate in batch according to claim 1, it is characterized in that: described substrate is aluminium base or ceramic substrate.
6. the manufacture method of a flexible LED light source use substrate in batch, comprise the steps:
S1: be taken to few 2 substrates, described substrate be fixed on the one side of insulating barrier with being spaced from each other, described insulating barrier and substrate contacted position is provided with opening;
S2: line layer and pad are installed on the another side of insulating barrier;
S3: not pasted reflector layer by the zone of line layer and pad covering on line layer and on described insulating barrier another side, obtain flexible LED light source substrate in batch.
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| CN201310060972.5A CN103151444B (en) | 2013-02-27 | 2013-02-27 | A kind of flexible LED light source substrate group and manufacture method thereof |
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| CN201310060972.5A CN103151444B (en) | 2013-02-27 | 2013-02-27 | A kind of flexible LED light source substrate group and manufacture method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104165326A (en) * | 2014-08-26 | 2014-11-26 | 广东金达照明科技股份有限公司 | LED candle lamp |
| CN104037302B (en) * | 2014-05-23 | 2017-04-26 | 常州市武进区半导体照明应用技术研究院 | LED (light-emitting diode) package assembly |
| CN108518594A (en) * | 2018-02-09 | 2018-09-11 | 中山市立体光电科技有限公司 | A kind of LED light source and preparation method thereof of big light emitting anger |
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| CN101050846A (en) * | 2006-04-05 | 2007-10-10 | 财团法人工业技术研究院 | Method for producing flexible light source and flexible base board and flexible solid state light source |
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| CN102522479A (en) * | 2011-12-28 | 2012-06-27 | 深圳市丽晶光电科技股份有限公司 | LED (light-emitting diode) module light source, processing method of LED module light source and LED display device |
| CN203232904U (en) * | 2013-02-27 | 2013-10-09 | 上舜照明（中国）有限公司 | Flexible substrate group for LED light sources |
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- 2013-02-27 CN CN201310060972.5A patent/CN103151444B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1928425A (en) * | 2005-09-08 | 2007-03-14 | 安华高科技Ecbuip(新加坡)私人有限公司 | Low profile light source utilizing a flexible circuit carrier |
| CN101050846A (en) * | 2006-04-05 | 2007-10-10 | 财团法人工业技术研究院 | Method for producing flexible light source and flexible base board and flexible solid state light source |
| KR100973330B1 (en) * | 2010-01-22 | 2010-07-30 | 주식회사 비에스엘 | Led package module for straight pipe type led lamp and process for producing the same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037302B (en) * | 2014-05-23 | 2017-04-26 | 常州市武进区半导体照明应用技术研究院 | LED (light-emitting diode) package assembly |
| CN104165326A (en) * | 2014-08-26 | 2014-11-26 | 广东金达照明科技股份有限公司 | LED candle lamp |
| CN104165326B (en) * | 2014-08-26 | 2017-02-15 | 广东金达照明科技股份有限公司 | LED candle lamp |
| CN108518594A (en) * | 2018-02-09 | 2018-09-11 | 中山市立体光电科技有限公司 | A kind of LED light source and preparation method thereof of big light emitting anger |
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| CN103151444B (en) | 2016-04-27 |
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