CN103151444B - A kind of flexible LED light source substrate group and manufacture method thereof - Google Patents
A kind of flexible LED light source substrate group and manufacture method thereof Download PDFInfo
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- CN103151444B CN103151444B CN201310060972.5A CN201310060972A CN103151444B CN 103151444 B CN103151444 B CN 103151444B CN 201310060972 A CN201310060972 A CN 201310060972A CN 103151444 B CN103151444 B CN 103151444B
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Abstract
The invention provides a kind of flexible LED light source substrate group being mainly used in using in wide-angle light-emitting lamp, belong to field of semiconductor illumination.Include insulating barrier, reflector layer and at least 2 substrates, the one side of insulating barrier is fixed in the front of described substrate, and substrate leaves gap each other; The position that insulating barrier is relative with substrate is provided with opening, insulating barrier another side is provided with the line layer for connecting chip packing-body; Described line layer and insulating barrier are provided with reflector layer.Manufacture method mainly by being interconnected by insulating barrier on multiple spaced substrate, then arranges line layer and pad on the insulating layer, and is interconnected with chip, then pastes upper reflector layer, obtains LED light source substrate in batch.The advantages such as it is large that the LED lamp adopting flexible LED light source substrate group provided by the invention to produce has space luminescence angle, and space luminescence is even, and the production of light fixture, manufacturing process are simple.
Description
Technical field
The invention provides a kind of flexible LED light source substrate being mainly used in using in wide-angle light-emitting lamp, belong to field of semiconductor illumination.
Background technology
As lighting technology of new generation, LED development is very fast, and technology constantly promotes, market scale constantly expands, and constantly replaces traditional lighting light fixture by feat of advantages such as energy-saving and environmental protection, all solid state, long-lives.
Over the past two years, the space luminescence angle Problems existing of light fixture becomes the focus that consumers in general and the producer pay close attention to jointly, the space luminescence angle of traditional incandescent lamp and fluorescent lamp can reach more than 300 °, luminous close to the total space, and in the space luminescence angle of product nominal, lamp luminescence is very even, does not have obvious dark space and glare phenomenon.Current LED lamp, as: the space luminescence angle of the light fixtures such as LEDbulb lamp, LED candle lamp, LED fluorescent lamp tube is all less, its main cause is: all LED light sources are all positioned at same plane, light emission direction is identical, and lampshade is only hemisphere or little dome-type, the light fixture maximum space light emitting anger adopting this lampshade is in theory 180 °, but due to the problem of luminous intensity distribution, generally can only reach about 120 °.In order to address this problem, people have carried out very many-sided improvement, such as use frosted lampshade, frosted is increased by the inner surface at lampshade, make light inner through multiple reflections, scattering at lampshade, to realize the object at the space luminescence angle of improving light, adopt the space luminescence angle that generally can realize 130 ° ~ 160 ° in this way, someone further, increase the profile of lampshade, make it to exceed semicircle, promote the space luminescence angle of light fixture further by lampshade, this method also can improve light fixture space luminescence angle, 160 ° ~ 230 ° can be reached, that obviously improves light fixture goes out optical issue, but fundamentally do not address this problem, because all light sources still at grade, when light emits from light source, remain and to launch to approximate same direction, in order to further improve the space luminescence angle of light fixture, address this problem completely, each light source in light fixture has been configured in different planes by someone, the light-emitting area of light fixture is arranged to multiple independently light-emitting area, different light sources so just can be made to be irradiated to different directions respectively, CN101893180 provides a kind of LED candle lamp adopting the program to design, in this candle lamp, some LEDs light sources are welded on the correspondence position of radiator respectively, make it the space luminescence substantially achieving more than 300 °, but still there are some technical problems in the program, mainly contain: exist owing to there being the carrier radiator as strutting piece and heat sink, at each concave edges profile place of radiator, all more or less there is light-baffling phenomena, the light that the light source that each profile can block this profile side sends, thus make light occur periodic dark space in the distribution in space.
Summary of the invention
To be solved by this invention: LED lamp space luminescence angle is less than normal, there is the technical problems such as periodicity dark space in light fixture space luminescence.The invention provides a kind of flexible LED light source substrate group and manufacture method, the LED light source substrate in batch several separate substrates made folds or enclosing, can realize required light fixture space luminescence demand.Concrete technical scheme is:
A kind of flexible LED light source substrate group, include insulating barrier, reflector layer and at least 2 substrates, the one side of insulating barrier is fixed in the front of described substrate, and substrate leaves gap each other; The position that insulating barrier is relative with substrate is provided with opening, insulating barrier another side is provided with the line layer for connecting chip packing-body; Described line layer and insulating barrier another side are provided with reflector layer.
This LED light source substrate in batch can be assemblied in LED inside, when being manufactured LED light source, COB (chiponboard) quantity of light source installed in substrate in batch can be selected according to the structure of the LED of reality, usually can be set to 3 ~ 6; The material of insulating barrier can adopt the materials such as conventional FR4, FR5, and it has certain pliability, and substrate in batch can be bent according to actual conditions, ensures that the light source module after making can throw light on towards different directions.The arrangement of the COB light source in substrate in batch is arranged according to actual conditions, such as: can be set to single file, also can be set to multiple lines and multiple rows; For common LED bulb, multiple COB light source is undertaken arranging by single file, if when needing the light source module with multirow in light, the light source module of multiple this single-row layout both can have been adopted, multiple lines and multiple rows also can be adopted to be arranged into overall light source module; Adopt the light source module of single-row layout better, it is convenient processing and manufacture not only, when mounted LED lamp, is also convenient to install.
The effect of the line layer arranged on the insulating layer couples together between chip packing-body, and connected mode can adopt series, parallel or series-parallel connection.When needing, also can the pad be connected with line layer be set on the insulating barrier of substrate in batch, by pad, substrate in batch is connected with external circuit, the position of pad does not need to be particularly limited to, carry out arranging according to side circuit situation, such as: when adopting the light source module of single-row layout, by the substrate at two ends in module, pad can be installed.
Owing to being connected by each substrate by insulating barrier between substrate in batch, it has certain flexibility or bendable folding endurance, can be bent to given shape, to reach the object of irradiating to different directions.Bending shape can according to actual needs or the structure of LED set, both can become certain cambered surface, also light source module can be surrounded cast, carry out the object of throwing light on to reach to surrounding.
Substrate can adopt aluminium base or ceramic substrate, the spaced preferably 2 ~ 10mm between substrate; Above-mentioned reflector layer can adopt conventional welding resistance wet goods.
Present invention also offers a kind of method being suitable for the substrate in batch of industrialized production, specifically:
A manufacture method for flexible LED light source substrate group, comprises the steps:
S1: be taken to few 2 substrates, be fixed on being spaced from each other in the one side of insulating barrier by described substrate, the position that described insulating barrier contacts with substrate is provided with opening;
S2: install line layer and pad on the another side of insulating barrier;
S3: do not pasted reflector layer by the region that line layer and pad cover on line layer and on described insulating barrier another side, obtain flexible LED light source substrate group.
When using this substrate in batch to manufacture light source, chip being installed on the opening part of insulating barrier in substrate in batch, encapsulation, then line layer is connected with chip.
technique effect
Flexible LED light source substrate group provided by the invention is mainly used to manufacture the LED lamp with wide-angle space luminescence, as LED candle lamp, LEDbulb lamp, the light fixtures such as LED daylight lamp, it is large that the LED lamp adopting flexible LED light source substrate group provided by the invention to produce has space luminescence angle, the advantages such as space luminescence is even, and the production of light fixture, manufacturing process are simple.
Accompanying drawing explanation
Fig. 1 is the agent structure schematic diagram of flexible LED light source substrate group provided by the invention;
Fig. 2 is the flexible LED light source substrate group structural representation of a kind of cascaded structure provided by the invention;
Fig. 3 is the flexible LED light source substrate group structural representation of a kind of parallel-connection structure provided by the invention;
Fig. 4 is the cross section structure schematic diagram of flexible LED light source substrate group provided by the invention.
Fig. 5 is the structural representation that flexible LED light source substrate group enclosing provided by the invention becomes to have large space light emitting anger light source.
Wherein 11,12,13 is substrates; 21,22,23 is insulating barriers; 31,32,33,34 is line layers; 41,42,43 is reflector layers; 51,52,53 is chip packing-bodies; 61,62 is pads.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described further.
embodiment 1
See Fig. 1, 2, 4, aluminium base section steel cutting larger for area is become 3 independently little substrates 11, 12, 13, remove waste material, these are independently arranged as single file between little substrate, distance between adjacent substrate is 2mm, then insulating barrier 21 is pasted at independently little substrate surface, 22, 23, according to technological requirement, at stickup insulating barrier 21, 22, before 23, can at little substrate 11, 12, the surface-coated glue layer of 13, insulating barrier 21, 22, 23 are covered in substrate 11, 12, part on 13 is provided with opening, make substrate 11, 12, in the middle of 13, some region is exposed, this region of exposing is installed for chip afterwards.As a rule, in insulating barrier pasted by substrate, adopt the insulating layer material of a monoblock, again by each little substrate sticking on this insulating barrier, in Fig. 1,2,4, due to insulating barrier middle opening, therefore respectively the insulating barrier of opening both sides is represented with Reference numeral 21,22,23.As shown in Figure 4, from the cross section of LED light source substrate in batch, insulating barrier 21,22,23 couples together between adjacent substrate 11,12,13, forms an entirety, and the subregion be positioned on substrate 11,12,13 is disconnected, represent with insulating barrier 21,22,23 in the diagram.The outline line of the substrate 11,12,13 that what the dotted line in Fig. 1 and Fig. 2 represented is below insulating barrier 21,22,23, be blocked.
When using it for manufacture light source, need according to circuit design requirements, at insulating barrier 21, 22, line layer 31 is pasted on 23, 32, 33, 34, in fig. 2, circuit layer 31, 32, 33, 34 adopt series system, series system is adopted to couple together in the circuit of three luminous zones, pad 61, 62 are connected with circuit layer, and eventually through pad 61, 62 are connected with external circuit, then line layer and be not coated with line layer and pad insulating barrier above paste reflector layer 41, 42, 43, now obtain flexible LED light source substrate group, then conventional packaging technology is adopted, chip is installed in the luminous zone of insulating layer openings, encapsulate, obtain chip packing-body 51, 52, 53, .
In fig. 2, be succinct display, the reflector layer 41,42,43 be positioned at above insulating barrier 21,22,23 and circuit layer 31,32,33,34 does not draw.
embodiment 2
See Fig. 1, 3, 4, ceramic wafer section steel cutting larger for area is become 3 independently little substrates 11, 12, 13, remove waste material, these are independently arranged as single file between little substrate, distance between adjacent substrate is 10mm, then insulating barrier 21 is pasted at independently little substrate surface, 22, 23, according to technological requirement, at stickup insulating barrier 21, 22, before 23, can at little substrate 11, 12, the surface-coated glue layer of 13, insulating barrier 21, 22, 23 are covered in substrate 11, 12, part on 13 is provided with opening, make substrate 11, 12, in the middle of 13, some region is exposed, this region of exposing is installed for chip afterwards.As a rule, in insulating barrier pasted by substrate, adopt the insulating layer material of a monoblock, again by each little substrate sticking on this insulating barrier, in Fig. 1,3,4, due to insulating barrier middle opening, therefore respectively the insulating barrier of opening both sides is represented with Reference numeral 21,22,23.As shown in Figure 4, from the cross section of LED light source substrate in batch, insulating barrier 21,22,23 couples together between adjacent substrate 11,12,13, forms an entirety, and the subregion be positioned on substrate 11,12,13 is disconnected, represent with insulating barrier 21,22,23 in the diagram.The outline line of the substrate 11,12,13 that what the dotted line in Fig. 1 and Fig. 3 represented is below insulating barrier 21,22,23, be blocked.
When using it for manufacture light source, need according to circuit design requirements, at insulating barrier 21, 22, line layer 31 is pasted on 23, 32, 33, 34, in figure 3, circuit layer 31, 32, 33, 34 adopt parallel way, series system is adopted to couple together in the circuit of three luminous zones, pad 61, 62 are connected with circuit layer, and eventually through pad 61, 62 are connected with external circuit, then line layer and be not coated with line layer and pad insulating barrier above paste reflector layer 41, 42, 43, now obtain flexible LED light source substrate group, then conventional packaging technology is adopted, chip is installed in the luminous zone of insulating layer openings, encapsulate, obtain chip packing-body 51, 52, 53, .
In figure 3, be succinct display, the reflector layer 41,42,43 be positioned at above insulating barrier 21,22,23 and circuit layer 31,32,33,34 does not draw.
embodiment 3
See Fig. 5, by flexible LED light source substrate group enclosing provided by the invention on the assembly that has three sides, and fixing, then this sub-assembly overall package can be produced a kind of LED lamp with large space light emitting anger on light fixture.
Claims (1)
1. a flexible LED light source substrate group, include insulating barrier (21,22,23), reflector layer (41,42,43) and substrate, it is characterized in that: the one side of insulating barrier (21,22,23) is fixed in the front of described substrate, and substrate leaves gap each other; Insulating barrier (21,22, the 23) position relative with substrate is provided with opening; The another side of insulating barrier (21,22,23) is provided with the line layer (31,32,33,34) for connecting chip packing-body (51,52,53); Described line layer (31,32,33,34) and insulating barrier (21,22,23) another side are provided with reflector layer (41,42,43);
Described substrate is 3 ~ 6;
Described substrate is single-row arrangement;
Spacing between described substrate is 2 ~ 10mm;
Described substrate is aluminium base or ceramic substrate;
Described flexible LED light source substrate group prepares as follows:
S1: get substrate, is fixed on described substrate in the one side of insulating barrier with being spaced from each other, and the position that described insulating barrier contacts with substrate is provided with opening;
S2: install line layer and pad on the another side of insulating barrier;
S3: do not pasted reflector layer by the region that line layer and pad cover on line layer and on described insulating barrier another side, obtain flexible LED light source substrate group.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310060972.5A CN103151444B (en) | 2013-02-27 | 2013-02-27 | A kind of flexible LED light source substrate group and manufacture method thereof |
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| CN201310060972.5A CN103151444B (en) | 2013-02-27 | 2013-02-27 | A kind of flexible LED light source substrate group and manufacture method thereof |
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| CN103151444A CN103151444A (en) | 2013-06-12 |
| CN103151444B true CN103151444B (en) | 2016-04-27 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104037302B (en) * | 2014-05-23 | 2017-04-26 | 常州市武进区半导体照明应用技术研究院 | LED (light-emitting diode) package assembly |
| CN104165326B (en) * | 2014-08-26 | 2017-02-15 | 广东金达照明科技股份有限公司 | LED candle lamp |
| CN108518594A (en) * | 2018-02-09 | 2018-09-11 | 中山市立体光电科技有限公司 | A kind of LED light source and preparation method thereof of big light emitting anger |
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| CN1928425A (en) * | 2005-09-08 | 2007-03-14 | 安华高科技Ecbuip(新加坡)私人有限公司 | Low profile light source utilizing a flexible circuit carrier |
| CN101050846A (en) * | 2006-04-05 | 2007-10-10 | 财团法人工业技术研究院 | Method for producing flexible light source and flexible base board and flexible solid state light source |
| CN102522479A (en) * | 2011-12-28 | 2012-06-27 | 深圳市丽晶光电科技股份有限公司 | LED (light-emitting diode) module light source, processing method of LED module light source and LED display device |
| CN203232904U (en) * | 2013-02-27 | 2013-10-09 | 上舜照明（中国）有限公司 | Flexible substrate group for LED light sources |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100973330B1 (en) * | 2010-01-22 | 2010-07-30 | 주식회사 비에스엘 | Led package module for straight pipe type led lamp and process for producing the same |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1928425A (en) * | 2005-09-08 | 2007-03-14 | 安华高科技Ecbuip(新加坡)私人有限公司 | Low profile light source utilizing a flexible circuit carrier |
| CN101050846A (en) * | 2006-04-05 | 2007-10-10 | 财团法人工业技术研究院 | Method for producing flexible light source and flexible base board and flexible solid state light source |
| CN102522479A (en) * | 2011-12-28 | 2012-06-27 | 深圳市丽晶光电科技股份有限公司 | LED (light-emitting diode) module light source, processing method of LED module light source and LED display device |
| CN203232904U (en) * | 2013-02-27 | 2013-10-09 | 上舜照明（中国）有限公司 | Flexible substrate group for LED light sources |
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