CN102522479A - LED (light-emitting diode) module light source, processing method of LED module light source and LED display device - Google Patents
LED (light-emitting diode) module light source, processing method of LED module light source and LED display device Download PDFInfo
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- CN102522479A CN102522479A CN2011104474268A CN201110447426A CN102522479A CN 102522479 A CN102522479 A CN 102522479A CN 2011104474268 A CN2011104474268 A CN 2011104474268A CN 201110447426 A CN201110447426 A CN 201110447426A CN 102522479 A CN102522479 A CN 102522479A
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Abstract
The invention relates to the field of LED (light-emitting diode) illumination and provides an LED display device, an LED module light source and a processing method of the LED module light source. The LED module light source comprises a metal plate, a plurality of LED light emitting wafers arranged on the metal plate and a conductive thin film. The LED light emitting wafers are connected through the conductive thin film. The metal plate can be folded. An LED light emitting device disclosed by the invention has the advantages of simple structure, small amount of packaging materials and low cost; and each LED lamp is in contact with the metal plate, so the heat dissipation effect is good. Meanwhile, the metal plate can be folded, so the LED light emitting device disclosed by the invention can be made into various shapes and is not limited to the plane, for example, the LED light emitting device can be made into a curved surface and the like as required. Due to the adoption of the processing method of the LED module light source, which is disclosed by the invention, the process is simplified, the production efficiency is improved and the materials are saved.
Description
Technical field
The present invention relates to the LED lighting technical field, relate in particular to a kind of LED die set light source and processing method thereof and LED display unit.
Background technology
Common lamp tube type LED lamp source sketch map such as Fig. 1, by the LED surface mounted light, circuit board (circuit board is an aluminium base among the figure), metal shell is formed.The LED surface mounted light is welded on the aluminium base, and aluminium base is fixed on the metal shell through the heat conduction adhesive tape.The LED surface mounted light mainly is to conduct the heat that operate as normal produces to aluminium base through pad, but because the pad contact area is less, the heat of conduction is limited.
The lamp in existing LED lamp source all is to be welded on the pcb board (FR-4 and aluminium base) with packaged LED surface mounted light; Its processing step comprises: Gu brilliant (promptly wafer being fixed on the support) through elargol solid-brilliant baking-bonding wire (soon gold thread is welded on the wafer that has fixed)-(wafer that soon bonding wire will be good is put into mould together with support in sealing; Inject glue then)-sealing baking-Qie muscle (promptly excise the connection of wafer with support, become independently surface mounted light) etc.Because the restriction of pcb board technology causes existing lamp source can only make the plane at present, the distribution of lamp can not be made curved surface, and profile is single, can't satisfy specific needs, shown in Figure 1A, 1B.Simultaneously, for the outward appearance that guarantees surface mounted light and the convenience of welding, the material that encapsulation is used is more, and every lamp is little with the PCB contact area, and the conduction heat is limited, LED lamp heat radiation deficiency.
Summary of the invention
For solving the defective that prior art exists; The present invention provides a kind of distribution of lamp can make curved surface and good heat dissipation, LED die set light source that packaging cost is low; Comprise metallic plate, be arranged in a plurality of LED luminescent wafers and conductive film on the said metallic plate; Connect said metallic plate flexible between the said LED luminescent wafer through said conductive film.
Further, also can adopt following optimized technical scheme:
Said metallic plate is the copper coin of thickness at 0.3 ~ 0.5mm.
The luminous tube of adjustment radiation direction is installed on the said LED luminescent wafer.
Said luminous tube is the groove-like of certain radian.
Said luminous tube is divided into plural part from top to bottom, and the radian of various piece is different, and the angle difference is set.
The light-emitting area of said LED die set light source is curved surface.
The present invention also provides a kind of processing method of LED die set light source, comprises the steps:
A. process said metallic plate and become tabular (face that is the packaged LED wafer is the plane) or stereo structure (face that is the packaged LED wafer is a curved surface);
B. the LED luminescent wafer is arranged, i.e. the corresponding as required LED luminescent wafer of arranging on metallic plate;
C. said LED luminescent wafer is embedded and is encapsulated on the said metallic plate;
D. cut muscle, be about to the redundance excision of said metallic plate;
E. lay conductive film, be electrically connected said LED luminescent wafer.
Preferably, also be included in before or after the steps A fixedly luminous tube 3 on said metallic plate 1, and make LED luminescent wafer 2 be in the step of its inner appropriate location.
The present invention also further provides a kind of LED display unit, and it comprises display module, control system and power-supply system, said display module be stitched together more than two like the described arbitrary LED die set light source of preamble.
The invention has the beneficial effects as follows:
LED luminous device structure of the present invention is simple, and the material that encapsulation is used is few, has saved circuit board simultaneously, and packaging cost is low; The lamp of group more than many directly is encapsulated in whole linking to each other on the metallic plate, and the LED lamp closely links to each other with metallic plate, and the heat that LED lamp operate as normal produces can conduct through contact-making surface fast, promotes the heat-sinking capability of LED lamp, so heat radiation is good.Simultaneously, because of used metallic plate flexible, the shape that LED light-emitting device of the present invention can be made is various, is not limited to the plane, such as making curved surface etc. as required.Because the processing method of LED die set light source of the present invention need not to cut the muscle operation, so simplified technology, avoid cutting bad that muscle causes, improve production efficiency and practiced thrift material.
In addition, through outside the LED wafer, reflection shield being set, every LED lamp all has independently reflective tube, can adjust whole light emission direction.Moreover this LED module lamp source has the cascade ability, can choose suitable module lamp source according to needs of production and carry out the cascade splicing.
Description of drawings
Figure 1A, 1B are respectively that the master of the LED light-emitting device of prior art looks and schematic side view (can only make the plane).
Fig. 2 is that the master of the LED light-emitting device of one embodiment of the invention looks sketch map.
Fig. 3 is the end view (this embodiment makes plane) of the LED light-emitting device of Fig. 2 embodiment.
Fig. 4 is the end view (this embodiment makes convex-surface type) of the LED light-emitting device of another embodiment.
Fig. 5 is the end view (this embodiment makes concave) of the LED light-emitting device of an embodiment again.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the present invention is done further detailed explanation.
Like Fig. 2, shown in 3, be that the master of the LED die set light source of a plane looks sketch map and schematic side view, it comprises metallic plate 1, LED lamp and conductive film 4; Said LED lamp comprises a plurality of LED luminescent wafers 2 and luminous tube 3; A plurality of LED luminescent wafers 2 are arranged as required and are encapsulated on the said metallic plate, and place in the luminous tube 3, and luminous tube 3 is fixed on the metallic plate 1; Be used to adjust radiation direction, improve the luminous utilance of LED.Connect through said conductive film 4 (power supply when conductive film should be able to guarantee LED lamp operate as normal and lamp source class join requirement) as required between said a plurality of LED luminescent wafer 2, said metallic plate 1 can be bent into nonplanar shape as required.Among this embodiment, said metallic plate 1 adopts the copper coin of thickness at 0.3 ~ 0.5mm, with the requirement (obviously, the metallic plate 1 here also can adopt other can guarantee the metal material that the heat radiation of LED lamp requires) that guarantees radiating effect and amount of deflection aspect.Said luminous tube 3 is the groove-like of certain radian, and said luminous tube 3 is divided into plural part from top to bottom, and the radian of various piece is different, the angle difference is set, to satisfy the requirement of particular light ray direction of illumination.Described certain radian is meant, said luminous tube 3 can make rayed that each LED wafer 2 sends in predetermined scope.
As shown in Figure 4, be the schematic side view of the LED die set light source of another one embodiment, the difference of itself and previous embodiment is, and the LED die set light source is the curved surface of evagination, and promptly the LED lamp is arranged on the outwards outstanding side of metallic plate 1, to obtain bigger irradiated area.Under this situation, the size of metallic plate 1, curvature should and combine actual needs, technology, material etc. comprehensively to choose the curvature of rational size and plate face according to arrangement, the spacing of LED luminescent wafer 2.
As shown in Figure 5; Be the schematic side view of the LED die set light source of another embodiment, the difference of itself and previous embodiment is that the LED die set light source is the curved surface of indent; Be that LED lamp (LED luminescent wafer+luminous tube 3) is arranged on the side that metallic plate 1 caves inward, with the radiation response that obtains more to concentrate.
LED die set light source of the present invention can with packaged polylith LED die set light source splicing, to change its length, area etc., satisfy needs of production as required.
The present invention also provides a kind of processing method of LED die set light source, comprises the steps:
1. confirm arrangement mode and the spacing of a plurality of LED luminescent wafers 2 etc. as required.
2. 1 one-tenth tabular of processing metal plate or three-dimensional bending according to actual needs.
3. arrange LED luminescent wafer 2, promptly on metallic plate 1, arrange according to determined arrangement mode and spacing, corresponding embedding and packaged LED luminescent wafer 2 are to metallic plate 1.The arrangement mode of said LED luminescent wafer 2, the spacing of wafer etc. need to consider that the metallic plate 1 of packaged LED wafer 2 is plane or curved surface, with scientific and reasonable confirming.
4. corresponding fixedly luminous tube 3 and makes LED luminescent wafer 2 be in its inner appropriate location on said metallic plate 1.
5. cut muscle, be about to the redundance excision of said metallic plate.
6. lay conductive film, be electrically connected said LED luminescent wafer.Also can connect with lead as required between said a plurality of LED luminescent wafer 2, can realize goal of the invention equally.
Processing method of the present invention is not limited to the above, can adjust under a stable condition such as the order of some procedure of processing, also can realize technique effect of the present invention.For example, step 2 also can in the end be carried out etc.
The present invention also provides a kind of LED display unit, and it comprises display module, control system and power-supply system, said display module be stitched together more than two like the described LED die set light source of preamble embodiment.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, make some substituting or obvious modification under the prerequisite of the present invention design not breaking away from, and performance or purposes are identical, all should be regarded as belonging to protection scope of the present invention.
Claims (9)
1. LED die set light source is characterized in that: comprise metallic plate, be arranged in a plurality of LED luminescent wafers and conductive film on the said metallic plate, connect through said conductive film between the said LED luminescent wafer, said metallic plate can be rolled over.
2. LED die set light source as claimed in claim 1 is characterized in that: said metallic plate is the copper coin of thickness at 0.3 ~ 0.5mm.
3. LED die set light source as claimed in claim 1 is characterized in that: the reflective tube that the adjustment radiation direction is installed on the said LED luminescent wafer.
4. LED die set light source as claimed in claim 3 is characterized in that: said luminous tube is the groove-like of certain radian.
5. LED die set light source as claimed in claim 3 is characterized in that: said luminous tube is divided into plural part from top to bottom, and the radian of various piece is different, and the angle difference is set.
6. as like the arbitrary described LED die set light source of claim 1-5, it is characterized in that: the light-emitting area of said LED die set light source is curved surface.
7. a LED display unit comprises display module, control system and power-supply system, it is characterized in that: said display module be stitched together more than two like the described LED die set light source of claim 1-6.
8. the processing method of a LED die set light source is characterized in that comprising the steps:
A. process said metallic plate and become tabular (face that is the packaged LED wafer is the plane) or stereo structure (face that is the packaged LED wafer is a curved surface);
B. the LED luminescent wafer is arranged, i.e. the corresponding as required LED luminescent wafer of arranging on metallic plate;
C. said LED luminescent wafer is embedded and is encapsulated on the said metallic plate;
D. cut muscle, be about to the redundance excision of said metallic plate;
E. lay conductive film, be electrically connected said LED luminescent wafer.
9. the processing method of LED die set light source as claimed in claim 8 is characterized in that: also be included in before or after the steps A fixedly luminous tube on said metallic plate, and make said LED luminescent wafer be in the step of its inner appropriate location.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011104474268A CN102522479A (en) | 2011-12-28 | 2011-12-28 | LED (light-emitting diode) module light source, processing method of LED module light source and LED display device |
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| CN2011104474268A CN102522479A (en) | 2011-12-28 | 2011-12-28 | LED (light-emitting diode) module light source, processing method of LED module light source and LED display device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151444A (en) * | 2013-02-27 | 2013-06-12 | 上舜照明（中国）有限公司 | Base plate group for flexible LED (Light Emitting Diode) light source and manufacturing method thereof |
| CN103346249A (en) * | 2013-06-21 | 2013-10-09 | 华南理工大学 | LED backlight source curved surface radiating fin and manufacturing method thereof |
| US9059339B1 (en) | 2014-02-11 | 2015-06-16 | International Business Machines Corporation | Light emitting diodes with via contact scheme |
| CN107202265A (en) * | 2017-07-19 | 2017-09-26 | 广州新诚生物科技有限公司 | Intelligent head lamp lamp group |
| CN107238003A (en) * | 2017-07-19 | 2017-10-10 | 广州新诚生物科技有限公司 | Intelligent head lamp |
| US9865769B2 (en) | 2015-03-23 | 2018-01-09 | International Business Machines Corporation | Back contact LED through spalling |
| CN110265535A (en) * | 2019-06-27 | 2019-09-20 | 深圳光台实业有限公司 | A kind of LED support encapsulating structure and packaging technology |
| CN112705915A (en) * | 2020-01-21 | 2021-04-27 | 羽源洋(宁波)科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
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| CN1928425A (en) * | 2005-09-08 | 2007-03-14 | 安华高科技Ecbuip(新加坡)私人有限公司 | Low profile light source utilizing a flexible circuit carrier |
| US20100079989A1 (en) * | 2008-09-27 | 2010-04-01 | Kuang-Chao Yeh | Flexible Thin-Type Light-Emitting-Diode Circuit Substrate and a Light-Emitting-Diode Lamp Strip |
| CN202511024U (en) * | 2011-12-28 | 2012-10-31 | 深圳市丽晶光电科技股份有限公司 | Light-emitting diode (LED) display device and module light source thereof |
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| CN1928425A (en) * | 2005-09-08 | 2007-03-14 | 安华高科技Ecbuip(新加坡)私人有限公司 | Low profile light source utilizing a flexible circuit carrier |
| US20100079989A1 (en) * | 2008-09-27 | 2010-04-01 | Kuang-Chao Yeh | Flexible Thin-Type Light-Emitting-Diode Circuit Substrate and a Light-Emitting-Diode Lamp Strip |
| CN202511024U (en) * | 2011-12-28 | 2012-10-31 | 深圳市丽晶光电科技股份有限公司 | Light-emitting diode (LED) display device and module light source thereof |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151444A (en) * | 2013-02-27 | 2013-06-12 | 上舜照明（中国）有限公司 | Base plate group for flexible LED (Light Emitting Diode) light source and manufacturing method thereof |
| CN103151444B (en) * | 2013-02-27 | 2016-04-27 | 上舜照明（中国）有限公司 | A kind of flexible LED light source substrate group and manufacture method thereof |
| CN103346249A (en) * | 2013-06-21 | 2013-10-09 | 华南理工大学 | LED backlight source curved surface radiating fin and manufacturing method thereof |
| US9059339B1 (en) | 2014-02-11 | 2015-06-16 | International Business Machines Corporation | Light emitting diodes with via contact scheme |
| US9865769B2 (en) | 2015-03-23 | 2018-01-09 | International Business Machines Corporation | Back contact LED through spalling |
| CN107202265A (en) * | 2017-07-19 | 2017-09-26 | 广州新诚生物科技有限公司 | Intelligent head lamp lamp group |
| CN107238003A (en) * | 2017-07-19 | 2017-10-10 | 广州新诚生物科技有限公司 | Intelligent head lamp |
| CN110265535A (en) * | 2019-06-27 | 2019-09-20 | 深圳光台实业有限公司 | A kind of LED support encapsulating structure and packaging technology |
| CN112705915A (en) * | 2020-01-21 | 2021-04-27 | 羽源洋(宁波)科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| CN112705915B (en) * | 2020-01-21 | 2022-07-01 | 深圳市佳康捷科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
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Application publication date: 20120627 |